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WO2009116167A1 - Tête magnétique, dispositif de stockage magnétique, et procédé de fabrication de tête magnétique - Google Patents

Tête magnétique, dispositif de stockage magnétique, et procédé de fabrication de tête magnétique Download PDF

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Publication number
WO2009116167A1
WO2009116167A1 PCT/JP2008/055273 JP2008055273W WO2009116167A1 WO 2009116167 A1 WO2009116167 A1 WO 2009116167A1 JP 2008055273 W JP2008055273 W JP 2008055273W WO 2009116167 A1 WO2009116167 A1 WO 2009116167A1
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WO
WIPO (PCT)
Prior art keywords
layer
magnetic
insulating layer
thermal expansion
magnetic head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/055273
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English (en)
Japanese (ja)
Inventor
正弘 筧
知佳 青木
隆英 小野
淳史 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to PCT/JP2008/055273 priority Critical patent/WO2009116167A1/fr
Publication of WO2009116167A1 publication Critical patent/WO2009116167A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
    • G11B5/3109—Details
    • G11B5/313—Disposition of layers
    • G11B5/3133—Disposition of layers including layers not usually being a part of the electromagnetic transducer structure and providing additional features, e.g. for improving heat radiation, reduction of power dissipation, adaptations for measurement or indication of gap depth or other properties of the structure
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
    • G11B5/3103—Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing
    • G11B5/3106—Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing where the integrated or assembled structure comprises means for conditioning against physical detrimental influence, e.g. wear, contamination
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/40—Protective measures on heads, e.g. against excessive temperature 
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/58—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed with provision for moving the head for the purpose of maintaining alignment of the head relative to the record carrier during transducing operation, e.g. to compensate for surface irregularities of the latter or for track following
    • G11B5/60—Fluid-dynamic spacing of heads from record-carriers
    • G11B5/6005—Specially adapted for spacing from a rotating disc using a fluid cushion
    • G11B5/6011—Control of flying height
    • G11B5/6064—Control of flying height using air pressure
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B2005/0002—Special dispositions or recording techniques
    • G11B2005/0005—Arrangements, methods or circuits

Definitions

  • the present invention relates to a magnetic head capable of changing the protruding amount of an element portion due to thermal expansion accompanying heating, a magnetic storage device including the magnetic head, and a method of manufacturing the same, and more particularly to an element in a high temperature environment.
  • the present invention relates to a magnetic head capable of suppressing excessive protrusion, a magnetic storage device including the magnetic head, and a manufacturing method thereof.
  • the distance between the recording surface of the magnetic disk and the element portion of the magnetic head that is, the so-called flying height of the magnetic head tends to be small.
  • a flying height of the order of 10 nm has been realized.
  • the flying height of the magnetic head decreases, there is a problem that the magnetic head easily collides with minute protrusions on the surface of the magnetic disk, causing damage to the magnetic disk and the magnetic head. Further, since there is a dimensional tolerance in the size of the magnetic head, there is a problem that the flying height cannot be set low beyond the tolerance range in consideration of contact with the medium.
  • a magnetic head is equipped with a built-in heater, and the flying height is adjusted by utilizing the phenomenon that the surface (floating surface) facing the recording medium protrudes due to the thermal expansion of the magnetic head when the heater is energized.
  • Controls have been proposed (for example, Patent Documents 1 to 3).
  • the protruding amount of the element portion tends to become excessive due to an increase in temperature of the element and its peripheral portion (so-called environmental temperature) during operation of the magnetic disk device. For this reason, it is difficult to control the flying height regardless of temperature conditions.
  • the present invention provides a method for manufacturing a magnetic head capable of suppressing excessive protrusion of elements against an increase in environmental temperature during operation of a magnetic disk device and controlling the flying height regardless of the environmental temperature.
  • Method for solving the problem Forming a first magnetic layer on a substrate; Forming a first insulating layer having magnetic and electrical insulation on the first magnetic layer; Forming a coil layer capable of generating a magnetic field on the first insulating layer; Forming a second insulating layer having magnetic and electrical insulation so as to cover the coil layer; Planarizing the second insulating layer; Forming a low thermal expansion layer having a lower coefficient of thermal expansion than the second insulating layer on the second insulating layer; Forming a mask layer on the low thermal expansion layer; Patterning the mask layer by physical etching; Removing the portion of the low thermal expansion layer where the mask layer is not formed; And a step of providing a second magnetic layer magnetically connected to the first magnetic
  • the flying height can be controlled regardless of the environmental temperature.
