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WO2010076990A3 - Compositions for an anisotropic conductive film, and anisotropic conductive film using same - Google Patents

Compositions for an anisotropic conductive film, and anisotropic conductive film using same Download PDF

Info

Publication number
WO2010076990A3
WO2010076990A3 PCT/KR2009/007519 KR2009007519W WO2010076990A3 WO 2010076990 A3 WO2010076990 A3 WO 2010076990A3 KR 2009007519 W KR2009007519 W KR 2009007519W WO 2010076990 A3 WO2010076990 A3 WO 2010076990A3
Authority
WO
WIPO (PCT)
Prior art keywords
compositions
anisotropic conductive
conductive film
variety
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2009/007519
Other languages
French (fr)
Korean (ko)
Other versions
WO2010076990A2 (en
Inventor
황자영
어동선
박진성
강정구
이태현
김현영
배상식
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cheil Industries Inc
Original Assignee
Cheil Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cheil Industries Inc filed Critical Cheil Industries Inc
Publication of WO2010076990A2 publication Critical patent/WO2010076990A2/en
Publication of WO2010076990A3 publication Critical patent/WO2010076990A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/445—Block-or graft-polymers containing polysiloxane sequences containing polyester sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2333/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
    • C08J2333/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
    • C08J2333/06—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)

Abstract

Compositions for an anisotropic conductive film of the present invention comprise binder resins, curable ingredients, and conductive particles, wherein said binder resins contain polyester-polysiloxane copolymers. The compositions for an anisotropic conductive film have superior fluidity and initial adhesion, and prevent the film from being peeled off from a variety of objects and thus maintain the initial outer appearance even when the film is used over a long period of time under high temperature/high humidity and thermal impact conditions. The compositions of the present invention have a high reliability against connection resistance. Therefore, the compositions of the present invention improve the reliability of a variety of display devices, and can be widely utilized as compositions for a variety of adhesives.
PCT/KR2009/007519 2008-12-29 2009-12-16 Compositions for an anisotropic conductive film, and anisotropic conductive film using same Ceased WO2010076990A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020080135835A KR101131163B1 (en) 2008-12-29 2008-12-29 Anisotropic conductive film composition for improvement of adhesion and anisotropic conductive film using it
KR10-2008-0135835 2008-12-29

Publications (2)

Publication Number Publication Date
WO2010076990A2 WO2010076990A2 (en) 2010-07-08
WO2010076990A3 true WO2010076990A3 (en) 2010-09-23

Family

ID=42310319

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/007519 Ceased WO2010076990A2 (en) 2008-12-29 2009-12-16 Compositions for an anisotropic conductive film, and anisotropic conductive film using same

Country Status (3)

Country Link
KR (1) KR101131163B1 (en)
TW (1) TWI410474B (en)
WO (1) WO2010076990A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101351617B1 (en) * 2010-12-23 2014-01-15 제일모직주식회사 Anisotropic conductive film
KR101397690B1 (en) * 2010-12-31 2014-05-22 제일모직주식회사 Anisotropic conductive film
CN103928781B (en) * 2013-01-10 2016-09-28 先锋材料科技股份有限公司 Conductive connector, method of manufacture and method of use thereof
WO2015102320A1 (en) * 2014-01-06 2015-07-09 주식회사 동진쎄미켐 Composition for forming conductive film, and conductive film
US20220267659A1 (en) * 2019-08-21 2022-08-25 Amogreentech Co., Ltd. Heat-dissipating plastic
CN114149264A (en) * 2021-12-14 2022-03-08 福建臻璟新材料科技有限公司 Preparation process of in-situ polymerization formed silicon nitride ceramic sheet

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993001248A1 (en) * 1991-07-12 1993-01-21 Minnesota Mining And Manufacturing Company Anisotropic conductive adhesive film
WO2000060614A1 (en) * 1999-04-01 2000-10-12 Mitsui Chemicals, Inc. Anisotropically conductive paste
JP2001291431A (en) * 2000-04-10 2001-10-19 Jsr Corp Composition for anisotropic conductive sheet, anisotropic conductive sheet, method for producing the same, and contact structure using anisotropic conductive sheet
JP2005126569A (en) * 2003-10-23 2005-05-19 Sumitomo Bakelite Co Ltd Anisotropically electrically conductive adhesive, anisotropically electrically conductive adhesive film, and display device
KR100722121B1 (en) * 2006-07-21 2007-05-25 제일모직주식회사 High reliability anisotropic conductive film composition
KR100787740B1 (en) * 2006-12-19 2007-12-24 제일모직주식회사 High reliability anisotropic conductive film composition

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6166722A (en) * 1984-09-11 1986-04-05 Univ Tohoku Thermoplastic elastomer having low modulus
DE102005051579A1 (en) 2005-10-27 2007-05-03 Wacker Chemie Ag Polyester-polysiloxane copolymers and process for their preparation
KR100787727B1 (en) * 2006-10-31 2007-12-24 제일모직주식회사 Composition for highly reliable anisotropic conductive film using styrene-acrylonitrile copolymer

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993001248A1 (en) * 1991-07-12 1993-01-21 Minnesota Mining And Manufacturing Company Anisotropic conductive adhesive film
WO2000060614A1 (en) * 1999-04-01 2000-10-12 Mitsui Chemicals, Inc. Anisotropically conductive paste
JP2001291431A (en) * 2000-04-10 2001-10-19 Jsr Corp Composition for anisotropic conductive sheet, anisotropic conductive sheet, method for producing the same, and contact structure using anisotropic conductive sheet
JP2005126569A (en) * 2003-10-23 2005-05-19 Sumitomo Bakelite Co Ltd Anisotropically electrically conductive adhesive, anisotropically electrically conductive adhesive film, and display device
KR100722121B1 (en) * 2006-07-21 2007-05-25 제일모직주식회사 High reliability anisotropic conductive film composition
KR100787740B1 (en) * 2006-12-19 2007-12-24 제일모직주식회사 High reliability anisotropic conductive film composition

Also Published As

Publication number Publication date
TW201035276A (en) 2010-10-01
KR101131163B1 (en) 2012-03-28
KR20100077793A (en) 2010-07-08
TWI410474B (en) 2013-10-01
WO2010076990A2 (en) 2010-07-08

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