WO2010044296A1 - 照明装置、表示装置、及びテレビ受信装置 - Google Patents
照明装置、表示装置、及びテレビ受信装置 Download PDFInfo
- Publication number
- WO2010044296A1 WO2010044296A1 PCT/JP2009/062658 JP2009062658W WO2010044296A1 WO 2010044296 A1 WO2010044296 A1 WO 2010044296A1 JP 2009062658 W JP2009062658 W JP 2009062658W WO 2010044296 A1 WO2010044296 A1 WO 2010044296A1
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- WO
- WIPO (PCT)
- Prior art keywords
- light
- light guide
- led
- light emitting
- guide plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0015—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it
- G02B6/002—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide, e.g. with collimating, focussing or diverging surfaces
- G02B6/0021—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide, e.g. with collimating, focussing or diverging surfaces for housing at least a part of the light source, e.g. by forming holes or recesses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/0035—Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it
- G02B6/0036—2-D arrangement of prisms, protrusions, indentations or roughened surfaces
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/0035—Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it
- G02B6/0045—Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide
- G02B6/0046—Tapered light guide, e.g. wedge-shaped light guide
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0075—Arrangements of multiple light guides
- G02B6/0078—Side-by-side arrangements, e.g. for large area displays
- G02B6/008—Side-by-side arrangements, e.g. for large area displays of the partially overlapping type
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0086—Positioning aspects
- G02B6/0088—Positioning aspects of the light guide or other optical sheets in the package
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
Definitions
- the present invention relates to a lighting device, a display device, and a television receiver.
- the illumination device includes a light emitting element that emits light in a direction substantially parallel to a display surface of a liquid crystal panel, and a light guide that receives light from the light emitting element and emits light from the light emitting surface toward the liquid crystal panel.
- a scattering surface is formed on the surface of the light guide opposite to the liquid crystal panel by printing a scattering pattern that scatters light.
- a scattering surface may be formed by performing uneven processing on the surface of the light guide instead of the scattering pattern.
- the light incident surface is also formed by injection molding.
- a light emitting element may not be arrange
- a method is considered in which an accommodation hole is provided inside the light guide and a light emitting element is arranged in the accommodation hole.
- the light incident surface is formed inside the accommodation hole.
- the light incident surface is formed along the mold release direction in consideration of the mold structure of the mold. JP 2006-24439 A
- the accommodation hole may be cooled and contracted.
- the accommodation hole since the accommodation hole is attached to the molding die, when the molding die is pulled out from the accommodation hole, the light incident surface rubs against the molding die, and the light incidence surface is scratched. If the light incident surface is scratched, the direction of light refraction may change due to the scratch, and light may be emitted outside the light guide.
- the light exits to the outside of the light guide the amount of light reaching the light exit surface decreases, and the brightness of the liquid crystal panel decreases.
- the present invention has been completed based on the above-described circumstances, and an object thereof is to increase the brightness.
- the present invention is a lighting device in which a light emitting element and a light guide are fixed to a surface of a base material, and the light guide is provided on a light incident surface provided in an accommodation hole for accommodating the light emitting element. And a scattering surface formed by performing uneven processing, and a light emitting surface that emits light incident on the inside from the light incident surface to the outside of the light guide after being reflected by the scattering surface.
- the accommodation hole is characterized in that a frontage is widened in a die-cutting direction of a mold for molding the accommodation hole.
- the light that has entered the light guide from the light incident surface is reflected by the scattering surface, and the reflected light is emitted from the light exit surface to the outside of the light guide.
- the opening is configured so that the opening widens in the direction of punching, it is possible to avoid scratching the light incident surface by the molding die when the die is punched. That is, although injection molding is employed to form a scattering surface that has been subjected to uneven processing, it is possible to avoid scratching the light incident surface due to this injection molding. Therefore, it is possible to avoid a change in the direction of light refraction at the light incident surface and to increase the luminance.
- the following configuration is preferable as an embodiment of the present invention.
- the accommodation hole opens to the surface side of the base material, the light guide is fixed to the base material after the light emitting element fixed to the surface of the base material is accommodated in the accommodation hole. be able to.
- the light incident surface may be a tilted surface directed toward the surface of the base material with a surface along the mold release direction of the mold as a reference surface. According to such a configuration, when the mold is removed, the mold is separated from the light incident surface, so that the light incident surface can be prevented from being damaged.
- the said accommodation hole is good also as a structure penetrated and provided in the attaching part for attaching the said light guide to the said base material. According to such a configuration, when the light emitting element is accommodated in the accommodation hole, the light emitting element is exposed to the outside of the accommodation hole, so that heat generated from the light emitting element is easily radiated.
- the scattering surface may have a configuration in which a plurality of linearly extending grooves are arranged in parallel at predetermined intervals. According to such a structure, a groove
- An arrangement interval of the grooves may be gradually reduced as a distance from the light incident surface becomes longer. According to such a configuration, luminance unevenness can be eliminated.
- the light-emitting element may have a light-emitting surface from which light is emitted, and the light-emitting surface may be disposed opposite to and parallel to the light incident surface. According to such a configuration, light emitted from the light emitting surface can be efficiently incident on the light incident surface.
- the light emitting element may be a light emitting diode. According to such a configuration, it is possible to achieve high brightness.
- the base material may be a circuit board formed by mounting the light emitting element on the surface. According to such a configuration, the light emitting element can be fixed to the circuit board which is a base material, and power can be supplied from the circuit board.
- the surface of the base material may be configured to be made of a synthetic resin exhibiting white having excellent light reflectivity. According to such a configuration, light from the light emitting element can be reflected by the surface of the base material and incident on the light incident surface, so that leakage light can be reduced and high luminance can be achieved.
- An optical member disposed opposite to the light emitting surface is provided, an optical axis of light traveling from the light emitting surface toward the optical member is set substantially perpendicular to the optical member, and the light from the light emitting element is The optical axis may be set substantially parallel to the optical member. According to such a structure, since it is not necessary to arrange
- the optical member may include a diffusion plate in which a large number of diffusion particles are dispersed in a transparent resin base material having a predetermined thickness. According to this, since the light incident on the diffusion plate is diffused by the diffusing particles, luminance unevenness can be reduced.
- the attachment portion, the light exit portion having the light exit surface, and the light guide portion disposed between the attachment portion and the light exit portion are configured integrally,
- the attachment portion, the light guide portion, and the light output portion may be arranged in this order from the light emitting element side. According to such a configuration, since the attachment portion, the light guide portion, and the light output portion can be arranged along the optical axis of the light from the light emitting element, the light guide can be thinned.
- the outer peripheral surface of the light guide portion may be a substantially smooth surface over the entire area, and the light incident surface may be disposed at a boundary position between the attachment portion and the light guide portion. According to such a configuration, light can be directly incident into the light guide.
- the light guides may be arranged two-dimensionally along the planar direction of the light exit surface. According to such a configuration, since the light emitting surfaces of the respective light guides can be two-dimensionally arranged in parallel, it is possible to further prevent uneven brightness from occurring in the entire lighting device.
- a display device of the present invention includes the above-described illumination device and a display panel that performs display using light from the illumination device. According to such a display device, since the luminance of the lighting device that supplies light to the display panel is stabilized, it is possible to realize display with excellent display quality.
- a liquid crystal panel can be exemplified as the display panel.
- Such a display device can be applied as a liquid crystal display device to various uses such as a display of a television or a personal computer, and is particularly suitable for a large screen.
- FIG. 1 is an exploded perspective view showing a schematic configuration of a television receiver according to Embodiment 1 of the present invention.
- Sectional drawing which expands and shows a central part by cut
- SYMBOLS 10 Liquid crystal display device, 11 ... Liquid crystal panel, 12 ... Backlight apparatus (illuminating device), 15 ... Optical member, 16 ... Light emitting diode (light emitting element), 16a ... Light emitting surface, 17 ... LED board (base material), 18 DESCRIPTION OF SYMBOLS ... Light guide plate (light guide), 30 ... Board
- FIGS. 1 A first embodiment of the present invention will be described with reference to FIGS.
- the liquid crystal display device 10 is illustrated.
- a part of each drawing shows an X axis, a Y axis, and a Z axis, and each axis direction is drawn to be a direction shown in each drawing.
- the upper side shown in FIGS. 4 to 10 is the front side, and the lower side is the back side.
- the television receiver TV includes a liquid crystal display device 10 (display device), front and back cabinets Ca and Cb that are accommodated so as to sandwich the liquid crystal display device 10, and a power source P.
- the display surface 11a is supported by the stand S along the vertical direction (Y-axis direction).
- the liquid crystal display device 10 has a horizontally long rectangular shape as a whole, and as shown in FIG. 2, a liquid crystal panel 11 as a display panel and a backlight device (an example of the “illumination device” of the present invention) 12 as an external light source. These are integrally held by a bezel 13 or the like having a frame shape.
- the display surface 11a is along the vertical direction” is not limited to an aspect in which the display surface 11a is parallel to the vertical direction, and the display surface 11a is installed in a direction along the vertical direction relative to the direction along the horizontal direction.
- it is meant to include those inclined at 0 ° to 45 °, preferably 0 ° to 30 ° with respect to the vertical direction.
- the liquid crystal panel 11 and the backlight device 12 constituting the liquid crystal display device 10 will be described sequentially.
- the liquid crystal panel (display panel) 11 has a rectangular shape in plan view, and a pair of glass substrates are bonded together with a predetermined gap therebetween, and liquid crystal is sealed between the glass substrates. It is said.
- One glass substrate is provided with a switching element (for example, TFT) connected to a source wiring and a gate wiring orthogonal to each other, a pixel electrode connected to the switching element, an alignment film, and the like.
- a switching element for example, TFT
- the substrate is provided with a color filter and counter electrodes in which colored portions such as R (red), G (green), and B (blue) are arranged in a predetermined arrangement, and an alignment film.
- a polarizing plate is disposed outside both substrates (see FIG. 5 and the like).
- the backlight device 12 roughly includes a chassis 14 having a substantially box shape opened on the front side (the liquid crystal panel 11 side, the light emitting side), and an opening of the chassis 14.
- LED light emitting diode
- base material of the present invention
- a light guide plate an example of the “light guide” of the present invention
- the backlight device 12 is generated in association with the light emission of the LED 16, the receiving member 19 that receives the diffusion plates 15 a and 15 b constituting the optical member 15 from the back side, the pressing member 20 that presses the diffusion plates 15 a and 15 b from the front side. And a heat dissipating member 21 for promoting heat dissipation.
- the backlight device 12 has a configuration in which the LEDs 16 are arranged on the side end portion (side edge) of the light guide plate 18 and a large number of unit light emitters composed of a set of the LED 16 and the light guide plate 18 arranged in parallel with each other are arranged in parallel.