  • FIG. 1 is a plan view showing a schematic configuration of a magnetic disk device including a magnetic head of the present invention.
  • 1 is a cross-sectional view in a direction perpendicular to a surface (floating surface) facing a storage medium, showing a schematic configuration of a magnetic head that is a first embodiment of a magnetic head of the present invention; It is a cross-sectional schematic diagram which shows another embodiment of the magnetic head of this invention. It is a cross-sectional schematic diagram which shows another embodiment of the magnetic head of this invention. It is a cross-sectional schematic diagram which shows another embodiment of the magnetic head of this invention. It is a cross-sectional schematic diagram which shows another embodiment of the magnetic head of this invention.
  • FIG. 5 is a schematic cross-sectional view for explaining the manufacturing process of the magnetic head according to the embodiment of FIG. 2.
  • FIG. 5 is a schematic cross-sectional view for explaining the manufacturing process of the magnetic head according to the embodiment of FIG. 2.
  • FIG. 5 is a schematic cross-sectional view for explaining the manufacturing process of the magnetic head according to the embodiment of FIG. 2.
  • FIG. 8 is a conceptual schematic diagram for explaining the cross-sectional shape of the magnetic head before and after ion milling.
  • FIG. 1 is a plan view showing a schematic configuration of a magnetic disk device (hard disk drive: HDD), which is an example of a magnetic storage device including a magnetic head according to the present embodiment.
  • HDD hard disk drive
  • the HDD 100 has a housing 101.
  • a storage medium (magnetic disk) 103 mounted on the spindle motor 102 and a head gimbal assembly 104 mounted with a magnetic head 108 facing the storage medium 103 are arranged.
  • the magnetic head 108 floats on the storage medium by an element portion (not shown) capable of applying a magnetic field for recording information on the storage medium 103 and an air flow generated by the rotation of the storage medium.
  • a slider (not shown) having a function.
  • the element portion and the slider are arranged to face the storage medium 103.
  • the head gimbal assembly 104 on which the magnetic head 108 is mounted is fixed to the tip of the carriage arm 106 that can swing around the shaft 105.
  • the storage medium 103 includes a magnetic film (not shown). By applying a magnetic field generated from the element portion to the storage medium 103, information can be magnetically recorded on the storage medium 103. If the magnetic head 108 further includes an element capable of reading the magnetic information recorded on the storage medium 103, the information on the storage medium 103 can be reproduced.
  • FIG. 2 shows a schematic configuration of the magnetic head according to the first embodiment of the magnetic head of the present invention, which is perpendicular to the surface facing the storage medium (floating surface 16) and perpendicular to the diameter direction of the recording medium. A sectional view of the surface is shown.
  • FIG. 1 An outline of a magnetic head 108 having a recording head portion 111 composed of a single magnetic pole type perpendicular magnetic head and a reproducing head portion 112 for reproducing information recorded at an arbitrary position of a recording layer on the storage medium 103.
  • a typical structure is shown.
  • the X-axis direction is the diameter direction of the recording medium
  • the Y-axis direction is the direction away from the recording medium
  • the Z-axis is the stacking direction of each layer stacked on the substrate (hereinafter referred to as “substrate”).
  • substrate the substrate
  • the X axis, the Y axis, and the Z axis are perpendicular to each other. Further, the distance in the X-axis direction is expressed as “width”, the distance in the Y-axis direction as “length”, and the distance in the Z-axis direction as “thickness”.
  • air bearing surface side the side closer to the air bearing surface (air bearing surface: ABS) in the Y-axis direction
  • the side away from the air bearing surface is referred to as the “height side”.
  • the magnetic head 108 is mounted as a magnetic recording device in a magnetic recording apparatus such as a hard disk drive.
  • the magnetic head 108 is, for example, a composite head capable of performing both recording and reproduction functions, and is formed on a substrate (not shown) made of a ceramic material such as AlTiC (Al 2 O 3 TiC).
  • an insulating layer (not shown) made of aluminum oxide (Al 2 O 3 ; hereinafter simply referred to as “alumina”) and a magnetoresistive effect (MR) on the recording medium
  • the magnetic head of the present invention may have a configuration in which, for example, an insulating layer, a recording head portion, and an overcoat layer are laminated in this order on a substrate.
  • the reproducing head portion 112 has, for example, a configuration in which the lower shield layer 3, the gap film 4, and the upper shield layer 6 are laminated in this order.
  • a magnetoresistive effect element (Magnetorescence effect element, hereinafter abbreviated as MR element) 5 is embedded so that one end face is exposed on the air bearing surface 16.
