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WO2009133663A1 - Probe card - Google Patents

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Publication number
WO2009133663A1
WO2009133663A1 PCT/JP2009/001739 JP2009001739W WO2009133663A1 WO 2009133663 A1 WO2009133663 A1 WO 2009133663A1 JP 2009001739 W JP2009001739 W JP 2009001739W WO 2009133663 A1 WO2009133663 A1 WO 2009133663A1
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WO
WIPO (PCT)
Prior art keywords
probe
ceramic
ceramic tubes
support plate
probe card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2009/001739
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French (fr)
Japanese (ja)
Inventor
水口浩
石黒義久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MINAKUCHI LABORATORY
Life Technology Research Institute Inc
K AND I Inc
Original Assignee
MINAKUCHI LABORATORY
Life Technology Research Institute Inc
K AND I Inc
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Application filed by MINAKUCHI LABORATORY, Life Technology Research Institute Inc, K AND I Inc filed Critical MINAKUCHI LABORATORY
Publication of WO2009133663A1 publication Critical patent/WO2009133663A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams

Definitions

  • the present invention relates to a probe card for measuring electrical characteristics of an IC chip, an LSI chip or the like.
  • Patent Document 1 discloses a vertical operation type probe card.
  • a guide hole is formed in two support plates spaced vertically, and a probe is inserted into the guide hole.
  • a curved portion is provided at a position located between the two support plates of the probe, and when the lower end of the probe comes into contact with the electrode pad, the curved portion is bent to ensure a predetermined contact pressure.
  • Patent Document 2 the same number of probes as electrode pads of a semiconductor element to be inspected are attached to an upper surface of a substrate on which a morning glory-type opening is formed with an adhesive, and one end of this probe is formed on the substrate.
  • a probe card is disclosed in which the other end connected to the pattern with solder or the like and brought into contact with the electrode pad is inserted into a guide hole of a plate provided in the opening.
  • Patent Documents 3 to 5 are known as prior arts in which a part of the probe is arranged in the tube.
  • Patent Document 3 discloses a structure in which a probe-integrated capillary tube is inserted and fixed in a guide hole formed in a guide plate into which a small and small probe composed of a vertical spring portion, a lower end cantilever portion, and a contact tip portion at the front end is inserted. Has been proposed.
  • Patent Document 4 a guide tube is connected to a connection portion of a lower probe pin that contacts a conductive pad, and a tip of a guide shaft portion of an upper probe pin connected to a conductive pattern is inserted into the guide tube.
  • a tip of a guide shaft portion of an upper probe pin connected to a conductive pattern is inserted into the guide tube.
  • Patent Document 5 proposes a structure in which an upper part of a probe pin is inserted into a guide pipe and a spring is provided between a flange part provided at the lower part and a lower end of the guide pipe.
  • the conventional probe card described above has the same number of probes as the electrode pads on the substrate to be inspected in the same arrangement as the electrode pads.
  • a guide hole is formed in the support plate so that the lower end of the probe contacts the electrode pad, and the lower end of the probe is inserted into the guide hole.
  • a probe card includes a substrate on which a conductive pattern is formed, a probe having one end connected to the conductive pattern, and a probe tip attached to the substrate and having the probe tip inserted therethrough. And a support plate having a guide hole formed therein, wherein the support plate is configured by assembling a plurality of ceramic tubes so that their axes are parallel to each other, and the plurality of ceramic tubes are adjacent to each other. The four ceramic tubes are arranged densely so that the centers of the ceramic tubes are the apexes of the square.
  • the probe can be inserted not only into the ceramic tube but also into the outer space. it can.
  • Another probe card includes a substrate on which a conductive pattern is formed, a probe connected at one end to the conductive pattern, and a guide hole that is attached to the substrate and through which the tip of the probe is inserted. And a support plate formed with a plurality of ceramic tubes arranged in parallel so that the axes are parallel to each other, the plurality of ceramic tubes being adjacent three ceramic tubes. Are densely arranged so that the center of the triangle becomes the apex of the equilateral triangle.
  • the method for manufacturing a probe card support plate according to the present invention includes, for example, casting a core material integrally when forming a green ceramic tube by casting, and then gasifying and removing the core material during firing.
