[go: up one dir, main page]

WO2010058520A1 - Dispositif d'ébullition et de refroidissement - Google Patents

Dispositif d'ébullition et de refroidissement Download PDF

Info

Publication number
WO2010058520A1
WO2010058520A1 PCT/JP2009/005577 JP2009005577W WO2010058520A1 WO 2010058520 A1 WO2010058520 A1 WO 2010058520A1 JP 2009005577 W JP2009005577 W JP 2009005577W WO 2010058520 A1 WO2010058520 A1 WO 2010058520A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat receiving
heat
steam
cooling device
pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2009/005577
Other languages
English (en)
Japanese (ja)
Inventor
坂本仁
吉川実
橋口毅哉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP2010539122A priority Critical patent/JP5678662B2/ja
Priority to US13/128,740 priority patent/US9297589B2/en
Publication of WO2010058520A1 publication Critical patent/WO2010058520A1/fr
Anticipated expiration legal-status Critical
Priority to US15/082,143 priority patent/US20160209120A1/en
Ceased legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/0233—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with air flow channels
    • F28D1/024—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with air flow channels with an air driving element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0283—Means for filling or sealing heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H10W40/73—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D2015/0216—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having particular orientation, e.g. slanted, or being orientation-independent

Definitions

  • the present invention relates to a boiling cooling device for cooling semiconductor devices and electronic equipment, and more particularly to a boiling cooling device that circulates a refrigerant by utilizing a phase change phenomenon between gas and liquid.
  • the boiling cooling apparatus described in Patent Document 1 has a thin refrigerant tank having a substantially trapezoidal planar shape and having a boiling space inside.
  • a contact portion with a heating element is provided on the lower surface of the refrigerant tank, and a vapor-side header tank and a liquid-side header tank are provided on the upper surface of the refrigerant tank.
  • the vapor-side header tank and the liquid-side header tank are connected to the internal space of the refrigerant tank. It has been.
  • the header tanks are connected by a plurality of heat radiation tubes. Radiation fins are installed between the radiation tubes.
  • Patent Document 2 discloses a CPU that guides refrigerant vapor from a vaporizer that contacts a CPU, which is a heating element, to a condenser via a vapor flow path, and returns the refrigerant liquefied in the condenser to the vaporizer via a fluid flow path.
  • a cooling device is disclosed. In this cooling device, the condenser is provided with a meandering pipe connected to the heat radiation fin.
  • Patent Document 3 discloses a thermosiphon type heat transfer body.
  • the heat absorption side header block and the heat radiation side header block in which the X direction refrigerant passage and the Y direction refrigerant passage are respectively formed are connected by a plurality of refrigerant pipes. Corrugated fins are installed between the refrigerant pipes.
  • the heat absorption side header block is disposed on the lower side
  • the heat radiation side header block is disposed on the upper side
  • the semiconductor element is brought into close contact with the lower surface of the heat absorption side header block.
  • Patent Document 4 describes a liquid cooling system.
  • the storage container in which the circulating solution for heat exchange and its vapor are stored is provided with a radiator. Furthermore, a part of the storage container outlet and the gas-liquid two-phase fluid inlet are connected by a pipe passing through the storage container.
  • the pipe is connected to the solution delivery port and enters the storage container, the solution delivery pipe part that enters the storage container, the pipe part in the fuser inside the storage container, and the gas-liquid two part that exits from the storage container and is connected to the gas-liquid two-phase fluid inlet. And a phase fluid inlet pipe portion.
  • a heating heat exchanger serving as a heat radiating portion of a heating element such as an electronic device is installed in the gas-liquid two-phase fluid inlet pipe portion.
  • Patent Document 5 discloses a cooling device that is an integrated thermosyphon in which a heat receiving portion and a heat radiating portion are mounted in the same housing.
  • a plurality of condenser tubes are arranged on a boiler plate having a plurality of pyramidal fins formed on the surface.
  • a steam chamber is formed between the condenser tube and the boiler plate.
  • the condenser pipe is sandwiched between the heat dissipating convolution fins. The steam generated in the steam chamber goes up the condenser pipe and is liquefied on the wall surface.
  • JP 2000-183259 A (FIGS. 1 to 3) JP 2002-168547 A (FIG. 1) JP 2003-166793 A (FIGS. 1 to 5) Japanese Patent Laying-Open No. 2005-195226 (FIG. 1) JP 2004-056121 A (FIGS. 1 to 4)
  • the vapor flow path and the liquid flow path are installed substantially perpendicularly to the ceiling of the refrigerant tank that is thin and has a flat ceiling.
  • the vapor flow path and the liquid flow path are installed substantially perpendicularly to the ceiling of the refrigerant tank that is thin and has a flat ceiling.
  • the pressure loss for the steam flow increases, the pressure difference between the upper and lower sides of the steam channel increases, and the temperature difference between the upper and lower sides of the steam channel increases accordingly, leading to a decrease in the performance of the cooler. It becomes.
  • the vapor channel and the liquid channel are opened on the same plane of the refrigerant tank, in other words, in the structure in which the liquid channel is opened on the vapor space of the refrigerant tank, the vapor is on the liquid channel side. In other words, the liquid proceeds in the opposite direction to the liquid flowing down in the liquid flow path, and the smooth circulation of the cooling liquid is hindered.
  • the pipe portion through which only the refrigerant liquid circulates and the pipe portion through which the refrigerant liquid containing a large amount of steam passes are configured with the same thickness, and the refrigerant transport capability is high. It varies greatly depending on the pipe part. For this reason, resistance will be produced in the circulation of the steam after all, and the smooth circulation of the steam may be hindered. Many of the parts to be cooled have a plate shape, but in the cooling device of Patent Document 4, the heat absorption part is a tubular body. For this reason, since the contact between the heat-absorbing part of the cooling device and the object to be cooled does not become a surface contact, the thermal resistance therebetween increases, making it difficult to perform efficient cooling.
  • the object of the present invention is to solve the above-mentioned problems of the prior art, and the object is to achieve a trade-off, which is to keep the pressure loss of the refrigerant circulation system low while maximizing the heat dissipation to the outside of the apparatus.
  • An object of the present invention is to provide a boiling cooling device capable of achieving both functions that have been considered.
  • the boiling cooling apparatus boiles a liquefied refrigerant into steam, and a heat receiving unit that contacts the cooled device and cools the cooled device;
  • a steam pipe connected to the upper part of the heat receiving part and carrying the steam generated in the heat receiving part, a heat radiating part for radiating heat to the atmosphere while condensing the vapor carried from the steam pipe into a liquefied refrigerant, and a heat radiating part
  • the boil cooling device boiles the liquefied refrigerant into steam, and also receives the heat receiving unit that contacts the device to be cooled and cools the device to be cooled.
  • a steam pipe that transports the steam generated in the heat receiving section, a heat radiating section that dissipates heat to the atmosphere while condensing the steam transported from the steam pipe into a liquefied refrigerant, and liquefied condensed in the heat radiating section
  • a liquid pipe for returning the refrigerant to the heat receiving part, and the steam pipe is drawn from the heat receiving part side in a direction parallel to the direction of gravity, and is bent in a direction nearly horizontal toward the heat radiating part.