  • the lower shield layer 3 and the upper shield layer 6 mainly shield the MR element 5 from the surroundings.
  • the lower shield layer 3 and the upper shield layer 6 are made of, for example, a magnetic material such as a nickel iron alloy (NiFe (hereinafter simply referred to as “permalloy (trade name)”); Ni: 80 wt%, Fe: 20 wt%). Their thickness is about 1.0 ⁇ m to 2.0 ⁇ m.
  • the gap film 4 magnetically and electrically separates the MR element 5 from the lower shield layer 3 and the upper shield layer 6.
  • the gap film 4 is made of, for example, a nonmagnetic nonconductive material such as alumina and has a thickness of about 0.1 ⁇ m to 0.2 ⁇ m.
  • an element using a magnetosensitive film exhibiting a magnetoresistive effect such as a giant magnetoresistive effect (GMR; Giant Magneto-resistive) or a tunnel magnetoresistive effect (TMR; Tunneling Magneto-resistive) can be used.
  • GMR giant magnetoresistive effect
  • TMR tunnel magnetoresistive effect
  • an insulating layer 9 is formed on the upper shield layer 6 of the reproducing head portion 112.
  • the insulating layer 9 is made of a nonmagnetic nonconductive material such as alumina.
  • a heater 30 is embedded in the insulating layer 9. The heater 30 heats the reproducing head unit 112 and the recording head unit 111 to expand them and project them to the air bearing surface side.
  • a resistance heater can be used as the heater 30, for example.
  • the resistance heater is made of, for example, titanium tungsten (TiW), tungsten (W), or nickel copper (NiCu). By controlling the electric power supplied to the resistance heater, the resistance heater generates heat.
  • the protruding amount of the reproducing head portion 112 (especially the MR element 5) and the recording head portion 111 (especially the main magnetic pole layer 11 described later) can be controlled.
  • the flying height can be controlled to be suitable for reproduction and recording.
  • the recording head unit 111 includes, for example, the main magnetic pole layer 11, the trailing shield layer 14, the connection layers 10A and 10B, the coils 8a to 8d (hereinafter may be collectively referred to as the coil 8), and the resin layers 13a to 13e (hereinafter referred to as the “coil 8”).
  • the coil 8 the resin layers 13a to 13e
  • the main magnetic pole layer 11, the connection layer 10B, the return yoke layer 15, the connection layer 10A, and the trailing shield layer 14 are each made of a magnetic material and are magnetically connected.
  • the coil 8 and a portion made of a magnetic material are shielded magnetically and electrically by the insulating layers 12 and 17 and the resin layer 13.
  • the low thermal expansion layer 18 and the mask layer 19 are located between the insulating layer 17 and the return yoke layer 15.
  • the coil 8, the resist 13, and the connection layer 10A are polished on the surface far from the substrate, and are located on substantially the same plane.
  • the coil layers 8a to 8d mainly generate a magnetic flux for recording.
  • the coil layers 8a to 8d are made of, for example, a conductive material such as copper (Cu).
  • the thickness of the coil layer is, for example, about 1 to 3 ⁇ m.
  • a coil located on the height side of the connection layer 10B is not shown.
  • the main magnetic pole layer 11 mainly contains magnetic flux generated in the coil layers 8A and 8B and emits the magnetic flux toward a magnetic disk (not shown).
  • the main magnetic pole layer 11 is normally exposed on the air bearing surface 16 side.
  • the main magnetic pole layer 11 includes, for example, an iron cobalt alloy (FeCo), an iron-based alloy (Fe-M; M is a metal element of 4A, 5A, 6A, 3B, and 4B), or nitrides of these alloys.
  • the thickness is about 0.1 ⁇ m to 0.5 ⁇ m.
  • the main magnetic pole layer 11 corresponds to a specific example of “first magnetic layer” in the invention.
  • the trailing shield layer 14 mainly reduces the magnetic field gradient of the write magnetic field of the main magnetic pole layer when the magnetic flux emitted from the main magnetic pole layer 11 is circulated to the return yoke 9 via a hard disk (not shown). Responsible for steep functions.
  • the trailing shield layer 14 also has a function of magnetically shielding the main magnetic pole layer 11 from the surroundings.
  • the trailing shield layer 14 is normally exposed on the air bearing surface 16 side.
  • the trailing shield layer 14 is made of a magnetic material such as permalloy (Ni: 80 wt%, Fe: 20 wt%), and has a thickness of about 1.0 ⁇ m to 2.0 ⁇ m.
  • the trailing shield layer 14 corresponds to a specific example of a “third magnetic layer” in the present invention.
