[go: up one dir, main page]

WO2009110387A1 - Stratifié pour carte souple et film polyimide thermoconducteur - Google Patents

Stratifié pour carte souple et film polyimide thermoconducteur Download PDF

Info

Publication number
WO2009110387A1
WO2009110387A1 PCT/JP2009/053724 JP2009053724W WO2009110387A1 WO 2009110387 A1 WO2009110387 A1 WO 2009110387A1 JP 2009053724 W JP2009053724 W JP 2009053724W WO 2009110387 A1 WO2009110387 A1 WO 2009110387A1
Authority
WO
WIPO (PCT)
Prior art keywords
polyimide resin
resin layer
polyimide
layer
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2009/053724
Other languages
English (en)
Japanese (ja)
Inventor
秀和 三瓶
栄次郎 青▲柳▼
王　宏遠
正彦 竹内
浩信 川里
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Nippon Steel Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co Ltd filed Critical Nippon Steel Chemical Co Ltd
Priority to JP2010501876A priority Critical patent/JP5235211B2/ja
Priority to KR1020107020640A priority patent/KR101370559B1/ko
Priority to CN2009801078941A priority patent/CN101960929B/zh
Publication of WO2009110387A1 publication Critical patent/WO2009110387A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/102—Oxide or hydroxide
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/12—Mixture of at least two particles made of different materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/582—Tearability
    • B32B2307/5825—Tear resistant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Definitions

  • the present invention relates to a laminate for a flexible substrate and a thermally conductive polyimide film which have an insulating layer having excellent heat conduction characteristics and are suitably used for a flexible circuit board.
  • Patent Document 2 describes a polyimide film composite material in which a thermally conductive filler is dispersed in a polyimide derived from siloxane diamine with respect to a thermally conductive polyimide film containing a thermally conductive filler.
  • the present invention has an insulating layer with excellent heat conduction characteristics, has a practical adhesive strength between the conductor layer and the insulating layer, and also has good heat resistance, flex resistance, and dimensional stability required as a flexible wiring board
  • An object of the present invention is to provide a laminate for a flexible substrate and a thermally conductive polyimide film.
  • the present inventors have at least a polyimide resin layer or a polyimide resin layer constituting a thermally conductive polyimide film of a laminate for a flexible substrate having a plurality of polyimide resin layers. It has been found that the above problem can be solved by forming one layer of a specific high thermal conductivity polyimide resin layer and further providing another resin layer, and the present invention has been completed.
  • the present invention provides a flexible laminate having a metal layer on one or both sides of a polyimide resin layer (A1), and the polyimide resin layer (A1) has two or more different resin layers, A polyimide resin layer (i) in which at least one of the resin layers contains a thermally conductive filler in a range of 30 to 75 wt% in a polyimide resin containing 10 to 95 mol% of a structural unit represented by the following general formula (1) And at least one layer is a polyimide resin layer (ii) having a glass transition temperature lower than that of the polyimide resin layer (i), and at least one layer of the polyimide resin layer (ii) is a metal layer and a polyimide resin layer (i).
  • the present invention relates to a laminate for a flexible substrate, wherein the thickness of the polyimide resin layer (i) is 50% or more of the total thickness of the polyimide resin layer (A1).
  • Ar 1 is a tetravalent organic group having one or more aromatic rings, and R is a lower alkyl group having 1 to 6 carbon atoms, a lower alkoxy group, a phenyl group, a phenoxy group, or a halogen.
  • the present invention provides a film composed of a flexible polyimide resin layer (A2), wherein the polyimide resin layer (A2) has two or more different resin layers, A polyimide resin layer (i) in which at least one layer contains a thermally conductive filler in a range of 30 to 75 wt% in a polyimide resin containing 10 to 95 mol% of the structural unit represented by the general formula (1), At least one layer is a polyimide resin layer (ii) having a glass transition temperature lower than that of the polyimide resin layer (i), and the thickness of the polyimide resin layer (i) is 50% or more of the total thickness of the polyimide resin layer (A2).
  • the present invention relates to a thermally conductive polyimide film.
  • the laminate for a flexible substrate, or the heat conductive polyimide film wherein the thickness of the polyimide resin layer (i) is 70 to 95% of the thickness of the polyimide resin layer (whole).
