WO2010082299A1 - Transfer apparatus and camera position adjusting method - Google Patents

Abstract

A transfer apparatus includes a unit stage arranged to face a transfer substrate; a center camera and an outer circumference camera arranged on the unit stage; a unit stage position adjusting means for shifting the arrangement position of the unit stage; and an outer circumference camera position adjusting means which can shift the arrangement position of the outer circumference camera.

Description

Transfer device and camera position adjustment method

The present invention adjusts the position of a transfer device for transferring a pattern formed on the surface of a mold to a transfer substrate and a camera for adjusting the relative position of the mold and the mold, or the mold and the pattern on the transfer substrate. The present invention relates to a camera position adjustment method.

Currently, there is proposed a transfer device that transfers a concavo-convex pattern onto a substrate surface by pressing a mold having a concavo-convex pattern formed on the surface against the substrate on which the transfer layer is formed (for example, , See FIG. 1 of Patent Document 1). In such a transfer apparatus, first, the reference positions of the mold and the substrate are made to coincide with each other while being separated from each other, and then the mold is pressed against the surface of the substrate.

In the case of a disk-shaped substrate having a circumferential pattern such as an optical recording medium or a magnetic recording medium, in order to adjust the relative position of the substrate and the mold and the mold and the mold, the centers of the circumferential patterns of the mold and the substrate are It is most desirable to match. One of the adjustments is usually mechanical means such as adjusting the center hole of the disk-shaped substrate and the center hole opened in the mold to a coaxial position by a center pin having a taper. There are problems such as the influence of the inner diameter processing tolerance of the mold and the possibility that the center of the disk-shaped substrate and mold and the center of each circumferential pattern include an error in the pattern forming process. As another method of adjustment, optical observation means, that is, means such as observing the alignment mark formed on the substrate and the mold with a camera or the like may be used, but a disk-like substrate used as a recording medium In general, a central hole for holding by a hub or the like is opened, so it is difficult to observe the center of the substrate and the center of the mold by direct observation using a camera. An alignment mark is formed in a region other than that and the relative position is adjusted by matching the alignment mark. In this case, the center position of the circumferential pattern on the substrate and the circumferential pattern on the mold is set. It cannot be specified accurately, that is, the center of the circumferential pattern on the substrate and the circumferential pattern on the mold must not be matched. There is a problem in that.
JP 2005-529436 Gazette

The present invention has been made in view of the above-described points, and is a transfer device capable of adjusting the relative position of the mold and the transfer substrate with high accuracy and the position of the camera used for the adjustment with high accuracy. An object of the present invention is to provide a camera position adjustment method to be adjusted.

The transfer device according to the present invention is a transfer device that forms the pattern on the transferred body by pressing the pattern formed on the mold against the transferred body, and the center of the installation position of the transferred body is the first. Photographing means for photographing the alignment mark formed on the mold through a second target mark, which is photographed through the target mark and spaced apart from the vertical axis of the installation position of the transfer object; Adjustment means for adjusting a positional relationship between a shooting position for shooting through the target mark and a shooting position for shooting through the second target mark.

The camera position adjusting method according to the present invention includes an alignment mark formed on the surface of the mold in a transfer device that forms the pattern on the surface of the transferred body by pressing the pattern formed on the mold against the transferred body. And a camera position adjustment method for adjusting a shooting position of a camera that shoots the center of the installation position of the transfer object, wherein the positional relationship is the same as the positional relationship between the alignment mark and the center of the installation position of the transfer object Photographing with the camera a reference member for adjustment having a reference mark and a reference center point that are maintained, and adjusting the first shooting position so that the first shooting position of the camera coincides with the reference center point A first photographing position adjusting step and a second photographing position for adjusting the second photographing position so that the second photographing position of the camera matches the reference mark. A position adjustment step, characterized in that it comprises a.

It is a figure showing the structure of the nanoimprint apparatus by a present Example. It is a schematic sectional drawing showing a control part at the time of camera position adjustment, a transfer part, a slide station table, and a camera unit with a reference member for adjustment. It is a figure showing an example of the reference member for adjustment. It is an overhead view of a camera unit. (A) is a bird's-eye view of a camera unit that also shows a fixing mechanism of a central camera and a moving mechanism of an outer peripheral camera, and (b) is a side view thereof. It is an example of the display image which the display part displayed. It is a flowchart showing a camera position adjustment process flow. FIG. 6 is a schematic diagram illustrating a transfer unit, a slide station table, and a camera unit of a transfer device at each stage in a camera position adjustment process according to the present embodiment together with an adjustment reference member. (A) is the time of fixing the adjustment reference member, (b) is an overhead view of the adjustment reference member and the camera unit after the center point adjustment. It is a bird's-eye view of the reference member for adjustment after position adjustment of an outer periphery camera, and a camera unit. It is a flowchart showing the substrate mold position adjustment process of a mold and a transfer substrate. It is a schematic diagram showing a transfer part, a slide station table, a camera unit, and a center pin of a transfer device at each stage in a substrate mold position adjustment process together with upper and lower molds and a transfer substrate. It is a schematic diagram showing a transfer part, a slide station table, a camera unit, and a center pin of a transfer device at each stage in a substrate mold position adjustment process together with upper and lower molds and a transfer substrate. It is a figure showing an upper mold. (A) is an overhead view of the upper and lower molds and the camera unit 40 after adjustment of the relative positions of the upper and lower molds. (A) is an overhead view of the upper and lower molds, the camera unit, and the transfer substrate after the relative position adjustment of the upper and lower molds, and (b) is the position adjustment of the upper and lower molds. It is an overhead view of the camera unit by another arrangement | positioning of an outer periphery camera. It is an overhead view of the camera unit and the adjustment reference member when adjusting the position of the outer peripheral camera when another reference mark is formed on the surface of the adjustment reference member. It is an overhead view of the camera unit and the adjustment reference member when adjusting the position of the outer peripheral camera when another reference mark is formed on the surface of the adjustment reference member.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a diagram illustrating a configuration of a nanoimprint apparatus 1 according to the present embodiment. The nanoimprint apparatus 1 is an apparatus that transfers a nanometer-sized uneven pattern formed on a mold surface to a transfer substrate that is a transfer target.