- a large number of unit light emitters (20 in FIG. 3) are juxtaposed along the parallel direction (Y-axis direction) of the LED 16 and the light guide plate 18 and arranged in tandem (see FIG. 3). 7 to 9).
- the backlight device 12 includes a large number of unit light emitters arranged in tandem in a direction substantially perpendicular to the tandem arrangement direction (Y-axis direction) and along the display surface 11a (X-axis direction).
- each member which comprises the backlight apparatus 12 is demonstrated in detail.
- the chassis 14 is made of metal, and as shown in FIG. 4, the bottom plate 14a has a rectangular shape, the side plate 14b rises from the outer end of each side of the bottom plate 14a, and the rising end of each side plate 14b.
- the long side direction of the chassis 14 coincides with the horizontal direction (X-axis direction), and the short side direction coincides with the vertical direction (Y-axis direction).
- a receiving member 19 and a pressing member 20 can be placed on each receiving plate 14c in the chassis 14 from the front side.
- Each receiving plate 14c is formed with a mounting hole 14d for screwing the bezel 13, the receiving member 19 and the pressing member 20 at a predetermined position, one of which is shown in FIG. Further, the long side receiving plate 14c is folded back so that the outer edge portion thereof is parallel to the side plate 14b (FIG. 4).
- an insertion hole 14e for passing a clip 23 for attaching the light guide plate 18 is formed through the bottom plate 14a at a predetermined position (FIGS. 5 and 6). Note that a mounting hole (not shown) for screwing the LED board 17 is formed through the bottom plate 14a at a predetermined position.
- the optical member 15 is interposed between the liquid crystal panel 11 and the light guide plate 18, and is disposed on the liquid crystal panel 11 side with diffusion plates 15 a and 15 b disposed on the light guide plate 18 side. And an optical sheet 15c.
- the diffusing plates 15a and 15b have a configuration in which a large number of diffusing particles are dispersed in a transparent resin base material having a predetermined thickness, and have a function of diffusing transmitted light.
- Two diffuser plates 15a and 15b having the same thickness are stacked and arranged. Of both diffusion plates 15a and 15b, the diffusion plate 15b located on the light guide plate 18 side is disposed so as to be opposed to a light emitting surface 36 described later, as shown in FIGS.
- the optical sheet 15c has a sheet shape that is thinner than the diffusion plates 15a and 15b, and three optical sheets are laminated. Specifically, the optical sheet 15c is a diffusion sheet, a lens sheet, and a reflective polarizing sheet in order from the diffusion plates 15a and 15b side (back side).
- the receiving member 19 is disposed at the outer peripheral end portion of the chassis 14 and can receive the outer peripheral end portions of the diffusion plates 15a and 15b over substantially the entire circumference.
- the receiving member 19 includes a pair of short side receiving members 19 ⁇ / b> A extending along each short side portion of the chassis 14, and two long side sides extending along each long side portion. It has receiving members 19B and 19C.
- Each receiving member 19 has a different form depending on each installation location. When the receiving members 19 are distinguished, the suffixes A to C are added to the symbols of the receiving members, respectively, and when the generic names are not distinguished, the suffix is not added to the symbols. .
- both short side receiving members 19A have substantially the same structure, and both have a substantially L-shaped cross section extending along the inner wall surfaces of the short side receiving plate 14c and the side plate 14b. I am doing. Of the portions parallel to the receiving plate 14c in both the short side receiving members 19A, the inner portion receives the back diffusion plate 15b, while the outer portion receives a short side pressing member 20A described later. Further, both short side receiving members 19A cover the short side receiving plate 14c and side plate 14b over substantially the entire length.
- the long side receiving members 19B and 19C are different from each other.
- the first long side receiving member 19B disposed on the lower side (vertical direction lower side) shown in FIG. 3 in the chassis 14 is, as shown in FIG. 7, the inner wall surface of the long side receiving plate 14c, And it is set as the form extended along the surface (surface on the opposite side to the LED board 17 side) of the light guide plate 18 adjacent to it. That is, the first long side receiving member 19B has a function of pressing the adjacent light guide plate 18 from the front side.
- the inner end receives the front diffusion plate 15a, while the outer portion receives a first long side pressing member 20B described later.
- a step portion 19Ba adapted to the outer edge of the front diffusion plate 15a is formed at the inner end of the first long side receiving member 19B.
- a recess 19Bb that receives the protrusion 20Bc of the first long side pressing member 20B is formed at a position adjacent to the outside of the step portion 19Ba in the first long side receiving member 19B.
- the first long side receiving member 19B covers the long side receiving plate 14c and the non-light emitting portions (the substrate mounting portion 30 and the light guiding portion 32) of each light guide plate 18 adjacent thereto over almost the entire length.
- the width of the first long side receiving member 19B is wider than the other receiving members 19A and 19C to cover the non-light emitting portion of the light guide plate 18.
- the second long side receiving member 19C disposed on the upper side (vertical upper side) shown in FIG. 3 in the chassis 14 extends along the inner wall surfaces of the receiving plate 14c, the side plate 14b, and the bottom plate 14a, as shown in FIG.
- the existing cross section has a substantially crank shape.
- a portion parallel to the receiving plate 14c is formed by knocking out a diffusion plate receiving projection 19Ca having a substantially arc-shaped cross section protruding toward the front side. It abuts against the plate 15b from the back side.
- the second long side receiving member 19C a portion parallel to the bottom plate 14a is formed with a light guide plate receiving protrusion 19Cb having a substantially arc-shaped cross section protruding toward the front side.
- the light guide plate 18 is contacted from the back side. That is, the second long side receiving member 19 ⁇ / b> C has both a function of receiving (supporting) the diffusion plates 15 a and 15 b and a function of receiving the light guide plate 18.
- a portion of the second long side receiving member 19C that is parallel to the receiving plate 14c and that is inward of the diffusion plate receiving protrusion 19Ca is in contact with the front end of the light guide plate 18 from the back side.
- the light guide plate 18 can be supported at two points together with the light guide plate receiving protrusion 19 ⁇ / b> Cb that abuts the base side portion of the light guide plate 18.
- the second long side receiving member 19C is configured to cover the long side receiving plate 14c and the side plate 14b over substantially the entire length.
- a projecting piece 19Cc facing the end surfaces of both diffusion plates 15a, 15b is formed to rise from the outer end of the second long side receiving member 19C.
- the holding member 20 is disposed at the outer peripheral end of the chassis 14, and the width dimension thereof is sufficiently smaller than the short side dimension of the chassis 14 and the diffusion plates 15 a and 15 b, so that the diffusion plate 15 a It is possible to locally press the outer peripheral end.
- the holding member 20 includes a short side holding member 20A arranged one by one on both short sides of the chassis 14 and a plurality of long side holding members 20B, 20C arranged on both long sides. Yes.
- Each pressing member 20 has a different form depending on each installation location.
- suffixes A to C are attached to the reference numerals of the pressing members, respectively, and when referring generically without distinction, the suffix is not attached to the reference sign. .
- Both short-side holding members 20A are arranged at substantially the center position of both short-side portions of the chassis 14, and are screwed in a state of being placed on the outer end portions of both short-side receiving members 19A. .
- both short-side holding members 20 ⁇ / b> A have holding pieces 20 ⁇ / b> Aa that protrude inward from the screwed main body portion, and the diffusion plate is formed by the tip of the holding pieces 20 ⁇ / b> Aa. 15a can be pressed from the front side.
- the liquid crystal panel 11 is placed on the pressing piece 20 ⁇ / b> Aa from the front side, and the liquid crystal panel 11 can be sandwiched between the bezel 13. Further, a buffer material 20Ab for the liquid crystal panel 11 is disposed on the front side surface of the pressing piece 20Aa.
- the long side pressing members 20B and 20C are different from each other.
- the first long side pressing member 20B disposed on the lower side (vertical direction lower side) shown in FIG. 3 in the chassis 14 is, as shown in FIG. Are arranged at approximately equal intervals at three positions of the substantially central position and the both side positions, and are screwed in a state of being placed on the outer end portion of the first long side receiving member 19B.
- the first long side pressing member 20B has a pressing piece 20Ba on the inner end side, like the short side pressing member 20A, and the back side surface of the pressing piece 20Ba is The diffusion plate 15a is pressed down, and the front surface can receive the liquid crystal panel 11 via the buffer material 20Bb.
- first long side pressing member 20B has a larger width dimension than the other pressing members 20A and 20C so as to be compatible with the first long side receiving member 19B, and on the back side, A projection 20Bc is provided for positioning with respect to the first long side receiving member 19B.
- the second long side pressing member 20 ⁇ / b> C arranged on the upper side (vertical upper side) shown in FIG. 3 in the chassis 14 is at two positions eccentric in the upper long side portion of the chassis 14 in the same figure. In addition, it is screwed in a state where it is placed directly on the receiving plate 14 c of the chassis 14.
- the second long side pressing member 20C has a pressing piece 20Ca on the inner end side, like the short side pressing member 20A and the first long side pressing member 20B.
- the back side surface of the pressing piece 20Ca presses the diffusion plate 15a, and the front side surface can receive the liquid crystal panel 11 via the cushioning material 20Cb.
- a cushioning material 20Cc different from the above is interposed between the pressing piece 20Ca and the bezel 13 in the second long side pressing member 20C.
- the heat dissipating member 21 is made of a synthetic resin material or a metal material having excellent heat conductivity and has a sheet shape.
- the heat dissipating member 21 is disposed inside the chassis 14 shown in FIG. 5 and outside the chassis 14 shown in FIG. There is something to be done.
- the one disposed in the chassis 14 is interposed between the bottom plate 14 a of the chassis 14 and the LED substrate 17, and is provided with notches for allowing other members to escape.
- the heat radiating member 21 disposed outside the chassis 14 is attached to the back surface of the bottom plate 14 a of the chassis 14.
- the LED 16 is a so-called surface-mounted LED that is surface-mounted on the LED substrate 17.
- the LED 16 is a side-emitting LED whose side surface adjacent to the mounting surface (the bottom surface in contact with the LED substrate 17) with respect to the LED substrate 17 is a light emitting surface 16 a while forming a horizontally long substantially block shape as a whole.
- the optical axis LA of the LED 16 is set to be substantially parallel to the display surface 11a of the liquid crystal panel 11 (the light emitting surface 36 of the light guide plate 18) (FIGS. 7 and 10).
- the optical axis LA of the LED 16 coincides with the short side direction (Y-axis direction) of the chassis 14, that is, the vertical direction, and the light emission direction (light emission direction from the light emitting surface 16a) is upward in the vertical direction. (FIGS. 3 and 7).
- the light emitted from the LED 16 spreads radially to some extent within a predetermined angle range around the optical axis LA, but its directivity is higher than that of a cold cathode tube or the like. That is, the light emission intensity of the LED 16 exhibits an angular distribution in which the direction along the optical axis LA is conspicuously high and rapidly decreases as the tilt angle with respect to the optical axis LA increases.