  • the long ceramic tube obtained or the long ceramic tube obtained by extrusion molding is densely arranged so that the axes are parallel and the center is the apex of a square or equilateral triangle.
  • the ceramic tube assembly is bonded to form a ceramic tube assembly, and then the ceramic tube assembly is cut into a predetermined dimension in a direction orthogonal to the axis.
  • the probe card support plate is made up of an assembly of a large number of ceramic tubes, it is not necessary to provide fine guide holes in a hard ceramic plate as in the prior art.
  • the thickness of the support plate must be such that the diameter of the guide hole is substantially unchanged between the inlet side and the outlet side so that the straight plate can be maintained.
  • the guide function was not sufficient, but by using a ceramic tube as in the present invention, it is possible to set the thickness so that the guide function can be sufficiently exhibited.
  • Sectional view of the probe card according to the present invention Sectional drawing of the probe card which concerns on another Example Perspective view of support plate
  • Example Perspective view of support plate Enlarged plan view of support plate Perspective view of an assembly of ceramic tubes before cutting into support plates
  • FIG. 1 is a sectional view of a probe card according to the present invention
  • FIG. 2 is a sectional view of a probe card according to another embodiment
  • FIG. 3 is a perspective view of a supporting plate
  • FIG. 4 is an enlarged plan view of the supporting plate
  • FIG. It is a perspective view of the aggregate
  • the probe card includes a substrate 1 and support plates 2 and 3.
  • a conductive pattern corresponding to the circuit of the chip 10 to be inspected is formed on the surface of the substrate 1.
  • An opening 4 is formed at the center of the substrate 1, and the support plates 2 and 3 are attached below the opening 4 with a spacer 12 in parallel with a space therebetween.
  • the support plate 2 is configured by assembling a large number of ceramic tubes 5 having a diameter of 1 to 100 ⁇ m and a length (height) of 1 to 50 ⁇ m so that their axes are parallel, and the outside is fixed by a frame 6. .
  • the aggregate of the plurality of ceramic tubes 5 is fixed with an adhesive 7 in a state of being densely arranged so that the centers O1, O2, O3, and O4 of the four adjacent ceramic tubes 5 are the apexes of a square.
  • a ceramic block in which the centers O1, O2, O3, and O4 are square apexes may be formed by immersing and firing the ceramic tubes 5 in the ceramic slurry in a densely arranged state. .
  • the shortest interval W1 between the outer peripheral surfaces of the opposing ceramic tubes in the space 8 surrounded by the four ceramic tubes 5 is equal to the inner diameter W2 of the ceramic tubes 5.
  • a probe 9 is inserted through the interior of the ceramic tube 5 constituting the support plates 2 and 3 and the space 8 formed by the four ceramic tubes 5. One end of the probe 9 is connected to a conductive pattern formed on the surface of the substrate 1.
  • a curved spring portion 9a is formed in a portion located between the support plates 2 and 3 of the probe 9, and a constant contact is made with the lower end of the probe 9 contacting the electrode pad 11 of the chip 10 at the time of inspection. The pressure can be maintained.
  • the linear spring portion 9b it is possible to make the linear spring portion 9b by slightly shifting the horizontal position of the support plates 2 and 3 as shown in FIG.
  • a core material made of resin or glass is set in a cylindrical mold, and slurry is cast into the mold. Then, after the fleshing, the green ceramic tube is taken out of the mold and fired. At this time, the core material disappears by the heat of firing, and a long ceramic tube having a through hole formed in the axial direction is obtained.
  • the inner surface of the through hole is finished.
  • a means for rotating a wire or a ceramic tube at a high speed by passing a wire having diamond powder bonded to the surface through the through hole can be considered. If the through hole is sufficiently smooth, finishing is not necessary.
  • the long ceramic tube 20 obtained as shown in FIG. 5 is densely arranged and bonded so that the axes thereof are parallel and the center thereof is the apex of the square to form a ceramic tube assembly 21, and thereafter
  • the ceramic tube aggregate 21 is cut into a predetermined dimension in a direction perpendicular to the axis to obtain support plates 2 and 3.
  • FIG. 6 is a view similar to FIG. 4 showing another embodiment.
  • a large number of ceramic tubes 5 are assembled so that their axes are parallel to each other, and the centers of three adjacent ceramic tubes are arranged. They are densely arranged so that O1, O2, and O3 are the vertices of an equilateral triangle.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

