[go: up one dir, main page]

WO2010058516A1 - Procédé de montage d’un élément - Google Patents

Procédé de montage d’un élément Download PDF

Info

Publication number
WO2010058516A1
WO2010058516A1 PCT/JP2009/005191 JP2009005191W WO2010058516A1 WO 2010058516 A1 WO2010058516 A1 WO 2010058516A1 JP 2009005191 W JP2009005191 W JP 2009005191W WO 2010058516 A1 WO2010058516 A1 WO 2010058516A1
Authority
WO
WIPO (PCT)
Prior art keywords
liquid
substrate
region
line
water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2009/005191
Other languages
English (en)
Japanese (ja)
Inventor
荒瀬秀和
中川徹
増田裕之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Priority to JP2010504336A priority Critical patent/JP4531862B2/ja
Priority to CN2009801150677A priority patent/CN102017106B/zh
Publication of WO2010058516A1 publication Critical patent/WO2010058516A1/fr
Priority to US12/827,255 priority patent/US7867563B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H10W90/00—
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H10W72/0198—
    • H10W72/073—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting

Definitions

  • the present invention relates to a member mounting method.
  • the active liquid crystal display element and the organic electroluminescence display element are formed on a glass substrate. Pixels arranged in a matrix on the substrate are controlled by transistors arranged in the vicinity of the pixels. With current technology, a transistor of a crystalline semiconductor cannot be formed on a glass substrate. Therefore, a thin film transistor made of an amorphous silicon or polysilicon thin film is used for pixel control. Thin film transistors have the advantage that they can be manufactured on a large-area substrate at low cost. However, there is a problem that the mobility is smaller than that of crystalline silicon and high-speed operation is not possible. In order to solve this problem, there has conventionally been proposed a method in which a number of transistors are manufactured in advance on a silicon wafer and then cut out from the wafer and placed on a substrate.
  • Patent Document 1 first, as shown in FIG. 9A, a substrate 100 including a plurality of hydrophilic regions 101 and a water-repellent region 102 formed so as to surround the plurality of hydrophilic regions 101 is prepared. .
  • a member-containing liquid 106 put in a container 107 is prepared.
  • the member-containing liquid 106 is prepared by dispersing the member 104 disposed on the substrate 100 in a solvent 103 that does not substantially dissolve in water.
  • One surface of the member 104 is hydrophilic and bonded to the substrate 100, and the surfaces of the member 104 other than the bonded surface are water repellent.
  • the water 108 is disposed in the plurality of hydrophilic regions 101 using the first squeegee 111.
  • reference numeral 121 denotes water arranged in the hydrophilic region 101.
  • the member-containing liquid 106 in which the member 104 is dispersed is applied using the second squeegee 112, and the member-containing liquid 106 is brought into contact with the water 121 disposed in the hydrophilic region 101.
  • reference numeral 122 denotes a member-containing liquid disposed in the hydrophilic region 101.
  • the member 104 moves into the water 121 disposed in the hydrophilic region 101, and then the hydrophilicity on the substrate 100 is removed by removing the water 121 and the solvent 103 contained in the member-containing liquid 106.
  • the member 104 is fixed to the region 101.
  • Patent Document 1 is an excellent method for arranging a member on a substrate.
  • the foreign matter 105 that is smaller than the volume of the mounted member 104 (hereinafter, sometimes simply referred to as “fine foreign matter”). May be mixed in the member-containing liquid 106.
  • fine foreign matter since the effect of the interfacial tension acting on the minute foreign matter 105 is larger than the effect of the interfacial tension acting on the member 104, even the minute foreign matter 105 is disposed in the hydrophilic region 101 where the member 104 is disposed. End up.
  • the minute foreign matter 105 disposed in the hydrophilic region 101 in which the member 104 is disposed becomes an obstacle and adversely affects the device characteristics to be manufactured (such as poor electrical connection).
  • the present invention solves the above-described problem.
  • the member is accurately and highly reproducibly specified even if a minute foreign matter is mixed in the member-containing liquid containing the member. It aims at providing the method of mounting in the position of.
  • a method for mounting a member is a method for mounting a plurality of members on a substrate, wherein the substrate includes a plurality of first regions, a first region, and a second region. 2 regions and lines, and the second region surrounds the plurality of first regions and the lines, and the lines are on one end side of the substrate along the one end.
  • Each member has a width shorter than the minimum length of each member, and each first region has the same shape and size as the surface of the member mounted on the substrate.
  • the first liquid does not dissolve in the second liquid and is higher than the wettability of the second liquid with respect to the surface of the member, the first region, and the line.
  • Has wettability (2) disposing the first liquid in the first region and the line; (3)
  • the term “mount” is a term including “implementation”.
  • Examples of the “member” in the present specification include electronic components.
  • the minute foreign matter is removed in the line, so that the member is mounted on the first region. Minute foreign matter is reduced. Therefore, there is no adverse effect (such as poor electrical connection) on the characteristics of the device to be manufactured. Furthermore, the apparatus and operation for removing minute foreign matters can be simplified or omitted, and the number of steps for removing minute foreign matters can be reduced, so that the manufacturing cost can be reduced.
  • FIG. 1A and 1B are perspective views showing examples of a first region, a second region, and a line in the mounting method of the present invention.
  • FIG. 2 is a cross-sectional view showing an example of the first region, the second region, and the line in the mounting method of the present invention.
  • FIG. 3 is a cross-sectional view schematically showing a member-containing liquid in the mounting method of the present invention.
  • 4A, 4B, and 4D are perspective views schematically showing a process of arranging the first liquid in the mounting method of the present invention, and FIG. 4C arranges the first liquid in the mounting method of the present invention. It is sectional drawing which shows the process to do typically.
  • FIGS. 5B and 5C are perspective views schematically showing steps of arranging members in the mounting method of the present invention
  • FIGS. 5B and 5C schematically show steps of arranging members in the mounting method of the present invention.