  • the first effect of the embodiment of the present invention is that the pressure loss in the circulation system of the entire boiling cooler can be reduced to the maximum.
  • the second effect of the embodiment of the present invention is that, in a separate-type boiling cooling device in which the heat receiving portion and the heat radiating portion are separated, the heat radiating portion is isolated from the heat receiving portion and direct heat radiating to the outside of the cooling device. It is possible to prevent the backflow of the condensed refrigerant inside the vapor pipe while taking advantage of the possible separation method.
  • FIG. 3B is a sectional view taken along line AA in FIG. 3A. It is a figure which shows the general vertical-type steam pipe which connects a heat receiving part and a thermal radiation part. It is a figure which shows the horizontal transition type
  • mold steam pipe which connects the heat receiving part and the thermal radiation part in the 1st Embodiment of this invention. It is a cross-sectional view which shows the heat receiving part of the 2nd Embodiment of this invention.
  • FIG. 11B is a sectional view taken along line AA in FIG. 11A. It is a top view of a circular bottom plate.
  • FIG. 11C is a cross-sectional view taken along line AA in FIG. 11C. It is a top view of a square-shaped side wall part.
  • FIG. 12B is a sectional view taken along line AA in FIG. 12A. It is a top view of a circular-shaped side wall part.
  • FIG. 12C is a cross-sectional view taken along line AA in FIG. 12C. It is a top view of a disk-shaped cover part. It is sectional drawing of a disk-shaped cover part. It is a top view of a truncated cone-shaped cover part. It is sectional drawing of a frustoconical cover part.
  • FIG. 1 is a schematic view showing a boiling cooling apparatus according to a first embodiment of the present invention.
  • the boiling cooling device has a heat receiving part 1, a steam pipe 2, a heat radiating part 3, a liquid pipe 4, a cooling fan 6, and a refrigerant inlet 7.
  • the upper part of the heat receiving part 1 and the upper part of the heat radiating part 3 are connected by a steam pipe 2.
  • the liquid pipe 4 drawn out from the lower part of the heat radiating unit 3 is connected to the side surface of the heat receiving unit 1.
  • the cover part of the heat receiving part 1 has a truncated pyramid shape.
  • the steam pipe 2 drawn vertically from the top of the heat receiving part 1 is bent in an arc shape and connected to the heat radiating part 3 in a horizontal state. That is, the steam pipe 2 has a first end connected to the heat receiving unit 1 and a second end connected to the heat radiating unit 3.
  • the direction of the central axis of the steam pipe 2 is substantially parallel to the direction of gravity in the vicinity of the first end.
  • the direction of the central axis of the steam pipe 2 is substantially perpendicular to the direction of gravity in the vicinity of the second end.
  • the bottom surface of the heat receiving unit 1 is flat. On the bottom surface of the heat receiving unit 1, for example, a heating element 5 which is a semiconductor device is disposed in close contact.
  • a refrigerant inlet 7 is provided in the upper part of the heat radiating section 3 for initial refrigerant injection or refrigerant injection for replenishment.
  • a cooling fan 6 for cooling the heat radiating unit 3 is installed on the side of the heat radiating unit 3.
  • the refrigerant boils inside the heat receiving portion 1 facing the heat generating element 5, and the vapor generated thereby travels toward the outlet to the steam pipe 2.
  • the heat receiving portion 1 is formed such that the steam flow path gradually narrows toward the steam pipe 2.
  • the steam pipe 2 is opened at a position directly above the heating element 5. With this structure, the steam generated in the heat receiving unit 1 is introduced into the steam pipe 2 with low resistance by effectively using the momentum of the boiling bubble flow.
  • the steam pipe 2 carries the steam toward the heat radiating section 3 along the arrow 8 by changing the angle gently.
  • the fact that the steam pipe 2 is connected to the upper side surface of the condensing unit 3 is considered to be a favorable condition for ensuring the performance of the heat radiating unit 3.
  • the steam introduced into the heat radiating section 3 flows from the top to the bottom inside the heat radiating section 3 and returns to the liquid.
  • the refrigerant that has returned to the liquid stays in the lower part of the heat dissipating part 3, travels in the liquid pipe 4 in the direction of arrow 9, and returns to the heat receiving part 1.
  • FIG. 2 is a cross-sectional view of the heat receiving portion 1.
  • the heat receiving part 1 has a main body part 1a, a steam outflow part 1c, a cover part 1b, and a condensate inflow part 1d.
  • the main body 1a has a box shape, and the planar shape is a quadrangle.
  • the cover part 1b has a truncated pyramid shape and is provided between the main body part 1a and the steam outlet part 1c.
  • the condensate inflow portion 1d is formed on the side surface of the main body 1a.
  • the liquid refrigerant 11 returning from the condenser (heat radiating unit 3) flows from the side surface of the heat receiving unit 1 through the condensate inflow unit 1d.
  • the refrigerant liquid 12 stays inside the heat receiving unit 1.
  • the refrigerant liquid 12 boils by the heat of the heat generating element 5 such as an electronic device installed in the lower part of the heat receiving unit 1, and generates a boiling bubble 13.
  • the generated steam 10 flows out from the upper steam outlet 1c to the steam pipe 2.
  • the pipe diameter of the steam pipe 2 is set larger.
  • the mass-based flow rates are the same everywhere, but the volume-based flow rates are very different. This is because the density varies greatly between liquid and gas.
  • the small diameter of the liquid pipe 4 connected to the heat receiving unit 1 has an effect of preventing the mixing of steam.
  • the heat receiving unit 1 includes a liquid pipe 4 having a small diameter connected to the side surface of the heat receiving unit 1 and a relatively large diameter connected to the upper part of the heat receiving unit 1 as shown in FIG. Most preferably, it has a structure connected to the steam pipe 2. With this structure, a check valve that prevents backflow or minimizes the influence of backflow in accordance with measures for preventing backflow of the liquid phase in the steam pipe 2 described below is provided. Can be realized without.
  • FIG. 3A is a side view showing the structure of the heat dissipating section 3 in the present embodiment.
  • 3B is a cross-sectional view taken along line AA in FIG. 3A.
  • the heat radiating section 3 includes a heat radiating section header 3a, a condensate retaining section 3b, a vapor / condensate cylinder 3c, a vapor / condensate flow path 3c ′, a cooling fin 3d, a steam inlet 3e, and a condensate outlet. 3f and a frame 3g.
  • a steam inlet 3e is fixed to the heat dissipating part header 3a.
  • a condensate outlet 3f is fixed to the condensate retention part 3b.
  • the heat dissipating part header 3a and the condensate retaining part 3b are connected by a steam / condensate cylinder 3c.
  • the steam / condensate flow path 3c ′ is formed in the steam / condensate cylinder 3c, and the steam and the condensate flow therethrough.
  • the cooling fins 3d are installed between the frame 3g and the steam / condensate tube 3c and between the steam / condensate tube 3c.
  • the steam that has flowed into the heat radiating section header 3a from the steam pipe 2 through the steam inlet 3e hits the opposite surface of the surface on which the steam inlet 3e is provided and diffuses left and right (that is, in the direction of the arrow in FIG. 3B). .
  • a method such as water repellent treatment of the inner wall surface is conceivable, but its effectiveness is not high for a highly wettable refrigerant. Therefore, one of the best methods is to form the refrigerant flow path in a nearly vertical state and discharge the refrigerant to the condensate retention part 3b with gravity.
  • the heat radiation part 3 is provided with a refrigerant inlet 7.
  • the refrigerant is injected, it is necessary to eliminate the non-condensable gas inside the boiling cooling device. Since the gas has a lower density than the refrigerant liquid, it is necessary to suck the gas from the upper part in the direction of gravity. The problem is where to provide the refrigerant inlet 7.