- the longitudinal direction of the LED 16 coincides with the long side direction (X-axis direction) of the chassis 14.
- the LED 16 has a plurality of LED chips 16c, which are light emitting elements, mounted on a substrate portion 16b disposed on the opposite side (back side) to the light emitting surface 16a, and the periphery thereof is surrounded by a housing 16d.
- the space surrounding the housing 16d is sealed with a resin material 16e.
- the LED 16 includes three types of LED chips 16c having different main emission wavelengths. Specifically, each LED chip 16c emits R (red), G (green), and B (blue) in a single color. It has become.
- Each LED chip 16 c is arranged in parallel along the longitudinal direction of the LED 16.
- the housing 16d has a horizontally long and substantially cylindrical shape exhibiting white with excellent light reflectivity. Further, the back surface of the substrate portion 16b is soldered to the land on the LED substrate 17.
- the LED substrate 17 is made of a synthetic resin whose surface (including the surface facing the light guide plate 18) is white with excellent light reflectivity. As shown in FIG. 3, the LED substrate 17 has a rectangular plate shape in plan view, and its long side dimension is set to be sufficiently smaller than the short side dimension of the bottom plate 14a. It is possible to partially cover the bottom plate 14a.
- a plurality of LED substrates 17 are arranged in a plane in a grid pattern in the plane of the bottom plate 14 a of the chassis 14. Specifically, in FIG. 3, a total of 25 LED substrates 17 are arranged in parallel, 5 in the long side direction of the chassis 14 and 5 in the short side direction.
- a wiring pattern made of a metal film is formed on the LED substrate 17 and the LED 16 is mounted at a predetermined position.
- An external control board (not shown) is connected to the LED board 17, and power necessary for lighting the LED 16 is supplied from the LED board 17, and drive control of the LED 16 is possible.
- a large number of LEDs 16 are arranged in a grid pattern on the LED substrate 17, and the arrangement pitch thereof corresponds to the arrangement pitch of light guide plates 18 described later. Specifically, a total of 32 LEDs 16 are arranged in parallel, 8 in the long side direction and 4 in the short side direction on the LED substrate 17.
- a photo sensor 22 is mounted on the LED substrate 17, and by detecting the light emission state of each LED 16 by the photo sensor 22, each LED 16 can be feedback controlled (FIG. 4).
- the LED board 17 has an attachment hole 17a (FIG. 6) for receiving the clip 23 for attaching the light guide plate 18 and a positioning hole 17b (FIG. 10) for positioning the light guide plate 18, respectively. Are provided according to the mounting position.
- the light guide plate 18 is made of a synthetic resin material (for example, polycarbonate) having a refractive index sufficiently higher than that of air and substantially transparent (excellent translucency). As shown in FIGS. 7 to 9, the light guide plate 18 introduces light emitted from the LEDs 16 in the vertical direction (Y-axis direction) and propagates the light inside (ZZ side) (Z It has a function of rising and emitting in the direction of the axial direction. As shown in FIG.
- the light guide plate 18 is formed in a plate shape having a rectangular shape in plan view as a whole, and its long side direction is the optical axis LA (light emission direction) of the LED 16 and the short side direction of the chassis 14 ( The short side direction is parallel to the long side direction (X axis direction, horizontal direction) of the chassis 14.
- the cross-sectional structure along the long side direction in the light guide plate 18 will be described in detail.
- the light guide plate 18 has one end side (the LED 16 side) in the long side direction serving as a board mounting portion 30 for mounting on the LED board 17, while the other side in the long side direction.
- the end side is a light emitting portion 31 that can emit light toward the diffuser plates 15a and 15b, and the light emitting portion between the substrate mounting portion 30 and the light emitting portion 31 emits light with little light exiting on the way.
- the light guide 32 can be guided to 31. That is, the board mounting portion 30 (LED 16), the light guide portion 32, and the light output portion 31 are sequentially arranged from the LED 16 side along the long side direction of the light guide plate 18, that is, the optical axis LA (light emission direction) of the LED 16. It can be said that.
- the substrate mounting portion 30 and the light guide portion 32 are non-light emitting portions, whereas the light output portion 31 is a light emitting portion.
- the direction from the board mounting part 30 toward the light emitting part 31 is forward, and conversely, the direction from the light emitting part 31 toward the board mounting part 30 (see FIG. The description will be made assuming that the left direction in FIGS.
- an LED accommodation hole 33 that accommodates the LED 16 is formed through the Z-axis direction at the front end position of the board mounting portion 30, and the light emitting surface 16 a of the LED 16 on the inner peripheral surface thereof.
- a light incident surface 34 on which light from the LED 16 is incident is disposed at the boundary position between the substrate mounting portion 30 and the light guide portion 32.
- the outer peripheral surface of the light guide portion 32 is substantially smooth over the entire area, and light is not diffusely reflected at the interface (interface with the external air layer). Since the incident angle with respect to the interface almost exceeds the critical angle, the light is guided to the light output portion 31 side while repeating total reflection.
- each LED chip 16c constituting the LED 16 emits R, G, B monochromatic light.
- the three monochromatic lights are mixed with each other.
- the white light is led to the light output unit 31.
- the light guide 32 is inserted into the positioning hole 17b of the LED board 17 at a position near the board mounting part 30 (near the rear end part), so that the X axis direction and the Y axis direction with respect to the LED board 17
- a positioning projection 35 capable of positioning the light guide plate 18 is provided so as to protrude to the back side.
- a light emitting surface 36 is the entire surface of the light exiting portion 31 facing the front side, that is, substantially the entire surface facing the diffusion plate 15b.
- the light exit surface 36 is a substantially smooth surface and is substantially parallel to the plate surfaces of the diffusion plates 15a and 15b (the display surface 11a of the liquid crystal panel 11), and is substantially orthogonal to the light incident surface 34. Yes.
- the optical axis of the light traveling from the light emitting surface 36 toward the optical member 15 is substantially orthogonal to the optical axis LA of the light from the LED 16. That is, the optical axis of the light traveling from the light emitting surface 36 toward the optical member 15 is set substantially perpendicular to the optical member 15, and the optical axis LA of the light from the LED 16 is set substantially parallel to the optical member 15.
- a scattering surface that scatters light at the interface by applying a fine unevenness to the back surface (the surface opposite to the light emitting surface 36, the surface facing the LED substrate 17) of the light emitting portion 31. 37 is formed.
- the scattering surface 37 includes a large number of grooves 37 a extending linearly along the short side direction of the light guide plate 18 at a predetermined interval, and the arrangement pitch (arrangement interval) of the grooves 37 a.
- the groove 37a constituting the scattering surface 37 has a lower density on the rear end side, that is, the side closer to the light incident surface 34 (closer side), and the front end side, that is, the side on which the distance from the light incident surface 34 is larger. It is arranged so that it becomes denser (the far side), so it is a gradation arrangement.
- the scattering surface 37 is provided over almost the entire area of the light output portion 31, and the almost entire area overlaps with the light emitting surface 36 in a plan view.
- a reflection sheet 24 that reflects light toward the inside of the light guide plate 18 is disposed on the back surface (including the scattering surface 37) of the light exit unit 31 and the light guide unit 32.
- the reflection sheet 24 is of a wide type formed larger than the dimension of the light guide plate 18 in the X-axis direction, and substantially the same size as the dimension of the light guide plate 18 shown in FIG. 13 in the X-axis direction.
- a narrow type formed. The wide type and the narrow type are alternately arranged in the X-axis direction.
- a wide type reflection sheet 24 is attached to the light guide plate 18 located in the center in FIG.
- a narrow type reflection sheet 24 is attached to the light guide plates 18 located on both the left and right sides in FIG. ing.
- the reflective sheet 24 can be disposed not only in the gap S between the slits 42 but also in the gap S between the adjacent light guide plates 18. That is, the wide-type reflection sheet 24 is configured to extend in the gap S between the light guide plates 18 along the back-side surfaces of the light output part 31 and the light guide part 32.
- the reflection sheet 24 is made of a synthetic resin (for example, a resin film such as white PET) having a white surface with excellent light reflectivity. As shown in FIG. It is arranged in a region corresponding to almost the entire area of the optical part 32.
- the reflection sheet 24 can reliably prevent light propagating in the light guide plate 18 from leaking to the back side, and can efficiently raise the light scattered on the scattering surface 37 to the light emitting surface 36 side. it can.
- the reflection sheet 24 is bonded to the light guide plate 18 by a transparent adhesive at a plurality of positions on the side end positions, that is, positions where it is difficult to optically interfere with the light propagating in the light guide plate 18.
- the reflection sheet 24 is provided with a hole through which the positioning protrusion 35 is passed at a position corresponding to the positioning protrusion 35.
- the side end surface and the front end surface (front end surface) in the light output part 31 are also smooth surfaces similar to the light guide part 32, almost no leakage light is generated.
- the front side surface (including the surface facing the diffusion plates 15 a and 15 b and the light emitting surface 36) and the back side surface (facing the LED substrate 17) of the light guide plate 18 are respectively X Parallel surfaces 38 and 41 that are substantially parallel to the axial direction and the Y-axis direction (display surface 11a) and inclined surfaces 39 and 40 that are inclined with respect to the X-axis direction and the Z-axis direction are formed.
- the back surface of the substrate mounting portion 30 is a mounting surface for the LED substrate 17 and a parallel surface 38 (a surface parallel to the surface on which the LED 16 is mounted on the LED substrate 17) in order to stabilize the mounting state. Has been.
- the back surface of the light guide unit 32 and the light output unit 31 is a continuous inclined surface 39. Therefore, among the light guide plates 18, the substrate mounting portion 30 is fixed in contact with the LED substrate 17, but the light guide portion 32 and the light output portion 31 are lifted from the LED substrate 17, and the LED substrate 17 is in a non-contact state. That is, the light guide plate 18 is supported in a cantilevered manner with the substrate attachment portion 30 on the rear end side as a base end (fulcrum) and the front end side as a free end.
- the surface on the front side of the entire area of the substrate mounting portion 30 and the light guide portion 32 and the portion of the light output portion 31 near the light guide portion 32 is a continuous inclined surface 40. Since this inclined surface 40 is substantially parallel to each other at substantially the same inclination angle as the inclined surface 39 on the back side, the entire area of the light guide portion 32 and the portion near the light guide portion 32 (side closer to the LED 16) in the light output portion 31 are plate thickness Is almost constant.
- the surface on the front side of the light emitting portion 31 near the front end is a parallel surface 41.
- the light exit surface 36 includes a parallel surface 41 and an inclined surface 40, the most part near the front end is the parallel surface 41, and a part near the light guide part 32 is the inclined surface 40.