  • FIG. 6A to 6D are perspective views for explaining the minimum length of a member in the mounting method of the present invention.
  • FIG. 7 is a photomicrograph of silicon oxide disposed on the substrate by the method of the example.
  • FIG. 8 is a photomicrograph of silicon oxide placed on the substrate by the method of the comparative example.
  • 9A, 9C, and 9D are perspective views schematically showing each step in the mounting method described in Patent Document 1, and FIG. 9B schematically shows a member-containing liquid used in this mounting method. It is sectional drawing.
  • FIG. 1A and 1B are perspective views showing an example of the first region 11, the second region 12, and the line 13 in the mounting method of the present invention.
  • FIG. 2 is a cross-sectional view showing an example of the first region 11, the second region 12, and the line 13 in the mounting method of the present invention.
  • water will be described as a specific example of the first liquid.
  • a substrate 1 as shown in FIGS. 1A, 1B, and 2 is prepared.
  • the substrate 1 is provided with a first region 11, a second region 12, and a line 13.
  • the second region 12 surrounds the first region 11 and the line 13.
  • the first region 11, the second region 12, and the line 13 are formed so that the wettability to water in the first region 11 and the line 13 is higher than that in the second region 12.
  • the first region 11 and the line 13 are hydrophilic, and the second region 12 is water repellent.
  • the line 13 is provided on one end side of the substrate 1 along the one end.
  • the first region 11 is disposed on the other end (end facing the one end) side of the substrate 1 with respect to the line 13.
  • FIG. 3 is a cross-sectional view schematically showing a member-containing liquid used in the mounting method of the present embodiment.
  • FIG. 3 shows the member-containing liquid 6 placed in the container 7.
  • the member-containing liquid 6 includes a second liquid 3, a member 4 dispersed in the second liquid 3, and a minute foreign material 5.
  • the second liquid 3 is a liquid in which water is not substantially dissolved. Specific examples include hexane. A specific example of the second liquid 3 will be described later.
  • the term “dispersion” in this specification refers to a state in which the member 4 is not aggregated in the second liquid 3. In order to disperse the member 4, the member-containing liquid 6 may be stirred.
  • FIG. 4A is a perspective view of the substrate 1 in which the first region 11, the line 13, and the second region 12 surrounding the first region 11 and the line 13 are provided on one main surface. .
  • the line 13 is provided on the one end (end 1a) side of the substrate 1 along the end 1a.
  • FIG. 4B is a perspective view schematically showing an example of the configuration and operation of a mounting apparatus for carrying out the mounting method of the present invention.
  • the mounting device used in the present embodiment exposes the first squeegee 41 for exposing the water (first liquid) 2 to the substrate 1 and the member-containing liquid 6 to the substrate 1.
  • the second squeegee 42 is arranged with a predetermined interval maintained between them, and the two squeegees are moved while maintaining the interval.
  • the fixing means and moving means for the squeegees 41 and 42 are not shown.
  • the substrate 1 comes into contact with the water 2 by moving the first squeegee 41 relative to the substrate 1, and water is applied only to the first region 11 and the line 13. Is placed.
  • 21 indicates water disposed in the first region 11, and 23 indicates water disposed in the line 13.
  • the arrow in a figure has shown the relative moving direction with respect to the board
  • FIG. 4B water is arranged on the first region 11 and the line 13 by the first squeegee 41, but the substrate 1 is immersed in a container that holds the water inside. Then, the water may be disposed on the first region 11 and the line 13 by pulling up.
  • FIG. 4C is a cross-sectional view schematically showing the water 21 arranged in the first region 11 and the water 23 arranged in the line 13, and FIG. 4D shows the water arranged in the first region 11.
  • 21 is a perspective view schematically showing water 21 and water 23 arranged in a line 13. Since the first region 11 and the line 13 are surrounded by the second region 12 having low wettability with respect to water (see FIG. 4A), the water 21 disposed in the first region 11 and the line 13 It is difficult for the water 23 arranged in the first area 11 and the line 13 to protrude. Accordingly, the shape of the contact surface between water and the substrate 1 is substantially the same as the shape of the first region 11 and the line 13.
  • step (3) and step (4) the steps (step (3) and step (4)) of arranging members on the substrate will be described with reference to FIGS. 5A to 5D.
  • the second squeegee 42 moves from one end side (the back side, the end 1a side in FIG. 5A) to the other end side (the front side, the end 1b side in FIG. 5A).
  • the substrate 1 is exposed to the member-containing liquid 6.
  • the member-containing liquid 6 first passes on the line 13 and then passes on the first region 11. Since the water 2 does not substantially dissolve in the second liquid 3 constituting the member-containing liquid 6, the water 21 arranged in the first region 11 and the water 23 arranged in the line 13 are: Each remains stable in the first region 11 and the line 13 (see FIGS. 4C and 4D). In this process, as shown in FIG.
  • the member 4 moves to the inside of the water 21 arranged in the first region 11 due to the interfacial tension acting on the member 4.
  • the minute foreign matter 5 moves to the inside of the water 23 arranged in the line 13 due to the interfacial tension acting on the minute foreign matter 5.
  • the water 21 and 23 and the member-containing liquid 6 are removed from one main surface of the substrate 1. As shown in FIGS. 5C and 5D, the member 4 is disposed in the first region 11, and the minute foreign matter 5 is disposed in the line 13.
  • the minute foreign matter 5 can be disposed on the line 13, and the minute foreign matter 5 can be removed from the member-containing liquid 6. That is, the member-containing liquid 6 first contacts the water 23 on the line 13, and most of the minute foreign matter 5 moves to the water 23 on the line 13. Therefore, the member-containing liquid 6 from which most of the minute foreign matters 5 have been removed is brought into contact with the water 21 on the first region 11, so that the member 4 can be accurately placed in the first region 11. it can.
  • the mounting method of the present invention is characterized in that a line 13 surrounded by the second region 12 is provided on one end side of the substrate 1 for the purpose of removing the minute foreign matter 5.
  • the shape of the line 13 may be a straight line or a curved line.
  • the number of lines 13 may be one, or two or more. In order to more effectively remove the minute foreign matter 5, the number of lines 13 is preferably 100 to 1000. When two or more lines 13 are provided, the shape of each line may be different.
