[go: up one dir, main page]

WO2010040645A2 - Support de circuit - Google Patents

Support de circuit Download PDF

Info

Publication number
WO2010040645A2
WO2010040645A2 PCT/EP2009/062430 EP2009062430W WO2010040645A2 WO 2010040645 A2 WO2010040645 A2 WO 2010040645A2 EP 2009062430 W EP2009062430 W EP 2009062430W WO 2010040645 A2 WO2010040645 A2 WO 2010040645A2
Authority
WO
WIPO (PCT)
Prior art keywords
circuit carrier
carrier
predetermined bending
circuit
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2009/062430
Other languages
German (de)
English (en)
Other versions
WO2010040645A3 (fr
Inventor
Markus Hofmann
Ralph Bertram
Robert Kraus
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of WO2010040645A2 publication Critical patent/WO2010040645A2/fr
Publication of WO2010040645A3 publication Critical patent/WO2010040645A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a circuit carrier, a retrofit lamp with at least one circuit carrier and a method for providing a circuit carrier.
  • the circuit carrier has at least one predetermined bending point. Due to the predetermined bending point, the regions of the circuit carrier which are longitudinally adjacent to the predetermined bending point, referred to below as “carrier regions” for short, can be angled relative to one another.
  • a carrier region may, in particular, be understood as meaning a region of the circuit carrier which has no predetermined bending point or a part thereof except at its edge.
  • a one-piece circuit carrier By providing the predetermined bending point, a one-piece circuit carrier can be provided, which can bend compactly, in particular fold, leaves. By bending, even complex structures and radiation characteristics can be easily provided.
  • LEDs can be arranged in a three-dimensional structure; In this way, for example, a radiation characteristic of an incandescent lamp can be simulated.
  • the one-piece construction also eliminates the need for a complicated and expensive connection between an LED board and a driver board. The elimination of the connection cable leads to an improved EMC behavior of the system. Also, the reliability of the component is increased. Furthermore, components or components can be equipped in a process step on a circuit board.
  • a predetermined bending point is understood as meaning both an elastic predetermined bending point which, in the event of a decreasing or missing application of force, pushes back into its starting position, as well as a desired folding point, which remains permanently bent, possibly with a slight springback.
  • the bending point may in particular have a radius of curvature of up to about 1 cm.
  • a circuit carrier is preferred which has at least one carrier region adjacent to a predetermined bending point, on which at least one light-emitting diode is mounted.
  • one or more light-emitting diodes can each be arranged on one or more carrier regions.
  • an orientation of the emission direction of the LED (s) can be determined by the orientation of the carrier areas, which greatly simplifies the alignment of the LEDs.
  • a circuit carrier which has at least one carrier region, on which at least one electronic component is mounted, for. B. one or more driver blocks, sensors, radio receiver u.v.m.
  • one or more carrier areas can be mixed with LEDs and electronic components.
  • a circuit carrier which has at least one carrier region which has at least one electrical contact element to the (with respect to the circuit carrier) external electrical connection.
  • the circuit carrier for example, with an external power source, for. B. a voltage source, and / or an external control circuit ver to be bound.
  • the electrical contact element may have contacts for transmitting electrical power and / or signals.
  • the circuit carrier can be used for example for contacting the socket, which further reduces the assembly effort and an EMC susceptibility to interference.
  • circuit carrier which has at least one carrier region which has at least one electrical contact element for external electrical connection is preferred.
  • a circuit carrier is also preferred which has at least one carrier region on which no component is mounted.
  • a support region can be used in particular for electrical insulation and / or for mechanical support.
  • a circuit carrier which has at least one electrical line which already crosses a predetermined bending point in the unbent state. This line can rest in the region of the predetermined bending point on the substrate of the circuit substrate or be lifted from this like a bridge. Since the circuit substrate can be fitted in the planned state, but also a bridging of the predetermined bending point by separately produced lines or line sections without too much effort is possible, for. B. by soldering.