  • the return yoke layer 15 has a function of circulating the magnetic flux emitted from the main magnetic pole layer 11 through the hard disk (not shown) in the recording head unit 111.
  • the return yoke layer 15 is made of, for example, a magnetic material such as permalloy (Ni: 80 wt%, Fe: 20 wt%), and has a thickness of about 1.0 ⁇ m to 4.0 ⁇ m.
  • the return yoke layer 15 corresponds to a specific example of “second magnetic layer” in the invention.
  • the resin layers 13a to 13e are made of, for example, a photoresist (photosensitive resin) that exhibits fluidity when heated.
  • a photoresist photosensitive resin
  • ceramics such as alumina may be disposed instead of the resin layers 13a to 13e.
  • the resin layers 13a to 13e correspond to a specific example of the “second insulating layer” in the present invention.
  • the thickness of the resin layer 13 is, for example, about 1 to 3 ⁇ m.
  • the insulating layers 12 and 17 are made of a nonmagnetic nonconductive material such as alumina or silicon oxide (SiO 2 ), and have a thickness of about 0.1 ⁇ m to 1.0 ⁇ m.
  • the insulating layers 12 and 17 correspond to specific examples of “first insulating layer” and “second insulating layer” in the present invention, respectively.
  • connection layer 10A is for magnetically connecting the return yoke layer 15 and the trailing shield 14, and is usually located on the air bearing surface side of the coil layer 8.
  • the connection layer 10 ⁇ / b> B is for magnetically coupling the return yoke layer 15 and the main magnetic pole layer 11, and is usually located on the height side of the coil layer 8.
  • the connection layers 10A and 10B are made of a magnetic material such as permalloy (Ni: 80% by weight, Fe: 20% by weight).
  • the low thermal expansion layer 18 is larger than the magnetic material constituting the main magnetic pole layer 11 and the return yoke layer 15, the nonmagnetic nonconductive material such as the insulating layers 12 and 17, the resin layer 13, and the thermal expansion coefficient of the coil 8. It is composed of a material having a small coefficient of thermal expansion. For example, SiC (silicon carbide), Si 3 N 4 (silicon nitride), SiO 2 (silicon oxide), AlN (aluminum nitride), or W (tungsten) is used as such a material.
  • the mask layer 19 is a layer provided for processing the low thermal expansion layer 18 and the insulating layer 17 by etching or the like in order to process the connection layer 10A and the connection layer 10B so that they can be magnetically connected by the return yoke layer 15. It is.
  • the mask layer 19 is provided on the low thermal expansion layer 18.
  • the mask layer 19 is a material having an etching rate smaller than the etching rates of the low thermal expansion layer 18 and the insulating layer 17, that is, a material having a high selectivity ([low thermal expansion layer etching rate] / [mask layer etching rate]). It is preferable from the point which forms a low thermal expansion layer and an insulating layer accurately.
  • Cr is preferably used as the mask layer 19.
  • the thickness of the mask layer 19 is about 0.1 to 0.3 ⁇ m.
  • the mask layer 19 may be removed by any means after the low thermal expansion layer 18 and the insulating layer 17 are processed into a desired shape, but may be left as in the present embodiment.
  • An overcoat layer (not shown) is provided on the upper surface of the recording head unit 111 to protect the reproducing head unit 112 and the recording head unit 111.
  • the material constituting the overcoat layer is not particularly limited.
  • the overcoat layer can be made of alumina, for example.
  • a predetermined magnetic flux is generated by passing a current through the coil 8 near the main magnetic pole layer 11.
  • the magnetic flux generated by the coil 8 passes through the main magnetic pole layer 11 and flows from the air bearing surface 16 to the surface of the recording medium (not shown).
  • the magnetic field flowing into the recording layer flows out into the magnetic flux and flows into the trailing shield layer 14, the connection layer 10 ⁇ / b> A, and the return yoke layer 15.
  • the main magnetic pole layer 11, the recording medium (not shown), the trailing shield 14, the connection layer 10A, the return yoke 15, and the connection layer 10B form a magnetic circuit. Using this magnetic circuit, magnetization (information) in a direction perpendicular to the recording medium surface of the recording medium can be recorded on the recording layer.
  • Each of the above layers uses, for example, an existing thin film process including a film forming technique such as plating or sputtering, a patterning technique using a photolithography method or an etching method, and a polishing technique such as machining or polishing, It can manufacture by laminating
  • substrate (not shown) which consists of ceramic materials in order toward the upper layer from the lower layer of FIG. Details of the method of manufacturing the magnetic head will be described later.