  • the width of the line 13 is made shorter than the minimum length of the member 4 to be mounted.
  • the volume of the water 23 arranged in the line 13 can be adjusted by adjusting the width of the line 13. If the width of the line 13 is increased, the volume of the water 23 disposed in the line 13 increases. Conversely, if the width of the line 13 is shortened, the volume of the water 23 arranged in the line 13 is reduced. By adjusting the volume of the water 23 arranged in the line 13, the size of the object arranged in the line 13 can be limited, and the member 4 can be prevented from being arranged in the line 13.
  • the volume of the water 23 arranged in the line 13 is adjusted by making the width of the line 13 shorter than the minimum length of the member 4 to be mounted. As a result, only the minute foreign matter 5 contained in the member-containing liquid 6 can be moved from the member-containing liquid 6 to the water 23 arranged in the line 13 and arranged in the line 13. That is, it is possible to remove the minute foreign matter 5 contained in the member-containing liquid 6 by the line 13. Therefore, in the mounting method of the present invention, the number of minute foreign objects 5 that are arranged in the first region 11 can be significantly reduced as compared with the case where the line 13 is not provided.
  • the width of the line 13 is smaller than the minimum length of the member 4 to be mounted (the length of the shortest side among the sides constituting the surface mounted on the substrate 1 in the member 4). If the length is long, the volume of the water 23 arranged in the line 13 increases too much, and it has been found that not only the minute foreign matter 5 but also the member 4 is arranged in the line 13.
  • the width of the line 13 needs to be shorter than the minimum length of the member 4, and more preferably shorter than one half of the minimum length of the member 4.
  • the member 4 includes two surfaces (P1), two surfaces (P2) having an area equal to or larger than the surface (P1), and two surfaces (P3) having an area larger than the surface (P2). ),
  • the length of each side is (L1), (L2), and (L3).
  • one surface (P3) of the member 4 is a surface on which the first region 11 of the substrate 1 is provided. It arrange
  • the “minimum length of the member to be mounted” means the short side length of the side length (L1) and the side length (L2) constituting the surface (P3) that is the surface to be mounted. This refers to (L1).
  • the meaning of “same shape and size” in this specification will be described later.
  • minimum length of the member to be mounted Means the length (L1) of the side having the shortest length among the sides (L1), (L2), and (L3) constituting the triangle.
  • the minimum length of the member to be mounted refers to the length (L1) of the side having the shortest length among the sides (L1) to (L6) constituting the hexagon.
  • the minimum length of the member to be mounted Means the length (L1) of the diameter of the surface (P3). In the case of an ellipse, it means the minor axis.
  • the minimum length of the member 4 to be mounted is preferably 10 ⁇ m or more.
  • the member 4 is a rectangular parallelepiped having the surface (P1), the surface (P2), and the surface (P3), the long side (the length in FIG. 6A) of the surface (P3) that is the surface to be mounted.
  • (L2) side is preferably 1000 ⁇ m or less.
  • the first squeegee 41 that supplies water to the substrate 1 is moved relative to the substrate 1 on the substrate 1, so that the first Water is disposed in the region 11 and the line 13.
  • the second squeegee 42 for supplying the member-containing liquid 6 to the substrate 1 is crossed from the one end side on which the line 13 is formed on the substrate 1 ( Relative to the substrate 1 from one end side (back side in FIG. 5A, end 1a side) to the other end side (front side, end 1b side in FIG. 5A) of the substrate 1 so as to cross the line.
  • the second squeegee 42 By operating the second squeegee 42 in this way, the member-containing liquid 6 first comes into contact with the water 23 (see FIG. 4B) disposed on the line 13.
  • interfacial tension acts on the member 4 in the member-containing liquid 6 and the minute foreign matter 5 mixed in the member-containing liquid 6 in the direction in which the member is drawn into the water 23.
  • the effect of the interfacial tension acting on the fine foreign matter 5 is greater than the effect of the interfacial tension acting on the member 4.
  • a force other than the interfacial tension acts on the minute foreign matter 5 and the member 4 respectively.
  • the interface tension is small. The influence of the force other than that is smaller than that of the member 4, and as a result, the influence of the interfacial tension is greatly affected.
  • the minute foreign matter 5 is easier to move into the water 23 than the member 4. Accordingly, the minute foreign matter 5 moves into the water 23 (see FIG. 5B), and the minute foreign matter 5 is arranged on the line 13 on the substrate 1 (see FIG. 5C). As a result, the minute foreign matter 5 present in the member-containing liquid 6 after passing through the line 13 is reduced more than before passing through the line 13.
  • the second squeegee 42 is moved relatively to the other end side of the substrate 1.
  • the member containing liquid 6 contacts the water 21 arrange
  • Interfacial tension acts on the member 4 in the member-containing liquid 6 in the direction in which the member 4 is drawn into the water 21. Thereby, the member 4 moves in the water 21 (refer FIG. 5B).
  • the member 4 is arrange
  • the second squeegee 42 is moved relative to the substrate 1 from one end side to the other end side of the substrate 1 so as to cross the line.
  • “moving relative to the substrate 1 from one end side to the other end side of the substrate 1 across the line” means the following.
  • a second squeegee 42 is prepared on the substrate 1 at a position on one end side (the back side, the end 1 a side in FIG. 4A) where the line 13 is formed.
  • the 2nd squeegee 42 is moved on the board
  • the second squeegee 42 is first moved so as to pass on the line 13. Further, the second squeegee 42 is continuously moved to the other end side without changing the moving direction, and is moved to the second region 12 where the line 13 is not formed. The second squeegee 42 is moved to the other end side of the substrate 1 so as to continue to pass over the first region 11.
  • the squeegees 41 and 42 move and the substrate 1 does not move.
  • the squeegees 41 and 42 may not move and the substrate 1 may move.
  • the squeegees 41 and 42 and the substrate 1 may move together.
  • the squeegees 41 and 42 may be moved relative to the substrate 1.
  • the first squeegee 41 and the second squeegee 42 are arranged in a state where a predetermined interval is maintained.
  • the squeegees 41 and 42 are moved. Accordingly, the first squeegee 41 moves in the same manner as the second squeegee 42.