  • the circuit carrier or its substrate can be made in principle basically of an elastic material, for. B. be a flexible circuit board.
  • Possible printed circuit board materials include, for example, polyester, PEN (polyethylene naphthalate) or PI (polyimide).
  • At least one carrier area adjoining a predetermined bending point is at least partially counterposed. is stiffened over the material of the predetermined bending point.
  • parts of the flexible printed circuit board ('Flexboard') can be provided on one or more support areas with a rigid material (for example aluminum or FR4). As a result, these support areas are stiffened and easier to assemble, in particular equipped, be.
  • a circuit carrier which has at least one heat sink attached thereto.
  • the circuit carrier can for example be glued directly to the heat sink, whereby a very good heat dissipation is ensured.
  • a circuit carrier is preferred in which, in the bent state, the heat sink is thermally connected via at least one electrically insulating carrier region on which preferably no component is mounted to at least one carrier region which carries at least one component.
  • one or more carrier areas of the circuit carriers can then be used by skillful bending, in particular folding, as an electrical insulator between a carrier area equipped, in particular with a driver circuit, and a metallic heat sink.
  • a circuit carrier is particularly preferred which uses at least one carrier region for electrical insulation, on which no component is mounted.
  • a circuit carrier is preferred in which a contact surface of the heat sink for contacting the circuit carrier has a plurality of facets whose transitions are shaped and positioned such that they correspond to those predetermined bending points of the circuit carrier which are arranged on the contact surface of the heat sink.
  • a molding of the circuit substrate to the heat sink can be achieved particularly easily.
  • the predetermined bending points are thus on the facet transitions (edges) of the heat sink.
  • the retrofit lamp has at least one circuit carrier as described above.
  • the light sources in particular LEDs, can be easily arranged in a three-dimensional structure by means of the flexible circuit carrier. As a result, preferably a radiation characteristic of an incandescent lamp can be reproduced.
  • a retrofit lamp is preferred in which the circuit carrier is equipped with LEDs, although this is not mandatory.
  • a retrofit lamp is preferred in which an electrical contact element of the circuit carrier, as already described, for example, has at least one electrical plug contact and is provided for receiving in a contact counter element of a base of the retrofit lamp.
  • the circuit substrate no longer needs to be wired consuming and EMC disadvantageous to the base of the retrofit lamp.
  • this is bent at least one predetermined bending point.
  • FIG. 1 shows in two partial images a circuit carrier according to a first embodiment in plan view of the unfolded circuit carrier (FIG. 1A) and as a side view of the folded circuit carrier (FIG. 1B);
  • 2 shows a partial circuit diagram of a circuit carrier according to a second embodiment in plan view of the unfolded circuit carrier (FIG. 2A) and as a side view of the folded circuit carrier (FIG. 2B);
  • FIG. 3 shows, in two partial images, a circuit carrier according to a third embodiment in a plan view of the unfolded circuit carrier (FIG. 3A) and as a side view of the folded circuit carrier (FIG. 3B);
  • FIG. 4 shows a sectional representation of a circuit carrier according to a fourth embodiment, which is connected to a heat sink;
  • FIG. 5 shows a circuit carrier according to a fifth embodiment, which is applied to a further heat sink
  • FIG. 6 shows a retrofit incandescent lamp with a circuit carrier according to a sixth embodiment.
  • FIG. 1A shows a plan view of an unfolded circuit carrier 1 which is equipped with light-emitting diodes 2 and driver components 3. Between the light-emitting diodes 2 and the driver modules 3 runs consistently a Sollfaltstelle 4, which divides the circuit substrate 1 in two adjacent to the Sollfaltstelle 4 carrier areas 5, 6.
  • the equipped with the light emitting diodes 2 light source support portion 5 is circular except for the straight edge at the Sollfaltstelle 4, wherein the light-emitting diodes 2 are evenly distributed over the light source carrier region 5.
  • the driver support portion 6, however, is rectangular in shape and has at its Sollfaltstelle 4 opposite end of a contact element 7, which here with two electrical plug-in contacts 8 is shown equipped. For ease of illustration has been dispensed with a representation of a wiring.
  • the light-emitting diodes 2 can be present, for example, as individual LEDs or as a group of a plurality of LED chips, which are mounted on a common substrate (LED modules).