- the board attachment portion 30 has a tapered shape in which the plate thickness gradually decreases as it goes to the rear end side (as it moves away from the light guide portion 32).
- the light exiting portion 31 has a constant thickness because the surface on the front side is the inclined surface 40 for the portion adjacent to the light guide portion 32, but the surface on the front side is a parallel surface 41 for the front portion. Therefore, it has a tapered shape in which the plate thickness gradually decreases as it goes to the front end side (as it moves away from the light guide portion 32).
- the front-side parallel surface 41 has a length dimension (dimension in the Y-axis direction) shorter than the back-side parallel surface 38. Therefore, the front end portion of the light exiting portion 31 has a thickness dimension smaller than that of the rear end portion of the substrate mounting portion 30, and the front end surface (front end surface) of the light exiting portion 31 has a surface area larger than that of the rear end surface of the substrate mounting portion 30. It is getting smaller.
- the outer peripheral end surface (including both side end surfaces and the front end surface) of the light guide plate 18 is a vertical end surface that is substantially straight along the Z-axis direction over the entire region.
- the light guide plate 18 having the above-described cross-sectional structure has a pair of LED housing holes 33 for housing the LEDs 16 as shown in FIG. 12, and light from two different LEDs 16 is incident on it. Regardless, the light emitted from each LED 16 can be guided to the diffusion plates 15a and 15b in an optically independent state.
- FIG. 12 it explains in detail with the plane arrangement of each composition part in light guide plate 18.
- the entire light guide plate 18 has a symmetrical shape centered on an axis of symmetry passing through the center position in the short side direction (X-axis direction).
- a pair of LED receiving holes 33 of the board mounting portion 30 are disposed symmetrically at positions shifted by a predetermined distance from the center position in the short side direction (X-axis direction) of the light guide plate 18.
- Each LED accommodation hole 33 has a substantially rectangular shape that is horizontally long when seen in a plan view, and is slightly larger than the outer shape of the LED 16.
- the LED housing hole 33 has a height dimension (dimension in the Z-axis direction) and a width dimension (dimension in the X-axis direction) that is slightly larger than that of the LED 16, and the surface area of the light incident surface 34 is larger than that of the light emitting surface 16 a of the LED 16. Is sufficiently large so that the radial light emitted from the LED 16 can be taken in without any excess.
- a slit 42 that divides the light guide part 32 and the light output part 31 into left and right parts is provided at a central position in the short side direction of the light guide plate 18.
- the slit 42 penetrates the light guide plate 18 in the thickness direction (Z-axis direction) and has a constant width in a form that opens forward along the Y-axis direction.
- the end face of the light guide plate 18 facing the slit 42 constitutes side end faces of the divided light guide portions 32S and the divided light output portions 31S, and is a substantially smooth surface that is substantially straight along the Z-axis direction.
- the light in the light guide plate 18 is totally reflected at the interface with the air layer of the slit 42 at the end face facing the slit 42, the light is transmitted between the divided light guide portions 32S and the divided light output portions 31S facing each other across the slit 42. Is prevented from coming and going and mixing. Thereby, the optical independence in each division
- the rear end position of the slit 42 is slightly forward of the positioning protrusion 35 and the irradiation area in the X-axis direction of each LED 16 (the angle range between the alternate long and short dash lines around the optical axis LA of the LED 16 shown in FIG. ) Is set behind.
- the pair of positioning projections 35 are located behind the irradiation region in the X-axis direction of each LED 16 at the outer end of the divided light guide 32S (the end opposite to the slit 42) in the same manner as the slit 42. It is symmetrically arranged in the position of the side, and it is avoided that the positioning protrusion 35 becomes an optical obstruction.
- the formation range of the slits 42 does not extend to the board mounting part 30, and both split light guide parts 32 ⁇ / b> S are connected to the common board mounting part 30, so that mechanical stability is ensured. ing.
- the light guide plate 18 is optically independent from each other, and two unit light guide plates (a divided light guide portion 32S and a divided light output portion 31S) individually corresponding to each LED 16 are provided by the substrate mounting portion 30. Due to the integrally connected configuration, the workability of attaching the light guide plate 18 to the LED substrate 17 is ensured. Moreover, the reflective sheet 24 is extended in the form which straddles the slit 42, as shown in FIG.
- the clip 23 includes an attachment plate 23 a parallel to the substrate attachment portion 30, an insertion protrusion 23 b protruding from the attachment plate 23 a in the plate thickness direction (Z-axis direction) of the substrate attachment portion 30, and an insertion It is comprised from a pair of latching piece 23c which protrudes from the front-end
- the clip 23 is guided by the insertion protrusion 23b being inserted into the clip insertion hole 43 of the board mounting part 30 and the mounting hole 17a of the LED board 17 and the locking piece 23c being locked to the edge of the mounting hole 17a.
- the light plate 18 can be fixed to the LED substrate 17 in an attached state.
- the clip 23 is provided with one insertion protrusion 23b on the attachment plate 23a and two insertion protrusions 23b on the attachment plate 23a.
- the former is used for the clip insertion hole 43 (FIG. 6) arranged at the end in the chassis 14, whereas the latter is used in a form straddling two light guide plates 18 arranged in parallel.
- the light guide plates 18 can be attached together. As shown in FIGS.
- a clip housing recess 44 for receiving the mounting plate 23 a of the clip 23 is provided on the peripheral edge of the clip insertion hole 43, so that the mounting plate 23 a is moved from the board mounting portion 30 to the front side. Protruding is prevented, thereby contributing to space saving, that is, reducing the thickness of the backlight device 12.
- a photosensor housing hole 45 capable of housing the photosensor 22 mounted on the LED substrate 17 is formed between the LED housing holes 33 in the board mounting portion 30 so as to penetrate therethrough. Since a predetermined number of the photosensors 22 are intermittently arranged on the LED substrate 17 and are arranged only between specific LEDs, the photosensors 22 are arranged in the photosensor housing holes 45 of all the light guide plates 18 in the chassis 14. 22 is not arranged (see, for example, FIG. 11). In addition, a pair of notches 46 are symmetrically arranged between the photosensor housing hole 45 and the LED housing holes 33 in the board mounting portion 30.
- This notch 46 is configured to open rearward while penetrating the board mounting portion 30, and a screw (not shown) for fixing the LED board 17 to the chassis 14 is passed therethrough. ing. Note that the notches 46 are not used in all the light guide plates 18 in the chassis 14 like the photosensor housing holes 45.
- the light guide plate 18 is planarly arranged in a grid pattern in the bottom plate 14a of the chassis 14, and its arrangement form will be described in detail.
- the arrangement form in the tandem arrangement direction (Y-axis direction) will be described.
- the light guide plate 18 is attached in a state in which the light guide portion 32 and the light output portion 31 are lifted from the LED substrate 17.
- the light guide plate 18 adjacent to the light guide plate 18 adjacent to the upper side in the vertical direction is disposed so as to cover almost the entire area of the light guide plate 32 from the front side.
- the substrate mounting portion 30 and the light guide portion 32 in the front light guide plate 18 and the rear light guide portion 32 and the light output portion 31 overlap each other when viewed in a plan view. It is a positional relationship.
- the substrate mounting portion 30 and the light guide portion 32 that are non-light emitting portions of the light guide plate 18 are covered with the light guide portion 32 and the light output portion 31 of the light guide plate 18 adjacent to the rear side thereof, so that the diffusion plate 15b side.
- only the light exit surface 36 of the light exit portion 31 that is a light emitting portion is exposed to the diffuser plate 15b.
- the light emission surfaces 36 of the respective light guide plates 18 are continuously arranged almost seamlessly in the tandem arrangement direction.
- the reflection sheet 24 is disposed on almost the entire surface of the back side of the light guide unit 32 and the light output unit 31, even if light leaks due to being reflected by the light incident surface 34, The leakage light is prevented from entering the rear light guide plate 18.
- the light guide part 32 and the light output part 31 in the light guide plate 18 on the rear side (front side) are mechanically supported from the back side by the light guide plate 18 overlapping the front side (back side).
- the front-side inclined surface 40 and the back-side inclined surface 39 of the light guide plate 18 have substantially the same inclination angle and are parallel to each other, there is almost no gap between the light guide plates 18 that overlap the front and back surfaces. Therefore, the front light guide plate 18 can be supported by the back light guide plate 18 without rattling.
- the light guide part 32 in the rear light guide plate 18 only covers the substrate attachment part 30 in the front light guide plate 18, and the rear part faces the LED substrate 17.
- the light guide plates 18 are not overlapped with each other in a predetermined direction with respect to a direction orthogonal to the tandem arrangement direction (X-axis direction). They are arranged in parallel at intervals. By providing this gap, a certain air layer can be secured between the light guide plates 18 adjacent in the X-axis direction, and this allows light to pass and mix between the light guide plates 18 adjacent in the X-axis direction. Thus, the optical independence of each light guide plate 18 is secured.
- the interval between the light guide plates 18 is equal to or smaller than the slit 42.
- a large number of light guide plates 18 are arranged in a plane in the chassis 14, and a light output surface of the entire backlight device 12 is configured by a set of the divided light output portions 31 ⁇ / b> S.
- the divided light guide portions 32S and the divided light output portions 31S of each light guide plate 18 are ensured optically independent from each other. Therefore, by individually controlling the lighting or non-lighting of each LED 16, it is possible to independently control whether or not light is emitted from each divided light emitting unit 31S, and thus driving the backlight device 12 called area active. Control can be realized. As a result, the contrast performance that is extremely important as the display performance in the liquid crystal display device 10 can be remarkably improved.
- the LEDs 16 are arranged in a state in which a predetermined gap is provided over the entire circumference with respect to the inner peripheral surface (including the light incident surface 34) in the LED accommodating hole 33.
- the gap between the light emitting surface 16a and the light incident surface 34 is about 0.3 mm.
- the gap is formed for the following reason. Provided. This gap is secured, for example, to absorb an assembly error that occurs when the light guide plate 18 is assembled to the LED substrate 17.
- the gap is also required to allow the light guide plate 18 to thermally expand due to heat generated when the LED 16 emits light.
- the light incident surface 34 can be configured as an inclined surface by utilizing a gap between the light emitting surface 16a and the light incident surface 34.
- the light guide plate 18 in the present embodiment is formed by injection molding with a molding die 47. This is because the scattering surface 37 needs to be formed.
- 15 and 16 are cross-sectional views showing how the light guide plate 18 is injection-molded by the molding die 47.
- FIG. FIG. 14 is an enlarged cross-sectional view of the LED housing hole 33, in which the inclination angle of the light incident surface 34 is made larger than the actual angle.
- the light incident surface 34 in the present embodiment is inclined with respect to the mold releasing direction of the molding die 47 for forming the light guide plate 18, so that the light incident surface 34 can be seen to be inclined. It is drawn at an angle (about 10 °) larger than the inclination angle ⁇ .