  • the linear expansion coefficient of the polyimide resin layer (A1) is 30 ppm / K or less, the thermal conductivity is 0.3 W / mK or more in the thickness direction ⁇ z of the polyimide resin layer, and 0.7 W / mK or more in the planar direction ⁇ xy, Said laminated body for flexible substrates whose peel strength of a polyimide resin layer and a metal layer is 0.8 kN / m or more.
  • the thermal conductivity of the polyimide resin layer (A2) is 30 ppm / K or less, the thermal conductivity is 0.3 W / mK or more in the thickness direction ⁇ z, and 0.7 W / mK or more in the planar direction ⁇ xy.
  • Polyimide film is 4) The laminate for a flexible substrate or the thermal conductive polyimide film, wherein the tear propagation resistance of the polyimide resin layer (A1) or (A2) is 1.5 to 8 kN / m. 5) Said laminated body for flexible substrates or said heat conductive polyimide film whose glass transition temperature of a polyimide resin layer (i) is 310 degreeC or more.
  • thermally conductive filler is at least one filler selected from silica, alumina, aluminum nitride, boron nitride, silicon nitride and magnesia, and the average particle diameter is in the range of 0.01 to 25 ⁇ m.
  • Laminated body or the above-mentioned heat conductive polyimide film is at least one filler selected from silica, alumina, aluminum nitride, boron nitride, silicon nitride and magnesia, and the average particle diameter is in the range of 0.01 to 25 ⁇ m.
  • the laminate for a flexible substrate of the present invention has a metal layer on one side or both sides of a polyimide resin layer, and the polyimide resin layer is composed of a plurality of layers. Moreover, although the heat conductive polyimide film of this invention does not have a metal layer for wiring formation, the polyimide resin layer is similarly comprised by multiple layers. And much description of the polyimide resin layer (A1) which comprises the laminated body for flexible substrates, and the polyimide resin layer (A2) which comprises a heat conductive polyimide film is common. Hereinafter, common portions will be described together. The description of the polyimide resin layer common to the polyimide resin layers (A1) and (A2) is understood as the description of both polyimide resin layers. In this case, the polyimide resin layer (A) is understood to represent both the polyimide resin layers (A1) and (A2).
  • At least one layer is the polyimide resin layer (i), and at least one layer is the polyimide resin layer (ii).
  • the polyimide resin layer (A) or the entire polyimide resin layer is referred to as the polyimide resin layer (A) or the entire polyimide resin layer. It is called a resin layer.
  • Examples of the metal layer serving as the conductor layer in the laminate for a flexible substrate include conductive metal foils such as copper, aluminum, iron, silver, palladium, nickel, chromium, molybdenum, tungsten, zinc, and alloys thereof. Among these, a copper foil or an alloy copper foil containing 90% or more of copper is preferably used.
  • the preferred thickness range of the conductor layer is 5 to 50 ⁇ m, and more preferably 8 to 35 ⁇ m.
  • the polyimide resin layer (A) has two or more different resin layers, and at least one of the resin layers is heated to a polyimide resin containing 10 to 95 mol% of the structural unit represented by the general formula (1).
  • the content ratio of the heat conductive filler in the polyimide resin layer (i) needs to be in the range of 30 to 75 wt%, and preferably in the range of 40 to 70 wt%. If the content ratio of the heat conductive filler is less than 30 wt%, the heat dissipation characteristics when the electronic component such as a flexible circuit board is used are not sufficient, and if it exceeds 75 wt%, the flexibility of the laminate of the present invention is characteristic. The decrease is remarkable, and the strength of the polyimide resin layer is also decreased.
  • thermally conductive filler a highly thermally conductive filler is preferable, and specific examples include aluminum, copper, nickel, silica, diamond, alumina, magnesia, beryllia, boron nitride, aluminum nitride, silicon nitride, and silicon carbide. . Among these, at least one filler selected from silica, alumina, aluminum nitride, boron nitride, silicon nitride, and magnesia is preferable. Since the polyimide resin layer acts as an insulating layer, the filler blended in the polyimide resin layer (i) is suitable from that viewpoint.