A probe card which is easy to produce and wherein the positions of probes are precise. A support plate (2) is configured by gathering many ceramic tubes (5) which are approximately 1 to 100µm in diameter and 1 to 50µm in length (height) with the axes thereof parallel to one another, and fixing the external side with a frame (6). The assembly of the many ceramic tubes (5) is fixed by an adhesive (7) while arranged densely such that the centers (O1, O2, O3, O4) of four adjacent ceramic tubes (5) become the vertexes of a square.

Description

プローブカードProbe card

本発明は、ＩＣチップやＬＳＩチップ等の電気的特性を測定するプロ－ブカードに関する。 The present invention relates to a probe card for measuring electrical characteristics of an IC chip, an LSI chip or the like.

ＩＣチップやＬＳＩチップは１枚の半導体ウェーハに多数のチップを作製し、これをチップ毎に切断して使用している。そして、個々のチップが不良品であるか否かのチェックは、チップ毎に切断する前にプロ－ブカードを用いて行っている。 As IC chips and LSI chips, a large number of chips are produced on one semiconductor wafer, and the chips are used by cutting each chip. Whether each chip is defective is checked using a probe card before cutting every chip.

特許文献１には垂直作動型のプローブカードが開示されている。この垂直作動型のプローブカードは上下に間隔をあけた２枚の支持プレートにガイド穴を形成し、このガイド穴にプローブを挿通している。そして、プローブの２枚の支持プレート間に位置する箇所に湾曲部を設け、プローブ下端が電極パッドに接触した際に湾曲部が撓むことで所定の接触圧を確保するようにしている。 Patent Document 1 discloses a vertical operation type probe card. In this vertically actuated type probe card, a guide hole is formed in two support plates spaced vertically, and a probe is inserted into the guide hole. A curved portion is provided at a position located between the two support plates of the probe, and when the lower end of the probe comes into contact with the electrode pad, the curved portion is bent to ensure a predetermined contact pressure.

特許文献２には、朝顔型に上に開いた開口部を形成した基板の上面に、検査する半導体素子の電極パッドと同数のプローブを接着剤により取付け、このプローブの一端を基板に形成した導電パターンに半田等で接続し、電極パッドに接触させる他端は前記開口部に設けたプレートのガイド穴に挿通したプローブカードが開示されている。 In Patent Document 2, the same number of probes as electrode pads of a semiconductor element to be inspected are attached to an upper surface of a substrate on which a morning glory-type opening is formed with an adhesive, and one end of this probe is formed on the substrate. A probe card is disclosed in which the other end connected to the pattern with solder or the like and brought into contact with the electrode pad is inserted into a guide hole of a plate provided in the opening.

またプローブの一部を管体内に配置した先行技術として、特許文献３～５が知られている。特許文献３にはガイド板に形成したガイド穴に、垂直スプリング部と、下端の片持ち梁部と、先端の接触先端部からなる微細小型のプローブを挿入したプローブ一体型細管を挿入固定した構造が提案されている。 Further, Patent Documents 3 to 5 are known as prior arts in which a part of the probe is arranged in the tube. Patent Document 3 discloses a structure in which a probe-integrated capillary tube is inserted and fixed in a guide hole formed in a guide plate into which a small and small probe composed of a vertical spring portion, a lower end cantilever portion, and a contact tip portion at the front end is inserted. Has been proposed.

特許文献４には、導電パッドに接触する下側プローブピンの接続部にガイド管が接続され、また導電パターンに接続される上側プローブピンのガイド軸部の先端が前記ガイド管に挿入された構造が提案されている。 In Patent Document 4, a guide tube is connected to a connection portion of a lower probe pin that contacts a conductive pad, and a tip of a guide shaft portion of an upper probe pin connected to a conductive pattern is inserted into the guide tube. Has been proposed.

特許文献５には、プローブピンの上部をガイド管に挿入し、下部に設けたフランジ部とガイド管下端との間にスプリングを設けた構造が提案されている。 Patent Document 5 proposes a structure in which an upper part of a probe pin is inserted into a guide pipe and a spring is provided between a flange part provided at the lower part and a lower end of the guide pipe.