  • the refrigerant inlet 7 is optimally installed at a position where the refrigerant circulation is less affected after the boiling cooling device is sealed. Therefore, if the refrigerant inlet 7 is provided at the corner of the heat radiating section header 3a, the non-condensable gas can be effectively exhausted and the influence on the flow of steam after sealing can be reduced.
  • FIG. 4A is a generally used system in which the heat receiving unit 1 and the heat radiating unit 3 are connected by a vertical steam pipe 2.
  • the steam is efficiently sent to the heat radiating section 3 (condensing section) along the arrow 8 indicating the steam flow direction. It is thought that it can be moved. Further, since the steam pipe 2 is not bent, it is also attractive that the pressure loss resulting therefrom is small.
  • the vapor in contact with the inner wall of the vapor pipe 2 may condense, and such liquefied refrigerant starts to fall along the inner wall in the direction of arrow 9 and tries to return to the heat receiving unit 1.
  • it since it flows in the opposite direction to the flow of the steam, it becomes resistance to both the steam and the condensate.
  • the pressure loss for the steam is large and the large pressure loss can induce more condensation in the tube. Therefore, the system flow may become unstable when the amount of steam generated in a high heat generation state is large.
  • a method of connecting the heat receiving portion 1 and the heat radiating portion 3 with an arc-shaped (horizontal transition type) steam pipe 2 shown in FIG. 4B will be considered.
  • the horizontal transition type shown in FIG. Condensation itself may occur inside the steam pipe 2.
  • the steam pipe 2 has a structure in which the latter half (the heat radiating part 3 side of the steam pipe 2) extends in a state of being almost horizontal. For this reason, even when a part of the vapor is condensed in the latter half of the vapor pipe 2, the liquefied refrigerant is pushed by the vapor flow traveling in the direction of the arrow 8 and sent to the condensing unit in the direction of the arrow 9 to the evaporation unit. There will be no return.
  • FIG. 5A is a cross-sectional view showing a heat receiving portion according to the second embodiment of the present invention.
  • FIG. 5B is a longitudinal sectional view showing a heat receiving part of the second embodiment of the present invention.
  • the same reference numerals are given to the same parts as those in the heat receiving part of the first embodiment shown in FIG. 2, and duplicate descriptions are omitted.
  • a plurality of boiling promotion fins (boiling promotion plates, also simply referred to as fins) 14 are installed on the inner bottom surface of the main body 1 a of the heat receiving unit 1.
  • Arrow 16 indicates the liquid flow direction.
  • Arrow 17 indicates the direction of steam flow.
  • the liquid phase refrigerant 11 flows into the heat receiving portion 1, it flows in between the boiling promotion fins 14 formed along the flow, as indicated by an arrow 16.
  • a refrigerant flow is formed between the boiling promotion fins 14. Further, since the bubbles flow vigorously between the boiling promotion fins 14 when the boiling bubbles rise, heat transfer is promoted by the convection effect.
  • FIG. 6A is a cross-sectional view showing a heat receiving portion of a third embodiment of the present invention.
  • FIG. 6B is a longitudinal sectional view showing a heat receiving part of the third embodiment of the present invention.
  • the same reference numerals are assigned to the same parts as those in the heat receiving part of the second embodiment shown in FIGS. 5A and 5B, and duplicate descriptions are omitted.
  • the planar shape of the heat receiving part 1 is an ellipse.
  • the cover portion 1b Since the main body portion 1a of the heat receiving portion 1 has an elliptical shape, the cover portion 1b has an elliptic frustum shape. Since the heat receiving part 1 has an elliptical shape, the flow of steam becomes smoother.
  • the planar shape of the heat receiving portion 1 may be a circle instead of an ellipse, and the shape can be appropriately selected according to the shape of the heat generating element 5 to be cooled.
  • FIG. 7 is a longitudinal sectional view showing a heat receiving portion of the fourth embodiment of the present invention.
  • the same reference numerals are assigned to the same parts as those of the heat receiving part of the second embodiment shown in FIGS. 5A and 5B, and a duplicate description is omitted.
  • the boiling promotion fins 14 that promote the boiling of the refrigerant are formed using a porous material. When porous fins are used, the amount of foam from the pores increases and the amount of heat transfer also improves.
  • FIG. 8 shows an enlarged view of a full porous (trade name) manufactured by Furukawa Sky Co., Ltd. as an example of a porous material.
  • FIG. 9 shows an enlarged view of Alporus (trade name) manufactured by Shinko Steel Wire Co., Ltd. These are all porous materials made of aluminum. These materials can be suitably used for the boiling promotion fins 14.
  • FIG. 10 is a longitudinal sectional view showing a heat receiving part of the fifth embodiment of the present invention.
  • the same reference numerals are assigned to the same parts as those of the heat receiving part of the second embodiment shown in FIGS. 5A and 5B, and a duplicate description is omitted.
  • the connection part of each part of the heat receiving part is bent suddenly at a certain angle. In this case, the flow around the corner may not follow the shape of the corner suddenly and may cause a pressure loss.
  • FIG. 10 is a longitudinal sectional view showing a heat receiving part of the fifth embodiment of the present invention.
  • the corners between the main body 1a and the cover 1b of the heat receiving part and between the cover 1b and the steam outflow part 1c are provided as shown in FIG. It is tied to draw a smooth curve. That is, the connection part of the main-body part 1a and the cover part 1b in the heat receiving part 1 is formed in the streamline type. Moreover, the connection part of the cover part 1b and the vapor
  • the refrigerant evaporates, and the steam generated by the boiling flows to the upper part opposite to the direction of gravity by buoyancy.
  • a steam pipe 2 is connected to the upper part of the heat receiving unit 1.
  • the refrigerant vapor is sent to the heat radiating section (heat exchanging section) 3 through the steam pipe 2 without impairing the momentum of the steam generated by buoyancy.
  • the heat radiating unit 3 the refrigerant is liquefied and condensed by removing heat from the refrigerant.
  • the condensed liquid refrigerant returns from the lower part of the heat radiating part 3 to the liquid refrigerant in the heat receiving part (boiling part) 1 through the liquid pipe 4.
  • the outer bottom face is planar, and the boiling surface which is the inner bottom face is formed planarly.
  • the heat receiving unit 1 can receive boiling heat using the entire surface of the semiconductor package.
  • the conventional heat pipe has a heat receiving structure on the side surface of a circular or elliptical pipe, whereas the heat receiving structure of the embodiment of the present invention can transfer heat preferentially.
  • the planar heat receiving structure is also advantageous in constructing a structure that efficiently transfers heat from the package to the refrigerant and promotes a gas phase change of the refrigerant.
  • Boiling bubbles generated on a flat boiling surface flow at a certain speed to the upper part in the direction opposite to the direction of gravity. Since the cross-sectional area of the steam pipe (tube) 2 connected to the heat radiating unit 3 is smaller than the area of the boiling surface, the entire boiling cooling device can be made compact. In order to efficiently flow the generated steam bubble flow to the steam pipe 2, the upper side wall of the heat receiving portion 1 has a gradually reducing cross-sectional area of the steam channel like a truncated cone or a square frustum. Therefore, the pressure loss from the boiling surface to the steam pipe 2 can be minimized.
  • the steam pipe 2 is bent laterally with respect to the gravitational direction immediately after the connection portion with the heat receiving portion 1 and sent to the heat radiating portion (condensing portion) 3.
  • the heat radiating unit 3 and the heat receiving unit 1 are installed in a direction transverse to the direction of gravity. Even if condensation occurs inside the vapor pipe 2, the liquid refrigerant is sent to the heat radiating section 3 along the flow of the vapor (see FIG. 4B), and the stay in the vapor pipe 2 can be suppressed.