- the molding die 47 for molding the light guide plate 18 is composed of an upper die 47A and a lower die 47B as shown in FIGS. Of the molding die 47, the protrusion 47C for molding the LED housing hole 33 is configured as a part of the lower die 47B.
- the upper mold 47A and the lower mold 47B are closed, a molding space is formed.
- the molten resin 48 is supplied to the molding space, and the molten resin 48 is filled into the molding space as shown in FIG. Then, after the resin 48 is cooled, as shown in FIG. 16, the upper and lower molds 47A and 47B are opened, and the cooled and solidified resin 48 is released to form the light guide plate 18.
- the surface of the LED accommodation hole 33 that faces the light incident surface 34 is a vertical surface 49 that extends along the direction in which the lower mold 47B is released. During the cooling of the resin 48, the resin 48 contracts, so that the projection 47 ⁇ / b> C is sandwiched between the light incident surface 34 and the vertical surface 49. If the light incident surface 34 is a surface parallel to the vertical surface 49, that is, a surface along the mold releasing direction of the lower mold 47 ⁇ / b> B, the light incident surface 34 and the protrusion 47 ⁇ / b> C move relative to each other and move relatively. Since the incident surface 34 and the protrusion 47C rub against each other, the light incident surface 34 may be damaged.
- the LED housing hole 33 in the present embodiment has a wide opening toward the mold release direction of the lower mold 47B, and the light incident surface 34 has a surface along the mold release direction of the lower mold 47B as a reference plane L2. Since the inclined surface is directed toward the surface 51 of the LED substrate 17, when the light incident surface 34 and the protrusion 47 ⁇ / b> C move relative to each other in the mold release direction, they are separated from each other, and the protrusion 47 ⁇ / b> C and the light incident surface 34 are separated from each other. Rubbing is avoided. Therefore, the light incident surface 34 is not damaged.
- the die-cutting direction of the lower die 47B is the direction indicated by the arrow P1 shown in FIGS. 14 to 16, and the surface 51 of the LED substrate 17 from the surface 50 opposite to the LED substrate 17 in the light guide plate 18. It is the direction toward.
- the mold release direction P1 of the lower mold 47B is the direction opposite to the mold release direction P2 of the upper mold 47A.
- the reference surface L2 is a surface along the die cutting direction P1 of the lower die 47B, and is a surface parallel to the XZ plane in this embodiment.
- the inclination angle ⁇ is an angle when a portion where the inclined surface L1 and the reference surface L2 intersect is viewed from the X-axis direction when the inclined surface along the light incident surface 34 is L1.
- the inclination angle ⁇ is preferably 1 ° to 10 °, and more preferably 1 ° to 3 °.
- the light incident surface 34 is disposed so as to face the light emitting surface 16a of the LED 16, and the optical axis LA1 of the light incident from the light incident surface 34 into the light guide 32 is slightly in the Z-axis direction than the optical axis LA.
- the inclination angle ⁇ is about 1 ° to 3 °, so that no light is emitted outside the light guide 32.
- the direction of refraction changes greatly at the light incident surface 34, and the optical axis LB1 of the light incident on the light guide portion 32 is changed inside the light guide portion 32.
- the light incident surface 34 is scratched because the light incident surface 34 is inclined so that the releasability between the projection 47C and the light incident surface 34 is dramatically improved. There is no fear. Therefore, it is possible to avoid a significant change in the direction of refraction on the light incident surface 34 and to prevent leakage light (the optical axis LB2 of leakage light). Therefore, the amount of light reaching the light emitting surface 36 is increased, and the brightness of the liquid crystal panel 11 can be increased.
- the present embodiment has the following effects. Since the LED housing hole 33 opens to the surface 51 side of the LED substrate 17, the LED 16 fixed to the surface 51 of the LED substrate 17 is housed in the LED housing hole 33, and the light guide plate 18 is attached to the LED substrate 17. Can be fixed. Since the LED 16 is exposed to the outside of the LED housing hole 33 when the LED 16 is housed in the LED housing hole 33, it is easy to dissipate heat generated from the LED 16.
- the scattering surface 37 is composed of a plurality of grooves 37a
- the grooves 37a can function as prisms and can reflect light. Since the arrangement interval of the grooves 37a is gradually reduced as the distance from the light incident surface 34 becomes longer, unevenness in luminance can be eliminated.
- the light emitting surface 16a is disposed so as to face the light incident surface 34, the light emitted from the light emitting surface 16a can be efficiently incident on the light incident surface 34. -Since the light emitting diode 16 is employed as the light emitting element, high luminance can be achieved.
- the LED 16 can be fixed to the LED substrate 17 and can be supplied with power from the LED substrate 17. Since the light from the LED 16 can be reflected by the surface 51 of the LED substrate 17 and incident on the light incident surface 34, leakage light can be reduced and high luminance can be achieved. Since the optical axis LA of the light from the LED 16 and the optical axis of the light emitted from the light emitting surface 36 are arranged substantially orthogonal to each other, the light guide plate 18 can be thinned in the Z-axis direction.
- the optical member 15 is configured to include the diffusing plates 15a and 15b, the light incident on the diffusing plates 15a and 15b can be diffused by the diffusing particles, and luminance unevenness can be reduced.
- the light guide plate 18 is composed of the substrate mounting portion 30, the light guide portion 32, and the light output portion 31 in order from the LED 16 side along the Y-axis direction, the light guide plate 18 can be thinned in the Z-axis direction. Since the light incident surface 34 is disposed at the boundary position between the substrate mounting portion 30 and the light guide portion 32, light can be directly incident on the inside of the light guide portion 32. Since the plurality of light guide plates 18 are arranged two-dimensionally along the plane direction of the light emitting surface 36, it is possible to make the luminance unevenness less likely to occur in the entire backlight device 12.
- Embodiment 2 of the present invention will be described with reference to FIG.
- the LEDs 16 in the first embodiment are arranged obliquely, and the same reference numerals are assigned to the same components as those in the first embodiment, and the configurations, operations, and effects that are the same as those in the first embodiment are described. The description is omitted.
- the light emitting surface 16a of the LED 16 of the present embodiment is disposed to face the light incident surface 34 in parallel. For this reason, the optical axis LA of the light emitted from the light emitting surface 16a and the light incident surface 34 are orthogonal to each other.
- the optical axis LA of the light from the LED 16 and the optical axis LA1 of the light incident on the inside of the light guide 32 can be arranged in a straight line, and the light from the LED 16 is efficiently transmitted to the light incident surface 34. It can be incident well.
- the concave portion 52 is formed on the surface 51 of the LED substrate 17 and the LED 16 is fixed to the concave portion 52.
- the convex portion is formed on the surface 51 of the LED substrate 17.
- the LED 16 may be disposed obliquely on the convex portion.
- one light guide plate 18 includes a pair of LEDs 16.
- one light guide plate 18 may include three or more LEDs.
- each of the above embodiments shows the light guide plate 18 provided with one slit 42, according to the present invention, the light guide plate 18 may be provided with two or more slits 42. In this way, since one or more LEDs 16 can be provided on one light guide plate 18, the assembling workability of the backlight device 12 is excellent.
- the light guide plate 18 is divided into a plurality of optically independent regions by providing the slit 42 in the light guide plate 18 and dividing the light output portion 31 and the light guide portion 32.
- the present invention includes a configuration in which each LED 16 is individually provided on each light guide plate 18 (having only one light incident surface 34) without the slit 42. In this way, it is possible to reliably prevent light from the adjacent LED 16 that does not correspond to entering the predetermined light guide plate 18, which is suitable for maintaining optical independence in the light guide plate 18. Become.
- the light guide plate 18 is fixed to the LED substrate 17.
- the light guide plate 18 is fixed to the bottom plate 14 a of the chassis 14 to which the LED substrate 17 is integrally fixed. What was done is also included in the present invention.
- the bottom plate 14a of the chassis 14 becomes a “base material”, and the light guide plate 18 is directly fixed to the bottom plate 14a of the chassis 14 as a base material, whereas the LED 16 is indirectly connected via the LED substrate 17.
- the configuration is such that the chassis 14 is fixed to the bottom plate 14a.
- the light guide plate 18 is fixed to the LED substrate 17 using the clip 23, but other than that, for example, those fixed using an adhesive or double-sided tape are also included in the present invention. It is. In this way, since it is not necessary to form uneven shapes such as the clip insertion hole 43 and the clip receiving recess 44 in the light guide plate 18, it is possible to avoid an optical adverse effect on the light guide plate 18 in advance. .
- the fixing position by the fixing member can be set, for example, at a position immediately before the light incident surface 34, and the effect that the degree of freedom of design can be increased is also obtained.
- the light guide plate 18 has a rectangular shape when viewed in plan, but the light guide plate 18 may have a square shape when viewed in plan.
- each length dimension, each width dimension, each thickness dimension, and each outer surface shape in the substrate attachment part 30, the light guide part 32, and the light output part 31 can be appropriately changed.
- the light emitting direction of the LED 16 is shown as being vertically upward, but the light emitting direction of the LED 16, that is, the installation direction of the LED 16 on the LED substrate 17 can be appropriately changed.
- the present invention includes those in which the LED 16 is installed with respect to the LED substrate 17 so that the light emitting direction is downward in the vertical direction, and in which the light emitting direction (optical axis) is aligned with the horizontal direction. .
- what mixed LED16 from which light emission directions differ is also contained in this invention.
- the LED 16 including the three types of LED chips 16c that emit R, G, and B in a single color is shown.
- the present invention includes an LED that uses a type of LED that incorporates a chip and emits white light using a phosphor.
- the LED 16 including the three types of LED chips 16c that emit R, G, and B in a single color is used, but C (cyan), M (magenta), and Y
- the present invention includes an LED using three types of LED chips each emitting a single color of (yellow).
- liquid crystal panel 11 and the chassis 14 are vertically placed with their short sides aligned with the vertical direction, but the liquid crystal panel 11 and the chassis 14 have their long sides. What is set in the vertical state in which the direction coincides with the vertical direction is also included in the present invention.
- the light incident surface 34 is exemplified as an inclined surface.
- the light incident surface 34 is a vertical surface, and the die releasing direction of the lower mold 47B is oblique. The direction is also included.
- the protrusion 47C is formed integrally with the lower mold 47B.
- the protrusion 47C is formed integrally with the upper mold 47A, and the protrusion 47C is formed of the upper mold.
- the die may be punched in the punching direction P2.
- the light incident surface 34 faces in the opposite direction to the surface 51 of the LED substrate 17.
- the LED housing hole 33 is a through hole.
- a recess that does not penetrate the LED housing hole 33 may be used.
- the scattering surface 37 has a configuration in which a plurality of grooves 37a are arranged in parallel. .