The control unit 10 gives various control signals to each component of the device according to an operation input to the operation unit 11 such as a keyboard by an administrator of the nanoimprint apparatus (hereinafter simply referred to as an administrator). Processing such as analysis of output signals from each component is performed. Further, the control unit 10 outputs an output signal from the camera unit 40 to the display unit 12 such as a monitor.

The upper mold stage 22a is installed on the lower surface of the upper stage 90a. On the lower surface of the upper mold stage 22a, an upper mold holding portion 21a made of a light transmissive material such as glass is installed. The upper mold stage 22a moves the upper mold holding unit 21a in two-dimensional directions with respect to the lower surface of the upper mold stage 22a in response to the upper mold control signal MSa from the control unit 10. The upper mold 60a is fixed to the lower surface of the upper mold holding portion 21a by, for example, vacuum suction or a mechanical support mechanism. The upper mold 60a is made of a light-transmitting material such as glass, for example, and a through hole 61a is provided at the center thereof, and at least one mark 62a is formed on the surface thereof. Further, an uneven pattern (not shown) for pattern transfer is formed on the surface of the upper mold 60a.

The lower mold stage 22b is installed on the upper surface of the lower stage 90b. On the upper surface of the lower mold stage 22b, a lower mold holding portion 21b made of a light transmissive material such as glass is provided. The lower mold stage 22b moves the lower mold holding unit 21b in two-dimensional directions with respect to the upper surface of the lower mold stage 22b in response to the lower mold control signal MSb from the control unit 10. The lower mold 60b is fixed to the upper surface of the lower mold holding portion 21b by, for example, vacuum suction or a mechanical support mechanism. The lower mold 60b is made of, for example, a light transmissive material such as glass, and a through hole is provided in the center thereof, and at least one mark 62b is formed on the surface thereof. In addition, an uneven pattern (not shown) for pattern transfer is formed on the surface of the lower mold 60b.

The slide station table 30 is installed on the upper surface of the upper stage 90a, and moves the camera unit 40 in two-dimensional directions with respect to the lower surface of the slide station table 30 in accordance with a unit position control signal US from the control unit 10. .

The camera unit 40 is a unit for photographing the pin center mark 71 of the upper mold 60a, the lower mold 60b, and the center pin 70. On the unit stage 42, a center camera 41a for photographing the pin center mark 71 of the center pin 70, and outer peripheral cameras 41b to 41d (for photographing the mark 62a of the upper mold 60a and the mark 62b of the lower mold 60b). 41d is not shown). Each of the central camera 41a and the outer peripheral cameras 41b to 41d gives an imaging signal PD obtained by photographing to the control unit 10.

At this time, the central camera 41a is fixedly installed on the unit stage 42 with its photographing lens directed vertically downward. On the other hand, each of the outer peripheral cameras 41b to 41d is installed on the unit stage 42 in a state where the photographing lens is directed perpendicular to the surfaces of the upper mold 60a and the lower mold 60b. The outer peripheral camera 41b is installed on the unit stage 42 at a position separated from the imaging unit 41a by the same distance as the distance between the center point of the lower mold 60b and the mark 62a. The photographing unit 41c is installed on the unit stage 42 at a position separated from the photographing unit 41a by the same distance as the center point of the lower mold 60b and the mark 62b. Each of the photographing units 41b to 41d can be finely adjusted in accordance with the position control signal CS supplied from the control unit 10.

The center pin 70 passes through the through hole of the lower mold 60b, and supports the transfer substrate 80 from the lower side with a support portion at the tip thereof. The center pin 70 passes through the central through-hole of the transfer substrate 80 and can be photographed by the central camera 41a.

The transfer substrate 80 has, for example, a disk shape with a through hole provided at the center, and is supported so that the center coincides with the center axis of the center pin 70. On both surfaces of the transfer substrate 80, an upper transfer layer and a lower transfer layer (both not shown) made of a transfer layer material that is cured when irradiated with ultraviolet rays are formed.

The upper stage 90a supports the upper mechanism 50a, and the lower stage 90b supports the lower mechanism 50b. The upper stage 90 a and the lower stage 90 b are connected by a ball screw 91. The stage drive unit 92 rotates the ball screw 91 according to the stage drive signal SG from the control unit, and moves the upper stage 90a upward or downward while maintaining a parallel state with respect to the lower stage 90b. That is, the upper mechanism 50a and the lower mechanism 50b are moved so as to approach or separate from each other.