  • the heat radiating section 3 has a portion where the steam pipe 2 is bent and reaches the upper entrance, and the condensed liquid phase is refluxed from the lower portion of the heat radiating section 3 to the heat receiving section 1.
  • the liquefied refrigerant from the heat radiating unit 3 is discharged into the liquefied refrigerant in the heat receiving unit (boiling unit) 1.
  • the reflux of the liquid phase from the heat radiating unit 3 to the heat receiving unit 1 depends on the flow due to gravity.
  • the pressure difference is kept small by reducing the height difference. As a result, the pressure loss can be further reduced.
  • the height of the bottom surface of the heat radiating unit 3 is slightly higher than the height of the liquid level of the liquefied refrigerant in the heat receiving unit 1. Due to this height difference, the liquefied refrigerant can be returned to the heat receiving section 1.
  • FIGS. 2 and 5A to 7 The heat receiving portion shown in FIGS. 2 and 5A to 7 will be described.
  • the main body 1a of the heat receiving portion 1 is composed of a bottom plate 1a 1 and a side wall portion 1a 2.
  • FIG. 11A is a plan view of the bottom plate 1a 1 when the bottom plate is square.
  • FIG. 11B is a cross-sectional view taken along the line AA in FIG. 11A.
  • FIG. 11C is a plan view of the bottom plate 1a 1 when the bottom plate is circular.
  • FIG. 11D is a cross-sectional view taken along line AA in FIG. 11C.
  • FIG. 12A is a plan view of the side wall 1a 2 when the side wall is a quadrangle.
  • 12B is a cross-sectional view taken along line AA in FIG. 12A.
  • FIG. 12C is a plan view of the side wall 1a 2 when the side wall is circular.
  • 12D is a cross-sectional view taken along line AA in FIG. 12C.
  • 13A and 13B are a plan view and a cross-sectional view, respectively, of the cover portion 1b when the cover portion has a disk shape.
  • 13C and 13D are a plan view and a cross-sectional view, respectively, of the cover portion 1b when the shape of the cover portion is a truncated cone shape.
  • the bottom plate 1a 1 of the heat receiving unit 1 is desirably made of a material having high thermal conductivity so as to be in contact with the heating element 5.
  • a material having high thermal conductivity is preferable, such as copper and aluminum.
  • the first purpose is to generate a boiling bubble, and it is necessary to efficiently discharge the vapor while supplying the liquid necessary for continuously boiling.
  • the surface tension is generally smaller than that of water, and the diameter of bubbles formed at the time of boiling is around 1.0 mm. In such a case, it is not desirable to make the distance between the boiling promoting fins 14 extremely narrow and less than the diameter of the bubbles, and it is desirable to make it about the diameter of the bubbles or more.
  • the heat dissipation amount can be increased as the surface area of the boiling promotion fins 14 increases, if the distance between the boiling promotion fins 14 is too large, the number of boiling promotion fins 14 that can be formed is limited. Further, the amount of heat passing through the inside of the boiling promotion fin 14 depends on the thickness of the boiling promotion fin 14.
  • the best structure for boiling promotion fins 14 is a distance between fins of 1.0 mm, a fin thickness of 1.0 to 2.0 mm, and a fin height of 1.0 to 5.0 mm. If the fin structure has an aspect ratio of about 1: 5 on the millimeter scale, it is one of good methods to manufacture by cutting.
  • the boiling promotion fins 14 and the bottom plate 1a 1 inside the heat receiving part 1 are integrally formed, it is possible to reduce the thermal resistance generated at their connecting parts as compared with the case where they are separately formed and combined.
  • 11A to 11D show an example in which the boiling promotion fins 14 and the bottom plate 1a 1 are integrally formed.
  • the bottom surface of the bottom plate 1a 1 is smoothed, and the porous body is joined to the smoothed bottom surface by brazing or the like. Is preferred. While any porous material exemplified that in FIGS. 8 and 9 is made of aluminum, in this case, it is preferable that the bottom plate 1a 1 using the same aluminum.
  • the side surface portion 1a 2 is formed using a material having high thermal conductivity (copper, aluminum). Screwing the threads of the engraved by condensate inlet portion 1d on the side surface portion 1a 2.
  • the bottom plate 1a 1 and the side surface portion 1a 2 are joined by means such as brazing to form the main body portion 1a of the heat receiving portion 1.
  • the cover portion 1b shown in FIGS. 13A to 13D formed using a material having high thermal conductivity is joined to the main body portion 1a by means such as brazing to create the heat receiving portion 1. As shown in FIGS.
  • a steam outflow portion 1c with a thread engraved in advance is screwed into the cover portion 1b.
  • the cover part 1b is previously formed integrally with the vapor
  • the heat dissipating part 3 is mainly configured by a heat dissipating part header 3a, a condensate retaining part 3b, a steam / condensate liquid cylinder 3c, and a heat dissipating fin 3d.
  • This basic structure is similar to a radiator used in automobiles.
  • the steam inlet 3e is preferably connected at a right angle from the center of the heat radiation portion header 3a.
  • the steam flowing into the heat radiating portion header 3a can be diffused so as to collide with the wall on the back side of the heat radiating portion header 3a and fill the heat radiating portion header 3a.
  • the pressure inside the heat radiating section header 3a can be made constant, and therefore the flow rate of each steam / condensate flow path 3c ′ can be made uniform.
  • the vapor / condensate flow tube 3c is preferably as thin as possible from the viewpoint of heat dissipation, but needs a certain thickness from the viewpoint of the flow of the condensed refrigerant.
  • condensation relies on gravity-dependent liquid phase exclusion capabilities.
  • the condensed refrigerant forms a thin liquid phase on the inner wall of the vapor / condensate flow tube 3c and is discharged to the condensate retention part 3b side by gravity.
  • vapor may be trapped as bubbles in the condensed liquid phase. In such a case, resistance to the discharge of the liquid phase occurs.
  • the flow path width of the steam / condensate flow tube 3c is minimized as much as possible.
  • the width of the inner surface of the flow path of the steam / condensate flow tube 3c is 0.3 mm or more, and the width of the inner surface of the flow path of the steam / condensate flow tube 3c is 1.0 mm from the viewpoint of heat dissipation. It is preferable that it is below mm.
  • the polymer material is highly flexible but has water permeability, and the refrigerant leaks through the pipe wall surface.
  • a polymer material with low water permeability like butyl rubber
  • a polymer pipe material with a metal thin film laminated and keep the flexibility with a bellows shape.
  • Adoption of metal piping materials is good. It is preferable to provide an inflow / outflow nozzle at a position where the pipe is connected to the heat receiving section 1 and the heat radiating section 3 and to connect the piping material. Since there is a risk of refrigerant leakage even through the interface between the connection portion and the piping material, it is desirable to seal the connection portion with an adhesive.
  • the refrigerant is injected and the internal air is removed through the refrigerant inlet 7.
  • the inside of the cooler becomes the saturated vapor pressure of the refrigerant.
  • the saturated vapor pressure is preferably as close to 1 atm as possible. The reason why the temperature greatly deviates from 1 atm is because it is necessary to increase the strength of the cooler.
  • Novec manufactured by 3M which is a kind of fluorine-based refrigerant, has a boiling point of 47 ° C. at atmospheric pressure and a saturated vapor pressure of about 40 kPa at room temperature.
  • the refrigerant is a boiling cooling device according to the embodiment of the present invention. Is good. While the present invention has been described with reference to the embodiments, the present invention is not limited to the above embodiments. Various changes that can be understood by those skilled in the art can be made to the configuration and details of the present invention within the scope of the present invention.
  • the present invention can be applied to a boiling cooling device. According to this boiling cooling device, It is possible to achieve both the function of suppressing the pressure loss of the refrigerant circulation system to a low level while maximizing the heat radiation to the outside of the apparatus.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