  • the thermal expansion coefficient of each layer from the main magnetic pole layer 11 to the insulating layer 17 is smaller than that of the low thermal expansion layer 18.
  • the main magnetic pole layer 11 is in contact with and in close contact with the low thermal expansion layer 18 via the insulating layer 12, the coil 8, the resin layer 13, and the insulating layer 17.
  • the adhesion between the layers is obtained by lamination using the existing thin film process.
  • the low thermal expansion layer 18 having a relatively small thermal expansion coefficient is in close contact with the insulating layer 17, thereby suppressing protrusion of the insulating layer 17 toward the air bearing surface 16 in a scene where the environmental temperature rises.
  • the insulating layer 17 whose protrusion is suppressed is in close contact with the coil 8 and the resin layer 13, thereby suppressing the coil 8 and the resin layer 13 from protruding toward the air bearing surface 16 in a scene where the environmental temperature rises.
  • the coil 8 and the resin layer 13 whose protrusion is suppressed are in close contact with the insulating layer 12, thereby suppressing the insulating layer 12 from protruding toward the air bearing surface 16 in a scene where the environmental temperature rises.
  • the insulating layer 12 whose protrusion is suppressed is in close contact with the main magnetic pole layer 11, thereby suppressing the main magnetic pole layer 11 from protruding toward the air bearing surface 16 when the environmental temperature rises.
  • the low thermal expansion layer 18 functions to suppress displacement in the direction in which the air bearing surface 16 side from the main magnetic pole layer 11 to the insulating layer 17 protrudes.
  • the thickness of the low thermal expansion layer 18 is preferably a thickness capable of suppressing protrusion of each layer from the main magnetic pole layer 11 to the insulating layer 17.
  • the low thermal expansion layer 18 is made of SiC. In some cases, it is 1.0 to 5.0 ⁇ m.
  • the fact that the thickness of the low thermal expansion layer 18 is thicker than the total thickness of the insulating layer 17, the resin layer 13, the insulating layer 12, and the main magnetic pole layer 11 can effectively suppress the protrusion in a scene where the environmental temperature rises. To preferred.
  • the main magnetic pole layer 11 is difficult to protrude due to a small amount of heat from other than the heater 30. Therefore, in the magnetic disk apparatus equipped with the magnetic head of the present embodiment, even if the interval (so-called flying height) between the recording surface of the magnetic disk and the air bearing surface side of the main magnetic pole layer 11 is set narrow from the viewpoint of improving the recording density. In the scene where the environmental temperature rises, it is possible to prevent the air bearing surface side of the recording head unit 111 from colliding with the recording medium.
  • the heater 30 heats the main magnetic pole layer 11 to a temperature higher than the environmental temperature, so that the main amount necessary for controlling the flying height is increased.
  • the protrusion amount of the pole layer 11 is obtained.
  • the amount of protrusion (that is, control of the flying height) can be controlled with high accuracy without complicatedly controlling the energization amount of the heater 30 in consideration of heat from other than the heater 30. Therefore, such a magnetic disk device can perform stable writing on the recording medium.
  • the return yoke 15, the insulating layers 12 and 17, the coil 8, the resin layer 13 and the like are largely displaced by thermal expansion due to the increase in environmental temperature. Due to this thermal expansion, even if the heater 30 is not heated, the main magnetic pole layer 11 also protrudes from the air bearing surface side. The amount of protrusion caused by the change in environmental temperature is added to the amount of protrusion due to heating of the heater 30. For this reason, the accuracy of control of the protrusion amount decreases, and the probability of collision between the magnetic head and the recording medium increases.
  • FIGS. 3 to 5 are cross-sectional schematic views showing other embodiments of the magnetic head of the present invention.
  • the trailing shield layer 14 and the connection layers 10A and 10B are provided.
  • the trailing shield 14 and the connection layer 10A may not be provided.
  • the trailing shield 14 and the connection layers 10A and 10B may not be provided as shown in FIG.
  • the reproducing head unit 112 may not be provided.
  • Each of the magnetic heads shown in FIGS. 3 to 5 has a flat plane on which the upper surface of the coil 8 is located, and an insulating layer 17, a low thermal expansion layer 18, and a mask layer 19 are provided on the plane.
  • -Magnetic head manufacturing method- 6 to 8 are cross-sectional views for explaining the manufacturing process of the magnetic head according to the embodiment of FIG. Here, a cross-sectional view in a direction perpendicular to the substrate is shown in the laminate obtained in the course of manufacture.
  • an insulating layer 9 is formed on a substrate 7.