At the time of pattern transfer, the upper mechanism 50a is lowered to approach the lower mechanism 50b, the transfer substrate 80 is sandwiched between the upper mold 60a and the lower mold 60b, and is illustrated from the upper mechanism 50a side and the lower mechanism 50b side. Irradiation of the ultraviolet light onto the transfer substrate 80 forms concavo-convex patterns on both surfaces of the transfer substrate 80.

In the nanoimprint apparatus 1, before the pattern transfer, first, the upper mold 60a and the lower mold 60b are aligned with each other. That is, as shown in FIG. 1, the mark 62a of the upper mold 60a and the mark 62b of the lower mold 60b are both on an axis (indicated by a broken line) perpendicular to the surfaces of the upper mold 60a and the lower mold 60b. Therefore, the installation positions of the upper mold holding part 21a and the lower mold holding part 21b are adjusted so as to be positioned at the same position. Further, the center position of each of the upper mold 60a and the lower mold 60b and the center axis of the center pin 70 (indicated by a broken line), that is, the center position of the transfer substrate 80 are also adjusted. That is, the upper mold 60a, the lower mold 60b, and the center pin 70 are adjusted to normal transfer positions.

In the nanoimprint apparatus 1 shown in FIG. 1, a camera unit 40 is provided to perform such alignment. For example, the control unit 10 includes the upper mold holding unit so that the mark 62a of the upper mold 60a and the mark 62b of the lower mold 60b overlap each other at the same position in one frame image taken by the outer peripheral camera 41b. The upper mold stage 22a and the lower mold stage 22b are controlled so as to relatively move the 21a and the lower mold holding part 21b. Here, it is necessary to adjust the installation position of the camera unit 40 itself and the positions of the outer peripheral cameras 41b to 41d (hereinafter referred to as camera position adjustment) in order to reliably perform the alignment as described above. In the nanoimprint apparatus 1 shown in FIG. 1, an adjustment reference member 100 is used as an auxiliary instrument for adjusting the camera position.

FIG. 2 is a schematic sectional view showing the transfer unit 20 and the camera unit 40 together with the adjustment reference member 100 at the time of camera position adjustment. The camera position adjustment may be performed by separating the camera unit 40 from the nanoimprint apparatus 1, but here, a case where the camera unit 40 is installed in the nanoimprint apparatus 1 will be described. In this case, the upper mold holding part 21a does not hold the upper mold 60a, and the lower mold holding part 21b is fixed with the adjustment reference member 100 instead of the lower mold 60b. The adjustment reference member 100 is, for example, a disk-shaped member having a reference center point 101 and a reference mark 102 formed on the surface thereof. Hereinafter, the case where the adjustment reference member 100 is fixed to the lower mold holding portion 21b will be described, but the same applies to the case where the adjustment reference member 100 is fixed to the upper mold holding portion 22a.

FIG. 3 is a diagram illustrating an example of the adjustment reference member 100. The reference member for adjustment 100 has a disk shape, for example, and a reference center point 101 and a reference mark 102 are formed on the surface thereof. The reference mark 102 here is a circle drawn around the reference center point 101. The positional relationship between the center axis of the center pin 70 and the alignment marks 62a and 62b when each of the upper mold 60a, the lower mold 60b, and the center pin 70 is installed at a normal transfer position at the time of pattern transfer is normally transferred. When the positional relationship is established, the positional relationship between the reference center point 101 and the reference mark 102 is formed on the surface of the adjustment reference member 100 so as to be the same positional relationship as the regular transfer positional relationship. That is, when the upper mold 60a, the lower mold 60b, and the center pin 70 installed at the regular transfer position are overlapped with the adjustment reference member 100, the reference center point 101 and the center axis of the center pin 70 are equal to each other. The reference center point 101 and the reference mark 102 are formed so that the reference mark 102 and the alignment mark 62b of the lower mold 60b coincide with each other.

Further, from the viewpoint of adjusting the position of the mold and the transfer substrate with high accuracy, the reference mark 102 of the adjustment reference member 100 is formed by the same method as that used for forming the alignment mark on the surface of the mold. It is desirable to be done. For example, when the alignment mark on the surface of the mold is formed by an electron beam drawing device (EBR: Electron Beam Recorder), the reference mark 102 of the adjustment reference member 100 is also preferably formed by EBR. In addition, each of the reference center point 101 and the reference mark 102 is formed in a color different from the other parts on the adjustment reference member 100 so that photographing by the outer peripheral cameras 41a to 41d of the camera unit 40 can be easily performed. It is desirable. Note that the material of the adjustment reference member 100 itself may be the same material as the mold (for example, a light-transmitting material such as glass) or another material.

FIG. 4 is an overhead view of the camera unit 40. The center camera 41 a is fixed to the center portion of the unit stage 42 and is used for photographing the reference center point 101 of the adjustment reference member 100. Each of the outer peripheral cameras 41b to 41d is disposed around the central camera 41a, and is for photographing the reference mark 102 of the reference member for adjustment 100. Each of the outer peripheral cameras 41b to 41d is arranged at an equal distance on the circumference of a circle drawn with the fixed position of the central camera 41a as the center. As shown by the arrows in FIG. Each can be moved in the radial direction.