L'invention divulgue un dispositif d'ébullition et de refroidissement, comprenant une section de réception de chaleur pour porter à ébullition un réfrigérant liquéfié afin de convertir le réfrigérant liquéfié en vapeur et de refroidir un dispositif à refroidir en le mettant en contact avec le dispositif à refroidir, un tube de vapeur qui se connecte à la partie supérieure de la section de réception de chaleur et qui transporte la vapeur générée par la section de réception de chaleur, une section de dissipation de chaleur pour dissiper la chaleur dans l'atmosphère tout en condensant la vapeur, qui est transportée à partir du tube de vapeur, afin de convertir la vapeur en un réfrigérant liquéfié, et un tube de liquide pour renvoyer à la section de réception de chaleur le réfrigérant liquéfié condensé par la section de dissipation de chaleur. Au moins  une partie de la surface de la section transversale du chemin d'écoulement de la vapeur dans la section de réception de chaleur est progressivement réduite à partir de la partie inférieure de la section de réception de chaleur en direction de la partie supérieure de la section de réception de chaleur.
PCT/JP2009/005577 2008-11-18 2009-10-22 Dispositif d'ébullition et de refroidissement Ceased WO2010058520A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010539122A JP5678662B2 (ja) 2008-11-18 2009-10-22 沸騰冷却装置
US13/128,740 US9297589B2 (en) 2008-11-18 2009-10-22 Boiling heat transfer device
US15/082,143 US20160209120A1 (en) 2008-11-18 2016-03-28 Boiling heat transfer device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008294282 2008-11-18
JP2008-294282 2008-11-18