  • the method for forming the insulating layer 9 include a method of forming a film of alumina or silicon oxide by sputtering. Note that a reproducing head portion (not shown) may be provided on the substrate 7, but the description thereof is omitted in this specification.
  • the main magnetic pole layer 11 is formed on the insulating layer 9.
  • the method of forming the main magnetic pole layer 11 include a method of forming a magnetic material made of a CoFe magnetic material having a high saturation magnetic flux density by sputtering. Further, in order to form the main magnetic pole layer 11 having a predetermined core width (length on the air bearing surface 16 in a direction perpendicular to the paper surface (X-axis direction)), further etching may be performed. As this etching, it is possible to use a focused ion beam etching (Focused. Ion Beam: FIB) or an ion beam etching technique called ion milling.
  • FIB focused ion beam etching
  • ion milling ion milling
  • an insulating layer 12 is formed by sputtering alumina or silicon oxide at the positions where the coils 8a to 8d and the trailing shield 14 are to be formed.
  • the thickness of the insulating layer 12 the portion where the trailing shield 14 is desired to be formed is usually thinner than the other portions.
  • the coils 8a to 8d, the trailing shield layer 14, and the connection layer 10A ' are formed on the insulating layer 12. Further, the connecting portion 10B 'is formed at a position where the insulating layer 12 of the main magnetic pole 11 is not formed (usually, a position away from the air bearing surface).
  • the coils 8a to 8d are wound around the connection layer 10B 'so as to pass between the main magnetic pole layer 11 and the return yoke layer 15. A coil located on the height side of the connection layer 10B 'is not shown.
  • a resin layer 13z is formed between the windings of the coils 8a to 8d formed on the insulating layer 12.
  • the resin layer 13z can be formed by applying a photoresist having fluidity at the time of formation.
  • the upper surface of the resin layer 13z is normally convex.
  • the resin layer 13z is non-conductive and non-magnetic.
  • the upper part of the resin layer 13z and the connection portions 10A ′ and 10B ′ is used by using a chemical mechanical polishing method (also referred to as a CMP method (Chemical and Mechanical Polishing Method)). Polish and process so that the upper surface is flat.
  • the upper surfaces of the coils 8a to 8d, the resin layers 13a to 13e, and the connecting portion 10A, whose upper surfaces are exposed by this polishing, are located on substantially the same plane.
  • the surface of each layer becomes flat when the insulating layer 17a, the low thermal expansion layer 18a, and the mask layer 19a are formed in a later step.
  • the coil is exposed on the upper surface, but the coil may not be exposed on the upper surface as long as the upper surface is flat.
  • the insulating layer 17 may not be provided in a later process.
  • an insulating layer 17a, a low thermal expansion layer 18a, and a mask layer 19a are formed on the flattened coils 8a to 8d, the resin layers 13a to 13e, and the upper surfaces of the connection portions 10A and 10B. Form in order. Each of these is processed in a subsequent process, whereby the insulating layer 17, the low thermal expansion layer 18, and the mask layer 19 in the description of the embodiment of the magnetic head of the present invention are obtained.
  • the insulating layer 17a can be made of alumina, for example.
  • the low thermal expansion layer 18a can be made of, for example, SiC (silicon carbide), Si 3 N 4 (silicon nitride), SiO 2 (silicon oxide), AlN (aluminum nitride), and W (tungsten).
  • the mask layer 19a can be made of, for example, Cr (chrome).
  • the low thermal expansion layer 18a can be formed by, for example, a sputtering method. Since the upper surface of FIG. 7B is flat, the upper surfaces of these layers are flat.
  • the magnetic head manufacturing method of the present invention includes a step of forming a second insulating layer having magnetic and electrical insulation so as to cover the coil layer and to have a flat upper surface.
  • a recess is formed in the insulating layer 12
  • a coil is embedded in the recess using a sputtering method or a plating method
  • an alumina layer is then formed as a second insulating layer by a sputtering method
  • the upper surface of the alumina layer is further subjected to CMP. You may grind by.
  • the mask layer 19a is patterned by physical etching.
  • physical etching it is possible to use an ion beam etching called ion milling or a focused ion beam (Focused. Ion Beam: FIB) technique.
  • ion milling or a focused ion beam (Focused. Ion Beam: FIB) technique.
  • FIB focused ion beam
  • a resist layer 21 is formed as shown in FIG.
  • the resist layer 21 has a fluidity when formed like a photoresist, and is applied with a material that can be cured by irradiation with light, electron beam, or the like, and then light is irradiated to a desired position and further developed. Is obtained.