  • the width of the line 13 is made shorter than the minimum length of the member 4, and the second squeegee 42 that supplies the member-containing liquid 6 to the substrate 1 is placed across the line 13.
  • the minute foreign matter 5 mixed in the member-containing liquid 6 is not disposed on the first region 11.
  • the minute foreign matter 5 mixed in the member-containing liquid 6 is reduced more than when the squeegee starts (before the member-containing liquid 6 passes through the line 13). Therefore, the number of minute foreign objects 5 arranged in the first region 11 can be reduced.
  • the first region 11 and the line 13 having high water wettability are surrounded by the second region 12 having low water wettability.
  • the surface energy of the second region 12 is the surface energy of the first region 11 and the line 13.
  • the first region 11, the second region 12, and the line 13 may be formed so as to be lower.
  • region 11 and the line 13 is from the 1st area
  • the difference in water wettability between the first region 11 and the line 13 and the second region 12 is large. Is preferred.
  • the surface energy of the first region 11 and the surface energy of the line 13 are assumed to be the same. However, if the surface energy of the second region 12 is lower than the surface energy of the first region 11 and the line 13, the surface energy of the first region 11 is different from the surface energy of the line 13. May be.
  • the value of the surface energy of the solid exhibiting “hydrophilicity” and “water repellency” is not particularly limited.
  • the surface energy is preferably 40 mJ / m 2 or more (preferably 60 to 1000 mJ / m 2 ), and in the case of “water repellency”, the surface energy is 5 mJ / m 2 or more and 40 mJ / m 2. It is preferably less than 2 (preferably in the range of 5 to 25 mJ / m 2 ).
  • the first region 11 and the line 13 surrounded by the second region 12 become a second region 12 by preparing a hydrophilic substrate or a substrate that has been previously treated to have hydrophilicity. It can be produced by forming a water repellent film on the part. For example, first, a portion to be made hydrophilic is covered with a protective film such as a resist. Next, after the entire substrate is covered with a water repellent film, the protective film is removed to remove the water repellent film formed in the first region 11 and the line 13. This method can be applied to a film formed using a silane coupling agent or a sol-gel method.
  • a surface on which only the water repellent film specifically adheres may be formed in a portion to be the second region 12, and the water repellent film may be formed only in this portion.
  • the metal region can be made water repellant.
  • the water repellent film may be directly formed in a predetermined region by an ink jet method, a screen printing method, a relief printing method, an intaglio printing method, a micro contact printing method, or the like.
  • the hydrophilic first region 11 and the line 13 may be formed using an inorganic material.
  • a silicon substrate has higher water repellency than silicon oxide. Therefore, a silicon oxide film pattern may be formed on the surface of the silicon substrate, and the silicon oxide film portion may be used as the first region 11 and / or the line 13. In this configuration, water can be disposed only on the pattern portion of the silicon oxide film.
  • the silicon oxide film may be formed, for example, by depositing a silicon oxide film by a plasma CVD method, or may be formed by oxidizing the surface of the silicon substrate by corona discharge treatment or plasma treatment in an oxygen-existing atmosphere. Also good.
  • the shape of the first region 11 provided on the substrate 1 may be determined according to the shape of the member 4 mounted on the first region 11.
  • the shape of the first region 11 is a predetermined surface of the member 4 to be mounted, such as a triangle, a rectangle, a polygon such as a hexagon, a circle or an ellipse (a surface facing the substrate when mounted on the substrate). It is preferable to have the same shape and size as this shape.
  • the “same shape” means that the shape of the first region 11 and the predetermined surface of the member to be mounted (the surface facing the substrate when mounted on the substrate) are congruent or similar in mathematical concept. Saying that there is a relationship.
  • the same size means that the area of the predetermined surface of the member 4 to be mounted is S1, and the area of one first region 11 is S2, and the value of S2 / S1 is 0.64 to It means the range of 1.44.
  • the value of S2 / S1 is smaller than 0.64, the amount of water arranged in the first region 11 becomes too small, and the probability that the member 4 is arranged becomes small.
  • region 11 will increase too much, and the member 4 will be arrange
  • an organic film (hereinafter referred to as a water-repellent film) having water wettability lower than that of the first region 11 and the line 13 is formed in at least a part of the second region 12. And the like may be formed on the substrate 1.
  • a water-repellent film examples include a polymer film having a fluoroalkyl chain, a film formed of a silane coupling agent or a thiol molecule having a fluoroalkyl chain, and a fluoroalkyl chain formed by a sol-gel method.
  • An organic / inorganic hybrid film containing can be used.
  • the polymer film having a fluoroalkyl chain examples include polytetrafluoroethylene, polydifluoroethylene, and derivatives thereof.
  • the substrate When forming a water-repellent film with a silane coupling agent, the substrate may be immersed for a certain period of time in chloroform, alkane, alcohol, or silicone oil in which a silane coupling agent having a fluoroalkyl chain is dissolved at a concentration of several vol%. . In this case, it is possible to form a monomolecular film by washing the substrate with a solvent after immersion.
  • a substrate having active hydrogen on the surface is preferable, and examples thereof include a substrate made of silicon oxide, silicon nitride, stainless steel, copper, nickel, and a resin whose surface is activated. .
  • the substrate When forming a water-repellent film using thiol molecules, the substrate is immersed in an ethanol or propanol solution in which a thiol molecule having a fluoroalkyl chain is dissolved at a concentration of several vol% for a certain period of time, and then the substrate is washed with alcohol. Good. Thereby, a water-repellent monomolecular film is formed.
  • the substrate on which these monomolecular films can be formed include a substrate made of a metal such as gold, silver, and copper.
  • a water-repellent film is formed by a sol-gel method, for example, a spin coating method is used in which tetraethoxysilane which is a precursor of silicon oxide, alkoxysilane having a fluoroalkyl chain, an acid catalyst, and an alcohol solution in which water is dissolved. Or by dipping, and then heat treatment at 100 ° C. or higher.
  • This water repellent film can be formed on almost any substrate.