FIG. 5A is an overhead view of the camera unit 40 that also shows the fixing mechanism of the central camera 41a and the movement mechanisms of the outer peripheral cameras 41b to 41d. FIG. 5B is a side view of the camera unit 40. In FIG. 5B, the outer peripheral cameras 41b and 41d are omitted.

The center camera 41a is fixed by a fixing portion 43a so as to be positioned at the center of the unit stage 42. The outer peripheral camera 41c is held by the holding portion 43c. The holding portion 43c is movable in the radial direction of the circle drawn with the center of the unit stage 42 as a reference (in the direction of the arrow in the figure) by the screw rotation of the feed screw portion 44c. The feed screw portion 44c moves the holding portion 43c by screw rotation in accordance with the position control signal CS from the control portion 10. Further, the holder 43c can be moved by rotating the screw by manually adjusting the knob of the feed screw 44c by the administrator. The peripheral cameras 41b and 41d have the same configuration.

The unit stage 42 is configured such that each of the central camera 41a and the outer peripheral cameras 41b to 41d can photograph the adjustment reference member 100. In other words, if at least the movable region 45 in the unit stage 42 where the outer peripheral cameras 41a to 41d are located is made of a light-transmitting material such as glass, each of the central camera 41a and the outer peripheral cameras 41b to 41d is used for adjustment. The reference member 100 can be photographed. Alternatively, the central camera 41a and the outer peripheral cameras 41b to 41 can also be provided by providing a penetrating portion in at least the fixed region of the central camera 41a (the center of the unit stage 42) and the moving regions of the outer peripheral cameras 41b to 41d. Each of 41d can photograph the adjustment reference member 100.

6 (a) and 6 (b) show that the display unit 12 crosses an image of the frame frame FL and an adjustment target mark as a captured image PG represented by an imaging signal PD obtained by imaging by the central camera 41a. It is an example of the display image which displayed by superimposing with the image of LN1 (FIG. 6 (a)) or the intersection line LN2 (FIG.6 (b)). In the display image, an intersection line LN1 (FIG. 6 (a)) or an intersection line LN2 (FIG. 6 (b)) that represents the center in the imaging range by intersecting each other is displayed. The administrator can grasp the relative position of the center camera 41a with respect to the adjustment reference member 100 based on the intersection line LN1 or LN2 in the display image displayed on the display unit 12. The display unit 12 similarly displays images obtained by photographing with each of the outer peripheral cameras 41b to 41d.

FIG. 7 is a flowchart showing a camera position adjustment processing flow. FIG. 8 is a schematic diagram illustrating the transfer unit 20, the slide station table 30, and the camera unit 40 of the nanoimprint apparatus 1 at each stage in the camera position adjustment process according to this embodiment together with the adjustment reference member 100. Hereinafter, the camera position adjustment process will be described with reference to FIGS.

First, the adjustment reference member 100 is fixed to the lower mold holding portion 21b by, for example, vacuum suction or a mechanical support mechanism (step S101, FIG. 8A). FIG. 9A is an overhead view of the adjustment reference member 100 and the camera unit 40 when the adjustment reference member 100 is fixed. The position of the camera unit 40 at this point may be anywhere, for example, the position of the camera unit 40 may be shifted to the right with respect to the adjustment reference member 100 as shown in FIG.

Next, the camera unit 40 is moved so that the center within the photographing range of the central camera 41a coincides with the reference center point 101 of the adjustment reference member 100 (step S102, FIG. 8B).

For example, the administrator adjusts the position of the camera unit 40. In this case, the manager monitors the display image displayed on the display unit 12 based on the photographing signal PD from the central camera 41a, and adjusts the intersection of the intersection line LN1 shown in each of the display images and the adjustment reference. The movement direction of the camera unit 40 is input to the operation unit 11 so that the reference center point 101 of the member 100 matches. The control unit 10 issues a unit position control signal US to the slide station table 30 in response to the movement direction input. The slide station table 30 moves the camera unit 40 in the moving direction indicated by the unit position control signal US.

Further, the position of the camera unit 40 (position of the central camera 41a) is adjusted by a unit stage position adjustment (central camera position adjustment) unit comprising the control unit 10, the transfer unit 20, the slide station table 30, and the camera unit 40. Also good. In this case, the control unit 10 determines that the center of gravity of the image obtained by performing image analysis processing such as binarization processing on the image represented by the shooting signal PD from the center camera 41a is the center of the shooting range of the center camera 41a. The position of the camera unit 40 is adjusted so as to match. The control unit 10 analyzes the relative position between the position of the center of gravity of the image and the center of the shooting range, and determines the direction in which the camera unit 40 should be moved. In this case, the control unit 10 itself issues a unit position control signal US to the slide station table 30 without waiting for an input of the moving direction from the administrator. By such processing, the center position of the photographing range of the central camera 41a matches the reference center point 101 of the adjustment reference member 100.

FIG. 9B is an overhead view of the adjustment reference member 100 and the camera unit 40 after adjusting the center point. As shown in the figure, the center position of the photographing range of the central camera 41a coincides with the reference center point 101 of the adjustment reference member 100. Note that the position of each of the outer peripheral cameras 41b to 41d at this point may be anywhere.