特開平０９－１１３５３７号公報Japanese Patent Laid-Open No. 09-113537 特開２０００－３２７４０２号公報JP 2000-327402 A 特開２００４－１５６９６９号公報JP 2004-156969 A 特開２００６－２０８３２９号公報JP 2006-208329 A 特開２００８－２１０７３８号公報JP 2008-210738 A

　上述した従来のプローブカードは、検査対象となる基板の電極パッドと同数のプローブを電極パッドと同じ配置で備えている。そして、電極パッドにプローブ下端が接触するように支持プレートにガイド穴をあけ、このガイド穴にプローブ下端を挿通している。 The conventional probe card described above has the same number of probes as the electrode pads on the substrate to be inspected in the same arrangement as the electrode pads. A guide hole is formed in the support plate so that the lower end of the probe contacts the electrode pad, and the lower end of the probe is inserted into the guide hole.

　しかしながら、最近ではＩＣの微細化に伴い、電極パッドの間隔も数十μｍになっており、ガイド穴のピッチもそれにつれて小さくなっている。間隔が小さくなるとガイド穴径も必然的に小さくなり、従来は微細ドリルやレーザ光を利用して穴あけ加工を行っており、その作業が極めて面倒でプローブカードの製造コストの増大を招いている。 However, recently, with the miniaturization of ICs, the distance between electrode pads has become several tens of μm, and the pitch of guide holes has also decreased accordingly. When the interval is reduced, the diameter of the guide hole is inevitably reduced. Conventionally, drilling is performed using a fine drill or a laser beam, which is very troublesome and increases the manufacturing cost of the probe card.

上記課題を解決するため本発明に係るプロ－ブカードは、導電パターンが形成された基板と、前記導電パターンに一端が接続されるプローブと、前記基板に取付けられるとともに前記プロ－ブの先端が挿通されるガイド穴を形成した支持プレートとを備えたプロ－ブカードであって、前記支持プレートは多数のセラミック管を軸が平行となるように集合して構成され、前記多数のセラミック管は隣接する４つのセラミック管の中心が正方形の頂点となるように稠密配置されている。 In order to solve the above problems, a probe card according to the present invention includes a substrate on which a conductive pattern is formed, a probe having one end connected to the conductive pattern, and a probe tip attached to the substrate and having the probe tip inserted therethrough. And a support plate having a guide hole formed therein, wherein the support plate is configured by assembling a plurality of ceramic tubes so that their axes are parallel to each other, and the plurality of ceramic tubes are adjacent to each other. The four ceramic tubes are arranged densely so that the centers of the ceramic tubes are the apexes of the square.

前記４つのセラミック管で囲まれる空間の対向するセラミック管の外周面の最短間隔が、セラミック管の内径と等しい設定にすると、セラミック管の内側だけでなく外側の空間にもプローブを挿通することができる。 If the shortest interval between the outer peripheral surfaces of the opposing ceramic tubes in the space surrounded by the four ceramic tubes is set equal to the inner diameter of the ceramic tube, the probe can be inserted not only into the ceramic tube but also into the outer space. it can.

本発明に係る別のプロ－ブカードは、導電パターンが形成された基板と、前記導電パターンに一端が接続されるプローブと、前記基板に取付けられるとともに前記プロ－ブの先端が挿通されるガイド穴を形成した支持プレートとを備えたプロ－ブカードであって、前記支持プレートは多数のセラミック管を軸が平行となるように集合して構成され、前記多数のセラミック管は隣接する３つのセラミック管の中心が正三角形の頂点となるように稠密配置されている。 Another probe card according to the present invention includes a substrate on which a conductive pattern is formed, a probe connected at one end to the conductive pattern, and a guide hole that is attached to the substrate and through which the tip of the probe is inserted. And a support plate formed with a plurality of ceramic tubes arranged in parallel so that the axes are parallel to each other, the plurality of ceramic tubes being adjacent three ceramic tubes. Are densely arranged so that the center of the triangle becomes the apex of the equilateral triangle.