Publications (1)

Publication Number Publication Date
WO2010058520A1 true WO2010058520A1 (fr) 2010-05-27

Family

ID=42197964

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2009/005577 Ceased WO2010058520A1 (fr) 2008-11-18 2009-10-22 Dispositif d'ébullition et de refroidissement

Country Status (3)

Country Link
US (2) US9297589B2 (fr)
JP (2) JP5678662B2 (fr)
WO (1) WO2010058520A1 (fr)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012053624A1 (fr) * 2010-10-19 2012-04-26 日本電気株式会社 Dispositif de refroidissement et son procédé de fabrication
JP2012514855A (ja) * 2009-01-06 2012-06-28 マサチューセッツ インスティテュート オブ テクノロジー 熱交換器および関連方法
WO2012141321A1 (fr) * 2011-04-11 2012-10-18 日本電気株式会社 Structure de joint et dispositif de refroidissement
WO2013018667A1 (fr) * 2011-08-01 2013-02-07 日本電気株式会社 Dispositif de refroidissement et dispositif électronique l'utilisant
WO2013051363A1 (fr) 2011-10-06 2013-04-11 株式会社Ihi Composition magnétique et procédé de production associé
JP2013130331A (ja) * 2011-12-21 2013-07-04 Toshiba Corp 気泡駆動冷却装置
US20130219954A1 (en) * 2010-11-02 2013-08-29 Nec Corporation Cooling device and method for producing the same
ES2394878R1 (es) * 2011-06-15 2013-09-25 Torrelles Albert Puig Dispositivo de aprovechamiento termico
WO2013140761A1 (fr) * 2012-03-22 2013-09-26 日本電気株式会社 Structure de refroidissement pour substrat électronique et dispositif électronique l'utilisant
JP2013245903A (ja) * 2012-05-29 2013-12-09 Toyama Univ 高温液体の冷却装置
WO2014049805A1 (fr) * 2012-09-28 2014-04-03 株式会社 日立製作所 Système de refroidissement et dispositif électrique l'utilisant
JP2014074568A (ja) * 2012-10-05 2014-04-24 Fujitsu Ltd ループ型サーモサイフォン及び電子機器
JP2015090247A (ja) * 2013-11-06 2015-05-11 富士通株式会社 ループヒートパイプ及び情報処理装置
US9297589B2 (en) 2008-11-18 2016-03-29 Nec Corporation Boiling heat transfer device
JPWO2014045714A1 (ja) * 2012-09-19 2016-08-18 日本電気株式会社 冷却装置、それに使用される受熱部、沸騰部、その製造方法
US9468621B2 (en) 2011-10-04 2016-10-18 Ihi Corporation Metal-salen complex compound responsive drug and intra-corporeal behavior control system for metal-salen complex compound
JP2016205785A (ja) * 2015-04-28 2016-12-08 株式会社豊田中央研究所 媒体輸送システム、蓄熱システム及びヒートポンプ
JPWO2015107899A1 (ja) * 2014-01-16 2017-03-23 日本電気株式会社 冷却装置及び電子装置
WO2017110740A1 (fr) * 2015-12-25 2017-06-29 日本電気株式会社 Dispositif de dissipation de chaleur, dispositif de refroidissement à changement de phase dans lequel celui-ci est utilisé, et procédé de dissipation de chaleur
WO2020137822A1 (fr) * 2018-12-26 2020-07-02 Ｎｅｃプラットフォームズ株式会社 Dispositif de refroidissement et procédé de fabrication de dispositifs de refroidissement
WO2022209359A1 (fr) * 2021-04-01 2022-10-06 三菱重工業株式会社 Système de refroidissement

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2677261B1 (fr) * 2012-06-20 2018-10-10 ABB Schweiz AG Système de refroidissement biphasé pour composants électroniques
TWI494051B (zh) 2012-11-19 2015-07-21 宏碁股份有限公司 流體熱交換裝置
JP6237761B2 (ja) * 2013-02-26 2017-11-29 日本電気株式会社 電子機器冷却システム及び電子機器冷却システムの製造方法
JPWO2014192279A1 (ja) * 2013-05-29 2017-02-23 日本電気株式会社 冷却装置およびその製造方法
JP6353682B2 (ja) * 2014-04-01 2018-07-04 昭和電工株式会社 沸騰冷却装置
EP3236186B1 (fr) * 2014-12-02 2022-09-28 Beijing Institute of Spacecraft System Engineering Dispositif et procédé pour essayer la compatibilité d'une boucle de fluide à deux phases mû par gravité
US10480865B2 (en) * 2015-02-19 2019-11-19 J R Thermal LLC Intermittent thermosyphon
TWI650522B (zh) * 2015-05-21 2019-02-11 萬在工業股份有限公司 冷媒式散熱裝置
WO2016208180A1 (fr) * 2015-06-26 2016-12-29 パナソニックＩｐマネジメント株式会社 Dispositif de refroidissement et appareil électronique comportant celui-ci monté dessus
WO2017170153A1 (fr) * 2016-03-31 2017-10-05 日本電気株式会社 Refroidisseur à changement de phase et équipement électronique
GB2549946A (en) * 2016-05-03 2017-11-08 Bitfury Group Ltd Immersion cooling
TWI650520B (zh) * 2017-08-02 2019-02-11 萬在工業股份有限公司 相變化蒸發器及相變化散熱裝置
US10483727B2 (en) 2017-09-01 2019-11-19 Eaton Intelligent Power Limited Cooling system for tanks
US20190154352A1 (en) * 2017-11-22 2019-05-23 Asia Vital Components (China) Co., Ltd. Loop heat pipe structure
US10568238B1 (en) * 2018-08-10 2020-02-18 Facebook, Inc. Modular network switch
JP7204374B2 (ja) 2018-08-13 2023-01-16 新光電気工業株式会社 ループ型ヒートパイプ及びその製造方法
KR20200052722A (ko) * 2018-11-07 2020-05-15 주식회사 스마트웨어솔루션 전기, 전자 기기 냉각용 열전도 시스템
FR3090839B1 (fr) * 2018-12-19 2021-05-14 Valeo Systemes Thermiques Circuit de refroidissement pour composant de véhicule automobile
JP2020106209A (ja) * 2018-12-27 2020-07-09 川崎重工業株式会社 蒸発器及びループ型ヒートパイプ
JP7352848B2 (ja) * 2019-05-21 2023-09-29 株式会社ロータス・サーマル・ソリューション 冷却装置における冷却液の熱を取り出す熱交換構造、及び該熱交換構造を備える冷却装置
CN112103260A (zh) * 2019-06-18 2020-12-18 上海交通大学 空气冷却的大功率高热流散热装置
US20200409398A1 (en) * 2019-06-25 2020-12-31 Intel Corporation Device, system and method for providing microchannels with porous sidewall structures
TWI708920B (zh) * 2019-07-30 2020-11-01 營邦企業股份有限公司 迴路式熱虹吸散熱裝置
US20250113464A1 (en) * 2023-10-03 2025-04-03 xMEMS Labs, Inc. Active 2-Phase Mist-Stream Cooling System