Next, the positions of the outer peripheral cameras 41b to 41d are adjusted (step S103, FIG. 8 (c)). Specifically, the positions of the outer peripheral cameras 41b to 41d are individually adjusted so that the center positions of the photographing ranges of the outer peripheral cameras 41b to 41d coincide with the reference marks 102 of the adjustment reference member 100. Each of the outer peripheral cameras 41b to 41d is movable in the radial direction of a circle drawn around the fixed position of the central camera 41a, and individually moves on the unit stage 42 according to the position control signal CS from the control unit 10. Moving.

For example, the administrator adjusts the positions of the outer peripheral cameras 41b to 41d. The administrator monitors each display image of the outer peripheral cameras 41b to 41d displayed on the display unit 12 based on the photographing signal PD from each of the outer peripheral cameras 41b to 41d, and is displayed on each of the display images. The movement direction of each of the outer peripheral cameras 41b to 41d is individually input to the operation unit 11 so that the intersection of the intersection line LN1 coincides with the reference mark 102 of the adjustment reference member 100. The control unit 10 issues a position control signal CS to the camera unit 40 in response to the movement direction input. The slide station table 30 individually moves each of the outer peripheral cameras 41b to 41d in the moving direction indicated by the position control signal CS.

Further, the positions of the outer peripheral cameras 41b to 41d may be adjusted by adjusting the position of the outer peripheral camera including the control unit 10, the transfer unit 20, the slide station table 30, and the camera unit 40. In this case, the control unit 10 analyzes the image represented by the photographing signal PD from each of the outer peripheral cameras 41b to 41d, and determines the center position of each photographing range of the outer peripheral cameras 41b to 41d and the position of the reference mark 102. The positions of the outer peripheral cameras 41b to 41d are adjusted so as to match. At this time, the control unit 10 should move each of the outer peripheral cameras 41b to 41d by determining a relative position between the center position of each photographing range of the outer peripheral cameras 41b to 41d and the reference mark 102 by image analysis. Determine direction and distance traveled. The control unit 10 issues a position control signal CS indicating the moving direction and moving distance of each of the outer peripheral cameras 41b to 41d to the camera unit 40. By such processing, the center position of each photographing range of the outer peripheral cameras 41b to 41d coincides with the reference mark 102.

FIG. 10 is an overhead view of the adjustment reference member 100 and the camera unit 40 after the positions of the outer peripheral cameras 41b to 41d are adjusted. Since the reference mark 102 here is a circle drawn around the reference center point 101, each of the outer peripheral cameras 41b to 41d is adjusted in position on the circumference of the circle.

By the above camera position adjustment process, the outer periphery is positioned at the position of the reference mark 102 formed on the surface of the adjustment reference member 100 so as to have the same positional relationship as the alignment mark formed on the surface of the mold used for pattern transfer. The center positions of the photographing ranges of the cameras 41b to 41d could be matched. By performing such adjustment, in the subsequent pattern transfer process, the center position of each photographing range of the outer peripheral cameras 41b to 41d can be matched with the position of the alignment mark on the mold surface. Further, in the pattern transfer process, the relative position between the mold used during pattern transfer and the transfer substrate is also adjusted by matching the center position of the photographing range of the center camera 41a with the center of the center pin 70 that supports the transfer substrate. be able to.

FIG. 11 is a flowchart showing a substrate mold position adjustment process between the mold and the transfer substrate. 12 and 13 show the transfer unit 20, slide station table 30, camera unit 40, and center pin 70 of the nanoimprint apparatus 1 at each stage in the substrate mold position adjustment process, the upper mold 60 a, the lower mold 60 b, and the transfer substrate 80. It is a schematic diagram represented with. Hereinafter, the substrate mold position adjusting process between the mold and the transfer substrate using the camera unit with the camera position adjusted according to the present invention will be described with reference to FIGS.

First, the upper mold 60a, the lower mold 60b, and the camera unit 40 are installed in the nanoimprint apparatus 1 (step S201, FIG. 12 (a)). Specifically, the upper mold 60a is installed on the lower surface of the upper mold holding portion 21a, the lower mold 60b is installed on the upper surface of the lower mold holding portion 21b, and the camera unit 40 is installed on the upper portion of the slide station table 30.

FIG. 14 is a view showing the upper mold 60a. A through hole 61a is formed at the center of the upper mold 60a. An alignment mark 62a is formed on the surface of the upper mold 60a. An uneven pattern (not shown) for transferring a pattern to the transfer substrate is formed on the surface of the upper mold 60a, and the alignment mark 62b is a circle drawn with the center of the uneven pattern as a reference.

Usually, the alignment mark 62b has the same shape as the alignment mark 62a shown in FIG. That is, when the alignment mark 62a and the alignment mark 62b are overlapped, the center portion of the concavo-convex pattern formed on the upper mold coincides with the center portion of the concavo-convex pattern formed on the lower mold. The uneven pattern for pattern transfer may be different between the upper mold 60a and the lower mold 60b.

Each of the upper mold 60a and the lower mold 60b is made of a light transmissive material such as glass, for example, and the alignment mark 62a and the alignment mark 62b are non-transmissive materials or light transmissive to the surroundings due to diffraction / scattering or the like. The material is formed in a region that can be optically distinguished. Therefore, it can be photographed by the camera unit 40 whether or not the alignment mark 62a and the alignment mark 62b are overlapped when the upper mold 60a and the lower mold 60b are overlapped.