また本発明に係るプロ－ブカード用支持プレートの製造方法は、例えば鋳込み成形によってグリーン状態のセラミック管を成形する際に芯材を一体的に鋳込み、この後焼成時に前記芯材をガス化して除去し、得られた長尺のセラミック管、または押出し成形によって得られた長尺のセラミック管を、軸が平行になるとともにその中心が正方形の頂点または正三角形の頂点となるように稠密配置して接着してセラミック管集合体とし、この後前記セラミック管集合体を軸と直交方向に所定寸法に切断する。 Further, the method for manufacturing a probe card support plate according to the present invention includes, for example, casting a core material integrally when forming a green ceramic tube by casting, and then gasifying and removing the core material during firing. The long ceramic tube obtained or the long ceramic tube obtained by extrusion molding is densely arranged so that the axes are parallel and the center is the apex of a square or equilateral triangle. The ceramic tube assembly is bonded to form a ceramic tube assembly, and then the ceramic tube assembly is cut into a predetermined dimension in a direction orthogonal to the axis.

発明によればプロ－ブカード用支持プレートが多数のセラミック管の集合体からなるので、従来のように、微細なガイド穴を硬いセラミックプレートにあける必要がなくなる。 According to the present invention, since the probe card support plate is made up of an assembly of a large number of ceramic tubes, it is not necessary to provide fine guide holes in a hard ceramic plate as in the prior art.

また、従来にあっては支持プレートの厚さをガイド穴の径が入口側と出口側で実質的に変わらず直線状態維持できる厚さとしなければならず、必然的に支持プレートの厚さを厚くできず、ガイド機能が十分ではなかったが、本発明のようにセラミック管とすることで、ガイド機能を十分に発揮できる厚さに設定できる。 In addition, in the past, the thickness of the support plate must be such that the diameter of the guide hole is substantially unchanged between the inlet side and the outlet side so that the straight plate can be maintained. However, the guide function was not sufficient, but by using a ceramic tube as in the present invention, it is possible to set the thickness so that the guide function can be sufficiently exhibited.

本発明に係るプローブカードの断面図Sectional view of the probe card according to the present invention 別実施例に係るプローブカードの断面図Sectional drawing of the probe card which concerns on another Example 支持プレートの斜視図Perspective view of support plate 支持プレートの拡大平面図Enlarged plan view of support plate 支持プレートに切断する前のセラミック管の集合体の斜視図Perspective view of an assembly of ceramic tubes before cutting into support plates 別実施例を示す図４と同様の図The same figure as FIG. 4 showing another embodiment

以下に本発明の好適な実施例を添付図面に基づいて説明する。図１は本発明に係るプローブカードの断面図、図２は別実施例に係るプローブカードの断面図、図３は支持プレートの斜視図、図４は支持プレートの拡大平面図、図５は支持プレートに切断する前のセラミック管の集合体の斜視図である。 Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. 1 is a sectional view of a probe card according to the present invention, FIG. 2 is a sectional view of a probe card according to another embodiment, FIG. 3 is a perspective view of a supporting plate, FIG. 4 is an enlarged plan view of the supporting plate, and FIG. It is a perspective view of the aggregate | assembly of the ceramic tube before cut | disconnecting to a plate.

プローブカードは基板１と支持プレート２，３を備えている。基板１の表面には検査対象となるチップ１０の回路に相当する導電パターンが形成されている。基板１の中央には開口部４が形成され、この開口部４の下方にスペーサ１２を介して前記支持プレート２，３が平行に間隔をあけて取付けられている。 The probe card includes a substrate 1 and support plates 2 and 3. A conductive pattern corresponding to the circuit of the chip 10 to be inspected is formed on the surface of the substrate 1. An opening 4 is formed at the center of the substrate 1, and the support plates 2 and 3 are attached below the opening 4 with a spacer 12 in parallel with a space therebetween.

支持プレート２，３は同じ構造であるので一方の支持プレート２について説明する。支持プレート２は直径１～１００μｍ、長さ（高さ）１～５０μｍ程度の多数のセラミック管５…を軸が平行となるように集合させ、外側を枠体６で固定して構成されている。 Since the support plates 2 and 3 have the same structure, only one support plate 2 will be described. The support plate 2 is configured by assembling a large number of ceramic tubes 5 having a diameter of 1 to 100 μm and a length (height) of 1 to 50 μm so that their axes are parallel, and the outside is fixed by a frame 6. .