  • the light-emitting diodes 2 can shine in a different color or in the same color, including white.
  • the LEDs 2 can be equipped with a downstream optics.
  • the light source carrier region can also be equipped with one or more OLEDs.
  • the number of LEDs 2 is limited only by the available space and may include one or more light-emitting diodes 2.
  • the LEDs 2 can be tunable color.
  • driver support portion 6 may have one or more further Sollfaltstellen.
  • FIG. 1B shows in a side view the circuit carrier 1 from FIG. 1A in a folded state, as is suitable, for example, for use in a retrofit incandescent lamp, as will be described in more detail with reference to FIG.
  • the light source carrier region 5 is angled at the Sollfaltstelle 4 against the driver support portion 6 that the LEDs 2 in a predetermined Hauptabstrahlraum (up here) can radiate and simultaneously contacting the circuit substrate 1 in the back of the light source carrier region 5 can be done by inserting the contact element 7.
  • the driver components 3 are also positioned in a space-saving manner at the rear of the light source carrier region 5.
  • the circuit substrate 1 needs to be populated only once in the unfolded state according to IA and can then be folded by folding along the Sollfaltstelle 4 in a suitable form for use in a retrofit incandescent form, with a further post-processing of the circuit substrate. 1 (Additional wiring, attachment of the carrier areas 5, 6) due to its one-piece deleted.
  • the possibility of externally connecting the circuit carrier 1 by means of a simple non-wired contacting (here: plug connection) reduces the EMC susceptibility.
  • the circuit carrier 1 is constructed so that it has a flexible printed circuit board 9, which is stiffened in the carrier regions 5, 6 by stiffening layers 10 made of FR4 material (optionally, indicated by dashed lines), whereby a Be Suite- availability is improved.
  • stiffening layer (s) may also be arranged rearwardly with respect to the side to be loaded.
  • FIG. 2A shows a plan view of a circuit carrier 11 according to a further embodiment.
  • a further insulator carrier region 12 made of dielectric material is now present between the driver carrier region 6 and the light source carrier region 5, which by means of the Sollfaltstelle 4 against the light source carrier region 5 and fold by means of another Sollfaltstelle 13 against the driver support portion 6.
  • the driver carrier region 6 and the insulator carrier region 12 are approximately the same length.
  • the driver carrier region 6 can be protected against contact from this side due to the dielectric material property of the insulator driver region 10, as indicated by the arrow, for example.
  • the heat sink can then be fastened in particular flat on the insulator support region 12, z. B. by sticking by means of a thermally conductive adhesive, whereby a heat dissipation in particular from the driver support portion 6 to the heat sink in a simple manner possible.
  • FIG. 3A shows a circuit carrier 14 according to a third embodiment, in which two insulator carrier regions 12 of equal length are present laterally on the driver carrier region 6, which can be folded against the driver carrier region 6 by means of respective desired folds 15, these desired folds 15 being along the longer side of the driver-carrier area.
  • the two insulator support portions 12 along their Sollfaltstellen 14 by 180 ° forward as shown by the driver components 3 fold.
  • the insulator carrier regions 13 can also be folded over the surface (rear side) of the driver carrier region 6 that is not provided with the driver components 3, which then preferably angles or folds in the opposite direction relative to the light source carrier region 5, as shown in FIG. 2B becomes.
  • FIG. 4 shows yet another folded circuit carrier 16 in which only a plurality of light source carrier regions 17 are shown for the sake of simplicity.
  • Each light source carrier region 17 has at least one light-emitting diode 2 and is' separated 'by a corresponding Sollfaltstelle 18 of vertical wall support areas 19', which carry no light-emitting diode 2.
  • a two-sided, one-piece staircase pyramid results, with all light-emitting diodes 2 facing in the same direction (here: after above).
  • At least the portion of the circuit carrier 16 shown is mounted flat on a suitably shaped heat sink 20, wherein the surface contour of the contact surface 21 of the heat sink 20 corresponds to the contour of the back of the shown portion of the circuit substrate 16.
  • the Sollfaltstellen 18 are on edges 22 of the heat sink 20, which separate the individual facets of the heat sink 20 from each other.
  • FIG. 5 shows a circuit carrier 23 according to a further embodiment with a plurality of adjoining light source carrier regions 24, which are delimited from each other by Sollfaltstellen 25.