  • the water 21 and 23 and the second liquid 3 are removed from one main surface of the substrate 1. Regardless of the order in which the water 21 and 23 and the second liquid 3 are removed, the member 4 is disposed at a predetermined position (first region 11).
  • the method for removing the water 21 and 23 and the second liquid 3 is not particularly limited, and a known drying method can be used.
  • a known drying method can be used.
  • it can be selected from known drying methods such as natural drying, drying with a vacuum desiccator, drying by blowing air or gas, drying by heating and / or reduced pressure.
  • first liquid 2 and the second liquid 3 are interposed between the first liquid 2 and the second liquid 3.
  • An appropriate selection may be made in consideration of the interfacial tension acting on the interface and the wettability of the first liquid 2 and the second liquid 3 with respect to the surface of the member 4.
  • the first liquid 2 needs to be a combination that does not substantially dissolve in the second liquid 3.
  • the first liquid 2 is in the first liquid 2 even when the second liquid 3 (member-containing liquid 6) is in contact with the first liquid 2. 1, the member 4 can be moved into the first liquid 2 by the interfacial tension.
  • substantially not dissolving means that the solubility of the first liquid 2 in the second liquid 3 (weight of the first liquid dissolved in 100 ml of the second liquid) is 10 g or less, more preferably 1 g or less. Say something.
  • the first liquid 2 and the second liquid 3 for example, a liquid having a high polarity is used for the first liquid 2, and the second liquid 3 is more polar than the first liquid 2. Small liquids can be used.
  • the first liquid 2 examples include water. Moreover, alcohols, such as methanol, ethanol, ethylene glycol, and glycerol, or the liquid mixture of water and alcohol etc. are mentioned. Water is more suitable because it has a large surface tension and can hold the member 4 firmly in the first region 11. Accordingly, the first liquid 2 is preferably a liquid containing water. In this case, the second liquid 3 is preferably a liquid that does not contain water.
  • the second liquid 3 include alkanes such as hexane, heptane, octane, nonane, decane, undecane, dodecane, tridecane, tetradecane, pentadecane and hexadecane, aromatic hydrocarbons such as toluene, benzene and xylene, Chlorinated solvents such as chloromethane, dichloromethane, chloroform, carbon tetrachloride, monochlorobutane, dichlorobutane, monochloropentane and dichloropentane, ethers such as diethyl ether and petroleum ether, esters such as ethyl acetate and butyl acetate, silicone oil Perfluorooctane, perfluorononane, or a mixture thereof.
  • a chlorine-based solvent is desirably used for the second liquid 3.
  • an organic solvent containing a hydrocarbon chain can be used as the first liquid 2 and an organic solvent containing a fluorocarbon chain can be used as the second liquid 3.
  • the first liquid 2 examples include hexane, heptane, octane, nonane, decane, undecane, dodecane, tridecane, tetradecane, alkanes such as pentadecane and hexadecane, and aromatic carbonization such as toluene, benzene and xylene. Hydrogen etc. are mentioned.
  • the second liquid 3 include perfluorooctane and perfluorononane.
  • the material of the substrate 1 on which the member 4 is mounted is not particularly limited, and a substrate formed of an inorganic material, a polymer resin material, or a composite material of an inorganic material and a polymer resin material can be used.
  • a substrate formed of an inorganic material, a polymer resin material, or a composite material of an inorganic material and a polymer resin material can be used.
  • the inorganic material ceramics such as alumina, silicon and glass can be used.
  • the polymer resin material polyimide resin, polyamide resin, epoxy resin, polycarbonate resin and the like can be used.
  • a composite material of an inorganic material and a polymer resin material for example, a composite material including a fiber made of glass, ceramics, or metal and a polymer resin material can be used.
  • an SOI (Silicon On On Insulator) substrate or a compound semiconductor substrate can be used.
  • the production method of the member 4 is not particularly limited, and a known method can be applied.
  • the member manufacturing method described in the specification of Patent Document 1 can be applied.
  • the surface of the member 4 is wetted so that the wettability of the first liquid 2 with respect to the surface of the member 4 is higher than the wettability of the second liquid 3 with respect to the surface of the member 4. You may provide further the process of giving a process.
  • the higher the surface energy of the member 4 may, 40 mJ / m 2 or more.
  • the surface energy of the member 4 is small, it is preferable to increase the surface energy by treating the surface of the member 4.
  • silicon is present on the surface of the member 4, the surface energy can be increased by irradiating ultraviolet rays in an ozone atmosphere. This method is also effective for electrode materials such as platinum, gold, copper, and nickel.
  • the surface energy of the member 4 can also be formed by forming a thin film having affinity for the first liquid 2 on the surface of the member 4 (for example, a hydrophilic film when water is used for the first liquid 2). Can be increased.
  • a thin film such as silicon oxide, silicon nitride, or titanium oxide may be formed on the surface of the member 4 by a vacuum sputtering method or a thermal CVD method. It is also effective to irradiate ultraviolet rays in an ozone atmosphere after forming these thin films. It is also possible to increase the surface energy by modifying the surface of the member 4 with a silane coupling agent having an amino group, a carboxyl group or a hydroxyl group at the terminal. When surface-treating only a metal, the surface may be modified with a thiol having an amino group, a carboxyl group or a hydroxyl group at the terminal.
  • the first liquid 2 is an organic solution containing hydrocarbon chains
  • a thin film having hydrocarbon chains is formed on the surface of the member 4.
  • Such an organic film can be formed, for example, by treating the member 4 with a silane coupling agent having a hydrocarbon chain. As a result, the surface of the member 4 becomes non-polar, easily wetted by the organic solution containing hydrocarbon chains, and easily drawn into the first liquid 2.
  • the line 13 formed on one main surface of the substrate 1 is held, but before or after the removal process of the first liquid 2 and the second liquid 3, You may cut
  • the first region 11 and the line 13 having affinity for the first liquid 2 are formed surrounded by the second region 12 having no affinity for the first liquid 2.
  • the first liquid 2 can be accurately arranged in the first region 11 and the line 13.
  • the minute foreign matter 5 can be disposed on the line 13, and the minute foreign matter 5 can be removed from the member-containing liquid 6.
  • the member 4 can be accurately arranged in the first region 11.