  • the filler shape is not particularly limited, and may be a plate shape, a needle shape, or a rod shape. It is also preferable to use a spherical filler and a plate-like filler in combination when the content of the heat conductive filler is increased and the balance with characteristics such as heat conductivity is taken into consideration.
  • the particle size of the thermally conductive filler is preferably in the range of 0.01 to 25 ⁇ m and preferably in the range of 1 to 8 ⁇ m from the viewpoint of uniformly dispersing the filler in the thickness direction of the polyimide resin layer. Is more preferable. If the average particle diameter of the heat conductive filler is less than 0.01 ⁇ m, the heat conduction inside each filler is reduced, and as a result, the heat conductivity of the polyimide resin layer is not improved and the particles are aggregated. It tends to occur and it may be difficult to disperse uniformly. On the other hand, if it exceeds 25 ⁇ m, the possible filling rate of the polyimide resin layer is lowered, and the polyimide resin layer tends to become brittle due to the filler interface.
  • the particle size is expressed by an average long diameter D L.
  • a preferable range of the average major axis D L is in the range of 0.1 to 15 ⁇ m, particularly preferably in the range of 0.5 to 10 ⁇ m.
  • the plate filler boron nitride is preferably used. If the average major axis D L is less than 0.1 ⁇ m, the thermal conductivity is lowered and the plate-like effect is reduced. On the other hand, if it exceeds 15 ⁇ m, it is difficult to orient at the time of film formation.
  • the average major axis D L means the average value of the longitudinal diameters of the plate-like fillers.
  • the average diameter means the median diameter, and the mode diameter is preferably one peak within the above range, and this is the same for the spherical filler.
  • the particle size of the heat conductive filler is also related to the thickness of the polyimide resin layer (i).
  • the average particle diameter or average major axis of the thermally conductive filler is 70% or less, preferably 50% or less of the thickness of the polyimide resin layer (i).
  • the polyimide resin constituting the polyimide resin layer (i) contains 10 to 95 mol%, preferably 50 to 95 mol% of the structural unit represented by the general formula (1).
  • Ar 1 is a tetravalent organic group having one or more aromatic rings, and R is a lower alkyl group having 1 to 6 carbon atoms, a lower alkoxy group, a phenyl group, a phenoxy group, or a halogen. . Since Ar 1 can be regarded as a residue of an aromatic tetracarboxylic acid that is a polyimide raw material, Ar 1 is understood by showing a specific example of an aromatic tetracarboxylic acid. R can be regarded as a part of the residue of aromatic diamine which is a polyimide raw material.
  • aromatic tetracarboxylic acids include pyromellitic dianhydride (PMDA), 3,3 ', 4,4'-benzophenone tetracarboxylic dianhydride, 2,2', 3,3'-benzophenone Tetracarboxylic dianhydride, 2,3,3 ', 4'-benzophenonetetracarboxylic dianhydride, naphthalene-2,3,6,7-tetracarboxylic dianhydride (NTCDA), naphthalene-1,2 , 5,6-tetracarboxylic dianhydride, naphthalene-1,2,4,5-tetracarboxylic dianhydride, naphthalene-1,4,5,8-tetracarboxylic dianhydride, naphthalene-1, 2,6,7-tetracarboxylic dianhydride, 4,8-dimethyl-1,2,3,5,6,7-hexahydronaphthalene-1,2,5,6
  • the aromatic tetracarboxylic acid residue which is a polyimide raw material and the aromatic diamine residue will be described separately.
  • the residue include the same aromatic tetracarboxylic acid residues as those described above for Ar 1 .
  • aromatic diamine residue examples include the following aromatic diamine residues.
  • aromatic diamine residues 4,6-dimethyl-m-phenylenediamine, 2,5-dimethyl-p-phenylenediamine, 2,4-diaminomesitylene, 4,4'-methylenedi-o-toluidine, 4,4'-methylenedi-2 , 6-Xylidine, 4,4'-methylene-2,6-diethylaniline, 2,4-toluenediamine, m-phenylenediamine, p-phenylenediamine, 4,4'-diaminodiphenylpropane, 3,3'- Diaminodiphenylpropane, 4,4'-diaminodiphenylethane, 3,3'-diaminodiphenylethane, 4,4'-diaminodiphenylmethane, 3,3'-diaminodiphenylmethane, 2,2-bis [4- (4-amino Phen
  • each of the diamine and acid anhydride may be used alone or in combination of two or more. At least one of these uses 2 or more types. Preference is given to using diamines which give structural units of the general formula (1) such as 2,2′-dimethyl-4,4′-diaminobiphenyl as diamines and in addition to those represented by the general formula (1). It is better to use other diamines that give structural units that are not.