The lower mold 60b is fixed to the upper surface of the lower mold holding portion 21b so that the top of the center pin 70 penetrates the through hole 61b as shown in FIG. 12 (a). Therefore, the position of the center pin 70 can also be photographed by the camera unit 40.

FIG. 15A is an overhead view of the upper mold 60a, the lower mold 60b, and the camera unit 40 when they are installed. At this time, the alignment mark 62a and the alignment mark 62b do not coincide with each other. Further, the center in the shooting range of the central camera 41a and the centers of the upper mold 60a and the lower mold 60b do not coincide with each other, and the center in the shooting range of each of the outer peripheral cameras 41b to 41d and the alignment mark Each of 62a and alignment mark 62b does not match each other.

Next, the relative position of each of the upper mold 60a and the lower mold 60b is adjusted (upper and lower mold relative position adjustment) (step S202, FIG. 12B). Specifically, the position is adjusted so that the alignment mark 62a of the upper mold 60a and the alignment mark 62b of the lower mold 60b overlap each other when viewed from the camera unit 40. At this time, only the outer peripheral cameras 41b to 41d are used without using the central camera 41a.

For example, the administrator adjusts the relative position of the upper and lower molds. The administrator monitors each display image of the outer peripheral cameras 41b to 41d displayed on the display unit 12 based on the photographing signal PD from each of the outer peripheral cameras 41b to 41d, and is displayed on each of the display images. The movement direction of the upper mold holding part 21a is input to the operation part 11 so that the position of the alignment mark 62a and the position of the alignment mark 62b coincide. The control unit 10 issues an upper mold control signal MSa to the upper mold stage 22a in response to the movement direction input. The upper mold stage 22a moves the upper mold holding part 21a in the moving direction indicated by the upper mold control signal MSa. At this time, the upper mold 60a also moves in the same direction by the same distance as the upper mold holding portion 21a moves.

For example, the control unit 10 may adjust the relative position of the upper and lower molds. In this case, the control unit 10 analyzes the image represented by the photographing signal PD from each of the outer peripheral cameras 41b to 41d, and the upper mold holding unit 21a so that the position of the alignment mark 62a matches the position of the alignment mark 62b. Adjust the position. At this time, the control unit 10 analyzes the relative positions of the alignment mark 62a and the alignment mark 62b, and determines the direction and moving distance in which the upper mold holding unit 21a should be moved. The control unit 10 issues an upper mold control signal MSa to the upper mold stage 22a to the effect that the upper mold holding unit 21a should be moved by the moving distance in the determined direction. By such processing, the position of the alignment mark 62a of the upper mold 60a and the position of the alignment mark 62b of the lower mold 60b coincide with each other. In both cases, manual adjustment by the administrator and automatic adjustment by the control unit 10 may be performed by moving the lower mold holding unit 21b. Note that the positions of the alignment mark 62a and the alignment mark 62b after the adjustment are sufficient if they are within the photographing ranges of the outer peripheral cameras 41b to 41d, and are not necessarily located at the center of these photographing ranges.

FIG. 15B is an overhead view of the upper mold 60a, the lower mold 60b, and the camera unit 40 after adjusting the relative positions of the upper and lower molds. At this time, the position of the alignment mark 62a and the position of the alignment mark 62b coincide with each other. It should be noted that the center position within the shooting range of the central camera 41a and the center positions of the upper mold 60a and the lower mold 60b do not coincide with each other, and the center positions within the shooting ranges of the outer peripheral cameras 41b to 41d. Also, the positions of the alignment mark 62a and the alignment mark 62b do not coincide with each other.

Next, the position of the camera unit 40 is adjusted so that the center position of the photographing range of the center camera 41a matches the center position of the center pin 70 (step S203, FIG. 13 (a)). At this time, first, the transfer substrate 80 is supported by the center pin 70 as shown in FIG. The transfer substrate 80 has, for example, a disk shape with a through hole provided at the center, and the center is supported so as to coincide with the pin center 71 of the center pin 70. The diameter of the transfer substrate 80 having a disk shape may be larger or smaller than the diameter of the circle that is the alignment mark 62a and the diameter of the circle that is the alignment mark 62b. On both surfaces of the transfer substrate 80, an upper transfer layer and a lower transfer layer (both not shown) made of a transfer layer material that is cured when irradiated with ultraviolet rays are formed.

After the transfer substrate 80 is supported by the center pin 70, the position of the camera unit 40 is adjusted. Specifically, the position of the camera unit 40 is adjusted so that the center in the shooting range of the central camera 41a matches the pin center 71. At this time, only the central camera 41a is used without using the peripheral cameras 41b to 41d.

For example, the administrator adjusts the center position. In this case, the manager monitors the display image displayed on the display unit 12 based on the photographing signal PD from the central camera 41a, and the intersection of the intersection line LN1 shown in each of the display images and the pin center 71. Are input in the moving direction of the camera unit 40 with respect to the operation unit 11. The control unit 10 issues a unit position control signal US to the slide station table 30 in response to the movement direction input. The slide station table 30 moves the camera unit 40 in the moving direction indicated by the unit position control signal US.