  • the light-emitting diodes 2 now do not radiate in the same direction, but essentially in an upper half-space.
  • the individual light source carrier regions 24 are angled relative to one another.
  • the substrate 26 carrying the light source carrier regions 24 is here also fastened flat on a suitably contoured heat sink 27.
  • the LED retrofit lamp 28 shows an LED retrofit lamp 28, which by means of a standard socket 29, z.
  • a standard socket 29 As an Edison socket (as shown) or a bayonet cap, etc., can be used in known, standardized versions.
  • the LED retrofit lamp 28 also has a transparent and / or translucent (opaque) piston 30, which conducts the light generated by the light sources 2 of the lamp 28, possibly scattered, to the outside.
  • a transparent and / or translucent (opaque) piston 30 which conducts the light generated by the light sources 2 of the lamp 28, possibly scattered, to the outside.
  • between the base 29 and the piston 30 there is an in practice opaque, in particular metallic, receptacle 31 for the circuit carrier, which is shown here as transparent only for a better description.
  • Such a LED retrofit lamp 28 is particularly easy to produce due to the foldable circuit substrate 1 and also very reliable, in particular EMC-safe.
  • the circuit carrier may also have only elastic spring-backable predetermined bending points in the strict sense, or a combination of resiliently spring-loaded predetermined bending points and non-elastically springing-back predetermined bending points (desired folding points).
  • circuit carrier of FIG. 1 instead of the circuit carrier of FIG. 1, another flexible, in particular foldable, circuit carrier can be used in the retrofit lamp, for example according to FIGS. 2 to 5.
  • the embodiment according to FIGS. 2 and 3 has the advantage that the driver -Barrier area against the metallic receptacle, which serves as a heat sink, is electrically isolated and yet the heat sink or the recording in thermally good contact with the driver blocks 3 is.
  • some or all support regions can be provided at least partially with stiffening elements, in particular with layers or plates.
  • one or more carrier regions can have at least one light-emitting diode as the light source.
  • the light source can be present, for example, as a single light-emitting diode or LED module with a plurality of light-emitting diode regions, in particular LED chips.
  • the individual light-emitting diodes or LED chips can each monochrome or multichromic, z. B. white, radiate. In the presence of multiple light emitting diodes or LED chips, these z. B. same color (monochrome or multichrome) and / or different colors shine.
  • an LED module may have a plurality of LEDs or LED chips ('LED cluster'), which together may result in a white mixed light, e.g. B.
  • the LED cluster preferably comprises light-emitting diodes (individual LEDs or LED chips) which shine in the primary colors red (R), green (G) and blue (B).
  • red (R), green (G) and blue (B) red
  • B blue
  • RGB, RRGB, RGGB, RGBB, RGGBB etc. are possible.
  • the color combination is not limited to R, G and B (and A).
  • one or more amber LEDs 'amber' (A) may also be present to produce a warm white hue. But other suitable combinations are possible, such as RGBW, with another white LED, RGBYW with another yellow LED, etc.
  • LEDs with different colors these can also be controlled so that the LED module radiates in a tunable RGB color range .
  • phosphor LED blue chips can also be used, e.g. B. in surface mounting technology, z. In ThinGaN technology.
  • an LED module can also have a plurality of white LED chips, which can be a simple scalability of the luminous flux can be achieved.
  • the LED chips and / or the modules can be equipped with suitable optics for beam guidance, z. B. Fresnel lenses, collimators, and so on. It can be arranged on a contact several identical or different types of LED modules, for. B. several similar LED modules on the same substrate.
  • organic LEDs are generally used.
  • light sources such as other semiconductor light sources, eg. B. diode lasers, as for example, incandescent, halogen, fluorescent and other light sources.
  • the support area are stiffened in a different way, for. B. by stiffening layers of a different material.
  • the stiffening z. B. be present on one or both sides, wherein the stiffening layers need not be identically shaped nor need to be made of identical material.
  • a stiffening layer on one side may consist of FR4 material and an aluminum stiffening layer on the other side.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Bending Of Plates, Rods, And Pipes (AREA)
  • Wire Bonding (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Abstract

