[go: up one dir, main page]

WO2010077014A3 - 방향족 폴리에스테르 아미드 공중합체, 고분자 필름, 프리프레그, 프리프레그 적층체, 금속박 적층판 및 프린트 배선판 - Google Patents

방향족 폴리에스테르 아미드 공중합체, 고분자 필름, 프리프레그, 프리프레그 적층체, 금속박 적층판 및 프린트 배선판 Download PDF

Info

Publication number
WO2010077014A3
WO2010077014A3 PCT/KR2009/007763 KR2009007763W WO2010077014A3 WO 2010077014 A3 WO2010077014 A3 WO 2010077014A3 KR 2009007763 W KR2009007763 W KR 2009007763W WO 2010077014 A3 WO2010077014 A3 WO 2010077014A3
Authority
WO
WIPO (PCT)
Prior art keywords
prepreg
laminate
aromatic polyester
polyester amide
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2009/007763
Other languages
English (en)
French (fr)
Other versions
WO2010077014A2 (ko
Inventor
구본혁
옥태준
박정원
오영택
크라브주그드미트리
김만종
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lotte Fine Chemical Co Ltd
Original Assignee
Samsung Fine Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Fine Chemicals Co Ltd filed Critical Samsung Fine Chemicals Co Ltd
Priority to CN2009801532722A priority Critical patent/CN102272200B/zh
Priority to JP2011543429A priority patent/JP2012514066A/ja
Publication of WO2010077014A2 publication Critical patent/WO2010077014A2/ko
Publication of WO2010077014A3 publication Critical patent/WO2010077014A3/ko
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/44Polyester-amides
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/0145Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Polyamides (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

방향족 폴리에스테르 아미드 공중합체, 고분자 필름, 프리프레그, 프리프레그 적층체, 금속박 적층판 및 프린트 배선판이 개시된다. 개시된 방향족 폴리에스테르 아미드 공중합체는 전체 반복단위에 대하여 방향족 디올에서 유래하는 반복단위(A) 20~25몰%를 포함하고, 상기 방향족 디올에서 유래하는 반복단위(A)는 레조르시놀에서 유래하는 반복단위(RCN), 및 바이페놀과 하이드로퀴논 중 적어도 1종의 화합물에서 유래하는 반복단위(HQ)를 모두 포함한다.
PCT/KR2009/007763 2008-12-31 2009-12-24 방향족 폴리에스테르 아미드 공중합체, 고분자 필름, 프리프레그, 프리프레그 적층체, 금속박 적층판 및 프린트 배선판 Ceased WO2010077014A2 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2009801532722A CN102272200B (zh) 2008-12-31 2009-12-24 芳香族聚酯酰胺共聚物、高分子膜、预浸料坯、预浸料坯层叠体、金属箔层叠板和印刷线路板
JP2011543429A JP2012514066A (ja) 2008-12-31 2009-12-24 芳香族ポリエステルアミド共重合体、高分子フィルム、プリプレグ、プリプレグ積層体、金属箔積層板及びプリント配線板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2008-0138702 2008-12-31
KR1020080138702A KR101595121B1 (ko) 2008-12-31 2008-12-31 방향족 폴리에스테르 아미드 공중합체, 상기 방향족 폴리에스테르 아미드 공중합체를 채용한 프리프레그와 프리프레그 적층체, 및 상기 프리프레그 또는 프리프레그 적층체를 채용한 금속박 적층판과 프린트 배선판

Publications (2)

Publication Number Publication Date
WO2010077014A2 WO2010077014A2 (ko) 2010-07-08
WO2010077014A3 true WO2010077014A3 (ko) 2010-09-16

Family

ID=42310339

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/007763 Ceased WO2010077014A2 (ko) 2008-12-31 2009-12-24 방향족 폴리에스테르 아미드 공중합체, 고분자 필름, 프리프레그, 프리프레그 적층체, 금속박 적층판 및 프린트 배선판

Country Status (5)

Country Link
JP (1) JP2012514066A (ko)
KR (1) KR101595121B1 (ko)
CN (1) CN102272200B (ko)
TW (1) TW201035168A (ko)
WO (1) WO2010077014A2 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101798237B1 (ko) * 2011-05-06 2017-11-15 심천 워트 어드밴스드 머티리얼즈 주식회사 전방향족 폴리에스테르 아미드 공중합체 수지, 상기 전방향족 폴리에스테르 아미드 공중합체 수지를 포함하는 고분자 필름, 상기 고분자 필름을 포함하는 연성 금속박 적층판, 및 상기 연성 금속박 적층판을 구비하는 연성 인쇄 회로기판
US10787570B2 (en) 2015-09-09 2020-09-29 Sumitomo Chemical Company, Limited Aromatic polyester, liquid aromatic-polyester composition, process for producing aromatic-polyester film, and aromatic-polyester film
CN106633044A (zh) * 2016-11-30 2017-05-10 彭州市运达知识产权服务有限公司 一种液晶聚芳酯及其制备方法
KR102049024B1 (ko) 2017-03-22 2019-11-26 주식회사 엘지화학 반도체 패키지용 수지 조성물과 이를 이용한 프리프레그 및 금속박 적층판