  • Example 1 silicon oxide was mounted on a substrate using the mounting method of the present invention.
  • a pattern of a hydrophilic region (first region and line) surrounded by a water repellent region (second region) was formed on a silicon substrate by a method similar to the method described in the embodiment.
  • a silicon substrate having a thickness of 525 ⁇ m was subjected to plasma treatment in an oxygen-existing atmosphere to oxidize the substrate surface, thereby rendering the entire surface of the substrate hydrophilic.
  • a resist pattern corresponding to a first region and a line having a size described later was formed by using a photolithography method.
  • the substrate on which the resist pattern was formed was immersed in a perfluorooctane solution in which 1 vol% CF 3 (CF 2 ) 7 C 2 H 4 SiCl 3 was dissolved in a dry atmosphere for 20 minutes. Thereafter, the substrate was washed in pure perfluorooctane, and then the solvent was removed. Further, the resist film was removed with acetone, and a pattern of a hydrophilic region (first region and line) surrounded by a water-repellent region (second region) was formed on the silicon substrate.
  • the size of the substrate on which the silicon oxide was placed was 20 mm long ⁇ 60 mm wide.
  • a hydrophilic region serving as a first region for mounting a member As a pattern of a hydrophilic region serving as a first region for mounting a member, a rectangular region having a length of 10 ⁇ m and a width of 50 ⁇ m was arranged in a lattice pattern on the entire substrate at intervals of 100 ⁇ m and a length of 100 ⁇ m. The first region was formed so that the longitudinal direction of the first region coincided with the longitudinal direction of the substrate.
  • ⁇ Line for removing minute foreign matter As a hydrophilic region pattern to be used as a line for removing minute foreign matters, a line-shaped region having a length of 15 mm and a width of 5 ⁇ m was formed in which 300 rows were arranged in parallel at intervals of 100 ⁇ m. The line was formed so that the short direction of the line coincided with the long direction of the substrate.
  • an aluminum thin film having a thickness of 100 nm was formed on a silicon substrate having a thickness of 525 ⁇ m by electron beam evaporation.
  • a silicon oxide thin film having a thickness of 200 nm was formed by plasma CVD.
  • a 10 ⁇ m ⁇ 50 ⁇ m rectangular resist pattern was formed on this substrate by photolithography. Part of the silicon oxide was removed by dry etching using the resist pattern as a mask.
  • the resist film was peeled off by oxygen plasma ashing to form a silicon oxide pattern (hereinafter referred to as a silicon oxide plate) having a length of 10 ⁇ m ⁇ width of 50 ⁇ m ⁇ height of 0.3 ⁇ m.
  • the aluminum thin film was etched with a mixed solution of phosphoric acid and nitric acid at 47 ° C. (hereinafter referred to as hot phosphoric acid), and the silicon oxide plate was lifted off.
  • the silicon oxide plate dispersed in hot phosphoric acid was suction filtered with a filter.
  • the filter to which the silicon oxide plate was adhered was dried overnight in a dry atmosphere, and then the filter was immersed in a 1,4-dichlorobutane solution in which 1 vol% of 1-chloroethyltrichlorosilane was dissolved for 2 hours.
  • Suction filtration was performed in a dry nitrogen atmosphere to remove unreacted 1-chloroethyltrichlorosilane, and a silicon oxide plate whose surface was chemically modified was obtained on the filter.
  • This filter was immersed in 1,4-dichlorobutane and ultrasonic waves were applied to disperse the silicon oxide plate attached to the filter in 1,4-dichlorobutane, thereby obtaining a member-containing liquid.
  • a squeegee (corresponding to the squeegee 41 shown in FIG. 4B, hereinafter referred to as the squeegee 41) for placing the first liquid (in this embodiment, water is used) on the substrate is a slit type made of SUS304. did.
  • absorbent cotton was put in the inside of a slit.
  • the squeegee (corresponding to the squeegee 42 shown in FIG. 4B, hereinafter referred to as the squeegee 42) in which the second liquid (in the present embodiment, the above-mentioned member-containing liquid is used) is disposed on the substrate is polyethylene.
  • the produced knife-shaped thing was used.
  • the squeegee 41 and the squeegee 42 are arranged at the end portion on the side where the line of the substrate is formed with the edge surface of the squeegee parallel to the short direction of the substrate.
  • the squeegees 41 and 42 are arranged so that the squeegee edge surface and the substrate can be moved on the substrate with an interval of about 0.2 mm.
  • the distance between the squeegee 41 and the squeegee 42 was 1 mm.
  • FIG. 7 is a photomicrograph after this operation.
  • 42 hydrophilic regions (first regions) are arranged in a lattice shape, with 7 in the vertical direction and 6 in the horizontal direction.
  • a white rectangular portion is a silicon oxide plate arranged in a hydrophilic region, a white circle or a portion where a plurality of these are arranged is a minute foreign matter, and a black portion is a water repellent region (second region). It can be seen that the silicon oxide plates are arranged in the same direction on the substrate.
  • FIG. 8 is a photomicrograph after this operation. Also in the range shown in this photograph, as in the range shown in FIG. 7, 42 hydrophilic regions (first regions) are arranged in a lattice shape with 7 vertical and 6 horizontal.
  • Evaluation of each method of the example and the comparative example was performed by confirming the arrangement state of the silicon oxide plate and the minute foreign matter on the substrate. Specifically, 42 arbitrary hydrophilic regions on the substrate are selected, and the number Np of hydrophilic regions in which silicon oxide plates are arranged and the number Nc of hydrophilic regions in which minute foreign substances are arranged are determined. Each was counted and evaluated by its ratio Nc / Np. When the value of Nc / Np was in the range of 0 or more and less than 0.5, it was judged to be very good, in the range of 0.5 to less than 1.0, good, and in the case of 1.0 or more, it was judged as bad.
  • the mounting method of the present invention removes foreign matter (minute foreign matter) smaller than the volume of the member to be mounted in the line, compared with the method of the comparative example. It can be said that this method is remarkably excellent as a method for reducing the probability of being placed in a region.
  • the member mounting method of the present invention can be applied when a member including an electronic element is mounted or when a minute columnar member is mounted. This method can be applied to a method for manufacturing an electronic device or an electronic element.
  • the present invention can be applied to a method for manufacturing a circuit board and an electronic device including the circuit board, and a method for repairing the circuit board and an electronic device including the circuit board.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