- the groove 37a is gradually narrowed as the distance from the light incident surface 34 becomes longer.
- the grooves 37a are arranged at equal intervals, and light is incident. You may arrange
- the LED 16 is used as the point light source.
- the present invention includes a point light source other than the LED 16.
- the light source using a point light source is exemplified, but a light source using a linear light source such as a cold cathode tube or a hot cathode tube is also included in the present invention.
- the optical axis of the light traveling from the light emitting surface 36 toward the optical member 15 is arranged substantially orthogonal to the optical axis LA of the light from the LED 16, but according to the present invention, the LED 16 is guided. You may arrange
- the configuration of the optical member 15 can be appropriately changed. Specifically, the number of diffusion plates 15a and 15b and the number and type of optical sheets 15c can be changed as appropriate. It is also possible to use a plurality of optical sheets 15c of the same type.
- the LED 16 and the light guide plate 18 are two-dimensionally arranged in parallel in the chassis 14. However, one-dimensionally arranged in parallel is also included in the present invention. . Specifically, the LED 16 and the light guide plate 18 are arranged in parallel only in the vertical direction, and the LED 16 and the light guide plate 18 are arranged in parallel only in the horizontal direction are also included in the present invention.
- the light guide plates 18 are disposed so as to overlap each other when viewed in a plane.
- the present invention includes a configuration where the light guide plates 18 are disposed so as not to overlap each other when viewed in a plane. .
- liquid crystal display device 10 using the liquid crystal panel 11 as the display element has been exemplified, but the present invention can also be applied to a display device using another type of display element.
- the television receiver TV including the tuner T is illustrated, but the present invention can also be applied to a display device that does not include the tuner T.
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Abstract
Description
しかしながら、収容孔を成形する成形型を型抜きする際には、収容孔が冷却されて収縮している場合がある。この場合、収容孔が成形型に対して貼り付いた状態となっているため、成形型を収容孔から引き抜くと、光入射面が成形型と擦れ合い、光入射面に傷が付く。光入射面に傷が付くと、傷によって光の屈折方向が変化し、光が導光体の外部へ出光する可能性がある。光が導光体の外部に出光すると、光出射面に届く光の量が低下し、液晶パネルの輝度が低下してしまう。
本発明は、発光素子と導光体とが基材の表面に固定されてなる照明装置であって、前記導光体は、前記発光素子を収容する収容孔の内部に設けられた光入射面と、凹凸加工が施されることによって形成された散乱面と、前記光入射面から内部に入射した光を前記散乱面で反射させた後に前記導光体の外部へ出射する光出射面とを備え、前記収容孔は、同収容孔を成形する成形型の型抜き方向に向けて間口が広くなる構成としたところに特徴を有する。
(1)前記成形型の型抜き方向は、前記導光体における前記基材と反対側の面から前記基材の表面に向かう方向である構成としてもよい。このような構成によると、収容孔が基材の表面側に開口する形態となるため、基材の表面に固定された発光素子を収容孔に収容した上で導光体を基材に固定することができる。
このような表示装置によると、表示パネルに対して光を供給する照明装置の輝度が、安定化されているため、表示品質の優れた表示を実現することが可能となる。
本発明によれば、高輝度化を図ることができる。
本発明の実施形態1を図1~図16によって説明する。本実施形態では、液晶表示装置10について例示する。なお、各図面の一部にはX軸、Y軸及びZ軸を示しており、各軸方向が各図面で示した方向となるように描かれている。また、図4~図10に示す上側を表側とし、同図下側を裏側とする。
本実施形態に係るテレビ受信装置TVは、図1に示すように、液晶表示装置10(表示装置)と、当該液晶表示装置10を挟むようにして収容する表裏両キャビネットCa,Cbと、電源Pと、チューナーTとを備えており、その表示面11aが鉛直方向(Y軸方向)に沿うようスタンドSによって支持されている。液晶表示装置10は、全体として横長の方形を成し、図2に示すように、表示パネルである液晶パネル11と、外部光源であるバックライト装置(本発明の「照明装置」の一例)12とを備え、これらが枠状をなすベゼル13などにより一体的に保持されるようになっている。
次に、液晶表示装置10を構成する液晶パネル11及びバックライト装置12について順次に説明する。このうち、液晶パネル(表示パネル)11は、平面視矩形状をなしており、一対のガラス基板が所定のギャップを隔てた状態で貼り合わせられるとともに、両ガラス基板間に液晶が封入された構成とされる。一方のガラス基板には、互いに直交するソース配線とゲート配線とに接続されたスイッチング素子(例えばTFT)と、そのスイッチング素子に接続された画素電極、さらには配向膜等が設けられ、他方のガラス基板には、R(赤色),G(緑色),B(青色)等の各着色部が所定配列で配置されたカラーフィルタや対向電極、さらには配向膜等が設けられている。なお、両基板の外側には偏光板が配されている(図5など参照)。
続いて、バックライト装置12について詳しく説明する。バックライト装置12は、大まかには、図4に示すように、表側(液晶パネル11側、光出射側)に開口した略箱型をなすシャーシ14と、シャーシ14の開口部を覆うようにして配される光学部材15と、シャーシ14内に配される光源である発光ダイオード(本発明の「発光素子」の一例であって、以下「LED」という)16と、LED16が実装されたLED基板(本発明の「基材」の一例)17と、LED16から発せられる光を光学部材15側へ導く導光板(本発明の「導光体」の一例)18とを備える。
続いて、バックライト装置12を構成する各部材について詳しく説明する。シャーシ14は、金属製とされ、図4に示すように、液晶パネル11と同様に矩形状をなす底板14aと、底板14aの各辺の外端から立ち上がる側板14bと、各側板14bの立ち上がり端から外向きに張り出す受け板14cとからなり、全体としては表側に向けて開口した浅い略箱型(略浅皿状)をなしている。シャーシ14は、その長辺方向が水平方向(X軸方向)と一致し、短辺方向が鉛直方向(Y軸方向)と一致している。シャーシ14における各受け板14cには、表側から受け部材19や押さえ部材20が載置可能とされる。各受け板14cには、ベゼル13や受け部材19や押さえ部材20をネジ止めするための取付孔14dが所定位置に貫通形成されており、そのうちの1つを図8に示すものとする。また、長辺側の受け板14cは、その外縁部が側板14bに並行するよう折り返されている(図4)。一方、底板14aには、導光板18を取り付けるためのクリップ23を通すための挿通孔14eが所定位置に貫通形成されている(図5及び図6)。なお、底板14aには、LED基板17をネジ止めするための取付孔(図示せず)が所定位置に貫通形成されている。
光学部材15は、図4に示すように、液晶パネル11と導光板18との間に介在しており、導光板18側に配される拡散板15a,15bと、液晶パネル11側に配される光学シート15cとから構成される。拡散板15a,15bは、所定の厚みを持つ透明な樹脂製の基材内に拡散粒子を多数分散して設けた構成とされ、透過する光を拡散させる機能を有する。拡散板15a,15bは、同等の厚さのものが2枚、積層して配されている。両拡散板15a,15bのうち導光板18側に位置する拡散板15bは、図7や図8に示すように、後述する光出射面36と近接して対向配置されている。光学シート15cは、拡散板15a,15bと比べると板厚が薄いシート状をなしており、3枚が積層して配されている。具体的には、光学シート15cは、拡散板15a,15b側(裏側)から順に、拡散シート、レンズシート、反射型偏光シートとなっている。
受け部材19は、シャーシ14における外周端部に配されるとともに、拡散板15a,15bにおける外周端部をほぼ全周にわたって受けることが可能とされる。受け部材19は、図3に示すように、シャーシ14における各短辺部分に沿って延在する一対の短辺側受け部材19Aと、各長辺部分に沿って延在する2つの長辺側受け部材19B,19Cとを有している。各受け部材19は、各々の設置箇所に応じて互いの形態が異なっている。なお、受け部材19を区別する場合には、各受け部材の符号にそれぞれ添え字A~Cを付すものとし、区別せずに総称する場合には、符号に添え字を付さないものとする。
押さえ部材20は、図3に示すように、シャーシ14における外周端部に配されるとともに、その幅寸法がシャーシ14や拡散板15a,15bの短辺寸法よりも十分に小さく、拡散板15aの外周端部を局所的に押さえることが可能とされる。押さえ部材20は、シャーシ14における両短辺部分に1つずつ配される短辺側押さえ部材20Aと、両長辺部分に複数ずつ配される長辺側押さえ部材20B,20Cとを有している。各押さえ部材20は、各々の設置箇所に応じて互いの形態が異なっている。なお、押さえ部材20を区別する場合には、各押さえ部材の符号にそれぞれ添え字A~Cを付すものとし、区別せずに総称する場合には、符号に添え字を付さないものとする。
放熱部材21は、熱伝導性に優れた合成樹脂材料または金属材料からなるとともにシート状をなしており、図5に示すシャーシ14内に配されるものと、図7に示すシャーシ14外に配されるものとがある。放熱部材21のうちシャーシ14内に配されるものは、シャーシ14の底板14aとLED基板17との間に介在しており、所々に他の部材を逃がすための切り欠きが設けられている。一方、放熱部材21のうちシャーシ14外に配されるものは、シャーシ14の底板14aにおける裏側の面に貼り付けられている。