前記多数のセラミック管５の集合体は隣接する４つのセラミック管５…の中心Ｏ１、Ｏ２、Ｏ３、Ｏ４が正方形の頂点となるように稠密配置された状態で接着剤７で固着されている。接着剤で固定する代わりにセラミックスラリー中にセラミック管５…を稠密配置した状態で浸漬し、焼成することで中心Ｏ１、Ｏ２、Ｏ３、Ｏ４が正方形の頂点となるセラミックブロックを形成してもよい。 The aggregate of the plurality of ceramic tubes 5 is fixed with an adhesive 7 in a state of being densely arranged so that the centers O1, O2, O3, and O4 of the four adjacent ceramic tubes 5 are the apexes of a square. Instead of fixing with an adhesive, a ceramic block in which the centers O1, O2, O3, and O4 are square apexes may be formed by immersing and firing the ceramic tubes 5 in the ceramic slurry in a densely arranged state. .

特に図４に示す実施例にあっては、４つのセラミック管５…で囲まれる空間８の対向するセラミック管の外周面の最短間隔Ｗ１が、セラミック管５の内径Ｗ２と等しくしている。 In particular, in the embodiment shown in FIG. 4, the shortest interval W1 between the outer peripheral surfaces of the opposing ceramic tubes in the space 8 surrounded by the four ceramic tubes 5 is equal to the inner diameter W2 of the ceramic tubes 5.

そして、支持プレート２，３を構成するセラミック管５の内部および４つのセラミック管５で形成される空間８にはプローブ９を挿通している。このプローブ９の一端は前記基板１の表面に形成した導電パターンに接続されている。 A probe 9 is inserted through the interior of the ceramic tube 5 constituting the support plates 2 and 3 and the space 8 formed by the four ceramic tubes 5. One end of the probe 9 is connected to a conductive pattern formed on the surface of the substrate 1.

また、プローブ９の支持プレート２，３間に位置する部分には湾曲したスプリング部９ａを形成し、検査の際にプローブ９の下端がチップ１０の電極パッド１１に当たった状態で、一定の接触圧を維持できるようにしている。
尚、スプリング部９ａを設ける代わりに、図２に示すように支持プレート２，３の水平位置を若干ずらすことで直線的なスプリング部９ｂとすることも可能である。 Further, a curved spring portion 9a is formed in a portion located between the support plates 2 and 3 of the probe 9, and a constant contact is made with the lower end of the probe 9 contacting the electrode pad 11 of the chip 10 at the time of inspection. The pressure can be maintained.
Instead of providing the spring portion 9a, it is possible to make the linear spring portion 9b by slightly shifting the horizontal position of the support plates 2 and 3 as shown in FIG.

前記支持プレート２，３の製造方法の一例を述べる。
先ず、筒状の型内に樹脂やガラスなどからなる芯材をセットし、型内にスラリーを鋳込む。そして着肉後グリーン状態のセラミック管を型から取り出し焼成する。このとき、芯材は焼成の熱によって消失し、軸方向に貫通穴が形成された長尺のセラミック管が得られる。 An example of a method for manufacturing the support plates 2 and 3 will be described.
First, a core material made of resin or glass is set in a cylindrical mold, and slurry is cast into the mold. Then, after the fleshing, the green ceramic tube is taken out of the mold and fired. At this time, the core material disappears by the heat of firing, and a long ceramic tube having a through hole formed in the axial direction is obtained.

そして、前記貫通穴の内面を仕上げ加工する。仕上げ加工は、表面にダイヤモンド粉末を接着した線材を前記貫通穴に通し、線材またはセラミック管を高速で回転する手段が考えられる。尚、貫通穴が十分に平滑な場合には仕上げ加工は不要である。 Then, the inner surface of the through hole is finished. As the finishing process, a means for rotating a wire or a ceramic tube at a high speed by passing a wire having diamond powder bonded to the surface through the through hole can be considered. If the through hole is sufficiently smooth, finishing is not necessary.