On décrit un procédé de montage d’une pluralité d’éléments sur un substrat, le procédé comportant : (1a) une étape consistant à préparer un premier liquide ; (1b) une étape consistant à préparer un liquide vecteur d’éléments qui contient un élément et un deuxième liquide (le premier liquide ne se dissolvant pas dans le deuxième liquide et présentant une mouillabilité supérieure à celle du deuxième liquide par rapport à la surface de l’élément), une première région et une ligne présentant une largeur inférieure à la plus petite longueur de chaque élément ; (2) une étape consistant à appliquer  le premier liquide à la première région (11) et à la ligne ; (3) une étape consistant à amener le liquide vecteur d’éléments au contact du premier liquide appliqué à la première région en déplaçant par rapport au substrat une raclette qui fournit le liquide vecteur d’éléments au substrat, d’un côté d’extrémité du substrat à l’autre côté d’extrémité, de telle sorte que la raclette passe par-dessus la ligne ; et (4) une étape consistant à disposer chaque élément dans chaque première région à partir d’une position au-dessus du substrat en éliminant le premier liquide et le deuxième liquide.
PCT/JP2009/005191 2008-11-18 2009-10-06 Procédé de montage d’un élément Ceased WO2010058516A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010504336A JP4531862B2 (ja) 2008-11-18 2009-10-06 部材のマウント方法
CN2009801150677A CN102017106B (zh) 2008-11-18 2009-10-06 部件的装配方法
US12/827,255 US7867563B2 (en) 2008-11-18 2010-06-30 Component mounting method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008-294118 2008-11-18
JP2008294118 2008-11-18