LED16は、図10に示すように、LED基板17上に表面実装される、いわゆる表面実装型LEDである。LED16は、全体として横長な略ブロック状をなすとともに、LED基板17に対する実装面(LED基板17に当接される底面)に隣接する側面が発光面16aとなる側面発光型LEDである。このLED16における光軸LAは、液晶パネル11の表示面11a(導光板18における光出射面36)とほぼ並行する設定とされている(図7及び図10)。詳しくは、LED16における光軸LAは、シャーシ14における短辺方向(Y軸方向)、つまり鉛直方向と一致しているとともにその発光方向(発光面16aからの光の出射方向)は鉛直方向の上向きとされている(図3及び図7)。なお、LED16から発せられる光は、光軸LAを中心にして所定の角度範囲内で三次元的にある程度放射状に広がるのであるが、その指向性は冷陰極管などと比べると高くなっている。つまり、LED16の発光強度は、光軸LAに沿った方向が際立って高く、光軸LAに対する傾き角度が大きくなるに連れて急激に低下するような傾向の角度分布を示す。また、LED16における長手方向は、シャーシ14における長辺方向(X軸方向)と一致している。
LED基板17は、表面(導光板18との対向面を含む)が光の反射性に優れた白色を呈する合成樹脂製とされている。LED基板17は、図3に示すように、平面に視て矩形の板状をなし、その長辺寸法は、底板14aの短辺寸法よりも十分に小さくなる設定とされており、シャーシ14の底板14aを部分的に覆うことが可能とされる。LED基板17は、シャーシ14の底板14aの面内において、碁盤目状に複数枚が平面配置されている。具体的には、図3において、LED基板17は、シャーシ14の長辺方向に5枚、短辺方向に5枚、合計25枚が並列して配置されている。LED基板17には、金属膜からなる配線パターンが形成されるとともにその所定の位置にLED16が実装されている。このLED基板17には、図示しない外部の制御基板が接続されていて、そこからLED16の点灯に必要な電力が供給されるとともにLED16の駆動制御が可能となっている。LED基板17上には、多数のLED16が碁盤目状に平面配置されており、その配列ピッチは、後述する導光板18の配列ピッチに対応した大きさとなっている。具体的には、LED16は、LED基板17における長辺方向に8個、短辺方向に4個、合計32個が並列して配置されている。また、LED基板17上には、LED16以外にもフォトセンサ22が実装されており、このフォトセンサ22によって各LED16の発光状態を検出することで、各LED16をフィードバック制御可能とされる(図4及び図11)。また、LED基板17には、導光板18を取り付けるためのクリップ23を受け入れる取付孔17a(図6)と、導光板18を位置決めするための位置決め孔17b(図10)とがそれぞれ各導光板18の取付位置に応じて設けられている。
導光板18は、屈折率が空気よりも十分に高く且つほぼ透明な(透光性に優れた)合成樹脂材料(例えばポリカーボネートなど)からなる。導光板18は、図7~図9に示すように、LED16から鉛直方向(Y軸方向)に向けて発せられた光を導入するとともに、その光を内部で伝播させつつ光学部材15側(Z軸方向)へ向くよう立ち上げて出射させる機能を有する。導光板18は、図12に示すように、全体として平面に視て矩形をなす板状とされており、その長辺方向がLED16における光軸LA(発光方向)及びシャーシ14の短辺方向(Y軸方向、鉛直方向)と平行をなし、短辺方向がシャーシ14の長辺方向(X軸方向、水平方向)と平行をなしている。以下、導光板18における長辺方向に沿った断面構造について詳しく説明する。
基板取付部30における前端位置には、図11に示すように、LED16を収容するLED収容孔33がZ軸方向に沿って貫通形成されており、その内周面のうちLED16の発光面16aとの対向面(前面)が、LED16からの光が入射される光入射面34となっている。光入射面34は、基板取付部30と導光部32との境界位置に配されている。導光部32の外周面は、全域にわたってほぼ平滑面となっていて界面(外部の空気層との間の界面)にて光の乱反射が生じることがないので、導光部32内を伝播する光は、上記界面に対する入射角が殆ど臨界角を超えるので、全反射を繰り返しながら出光部31側へと導かれるようになっている。これにより、導光部32からの光漏れが防がれ、漏れ光が他の導光板18に入射する事態を回避できるようになっている。ところで、LED16を構成する各LEDチップ16cからは、R,G,Bの単色光が発せられているのであるが、この導光部32内を伝播する過程では3色の単色光が互いに混じり合い、白色光となって出光部31へと導かれるようになっている。また、導光部32における基板取付部30寄りの位置(後端部近傍)には、LED基板17の位置決め孔17bに挿入されることで、X軸方向及びY軸方向についてLED基板17に対して導光板18を位置決め可能な位置決め突部35が裏側へ突出して設けられている。
出光部31のうち表側を向いた面、つまり拡散板15bとの対向面のほぼ全域が光出射面36とされる。光出射面36は、ほぼ平滑な面とされるとともに概ね拡散板15a,15bの板面(液晶パネル11の表示面11a)と並行する形態とされ、上記光入射面34とはほぼ直交している。このため、光出射面36から光学部材15に向かう光の光軸は、LED16からの光の光軸LAに対してほぼ直交配置とされている。すなわち、光出射面36から光学部材15へ向かう光の光軸は、光学部材15に略垂直に設定され、LED16からの光の光軸LAは、光学部材15に略平行に設定されている。
出光部31における裏側の面(光出射面36とは反対側の面、LED基板17との対向面)には、微細な凹凸加工が施されることで、界面にて光を散乱させる散乱面37が形成されている。この散乱面37の界面にて導光板18内の光を散乱させることで、光出射面36に対する入射角が臨界角を超えない光(全反射を破る光)を生み出し、もって光を光出射面36から外部へと出射させることが可能とされる。散乱面37は、図13に示すように、導光板18の短辺方向に沿って直線的に延びる溝37aを所定間隔毎に多数本並列してなり、その溝37aの配列ピッチ(配列間隔)が光入射面34からの距離が長くなるに連れて次第に狭くなっている。つまり、散乱面37を構成する溝37aは、後端側、つまり光入射面34からの距離が小さい側(近い側)ほど低密度に、前端側、つまり光入射面34からの距離が大きい側(遠い側)ほど高密度になるよう配列され、いわばグラデーション配列となっている。これにより、例えば出光部31のうちLED16からの距離が小さい側と距離が大きい側とで輝度差が生じるのを防ぐことができ、光出射面36の面内において均一な輝度分布が得られるようになっている。散乱面37は、出光部31のほぼ全域にわたって設けられており、そのほぼ全域が平面に視て光出射面36と重畳する。
出光部31及び導光部32における裏側の面(散乱面37を含む)には、図13に示すように、光を導光板18の内部へと反射させる反射シート24が配されている。反射シート24は、図示はしないものの導光板18のX軸方向における寸法よりも大きめに形成された幅広タイプのものと、図13に示す導光板18のX軸方向における寸法とほぼ同じ大きさに形成された幅狭タイプのものと、から構成されている。前記幅広タイプのものと前記幅狭タイプのものとがX軸方向に交互に並んで配されている。具体的には、図11における中央に位置する導光板18に幅広タイプの反射シート24が貼着され、図11における左右両側に位置する導光板18に幅狭タイプの反射シート24が貼着されている。これにより、スリット42の隙間Sのみならず、隣り合う導光板18間の隙間Sにも反射シート24を配置できる。すなわち、幅広タイプの反射シート24は、出光部31及び導光部32における裏側の面に沿って導光板18間の隙間Sに延在する形態とされている。
導光板18は、その全体が短辺方向(X軸方向)の中央位置を通る対称軸を中心にした対称形状となっている。基板取付部30のLED収容孔33は、導光板18における短辺方向(X軸方向)の中央位置から所定距離ずつ両側方にずれた位置に一対配設され、対称配置されている。各LED収容孔33は、平面に視て横長な略矩形状をなし、LED16の外形よりも一回り大きくなっている。なお、LED収容孔33は、その高さ寸法(Z軸方向の寸法)及び幅寸法(X軸方向の寸法)がLED16よりも一回り大きく、光入射面34の表面積がLED16の発光面16aよりも十分大きく確保されているから、LED16から発せられた放射状の光を余すことなく取り込むことができるようになっている。
そして、導光板18における短辺方向の中央位置には、導光部32及び出光部31を左右に分割するスリット42が設けられている。スリット42は、導光板18を厚さ方向(Z軸方向)に貫通するとともに、Y軸方向に沿って前方へ向けて開口する形態で且つ一定幅とされている。導光板18におけるスリット42に臨む端面は、各分割導光部32S及び各分割出光部31Sの側端面を構成するとともに、Z軸方向に沿ってほぼ真っ直ぐなほぼ平滑面とされている。従って、導光板18内の光は、スリット42に臨む端面におけるスリット42の空気層との界面で全反射するので、スリット42を挟んで向かい合う分割導光部32S間及び分割出光部31S間で光が行き交ったり混じり合うことが防がれている。これにより、各分割導光部32S及び各分割出光部31Sにおける光学的独立性が担保されている。スリット42の後端位置は、位置決め突部35よりもやや前寄りで、且つ各LED16におけるX軸方向についての照射領域(図12に示すLED16の光軸LAを中心にした一点鎖線間の角度範囲)よりも後ろ寄りに設定されている。これにより、各LED16から発せられた光が、照射対象ではない隣の分割導光部32Sに直接入射するのが回避される。なお、一対の位置決め突部35は、分割導光部32Sの外側端部(スリット42とは反対側の端部)において、スリット42と同様に各LED16におけるX軸方向についての照射領域よりも後ろ寄りの位置に対称配置され、もって位置決め突部35が光学的な妨げとなることが避けられている。また、スリット42の形成範囲は、基板取付部30にまで及んでおらず、両分割導光部32Sが共通の基板取付部30に連なる形態とされているので、機械的な安定性が担保されている。言い換えると、この導光板18は、互いに光学的に独立し、各LED16に対して個別に対応した2枚の単位導光板(分割導光部32S及び分割出光部31S)が、基板取付部30によって一体に繋げられた構成となっていることで、LED基板17に対する導光板18の取付作業性が担保されている。また、反射シート24は、図13に示すように、スリット42を跨ぐ形態で延在している。
また、基板取付部30における両側端位置(両LED収容孔33よりも外寄りの位置)には、導光板18をLED基板17に取り付けるためのクリップ23を通すためのクリップ挿通孔43が一対貫通形成されている。クリップ23は、図6に示すように、基板取付部30に並行する取付板23aと、取付板23aから基板取付部30の板厚方向(Z軸方向)に突出する挿入突部23bと、挿入突部23bの先端から折り返し状に突出する一対の係止片23cとから構成されている。クリップ23は、挿入突部23bが基板取付部30のクリップ挿通孔43及びLED基板17の取付孔17aに挿入されるとともに係止片23cが取付孔17aの縁部に係止することで、導光板18をLED基板17に対して取付状態に固定可能とされる。なお、クリップ23には、図5及び図11に示すように、取付板23aに1本の挿入突部23bを設けたものと、取付板23aに2本の挿入突部23bを設けたものとがあり、前者は、シャーシ14内において端部に配されるクリップ挿通孔43(図6)に用いられるのに対し、後者は並列する2枚の導光板18に跨る形態で用いられ、2枚の導光板18を一括して取付可能とされる。クリップ挿通孔43の周縁には、図6及び図12に示すように、クリップ23の取付板23aを受け入れるクリップ収容凹部44が設けられており、それにより取付板23aが基板取付部30から表側に突出するのが防がれ、もって省スペース化、つまりバックライト装置12の薄型化に資する。
また、基板取付部30における両LED収容孔33間には、図12に示すように、LED基板17上に実装されたフォトセンサ22を収容可能なフォトセンサ収容孔45が貫通形成されている。このフォトセンサ22は、LED基板17において所定個数が間欠的に配置され、特定のLED間にのみ配されているので、シャーシ14内の全ての導光板18のフォトセンサ収容孔45内にフォトセンサ22が配される訳ではない(例えば図11参照)。また、基板取付部30におけるフォトセンサ収容孔45と両LED収容孔33との間には、一対の切り欠き46が対称配置されている。この切り欠き46は、基板取付部30を貫通しつつ後方へ開口する形態とされ、ここにLED基板17をシャーシ14に対して固定するためのビス(図示せず)が通されるようになっている。なお、この切り欠き46も、上記フォトセンサ収容孔45と同様にシャーシ14内の全ての導光板18において使用される訳ではない。