Further, for example, the control unit 10 may adjust the position of the camera unit 40. In this case, the control unit 10 determines that the center of gravity of the image obtained by performing image analysis processing such as binarization processing on the image represented by the shooting signal PD from the center camera 41a is the center of the shooting range of the center camera 41a. The position of the camera unit 40 is adjusted so as to match the position. At this time, the control unit 10 analyzes the relative position between the position of the center of gravity of the image and the center position of the shooting range by the camera unit 40, and determines the direction and moving distance in which the camera unit 40 should move. The control unit 10 issues a unit position control signal US to the slide station table 30 indicating that the camera unit 40 should be moved by the movement distance in the determined direction. By such processing, the center position of the photographing range of the center camera 41a matches the pin center 71 of the center pin 70.

FIG. 16A is an overhead view of the upper mold 60a, the lower mold 60b, the camera unit 40, and the transfer substrate 80 after the position of the camera unit 40 is adjusted. At this time, the center position of the photographing range of the central camera 41a and the pin center 71 coincide with each other. On the other hand, the center of each of the upper mold 60a and the lower mold 60b (the center of the alignment mark 62a and the alignment mark 62b which are circles) and the pin center 71 do not necessarily coincide with each other.

Next, the positions of the upper mold 60a and the lower mold 60b are adjusted (upper and lower mold position adjustment) so that the center position of each photographing range of the outer peripheral cameras 41b to 41d matches the position of the alignment mark 62a (step S204). FIG. 13B). At this time, only the outer peripheral cameras 41b to 41d are used without using the central camera 41a.

For example, the administrator adjusts the upper and lower mold positions. The intersection of the intersection line LN1 shown in the photographing range while monitoring the display image of each of the outer cameras 41b to 41d displayed on the display unit 12 based on the photographing signal PD from each of the outer cameras 41b to 41d. And the movement direction of the upper mold holding part 21a and the lower mold holding part 21b are input to the operation part 11 so that the alignment mark 62a matches. Since the position of the alignment mark 62a and the position of the alignment mark 62b have been adjusted so as to coincide with each other in step S202 described above, the upper mold holding portion 21a and the lower mold holding portion 21b are the same in the same direction. Move only the distance. The control unit 10 issues an upper mold control signal MSa to the upper mold stage 22a and a lower mold control signal MSb to the lower mold stage 22b in accordance with the movement direction input. The upper mold stage 22a moves the upper mold holding part 21a in the moving direction indicated by the upper mold control signal MSa. At the same time, the lower mold stage 22b moves the lower mold holding portion 21b in the moving direction indicated by the lower mold control signal MSb.

Also, for example, the control unit 10 may adjust the vertical mold position. In this case, the control unit 10 analyzes the image represented by the photographing signal PD from each of the outer peripheral cameras 41b to 41d, and the center position of each photographing range of the outer peripheral cameras 41b to 41d matches the position of the alignment mark 62a. Thus, the positions of the upper mold holding part 21a and the lower mold holding part 21b are adjusted. At this time, the controller 10 should move each of the outer peripheral cameras 41b to 41d by determining a relative position between the center position of each photographing range of the outer peripheral cameras 41b to 41d and the alignment mark 62a by image analysis. Determine direction and distance traveled. The control unit 10 issues an upper mold control signal MSa indicating the direction and distance to be moved to the upper mold stage 22a, and a similar lower mold control signal MSb to the lower mold stage 22b. By such processing, the center position of each photographing range of the outer peripheral cameras 41b to 41d coincides with the position of the alignment mark 62a.

FIG. 16B is an overhead view of the upper mold 60a, the lower mold 60b, the camera unit 40, and the transfer substrate 80 after adjusting the upper and lower mold positions. At this time, the center in the photographing range of the central camera 41a and the pin center 71 coincide with each other, and the centers of the upper mold 60a and the lower mold 60b (centers of the alignment marks 62a and 62b that are circles). ) And the pin center 71 coincide with each other.

By the above-described substrate mold position adjustment process, the relative position adjustment of the upper mold 60a, the lower mold 60b, and the transfer substrate 80 can be realized with high accuracy using the camera unit 40. The reason why these relative positions can be adjusted with high accuracy is that the outer periphery is positioned at the position of the reference mark formed on the surface of the adjustment reference member 100 so as to have the same positional relationship as the alignment mark formed on the mold surface. This is because the positions of the cameras 41b to 41d are adjusted in advance.

17 (a) and 17 (b) are overhead views of the camera unit 40 having an arrangement different from the arrangement of the outer peripheral cameras 41b to 41d. For example, as shown in FIG. 17A, each of the outer peripheral cameras 41b to 41d may be arranged so as to be 90 degrees with respect to the central camera 41a. Even when arranged in this way, the same effects as described above can be obtained. In addition, as shown in FIG. 17B, an outer peripheral camera 41e may be further added so that each of the outer peripheral cameras 41b to 41e is disposed at 90 degrees with respect to the central camera 41a. In this case, the accuracy of position adjustment can be improved by adding the outer peripheral camera 41e. The arrangement of the peripheral cameras 41b to 41d is not limited to the arrangement shown in FIGS. 17A and 17B, and the arrangement can be changed as necessary. In any case, the position adjustment of the outer peripheral cameras 41b to 41e and the relative position adjustment between the upper and lower molds and the transfer substrate are performed in the same manner as described above.