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/827,255 Continuation US7867563B2 (en) 2008-11-18 2010-06-30 Component mounting method

Publications (1)

Publication Number Publication Date
WO2010058516A1 true WO2010058516A1 (fr) 2010-05-27

Family

ID=42197960

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2009/005191 Ceased WO2010058516A1 (fr) 2008-11-18 2009-10-06 Procédé de montage d’un élément

Country Status (4)

Country Link
US (1) US7867563B2 (fr)
JP (1) JP4531862B2 (fr)
CN (1) CN102017106B (fr)
WO (1) WO2010058516A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012111055A1 (fr) * 2011-02-14 2012-08-23 パナソニック株式会社 Procédé de montage d'élément
US8394458B2 (en) 2011-02-14 2013-03-12 Panasonic Corporation Method for disposing a component
US8476098B2 (en) 2011-06-16 2013-07-02 Panasonic Corporation Method for fabricating solar cell comprising condenser lens and photoelectric conversion element

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112008000767T5 (de) * 2007-04-03 2010-04-29 Panasonic Corporation, Kadoma-shi Verfahren zum Bestücken von Bauelementen
KR20100087932A (ko) * 2009-01-29 2010-08-06 삼성전기주식회사 자기 조립 단분자막을 이용한 다이 어태치 방법 및 자기 조립 단분자막을 이용하여 다이가 어태치된 패키지 기판
US8414976B2 (en) 2011-04-18 2013-04-09 Panasonic Corporation Method for disposing a component
JP5087720B1 (ja) * 2011-04-18 2012-12-05 パナソニック株式会社 部材を配置する方法
US8803001B2 (en) * 2011-06-21 2014-08-12 Toyota Motor Engineering & Manufacturing North America, Inc. Bonding area design for transient liquid phase bonding process
US9044822B2 (en) 2012-04-17 2015-06-02 Toyota Motor Engineering & Manufacturing North America, Inc. Transient liquid phase bonding process for double sided power modules
US10058951B2 (en) 2012-04-17 2018-08-28 Toyota Motor Engineering & Manufacturing North America, Inc. Alloy formation control of transient liquid phase bonding
DE102012018747B4 (de) * 2012-09-21 2016-03-31 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zum Anordnen von Kleinteilen
US20150050816A1 (en) * 2013-08-19 2015-02-19 Korea Atomic Energy Research Institute Method of electrochemically preparing silicon film
US11764095B2 (en) * 2020-07-10 2023-09-19 Samsung Electronics Co., Ltd. Wet alignment method for micro-semiconductor chip and display transfer structure

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007059559A (ja) * 2005-08-23 2007-03-08 Matsushita Electric Ind Co Ltd 実装方法、電子機器の製造方法および表示装置
WO2007037381A1 (fr) * 2005-09-29 2007-04-05 Matsushita Electric Industrial Co., Ltd. Procédé de montage d’un élément constituant d’un circuit électronique et dispositif de montage adapté
WO2007105405A1 (fr) * 2006-03-10 2007-09-20 Matsushita Electric Industrial Co., Ltd. Procede et dispositif de montage d'un organe de forme anisotrope, procede de fabrication d'un dispositif electronique, dispositif electronique, et affichage

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6507989B1 (en) 1997-03-13 2003-01-21 President And Fellows Of Harvard College Self-assembly of mesoscale objects
US6417025B1 (en) 2001-04-02 2002-07-09 Alien Technology Corporation Integrated circuit packages assembled utilizing fluidic self-assembly
JP2003005212A (ja) 2001-06-20 2003-01-08 Seiko Instruments Inc 単結晶シリコントランジスタ素子を有する液晶表示装置およびその製造方法
US6872645B2 (en) 2002-04-02 2005-03-29 Nanosys, Inc. Methods of positioning and/or orienting nanostructures
US6969690B2 (en) 2003-03-21 2005-11-29 The University Of North Carolina At Chapel Hill Methods and apparatus for patterned deposition of nanostructure-containing materials by self-assembly and related articles

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007059559A (ja) * 2005-08-23 2007-03-08 Matsushita Electric Ind Co Ltd 実装方法、電子機器の製造方法および表示装置
WO2007037381A1 (fr) * 2005-09-29 2007-04-05 Matsushita Electric Industrial Co., Ltd. Procédé de montage d’un élément constituant d’un circuit électronique et dispositif de montage adapté
WO2007105405A1 (fr) * 2006-03-10 2007-09-20 Matsushita Electric Industrial Co., Ltd. Procede et dispositif de montage d'un organe de forme anisotrope, procede de fabrication d'un dispositif electronique, dispositif electronique, et affichage

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012111055A1 (fr) * 2011-02-14 2012-08-23 パナソニック株式会社 Procédé de montage d'élément
JP5036910B1 (ja) * 2011-02-14 2012-09-26 パナソニック株式会社 部材のマウント方法
US8394458B2 (en) 2011-02-14 2013-03-12 Panasonic Corporation Method for disposing a component
US8476098B2 (en) 2011-06-16 2013-07-02 Panasonic Corporation Method for fabricating solar cell comprising condenser lens and photoelectric conversion element

Also Published As

Publication number Publication date
CN102017106B (zh) 2012-07-04
CN102017106A (zh) 2011-04-13
JPWO2010058516A1 (ja) 2012-04-19
JP4531862B2 (ja) 2010-08-25
US7867563B2 (en) 2011-01-11
US20100266769A1 (en) 2010-10-21

Similar Documents

Publication Publication Date Title
JP4531862B2 (ja) 部材のマウント方法
CN101310373B (zh) 电子电路构成部件的装配方法
JP4733786B2 (ja) 部材をマウントする方法
US8394458B2 (en) Method for disposing a component
US8178154B2 (en) Method for disposing a component
US8187667B2 (en) Method for disposing a component
JP5000015B2 (ja) 部材の配置方法
JP5000014B2 (ja) 部材の配置方法
JP2010145441A (ja) 部材のマウント方法
JP5036910B1 (ja) 部材のマウント方法
US8414976B2 (en) Method for disposing a component
JP5087720B1 (ja) 部材を配置する方法

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200980115067.7

Country of ref document: CN

WWE Wipo information: entry into national phase

Ref document number: 2010504336

Country of ref document: JP

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09827298

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 09827298

Country of ref document: EP

Kind code of ref document: A1