ところで、導光板18は、既述した通り、シャーシ14の底板14a内において多数枚碁盤目状に平面配置されており、その配列形態について詳しく説明する。先に、タンデム配列方向(Y軸方向)の配列形態について説明する。導光板18は、図9に示すように、導光部32及び出光部31がLED基板17から浮き上がった状態で取り付けられているが、その浮き上がった導光部32及び出光部31が、前側(鉛直方向の上側)に隣り合う導光板18における基板取付部30及び導光部32のほぼ全域にわたって表側から覆い被さるようにして配されている。言い換えると、前後に隣り合う導光板18のうち、前側の導光板18における基板取付部30及び導光部32と、後側の導光部32及び出光部31とは、平面に視て互いに重畳する位置関係となっている。つまり、導光板18のうち非発光部分である基板取付部30及び導光部32は、その後側に隣り合う導光板18の導光部32及び出光部31によって覆われることで、拡散板15b側に露出することが避けられており、拡散板15b側に露出するのは発光部分である出光部31の光出射面36のみとされる。これにより、各導光板18の光出射面36がタンデム配列方向について殆ど継ぎ目無く連続的に配列されている。しかも、導光部32及び出光部31における裏側の面のほぼ全域に反射シート24が配されているので、仮に光入射面34にて反射されるなどして漏れ光が生じた場合でも、その漏れ光が後ろ隣りの導光板18内に入射することが回避されるようになっている。また、後側(表側)の導光板18における導光部32及び出光部31は、前側(裏側)に重なり合う導光板18によって裏側から機械的に支持されている。しかも、導光板18における表側の傾斜面40と裏側の傾斜面39とが共にほぼ同じ傾斜角度となっていて互いに平行をなしているので、表裏に重なり合う導光板18間に隙間が生じることが殆どなく、もって表側の導光板18を裏側の導光板18によってがたつきなく支持可能とされる。なお、後側の導光板18における導光部32は、その前側部分のみが、前側の導光板18における基板取付部30を覆っていて、後側部分はLED基板17と対向している。
次に、LED収容孔33の詳細な構成について図14から図16を参照しながら説明する。本実施形態における導光板18は、成形型47によって射出成形することによって形成されている。この理由は、散乱面37を形成する必要があるためである。図15及び図16は、成形型47によって導光板18を射出成形する様子を示した断面図である。また、図14は、LED収容孔33を拡大して示した断面図であって、光入射面34の傾斜角度を実際よりも大きめにして描いたものである。すなわち、本実施形態における光入射面34は、導光板18を成形する成形型47の型抜き方向に対して傾斜しており、光入射面34が傾斜している様子が分かるように、実際の傾斜角度θよりも大きめの角度(10°程度)で描いてある。
・LED収容孔33がLED基板17の表面51側に開口する形態となるため、LED基板17の表面51に固定されたLED16をLED収容孔33に収容した上で導光板18をLED基板17に固定することができる。
・LED16をLED収容孔33に収容したときにLED16がLED収容孔33の外部に露出するから、LED16から発生した熱を放熱し易くなる。
・溝37aの配列間隔を光入射面34からの距離が長くなるに連れて次第に狭くなるようにしたから、輝度ムラをなくすことができる。
・発光素子として発光ダイオード16を採用したから、高輝度化を図ることができる。
・LED16からの光をLED基板17の表面51で反射させて光入射面34に入射させることができるため、漏れ光を少なくして高輝度化を図ることができる。
・LED16からの光の光軸LAと光出射面36から出射される光の光軸とが略直交する配置としたから、導光板18をZ軸方向に薄型化することができる。
・光入射面34を基板取付部30と導光部32との境界位置に配置したから、導光部32の内部に光を直接入射させることができる。
・複数の導光板18を光出射面36の平面方向に沿って二次元的に並んで配置したから、当該バックライト装置12全体に一層輝度ムラが生じ難くすることができる。
次に、本発明の実施形態2を図17によって説明する。本実施形態は、実施形態1におけるLED16を斜めに配置したものであって、実施形態1と共通する構成について同一の符号を付すものとし、実施形態1と重複する構成、作用、および効果についてはその説明を省略する。本実施形態のLED16の発光面16aは、光入射面34と平行に対向配置されている。このため、発光面16aから発せられる光の光軸LAと光入射面34とは直交している。このようにすると、LED16からの光の光軸LAと導光部32の内部に入射した光の光軸LA1とを一直線上に配置することができ、LED16からの光を光入射面34に効率良く入射させることができる。なお、本実施形態ではLED基板17の表面51に凹部52を形成して、この凹部52にLED16を固定しているものの、本発明によると、LED基板17の表面51に凸部を形成して、この凸部の上にLED16を斜めに配置してもよい。
本発明は上記記述及び図面によって説明した実施形態に限定されるものではなく、例えば次のような実施形態も本発明の技術的範囲に含まれる。
Claims (18)
- 発光素子と導光体とが基材の表面に固定されてなる照明装置であって、
前記導光体は、前記発光素子を収容する収容孔の内部に設けられた光入射面と、凹凸加工が施されることによって形成された散乱面と、前記光入射面から内部に入射した光を前記散乱面で反射させた後に前記導光体の外部へ出射する光出射面とを備え、前記収容孔は、同収容孔を成形する成形型の型抜き方向に向けて間口が広くなることを特徴とする照明装置。 - 前記成形型の型抜き方向は、前記導光体における前記基材と反対側の面から前記基材の表面に向かう方向である請求の範囲第1項に記載の照明装置。
- 前記光入射面は、前記成形型の型抜き方向に沿う面を基準面として前記基材の表面に向けられた傾斜面である請求の範囲第1項または請求の範囲第2項に記載の照明装置。
- 前記収容孔は、前記導光体を基材に取り付けるための取付部を貫通して設けられている請求の範囲第1項から請求の範囲第3項のいずれか1項に記載の照明装置。
- 前記散乱面は、直線的に延びる溝を所定間隔毎に多数本並列してなる請求の範囲第1項から請求の範囲第4項のいずれか1項に記載の照明装置。
- 前記溝の配列間隔は、前記光入射面からの距離が長くなるに連れて次第に狭くなっている請求の範囲第5項に記載の照明装置。
- 前記発光素子は、光が発せられる発光面を有し、その発光面は、前記光入射面と平行に対向配置されている請求の範囲第1項から請求の範囲第6項のいずれか1項に記載の照明装置。
- 前記発光素子は、発光ダイオードである請求の範囲第1項から請求の範囲第7項のいずれか1項に記載の照明装置。
- 前記基材は、前記発光素子を表面に実装してなる回路基板である請求の範囲第1項から請求の範囲第8項のいずれか1項に記載の照明装置。
- 前記基材の表面は、光の反射性に優れた白色を呈する合成樹脂製とされている請求の範囲第1項から請求の範囲第9項のいずれか1項に記載の照明装置。
- 前記光出射面と対向配置された光学部材を備え、前記光出射面から前記光学部材へ向かう光の光軸は、前記光学部材に略垂直に設定され、前記発光素子からの光の光軸は、前記光学部材に略平行に設定されている請求の範囲第1項から請求の範囲第10項のいずれか1項に記載の照明装置。
- 前記光学部材は、所定の厚みを持つ透明な樹脂製の基材内に拡散粒子を多数分散して設けた拡散板を備えて構成されている請求の範囲第11項に記載の照明装置。
- 前記導光体は、前記取付部と、前記光出射面を有する出光部と、前記取付部と前記出光部との間に配設された導光部とが一体に構成され、前記取付部、前記導光部、及び前記出光部は、この順に、前記発光素子側から並んで配置されている請求の範囲第4項から請求の範囲第12項のいずれか1項に記載の照明装置。
- 前記導光部の外周面は全域にわたってほぼ平滑面とされ、前記光入射面は、前記取付部と前記導光部との境界位置に配置されている請求の範囲第13項に記載の照明装置。
- 前記導光体は、前記光出射面の平面方向に沿って二次元的に並んで配置されている請求の範囲第1項から請求の範囲第14項のいずれか1項に記載の照明装置。
- 請求の範囲第1項から請求の範囲第15項のいずれか1項に記載の照明装置と、前記照明装置からの光を利用して表示を行う表示パネルとを備える表示装置。
- 前記表示パネルは、一対の基板間に液晶を封入してなる液晶パネルとされる請求の範囲第16項に記載の表示装置。
- 請求の範囲第16項または請求の範囲第17項に記載された表示装置を備えるテレビ受信装置。
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| US20130196539A1 (en) * | 2012-01-12 | 2013-08-01 | John Mezzalingua Associates, Inc. | Electronics Packaging Assembly with Dielectric Cover |
| US9140930B2 (en) * | 2012-04-01 | 2015-09-22 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Slim frame backlight module |
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| CN111458925A (zh) * | 2019-01-18 | 2020-07-28 | 中强光电股份有限公司 | 光源模块及显示装置 |
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| US7961271B2 (en) * | 2007-02-27 | 2011-06-14 | Seiko Instruments Inc. | Lighting device and display device provided with the same |
| KR101432507B1 (ko) * | 2007-12-31 | 2014-08-21 | 삼성디스플레이 주식회사 | 백라이트 어셈블리 및 이를 갖는 표시 장치 |
| US8421955B2 (en) * | 2009-05-22 | 2013-04-16 | Hitachi Consumer Electronics Co., Ltd. | Liquid crystal display device |
-
2009
- 2009-07-13 WO PCT/JP2009/062658 patent/WO2010044296A1/ja not_active Ceased
- 2009-07-13 US US13/121,424 patent/US8517592B2/en not_active Expired - Fee Related
- 2009-07-13 CN CN2009801408937A patent/CN102187145A/zh active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09306222A (ja) * | 1996-05-10 | 1997-11-28 | Stanley Electric Co Ltd | バックライト用面光源装置 |
| JPH11231321A (ja) * | 1998-02-17 | 1999-08-27 | Enplas Corp | サイドライト型面光源装置及び液晶表示装置 |
| JP2004006081A (ja) * | 2002-05-31 | 2004-01-08 | Omron Corp | 面光源装置及び面光源装置の製造方法 |
| JP2006024439A (ja) * | 2004-07-08 | 2006-01-26 | Mitsubishi Electric Corp | 面状光源装置 |
| JP2008243808A (ja) * | 2007-02-27 | 2008-10-09 | Seiko Instruments Inc | 照明装置及び表示装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102187145A (zh) | 2011-09-14 |
| US20110176065A1 (en) | 2011-07-21 |
| US8517592B2 (en) | 2013-08-27 |
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