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54158871A (en) * 1978-06-06 1979-12-15 Mitsubishi Electric Corp Boiling-cooling unit
JPH048443U (fr) * 1990-05-09 1992-01-27
JP2001094023A (ja) * 1999-08-18 2001-04-06 Agilent Technol Inc 電子デバイス用冷却装置
JP2002168547A (ja) * 2000-11-20 2002-06-14 Global Cooling Bv 熱サイホンによるｃｐｕ冷却装置
JP2004056121A (ja) * 2002-07-18 2004-02-19 Delphi Technologies Inc 高性能沸騰表面および凝縮表面を備えたエレクトロニクス冷却用熱サイホン
JP2007010211A (ja) * 2005-06-30 2007-01-18 Hitachi Ltd 電子機器の冷却装置
JP2008130746A (ja) * 2006-11-20 2008-06-05 Hitachi Ltd 電子機器用沸騰冷却装置及びそれを利用した電子機器
JP2009088125A (ja) * 2007-09-28 2009-04-23 Panasonic Corp 冷却装置およびそれを備えた電子機器

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS537858A (en) * 1976-07-09 1978-01-24 Mitsubishi Electric Corp Apparatus for boiling and cooling
JPS5438771A (en) 1977-09-02 1979-03-23 Toshiba Corp Cooling fin
JPS63128737A (ja) 1986-11-19 1988-06-01 Mitsubishi Electric Corp 沸騰冷却装置の冷媒注入パイプ取付方法
JPH0428983A (ja) 1989-10-26 1992-01-31 Mitsubishi Electric Corp 沸騰冷却装置
JPH048443A (ja) 1990-04-24 1992-01-13 Shin Nippon Koki Kk 自動工具交換装置
JPH0482856U (fr) 1990-11-28 1992-07-20
JP2585479B2 (ja) 1991-04-23 1997-02-26 株式会社日立製作所 沸騰冷却装置
JPH05136305A (ja) * 1991-11-08 1993-06-01 Hitachi Ltd 発熱体の冷却装置
JPH06275749A (ja) 1993-03-18 1994-09-30 Hitachi Ltd 沸騰冷却装置
US5940270A (en) * 1998-07-08 1999-08-17 Puckett; John Christopher Two-phase constant-pressure closed-loop water cooling system for a heat producing device
JP4026039B2 (ja) 1998-12-18 2007-12-26 株式会社デンソー 沸騰冷却装置
US6608752B2 (en) * 2001-09-24 2003-08-19 General Electric Company Adaptive heat sink for electronics applications
US6561267B2 (en) * 2001-09-28 2003-05-13 Intel Corporation Heat sink and electronic circuit module including the same
JP3511604B2 (ja) 2001-11-30 2004-03-29 株式会社富士根産業 熱サイフォン型熱移動体
TW200409584A (en) * 2002-11-25 2004-06-01 Jun-Guang Luo Multi-position liquid storage tank temperature conduction apparatus and method
US20050067147A1 (en) * 2003-09-02 2005-03-31 Thayer John Gilbert Loop thermosyphon for cooling semiconductors during burn-in testing
JP2005195226A (ja) 2004-01-06 2005-07-21 Mitsubishi Electric Corp ポンプレス水冷システム
US7549460B2 (en) * 2004-04-02 2009-06-23 Adaptivenergy, Llc Thermal transfer devices with fluid-porous thermally conductive core
WO2006019219A2 (fr) * 2004-08-18 2006-02-23 Thermalforce Appareil de refroidissement de structure de tuyau de chauffage a boucle
JP2007150203A (ja) 2005-11-30 2007-06-14 Toyota Central Res & Dev Lab Inc ヒートシンク
US9297589B2 (en) 2008-11-18 2016-03-29 Nec Corporation Boiling heat transfer device
US20100147492A1 (en) * 2008-12-10 2010-06-17 Ronald David Conry IGBT cooling method
JP4881424B2 (ja) * 2009-11-10 2012-02-22 株式会社環境経営総合研究所 発泡材の製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54158871A (en) * 1978-06-06 1979-12-15 Mitsubishi Electric Corp Boiling-cooling unit
JPH048443U (fr) * 1990-05-09 1992-01-27
JP2001094023A (ja) * 1999-08-18 2001-04-06 Agilent Technol Inc 電子デバイス用冷却装置
JP2002168547A (ja) * 2000-11-20 2002-06-14 Global Cooling Bv 熱サイホンによるｃｐｕ冷却装置
JP2004056121A (ja) * 2002-07-18 2004-02-19 Delphi Technologies Inc 高性能沸騰表面および凝縮表面を備えたエレクトロニクス冷却用熱サイホン
JP2007010211A (ja) * 2005-06-30 2007-01-18 Hitachi Ltd 電子機器の冷却装置
JP2008130746A (ja) * 2006-11-20 2008-06-05 Hitachi Ltd 電子機器用沸騰冷却装置及びそれを利用した電子機器
JP2009088125A (ja) * 2007-09-28 2009-04-23 Panasonic Corp 冷却装置およびそれを備えた電子機器

Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9297589B2 (en) 2008-11-18 2016-03-29 Nec Corporation Boiling heat transfer device
JP2012514855A (ja) * 2009-01-06 2012-06-28 マサチューセッツ インスティテュート オブ テクノロジー 熱交換器および関連方法
US8678075B2 (en) 2009-01-06 2014-03-25 Massachusetts Institute Of Technology Heat exchangers and related methods
JPWO2012053624A1 (ja) * 2010-10-19 2014-02-24 日本電気株式会社 冷却装置及びその製造方法
WO2012053624A1 (fr) * 2010-10-19 2012-04-26 日本電気株式会社 Dispositif de refroidissement et son procédé de fabrication
CN103168210A (zh) * 2010-10-19 2013-06-19 日本电气株式会社 冷却装置和用于制造所述冷却装置的方法
US20130206368A1 (en) * 2010-10-19 2013-08-15 Nec Corporation Cooling device and method for producing the same
US20130219954A1 (en) * 2010-11-02 2013-08-29 Nec Corporation Cooling device and method for producing the same
WO2012141321A1 (fr) * 2011-04-11 2012-10-18 日本電気株式会社 Structure de joint et dispositif de refroidissement
ES2394878R1 (es) * 2011-06-15 2013-09-25 Torrelles Albert Puig Dispositivo de aprovechamiento termico
WO2013018667A1 (fr) * 2011-08-01 2013-02-07 日本電気株式会社 Dispositif de refroidissement et dispositif électronique l'utilisant
JPWO2013018667A1 (ja) * 2011-08-01 2015-03-05 日本電気株式会社 冷却装置及びそれを用いた電子機器
US9468621B2 (en) 2011-10-04 2016-10-18 Ihi Corporation Metal-salen complex compound responsive drug and intra-corporeal behavior control system for metal-salen complex compound
WO2013051363A1 (fr) 2011-10-06 2013-04-11 株式会社Ihi Composition magnétique et procédé de production associé
JP2013130331A (ja) * 2011-12-21 2013-07-04 Toshiba Corp 気泡駆動冷却装置
WO2013140761A1 (fr) * 2012-03-22 2013-09-26 日本電気株式会社 Structure de refroidissement pour substrat électronique et dispositif électronique l'utilisant
JPWO2013140761A1 (ja) * 2012-03-22 2015-08-03 日本電気株式会社 電子基板の冷却構造及びそれを用いた電子装置
JP2013245903A (ja) * 2012-05-29 2013-12-09 Toyama Univ 高温液体の冷却装置
JPWO2014045714A1 (ja) * 2012-09-19 2016-08-18 日本電気株式会社 冷却装置、それに使用される受熱部、沸騰部、その製造方法
WO2014049805A1 (fr) * 2012-09-28 2014-04-03 株式会社 日立製作所 Système de refroidissement et dispositif électrique l'utilisant
JP2014074568A (ja) * 2012-10-05 2014-04-24 Fujitsu Ltd ループ型サーモサイフォン及び電子機器
JP2015090247A (ja) * 2013-11-06 2015-05-11 富士通株式会社 ループヒートパイプ及び情報処理装置
JPWO2015107899A1 (ja) * 2014-01-16 2017-03-23 日本電気株式会社 冷却装置及び電子装置
JP2016205785A (ja) * 2015-04-28 2016-12-08 株式会社豊田中央研究所 媒体輸送システム、蓄熱システム及びヒートポンプ
WO2017110740A1 (fr) * 2015-12-25 2017-06-29 日本電気株式会社 Dispositif de dissipation de chaleur, dispositif de refroidissement à changement de phase dans lequel celui-ci est utilisé, et procédé de dissipation de chaleur
WO2020137822A1 (fr) * 2018-12-26 2020-07-02 Ｎｅｃプラットフォームズ株式会社 Dispositif de refroidissement et procédé de fabrication de dispositifs de refroidissement
JP2020106156A (ja) * 2018-12-26 2020-07-09 Ｎｅｃプラットフォームズ株式会社 冷却装置および冷却装置の製造方法
US11740035B2 (en) 2018-12-26 2023-08-29 Nec Platforms, Ltd. Cooling device and manufacturing method for cooling devices
WO2022209359A1 (fr) * 2021-04-01 2022-10-06 三菱重工業株式会社 Système de refroidissement
JP2022158103A (ja) * 2021-04-01 2022-10-17 三菱重工業株式会社 冷却システム
US12501581B2 (en) 2021-04-01 2025-12-16 Mitsubishi Heavy Industries, Ltd. Cooling system

Also Published As

Publication number Publication date
US20160209120A1 (en) 2016-07-21
JPWO2010058520A1 (ja) 2012-04-19
US20110214840A1 (en) 2011-09-08
JP5678662B2 (ja) 2015-03-04
JP6267079B2 (ja) 2018-01-24
JP2015019076A (ja) 2015-01-29
US9297589B2 (en) 2016-03-29

Similar Documents

Publication Publication Date Title
JP5678662B2 (ja) 沸騰冷却装置
CN1902754B (zh) 带有气泡泵的冷却系统
US8813834B2 (en) Quick temperature-equlizing heat-dissipating device
CN102834688B (zh) 相变冷却器和设有该相变冷却器的电子设备
JP3897024B2 (ja) 液循環型冷却装置
US20080170368A1 (en) Apparatuses for Dissipating Heat from Semiconductor Devices
US20080169086A1 (en) Heat dissipating device
JPWO2011145618A1 (ja) 沸騰冷却器
JP2008527285A (ja) 気泡ポンプを有する多方位冷却システム
CN111741650A (zh) 热超导散热板、散热器及5g基站设备
WO2015146110A1 (fr) Refroidisseur à changement de phase et procédé de refroidissement à changement de phase
JP4899997B2 (ja) サーマルサイフォン式沸騰冷却器
WO2023279757A1 (fr) Appareil de dissipation de chaleur et dispositif électronique
JP3169381U (ja) 電子機器用冷却装置及びそのヒートシンクモジュール
JP2013033807A (ja) 冷却装置およびそれを用いた電子機器
US20120024500A1 (en) Thermosyphon for cooling electronic components
WO2017082127A1 (fr) Dispositif de refroidissement d'équipement électronique
CN106455431B (zh) 板式环路热虹吸均温板
JP6024665B2 (ja) 平板型冷却装置及びその使用方法
CN108323099B (zh) 翅片式热管耦合散热器
WO2012026221A1 (fr) Dispositif de transport de chaleur de type en boucle
KR200448243Y1 (ko) 열 확산장치
TWI897224B (zh) 浸沒式散熱裝置
JP7558760B2 (ja) 冷却デバイスおよび電子部品の冷却構造
JP2013069740A (ja) 平板型冷却装置及びその使用方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09827302

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 13128740

Country of ref document: US

ENP Entry into the national phase

Ref document number: 2010539122

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 09827302

Country of ref document: EP

Kind code of ref document: A1