L'invention concerne un support de circuit présentant au moins un point de pliage préétabli. L'invention concerne également une lampe de mise à niveau présentant au moins un support de circuit plié. L'invention concerne enfin un procédé de préparation d'un support de circuit consistant à plier ledit support de circuit en au moins un point de pliage préétabli.
PCT/EP2009/062430 2008-10-08 2009-09-25 Support de circuit Ceased WO2010040645A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008050821 2008-10-08
DE102008050821.7 2008-10-08

Publications (2)

Publication Number Publication Date
WO2010040645A2 true WO2010040645A2 (fr) 2010-04-15
WO2010040645A3 WO2010040645A3 (fr) 2010-08-05

Family

ID=41351743

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2009/062430 Ceased WO2010040645A2 (fr) 2008-10-08 2009-09-25 Support de circuit

Country Status (1)

Country Link
WO (1) WO2010040645A2 (fr)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010115801A1 (fr) * 2009-04-09 2010-10-14 Ledon Lighting Jennersdorf Gmbh Dispositif del et capteur intégré
WO2011104102A1 (fr) * 2010-02-26 2011-09-01 Osram Gesellschaft mit beschränkter Haftung Support de base, support de source lumineuse, et système constitué d'un support de base et d'un support de source lumineuse
WO2011147644A3 (fr) * 2010-05-25 2012-04-26 Osram Ag Dispositif d'éclairage à semi-conducteur, procédé de fabrication d'un substrat support et procédé d'application d'un substrat support sur un corps de refroidissement
DE102012216911A1 (de) * 2012-09-20 2014-03-20 Osram Gmbh Verfahren zum Herstellen einer Lichtanordnung
DE102015206808A1 (de) * 2015-04-15 2016-10-20 Osram Gmbh Leuchtmittel mit LEDs
EP2665968B1 (fr) * 2011-01-20 2018-11-14 Philips Lighting Holding B.V. Dissipateur thermique multifonctionnel pour produits d'éclairage
DE102017116924A1 (de) * 2017-07-26 2019-01-31 Ledvance Gmbh Leuchtmittel und Verfahren zum Herstellen eines Leuchtmittels
EP2993384B1 (fr) * 2014-07-11 2019-04-24 vosla GmbH Dispositif d'eclairage en forme de bande, lampe et procede de fabrication de dispositif d'eclairage en forme de bande
EP4051950A1 (fr) * 2019-11-01 2022-09-07 Signify Holding B.V. Carte de circuit imprimé pliable avec fonction de dissipateur thermique

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2312310T3 (es) * 2000-02-02 2009-03-01 Infineon Technologies Ag Tarjeta chip con puntos de flexion predefinidos.
US6580228B1 (en) * 2000-08-22 2003-06-17 Light Sciences Corporation Flexible substrate mounted solid-state light sources for use in line current lamp sockets
US7086767B2 (en) * 2004-05-12 2006-08-08 Osram Sylvania Inc. Thermally efficient LED bulb
JP2006244725A (ja) * 2005-02-28 2006-09-14 Atex Co Ltd Ｌｅｄ照明装置
DE102007028463A1 (de) * 2007-06-18 2009-01-02 Osram Gesellschaft mit beschränkter Haftung Lichtemittierendes System mit Steckverbindung
US7637643B2 (en) * 2007-11-27 2009-12-29 Lighting Science Group Corporation Thermal and optical control in a light fixture