  • the resist layer 21 is formed to shield a part of the mask layer 19a from ions during ion milling.
  • the portion of the mask layer 19a where the resist 21 is not formed is removed by physical etching to obtain the mask layer 19 as shown in FIG.
  • FIG. 9 is a conceptual schematic diagram for explaining the cross-sectional shape of the magnetic head before and after ion milling.
  • FIG. 9A is a schematic cross-sectional view showing the insulating layer 17a, the low thermal expansion layer 18a, the mask layer 19a, and the resist layer 21 before ion milling.
  • the direction in which the constituent material of the mask radiates is the most at 180 ° with respect to the incident direction of ions, and is smaller as it approaches the 90 ° direction (according to the so-called cosine law).
  • the flat low thermal expansion layer 18a and the mask layer 19a are formed.
  • FIG. 9A is a schematic cross-sectional view showing the insulating layer 17a, the low thermal expansion layer 18a, the mask layer 19 and the resist layer 21 after ion milling.
  • FIG. 9C is a schematic cross-sectional view showing the insulating layer 17a, the low thermal expansion layer 18a, and the mask layer 19 after the resist layer 21 is further removed.
  • the region where the constituent material of the mask layer 19a scattered by ion milling can be reattached is on the side surface of the mask layer 19 (19b in FIG. 9B) or the side surface of the resist layer 21 (region 21a in FIG. 9B). Limited.
  • the mask layer 19 is as thin as 0.1 to 0.3 ⁇ m, and is positioned in a direction of approximately 90 ° with respect to the incident direction of ions to the mask layer 19a. Few. Further, the residue 23 generated by reattaching to the side surface 21a of the resist layer is peeled off together with the resist layer 21 as shown in FIG. 9C when the resist layer 21 is peeled off in the next step.
  • the mask layer 19 having a desired shape is obtained. Therefore, the low thermal expansion layer 18a and the insulating layer 17a can be precisely patterned in a patterning process described later. In this step, a part of the low thermal expansion layer 18a may be removed.
  • the stripping means is not particularly limited.
  • a wet process using a solvent capable of dissolving the resist layer 21 may be used, or a dry process in which ashing (ashing) is performed with oxygen plasma is used. It may be used.
  • ashing ashing
  • oxygen plasma oxygen plasma
  • the patterned resist layer 21 is provided on the mask layer 19a and the mask layer 19 is formed by ion milling.
  • the mask 19 may be formed using FIB.
  • FIB When physical etching using FIB is used, ions can be irradiated only at a desired position without providing a resist layer. Even in this case, since the region where the constituent material of the scattered mask layer 19a can be reattached is limited to the side surface of the mask layer 19, the mask layer 19 having a desired shape is obtained as in the case of physical etching by ion milling. It is done.
  • the low thermal expansion layer 18a and the insulating layer 17a are patterned. That is, the portions of the low thermal expansion layer 18a and the insulating layer 17a that are not covered with the mask layer 19 are removed to form the low thermal expansion layer 18 and the insulating layer 17 as shown in FIG.
  • the removing means is not particularly limited, but can be removed by RIE (Reactive Ion Etching), ion milling, or the like. By this removal, the connecting portions 10A and 10B are exposed on the upper surface of the obtained laminate.
  • a return yoke layer 15 capable of magnetically connecting the connection portions 10A and 10B exposed in the previous step is provided so as to cover the low thermal expansion layer 18.
  • the return yoke layer 15 can be formed by a sputtering method or the like.
  • an overcoat layer (not shown) is provided on the entire upper surface using a sputtering method, and the air bearing surface side is appropriately polished using a CMP method, whereby the magnetic head of this embodiment shown in FIG. obtain.
  • the magnetic head obtained by such a magnetic head manufacturing method can accurately control the amount of protrusion when the head is incorporated in a magnetic disk device.
  • a low thermal expansion layer and a mask layer are sequentially provided on the polished flat surface, and the mask layer is further patterned by physical etching. Since the material constituting the mask layer hardly adheres to the mask layer during the physical etching, the shape accuracy of the obtained mask layer is high. The accuracy of the pattern of the low thermal expansion layer processed using this mask layer is increased. For this reason, the accuracy of the shape of the low thermal expansion layer is improved, and the manufacturing yield of the magnetic head can be improved. Furthermore, when a magnetic disk device incorporating the obtained magnetic head is used, since contamination caused by peeling of the low thermal expansion layer is unlikely to occur, the recording or reproducing performance of the magnetic disk device can be maintained for a long time.
  • the present invention is not limited to the above embodiment.