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR920003419B1 (ko) * 1986-10-17 1992-04-30 폴리플라스틱스 가부시끼가이샤 폴리에스테르 수지조성물
JPH07126916A (ja) * 1993-09-03 1995-05-16 Polymer Processing Res Inst サーモトロピック液晶ポリマーフィラメントの製法
US20040061105A1 (en) * 2002-09-30 2004-04-01 St. Lawrence Michael R. Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof
JP2008291168A (ja) * 2007-05-28 2008-12-04 Sumitomo Chemical Co Ltd 液晶ポリマーフィルムの製造方法、及びプリント配線板用基板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6132884A (en) * 2000-01-14 2000-10-17 Ticona Llc Process for producing amorphous anisotrophic melt-forming polymers having a high degree of stretchability and polymers produced by same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR920003419B1 (ko) * 1986-10-17 1992-04-30 폴리플라스틱스 가부시끼가이샤 폴리에스테르 수지조성물
JPH07126916A (ja) * 1993-09-03 1995-05-16 Polymer Processing Res Inst サーモトロピック液晶ポリマーフィラメントの製法
US20040061105A1 (en) * 2002-09-30 2004-04-01 St. Lawrence Michael R. Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof
JP2008291168A (ja) * 2007-05-28 2008-12-04 Sumitomo Chemical Co Ltd 液晶ポリマーフィルムの製造方法、及びプリント配線板用基板

Also Published As

Publication number Publication date
JP2012514066A (ja) 2012-06-21
KR20100080081A (ko) 2010-07-08
CN102272200A (zh) 2011-12-07
KR101595121B1 (ko) 2016-02-17
TW201035168A (en) 2010-10-01
CN102272200B (zh) 2013-11-27
WO2010077014A2 (ko) 2010-07-08

Similar Documents

Publication Publication Date Title
MY143997A (en) Resin composition, prepreg and their uses
EP3805316A4 (en) COMPOSITION OF RESIN, PREPREGNATED, LAMINATED WITH METALLIC FOIL, RESIN FOIL AND PRINTED CARD
EP2578613B8 (en) Epoxy resin composition and pre-preg, support-provided resin film, metallic foil clad laminate plate and multilayer printed circuit board utilizing said composition
AU2002221097A1 (en) Material for insulating substrate, printed board, laminate, copper foil with resin, copper-clad laminate, polyimide film, film for tab, and prepreg
EP2216427A4 (en) COPPER FILM FOR PRINTED SWITCHING AND COPPER COVERED LAMINATE
TW200742520A (en) Resin composition, resin film, coverlay film, interlayer adhesive, metal clad laminate, and multilayer printer circuit board
TWI365886B (en) Epoxy resin composition, prepreg, laminate, and printed wiring board
EP2141198A4 (en) METHOD FOR PRODUCING A RESIN LACQUER WITH A HEAT-CURABLE SEMI-IPN COMPOSITE RESIN, RESIN LACQUER WITH THIS RESIN FOR ONE FITTED LADDER PLATE, AND PREPREG AND METAL-CASE LAMINATE
GB0702992D0 (en) Computer system having customizable printed circuit boards
WO2010077014A3 (ko) 방향족 폴리에스테르 아미드 공중합체, 고분자 필름, 프리프레그, 프리프레그 적층체, 금속박 적층판 및 프린트 배선판
WO2012006156A8 (en) Solventless laminating adhesive for flexible packaging laminations and laminated structures made with the adhesive
AU2003211733A1 (en) Polyamide-imide resin, flexible metal-clad laminate, and flexible printed wiring board
WO2006127046A3 (en) Method and apparatus for safe operation of an electronic firearm sight
TWI372590B (en) Single or multi-layer printed circuit board with improved edge via design
WO2008102113A3 (en) Printed circuit boards
WO2009019968A1 (ja) 多層ポリイミドフィルム、積層板および金属張積層板
WO2010070676A3 (en) Intuitive electronic circuit
GB2466151B (en) Heating system for a double-ovenized oscillator on a single printed circuit board
TW200801111A (en) Resin composition, prepreg, laminate, and wiring board
EP2039715A4 (en) THERMOPLASTIC POLYIMIDE AND LAMINATED POLYIMIDE FOIL AND METAL FILM-COATED POLYIMIDE FOIL USING THE THERMOPLASTIC POLYIMIDE
TW200735730A (en) Resin composite copper foil, printed wiring board, and production process thereof
WO2007115888A3 (de) Verdichteranordnung
WO2010077015A3 (ko) 방향족 폴리에스테르 아미드 공중합체, 고분자 필름, 프리프레그, 프리프레그 적층체, 금속박 적층판 및 프린트 배선판
EP4112294A4 (en) RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FILM COATED LAMINATE BOARD, RESIN SHEET AND PRINTED CIRCUIT BOARD
EP2562195A4 (en) EPOXY RESIN COMPOSITION, PREPREG, METALLIC COATING LAMINATE AND PRINTED BOARD

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200980153272.2

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09836335

Country of ref document: EP

Kind code of ref document: A2

ENP Entry into the national phase

Ref document number: 2011543429

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 09836335

Country of ref document: EP

Kind code of ref document: A2