次いで、図５に示すように得られた長尺のセラミック管２０を軸が平行になるとともにその中心が正方形の頂点となるように稠密配置して接着してセラミック管集合体２１とし、この後前記セラミック管集合体２１を軸と直交方向に所定寸法に切断して支持プレート２，３が得られる。 Next, the long ceramic tube 20 obtained as shown in FIG. 5 is densely arranged and bonded so that the axes thereof are parallel and the center thereof is the apex of the square to form a ceramic tube assembly 21, and thereafter The ceramic tube aggregate 21 is cut into a predetermined dimension in a direction perpendicular to the axis to obtain support plates 2 and 3.

図６は別実施例を示す図４と同様の図であり、この実施例にあっては多数のセラミック管５…を軸が平行となるように集合するとともに、隣接する３つのセラミック管の中心Ｏ１，Ｏ２，Ｏ３が正三角形の頂点となるように稠密配置している。 FIG. 6 is a view similar to FIG. 4 showing another embodiment. In this embodiment, a large number of ceramic tubes 5 are assembled so that their axes are parallel to each other, and the centers of three adjacent ceramic tubes are arranged. They are densely arranged so that O1, O2, and O3 are the vertices of an equilateral triangle.

１…基板、２，３…支持プレート、１０…チップ、１１…電極パッド、４…開口部、５…セラミック管、６…枠体、７…接着剤、８…空間、９…プローブ、９ａ，９ｂ…スプリング部、１０…チップ、１１…電極パッド、１２…スペーサ、２０…長尺のセラミック管、２１…セラミック管集合体、Ｏ１、Ｏ２、Ｏ３、Ｏ４…セラミック管の中心、Ｗ１…対向するセラミック管の外周面の最短間隔、Ｗ２…セラミック管の内径。 DESCRIPTION OF SYMBOLS 1 ... Substrate, 2, 3 ... Support plate, 10 ... Chip, 11 ... Electrode pad, 4 ... Opening, 5 ... Ceramic tube, 6 ... Frame, 7 ... Adhesive, 8 ... Space, 9 ... Probe, 9a, 9b ... Spring part, 10 ... Tip, 11 ... Electrode pad, 12 ... Spacer, 20 ... Long ceramic tube, 21 ... Ceramic tube assembly, O1, O2, O3, O4 ... Center of ceramic tube, W1 ... Opposite The shortest distance between the outer peripheral surfaces of the ceramic tube, W2 ... the inner diameter of the ceramic tube.

Claims (4)

導電パターンが形成された基板と、前記導電パターンに一端が接続されるプローブと、前記基板に取付けられるとともに前記プロ－ブの先端が挿通されるガイド穴を形成した支持プレートとを備えたプロ－ブカードであって、前記支持プレートは多数のセラミック管を軸が平行となるように集合して構成され、前記多数のセラミック管は隣接する４つのセラミック管の中心が正方形の頂点となるように稠密配置されていることを特徴とするプロ－ブカード。 A probe comprising a substrate on which a conductive pattern is formed, a probe connected at one end to the conductive pattern, and a support plate attached to the substrate and having a guide hole through which the tip of the probe is inserted. The support plate is configured by assembling a plurality of ceramic tubes so that their axes are parallel to each other, and the plurality of ceramic tubes are dense so that the centers of four adjacent ceramic tubes are at the apex of a square. A probe card characterized by being arranged. 請求項１に記載のプロ－ブカードにおいて、前記４つのセラミック管で囲まれる空間の対向するセラミック管の外周面の最短間隔が、セラミック管の内径と等しいことを特徴とするプロ－ブカード。 2. The probe card according to claim 1, wherein the shortest distance between the outer peripheral surfaces of the opposing ceramic tubes in the space surrounded by the four ceramic tubes is equal to the inner diameter of the ceramic tube. 導電パターンが形成された基板と、前記導電パターンに一端が接続されるプローブと、前記基板に取付けられるとともに前記プロ－ブの先端が挿通されるガイド穴を形成した支持プレートとを備えたプロ－ブカードであって、前記支持プレートは多数のセラミック管を軸が平行となるように集合して構成され、前記多数のセラミック管は隣接する３つのセラミック管の中心が正三角形の頂点となるように稠密配置されていることを特徴とするプロ－ブカード。 A probe comprising a substrate on which a conductive pattern is formed, a probe connected at one end to the conductive pattern, and a support plate attached to the substrate and having a guide hole through which the tip of the probe is inserted. The support plate is configured by assembling a plurality of ceramic tubes so that their axes are parallel to each other, and the plurality of ceramic tubes are arranged such that the centers of three adjacent ceramic tubes are the vertices of equilateral triangles. A probe card characterized by being densely arranged. プローブの先端部をガイドするガイド穴を多数形成したプロ－ブカード用支持プレートの製造方法において、鋳込み成形によってグリーン状態のセラミック管を成形する際に芯材を一体的に鋳込み、この後焼成時に前記芯材をガス化して除去し、得られた長尺のセラミック管を軸が平行になるとともにその中心が正方形の頂点または正三角形の頂点となるように稠密配置して接着してセラミック管集合体とし、この後前記セラミック管集合体を所定寸法に切断することを特徴とするプロ－ブカード用支持プレートの製造方法。 In a method for manufacturing a probe card support plate in which a number of guide holes for guiding the tip of a probe are formed, a core material is integrally cast when a green ceramic tube is formed by casting, and then the above-described firing is performed. The core material is removed by gasification, and the resulting long ceramic tube is closely arranged and bonded so that the axes are parallel and the center is the apex of a square or equilateral triangle, and the ceramic tube assembly is bonded Then, the ceramic tube assembly is cut into a predetermined size, and the method for manufacturing the probe card support plate is characterized in that:
PCT/JP2009/001739 2008-05-02 2009-04-15 Probe card Ceased WO2009133663A1 (en)