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9041295B2 (en) 2009-04-09 2015-05-26 Tridonic Jennersdorf Gmbh Integrated LED and sensor device
WO2010115801A1 (fr) * 2009-04-09 2010-10-14 Ledon Lighting Jennersdorf Gmbh Dispositif del et capteur intégré
WO2011104102A1 (fr) * 2010-02-26 2011-09-01 Osram Gesellschaft mit beschränkter Haftung Support de base, support de source lumineuse, et système constitué d'un support de base et d'un support de source lumineuse
US9157590B2 (en) 2010-02-26 2015-10-13 Osram Gmbh Base carrier, light source carrier and system comprising a base carrier and a light source carrier
WO2011147644A3 (fr) * 2010-05-25 2012-04-26 Osram Ag Dispositif d'éclairage à semi-conducteur, procédé de fabrication d'un substrat support et procédé d'application d'un substrat support sur un corps de refroidissement
EP2665968B1 (fr) * 2011-01-20 2018-11-14 Philips Lighting Holding B.V. Dissipateur thermique multifonctionnel pour produits d'éclairage
DE102012216911A1 (de) * 2012-09-20 2014-03-20 Osram Gmbh Verfahren zum Herstellen einer Lichtanordnung
EP2993384B1 (fr) * 2014-07-11 2019-04-24 vosla GmbH Dispositif d'eclairage en forme de bande, lampe et procede de fabrication de dispositif d'eclairage en forme de bande
DE102015206808A1 (de) * 2015-04-15 2016-10-20 Osram Gmbh Leuchtmittel mit LEDs
CN109307179A (zh) * 2017-07-26 2019-02-05 朗德万斯公司 发光装置及其制造方法
DE102017116924A1 (de) * 2017-07-26 2019-01-31 Ledvance Gmbh Leuchtmittel und Verfahren zum Herstellen eines Leuchtmittels
CN109307179B (zh) * 2017-07-26 2020-11-10 朗德万斯公司 发光装置及其制造方法
US11022255B2 (en) 2017-07-26 2021-06-01 Ledvance Gmbh Reflector lamp with flex DLE
DE102017116924B4 (de) 2017-07-26 2023-03-16 Ledvance Gmbh Leuchtmittel und Verfahren zum Herstellen eines Leuchtmittels
EP4051950A1 (fr) * 2019-11-01 2022-09-07 Signify Holding B.V. Carte de circuit imprimé pliable avec fonction de dissipateur thermique

Also Published As

Publication number Publication date
WO2010040645A3 (fr) 2010-08-05

Similar Documents

Publication Publication Date Title
WO2010040645A2 (fr) Support de circuit
DE102009047558B4 (de) Zweiteiliger LED-Streifen-Steckverbinder für Oberflächenmontage und LED-Baugruppe
DE102009023052B4 (de) Leuchtmodul und Leuchtvorrichtung
EP2078895B1 (fr) Système d'éclairage
DE102005054422A1 (de) Led-Lampe mit Leds auf einem Wärmeleitenden Ständer und Verfahren zur Herstellung der Led-Lampe
DE102008016458A1 (de) Leiterplatte
DE202008006327U1 (de) Lampe mit Wärmeaufbau sowie zugehörige Lampenabdeckung
DE102012207608A1 (de) Halbleiter-retrofitlampe mit zweiseitig angeordneten anschlusselementen
DE202010006197U1 (de) LED-Lampe
EP2185857B1 (fr) Module lumineux
WO2016005069A1 (fr) Lampe à semi-conducteur
EP2118562B1 (fr) Moyen d'éclairage del avec rayonnement lumineux omnidirectionnel et évacuation de chaleur optimisée
DE102013206342B4 (de) LED-Montageschaltungsplatine, gurtartiges flexibles LED-Licht und LED-Beleuchtungsvorrichtung, die diese nutzt
WO2009121559A1 (fr) Luminaire
DE102011076128A1 (de) Trägersystem und Lichtmodul zur Befestigung daran
WO2016091432A1 (fr) Lampe à carte pilote et embase
EP2613079A1 (fr) Moyen d'eclairage à DEL
EP2994695B1 (fr) Système réflecteur comprenant plusieurs réflecteurs et sources lumineuses à semi-conducteur
DE102017105918A1 (de) Lichtband mit diskreten LEDs, Lampe und Leuchte mit Lichtbändern und Verfahren zur Herstellung eines Lichtbands mit diskreten LEDs
DE202011050974U1 (de) LED-Leuchtröhre
WO2015040240A1 (fr) Lampe
DE102015216661A1 (de) Halbleiterlichtquelle
DE202015104292U1 (de) LED-Anordnung mit Pitch-Kompensation
DE102010018253A1 (de) Lichtquellenmodul und Lichtquelle
DE102012200669B4 (de) Leuchtvorrichtung mit sandwich-aufnahmevorrichtung

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09783408

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 09783408

Country of ref document: EP

Kind code of ref document: A2