  • the polyimide resin layer (i) contains a thermally conductive filler, it is necessary to maintain its mechanical strength while maintaining the excellent heat resistance and dimensional stability of the polyimide resin.
  • the other diamine an aromatic diamine having a structure having less rigidity than the diamine that gives the structural unit represented by the general formula (1) is suitable.
  • the diamine component contains 2,2'-dimethyl-4,4'-diaminobiphenyl as the main component, which includes 1,3-bis (3-aminophenoxy) benzene and 1,3-bis (4-amino).
  • the proportion of other diamine used is preferably in the range of 5 to 50 mol%.
  • the polyimide resin layer (ii) needs to have a glass transition temperature (Tg) lower than that of the polyimide resin layer (i), but is preferably a thermoplastic polyimide resin layer having a Tg of 200 ° C. or higher. More preferably, it is a thermoplastic resin having a Tg in the range of 200 to 350 ° C., and is a polyimide resin layer (i), that is, a layer having a Tg lower by 20 ° C. or more than the polyimide resin constituting the polyimide resin layer (i). It is good.
  • Tg glass transition temperature
  • the polyimide resin layer (i) is a base layer having a thickness of 50% or more of the polyimide layer
  • the Tg is also preferably high, preferably 310 ° C. or more, and in the range of 350 to 450 ° C. Is more preferable.
  • a known polyimide resin can be used as long as the above physical properties are satisfied, and it can be obtained from the acid dianhydride component and the diamine component described above.
  • Acid dianhydride components used to produce the polyimide resin layer (ii) include pyromellitic dianhydride (PMDA), 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride (BPDA) ), 3,3 ', 4,4'-benzophenone tetracarboxylic dianhydride (BTDA), 3,3', 4,4'-diphenylsulfone tetracarboxylic dianhydride (DSDA), 4,4'- Aromatic dianhydrides such as oxydiphthalic dianhydride (ODPA) are exemplified.
  • PMDA pyromellitic dianhydride
  • BPDA 4,4'-biphenyltetracarboxylic dianhydride
  • BTDA 3,3 ', 4,4'-benzophenone tetracarboxylic dianhydride
  • DSDA 4,4'-diphenylsulfone tetracarboxylic
  • diamine component examples include 2,2-bis (4-aminophenoxyphenyl) propane (BAPP), bis [4- (4-aminophenoxy) phenyl] sulfone (BAPS), 3,4′-diaminodiphenyl ether (3 , 4'-DAPE), 4,4'-diaminodiphenyl ether (4,4'-DAPE), 1,4-bis (4-aminophenoxy) benzene (TPE-Q), 4,4'-bis (4- Aminophenoxy) biphenyl (BAPB), 1,3-bis (3-aminophenoxy) benzene (APB), 1, 3-bis (4-aminophenoxy) benzene (TPE-R), 1,3-bis (4- Aromatic diamines such as aminophenoxy) -2,2-dimethylpropane (DANPG) are preferred.
  • BAPP 2,2-bis (4-aminophenoxyphenyl) propane
  • BAPS bis [4- (4-aminophenoxy) pheny
  • the polyimide resin layer (ii) preferably does not contain a filler, but may contain a thermally conductive filler in a certain proportion as necessary. Since the polyimide resin layer (ii) is provided mainly to increase the adhesive force with the metal layer, the thickness is preferably thin, and is preferably 3 ⁇ m or less.
  • the polyimide resin layer (ii) contains a heat conductive filler
  • it is preferably smaller than the content of the heat conductive filler in the polyimide resin layer (i).
  • the content is preferably in the range of 1 to 50 wt%, more preferably in the range of 10 to 40 wt%.