  • the above-described embodiment is an exemplification, and the present invention has any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and that exhibits the same effects. Are included in the technical scope.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Magnetic Heads (AREA)

Abstract

L'invention vise à proposer un procédé de fabrication de tête magnétique pour supprimer la protubérance excessive d'un élément en cas d'augmentation de la température ambiante dans le fonctionnement d'un dispositif de disque magnétique et commander la quantité de lévitation indépendamment de la température ambiante. A cet effet, une tête magnétique comprend un substrat, une première couche magnétique disposée sur le substrat, une première couche isolante qui est fournie sur la première couche magnétique et qui a une propriété isolante magnétique et électrique, une couche de bobine qui est disposée sur la première couche isolante et qui peut générer un champ magnétique, une seconde couche isolante qui est disposée de telle sorte que la couche de bobine est recouverte et qui a la propriété isolante magnétique et électrique, une couche à faible dilatation thermique qui est disposée sur la seconde couche isolante et dont le coefficient de dilatation thermique est inférieur à celui de la seconde couche isolante, et une seconde couche magnétique qui recouvre la couche à faible dilatation thermique de telle sorte que la couche est magnétiquement couplée à la première couche magnétique.
PCT/JP2008/055273 2008-03-21 2008-03-21 Tête magnétique, dispositif de stockage magnétique, et procédé de fabrication de tête magnétique Ceased WO2009116167A1 (fr)

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PCT/JP2008/055273 WO2009116167A1 (fr) 2008-03-21 2008-03-21 Tête magnétique, dispositif de stockage magnétique, et procédé de fabrication de tête magnétique

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PCT/JP2008/055273 WO2009116167A1 (fr) 2008-03-21 2008-03-21 Tête magnétique, dispositif de stockage magnétique, et procédé de fabrication de tête magnétique

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000353304A (ja) * 1999-06-09 2000-12-19 Sony Corp 磁気ヘッドの製造方法
JP2002123907A (ja) * 2000-10-13 2002-04-26 Tdk Corp 薄膜磁気ヘッドの製造方法
JP2003098690A (ja) * 2001-09-25 2003-04-04 Tdk Corp パターン化薄膜形成方法およびマイクロデバイスの製造方法
JP2003303405A (ja) * 2002-04-05 2003-10-24 Alps Electric Co Ltd 薄膜磁気ヘッド及びその製造方法
JP2004303320A (ja) * 2003-03-31 2004-10-28 Hitachi Ltd 磁気ディスク装置及び磁気ヘッドスライダ
JP2006018987A (ja) * 2004-06-04 2006-01-19 Tdk Corp オーバーコート積層体内に発熱体を備えた薄膜磁気ヘッド、該薄膜磁気ヘッドを備えたヘッドジンバルアセンブリ及び該ヘッドジンバルアセンブリを備えた磁気ディスク装置
JP2007080356A (ja) * 2005-09-13 2007-03-29 Hitachi Global Storage Technologies Netherlands Bv 磁気ヘッド及びその製造方法
JP2007184020A (ja) * 2006-01-04 2007-07-19 Hitachi Global Storage Technologies Netherlands Bv 垂直記録用磁気ヘッドの製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000353304A (ja) * 1999-06-09 2000-12-19 Sony Corp 磁気ヘッドの製造方法
JP2002123907A (ja) * 2000-10-13 2002-04-26 Tdk Corp 薄膜磁気ヘッドの製造方法
JP2003098690A (ja) * 2001-09-25 2003-04-04 Tdk Corp パターン化薄膜形成方法およびマイクロデバイスの製造方法
JP2003303405A (ja) * 2002-04-05 2003-10-24 Alps Electric Co Ltd 薄膜磁気ヘッド及びその製造方法
JP2004303320A (ja) * 2003-03-31 2004-10-28 Hitachi Ltd 磁気ディスク装置及び磁気ヘッドスライダ
JP2006018987A (ja) * 2004-06-04 2006-01-19 Tdk Corp オーバーコート積層体内に発熱体を備えた薄膜磁気ヘッド、該薄膜磁気ヘッドを備えたヘッドジンバルアセンブリ及び該ヘッドジンバルアセンブリを備えた磁気ディスク装置
JP2007080356A (ja) * 2005-09-13 2007-03-29 Hitachi Global Storage Technologies Netherlands Bv 磁気ヘッド及びその製造方法
JP2007184020A (ja) * 2006-01-04 2007-07-19 Hitachi Global Storage Technologies Netherlands Bv 垂直記録用磁気ヘッドの製造方法

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