18A and 18B show a camera unit at the time of position adjustment of the outer peripheral cameras 41b to 41d when the reference marks 102b to 102d different from the reference mark 102 described above are formed on the surface of the adjustment reference member 100. FIG. 40 is an overhead view of the reference member 40 and the adjustment reference member 100. FIG.

As shown in FIG. 18 (a), the position of the outer peripheral cameras 41b to 41d can be adjusted by using the adjustment reference member 100 formed by using three concentric circles centered on the reference center point 101 as reference marks 102b to 102d. good. In this case, as shown in FIG. 18B, the center of the outer camera 41b in the shooting range is on the reference mark 102b, the center of the outer camera 41c in the shooting range is on the reference mark 102c, and the outer camera 41d is shooting. Position adjustment is performed so that the center in the range is matched with the reference mark 102d. Three concentric circles centered on the center point of the mold are also formed on the surface of the mold used in the subsequent pattern transfer in the same positional relationship as the reference marks 102b to 52d. By doing so, the relative positions of the upper and lower molds and the transfer substrate can be adjusted in the same manner as described above.

19A and 19B show the camera unit 40 and the adjustment reference member 100 when the positions of the outer peripheral cameras 41b to 41d are adjusted when other reference marks 102b to 52d are formed on the surface of the adjustment reference member 100. FIG. FIG.

As shown in FIG. 19A, the positions of the outer peripheral cameras 41b to 41d may be adjusted using an adjustment reference member 100 in which each of the reference marks 102b to 102d is formed as a cross-shaped mark. Also in this case, as shown in FIG. 19 (b), the center in the photographing range of the outer peripheral camera 41b is on the reference mark 102b, the center in the photographing range of the outer peripheral camera 41c is on the reference mark 102c, and the outer peripheral camera 41d. The position is adjusted so that the centers in the image capturing range coincide with the reference marks 102d. Three cross-shaped marks are also formed on the surface of the mold used for the subsequent pattern transfer in the same positional relationship as the reference marks 102b to 102d. By doing so, the relative positions of the upper and lower molds and the transfer substrate can be adjusted in the same manner as described above.

The camera position adjustment process in the above-described embodiment is performed in a state where the camera unit 40 and the adjustment reference member 100 are installed in the nanoimprint apparatus 1, but the camera unit 40 and the adjustment reference member 100 may be used as necessary. The camera position adjustment process may be performed separately from the nanoimprint apparatus 1. This is because the purpose can be achieved if the positions of the outer peripheral cameras 41b to 41d can be adjusted. If the peripheral cameras 41b to 41d are installed in the nanoimprint apparatus 1 after adjusting the photographing position, the relative positions of the upper and lower molds and the transfer substrate can be adjusted.

Claims (10)

A transfer device for forming the pattern on the transferred body by pressing the pattern formed on the mold against the transferred body,
The center of the installation position of the transfer object is photographed through a first target mark, and an alignment mark formed on the mold is located at a position separated from the vertical axis of the installation position of the transfer object. Photographing means for photographing through the target mark;
A transfer apparatus comprising: an adjusting unit that adjusts a positional relationship between a shooting position for shooting through the first target mark and a shooting position for shooting through the second target mark. 2. The transfer apparatus according to claim 1, wherein the adjusting means adjusts positions of the first target mark and the second target mark. 2. The transfer according to claim 1, wherein the photographing unit includes a central camera that photographs a center of an installation position of the transfer object and an outer peripheral camera that photographs an alignment mark formed on the mold. apparatus. 4. The adjustment unit according to claim 3, wherein the central camera and / or the outer peripheral camera is moved to adjust a positional relationship between photographing positions through the first target mark and the second target mark. The transfer apparatus described. 2. The transfer apparatus according to claim 1, wherein a plurality of the outer peripheral cameras are provided. The photographing position for photographing through the first target mark by controlling the adjustment means is the center of the installation position of the transfer object, and the photographing position for photographing through the second target mark is Control means for adjusting a positional relationship between a photographing position for photographing through the first target mark and a photographing position for photographing through the second target mark so as to form an alignment mark formed on the mold. The transfer apparatus according to claim 1. In a transfer apparatus for forming the pattern on the surface of the transferred body by pressing the pattern formed on the mold onto the transferred body, the alignment mark formed on the surface of the mold and the position of the transferred body A camera position adjustment method for adjusting the shooting position of a camera that shoots the center,
Photographing an adjustment reference member having a reference mark and a reference center point having the same positional relationship as the positional relationship between the alignment mark and the center of the installation position of the transfer object with the camera;
A first shooting position adjustment step for adjusting the first shooting position so that the first shooting position of the camera matches the reference center point;
And a second photographing position adjusting step of adjusting the second photographing position so as to make the second photographing position of the camera coincide with the reference mark. The camera has a first target mark for specifying the first shooting position and a second target mark for specifying the second shooting position,
In the first photographing position adjustment step, the first target mark and the reference center point are matched,
The camera position adjustment method according to claim 7, wherein, in the second photographing position adjustment step, the second target mark and the reference mark are matched. The camera consists of a central camera for photographing the first photographing position and an outer peripheral camera for photographing the second photographing position,
The camera position adjustment method according to claim 7, wherein the respective shooting positions are adjusted by adjusting the installation positions of the first camera and the second camera. The camera position adjustment method according to claim 7, wherein the reference mark is at least one circle centered on the reference center point.

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