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JP2008120312A JP4260871B1 (en) 2008-05-02 2008-05-02 Probe card

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Publication number Priority date Publication date Assignee Title
ITMI20102434A1 (en) * 2010-12-28 2012-06-29 Technoprobe Spa MEASURING HEAD FOR A TEST EQUIPMENT FOR ELECTRONIC DEVICES
CN110865295A (en) * 2019-10-30 2020-03-06 武汉光庭信息技术股份有限公司 Onboard IC pin signal test fixture
EP4050248A1 (en) 2021-02-26 2022-08-31 NOV Process & Flow Technologies AS Subsea storage of a water miscible storage fluid
WO2022179921A1 (en) 2021-02-26 2022-09-01 Nov Process & Flow Technologies As Subsea storage of a water miscible storage fluid

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JPH04346255A (en) * 1991-05-23 1992-12-02 Nec Corp Micro pin assembly
JPH07247179A (en) * 1994-03-14 1995-09-26 Osamu Yamamoto Ceramic structure material, its production and production of ceramic sheet
JPH0812460A (en) * 1994-06-22 1996-01-16 Osamu Yamamoto Honeycomb ceramic structure
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JPS62227448A (en) * 1986-03-31 1987-10-06 Nippon Kinzoku Kk Preparation of catalyst carrier made of ceramic
JPH0487355A (en) * 1990-07-30 1992-03-19 Nec Corp Micropin aggregate and its production
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JPH07247179A (en) * 1994-03-14 1995-09-26 Osamu Yamamoto Ceramic structure material, its production and production of ceramic sheet
JPH0812460A (en) * 1994-06-22 1996-01-16 Osamu Yamamoto Honeycomb ceramic structure
JP2001041978A (en) * 1999-07-30 2001-02-16 Japan Electronic Materials Corp Probe and probe card using the same
JP2006133199A (en) * 2004-11-09 2006-05-25 Tnk Incubation:Kk Spring contact probe device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITMI20102434A1 (en) * 2010-12-28 2012-06-29 Technoprobe Spa MEASURING HEAD FOR A TEST EQUIPMENT FOR ELECTRONIC DEVICES
CN110865295A (en) * 2019-10-30 2020-03-06 武汉光庭信息技术股份有限公司 Onboard IC pin signal test fixture
EP4050248A1 (en) 2021-02-26 2022-08-31 NOV Process & Flow Technologies AS Subsea storage of a water miscible storage fluid
WO2022179921A1 (en) 2021-02-26 2022-09-01 Nov Process & Flow Technologies As Subsea storage of a water miscible storage fluid

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