  • the size rate of a heat conductive filler exceeds 50 wt%, adhesiveness will be inferior and the intensity
  • the thermally conductive filler is contained, the size is preferably small, and the preferable average particle diameter is 3 ⁇ m or less, and more preferably in the range of 0.01 to 1.0 ⁇ m.
  • the average particle size of the thermally conductive filler exceeds 3 ⁇ m, the filler cannot be uniformly dispersed and the surface becomes rough, which may reduce the adhesion to the metal layer, but less than 0.01 ⁇ m. In this case, the particles tend to aggregate and it is difficult to uniformly disperse the particles.
  • the thickness of the polyimide resin layer (i) with respect to the total thickness of the polyimide resin layer (A) needs to be 50% or more, preferably in the range of 70 to 95%.
  • the total thickness of the polyimide resin layer (A) is preferably in the range of 10 to 50 ⁇ m, more preferably in the range of 15 to 40 ⁇ m. If the thickness of the polyimide resin layer is less than 10 ⁇ m, it is brittle and easily broken, while if it exceeds 50 ⁇ m, the bending resistance tends to decrease.
  • the polyimide resin layer (A) of the laminate for a flexible substrate or the heat conductive polyimide film of the present invention has a linear expansion coefficient of 30 ppm / K or less, preferably 1 to 25 ppm / K, and has a thermal conductivity of the polyimide resin layer.
  • a linear expansion coefficient of 30 ppm / K or less preferably 1 to 25 ppm / K
  • 0.3 W / mK or more preferably 0.5 to 0.8 W / mK or more
  • in the plane direction ⁇ xy 0.7 W / mK or more, preferably 1.0 to 2.0 W / mK.
  • the above is preferable.
  • the peel strength between the polyimide resin layer (A1) and the metal layer is preferably 0.8 kN / m or more, more preferably 1.0 to 1.8 kN / m.
  • the thickness range of the polyimide resin layer (i) and the polyimide resin layer (ii) and the type and content of the heat conductive filler are set within an appropriate range. It is also possible by selecting the polyimide raw material to be used.
  • the linear expansion coefficient of the polyimide resin layer (A) exceeds 30 ppm / K, various problems such as curling and the shrinkage of the polyimide resin layer (A) being too large to be processed well can occur. If the thermal conductivity is less than 0.5 W / mK, the heat dissipation characteristics are degraded.
  • the laminate for flexible substrate of the present invention or the polyimide resin layer (A) of the heat conductive polyimide film of the present invention preferably has a tear propagation resistance of 1.5 to 8 kN / m. If the tear propagation resistance is less than 1.5 kN / m, the flexible circuit board may be torn during processing or breakage. If the tear propagation resistance of the polyimide resin layer (A) exceeds 8 kN / m, the thermal expansion coefficient of the polyimide resin layer (A) increases and the dimensional stability tends to deteriorate.
  • the thickness of the polyimide resin layer (i) is set to 50% or more of the total thickness and represented by the general formula (1). It is preferable to contain 50 mol% or more of structural units. Furthermore, it is preferable that the glass transition temperature of the polyimide resin layer (i) is 310 ° C. or higher, but in this case as well, the thickness of the polyimide resin layer (i) is 50% or more and is represented by the general formula (1). It becomes controllable by containing 50 mol% or more of structural units.
  • At least one layer of the polyimide resin layer (A1) is formed by a polyimide resin layer (i) containing a thermally conductive filler in a polyimide resin, and further a metal layer and a polyimide resin layer (i ) Is provided with a polyimide resin layer (ii) having a good metal layer and adhesive layer.
  • the polyimide resin layer (i) and the polyimide resin layer (ii) may each be provided in the polyimide resin layer (A), or one or both may be provided in two or more layers.
  • the polyimide resin layer (i) is one layer
  • the polyimide resin layer (ii) is one or two layers
  • the layer in contact with the metal layer is polyimide resin.
  • Layer (ii) is preferred. When providing a metal layer on both surfaces, it is good to make two layers which touch a metal layer into a polyimide resin layer (ii).
  • the polyimide resin layer (A2) has a layer structure similar to that of the polyimide resin layer (A1), and is suitable for use by being laminated on the metal layer. Film.
  • the polyimide resin layer (A) can be provided with other polyimide resin layers in addition to the polyimide resin layer (i) and the polyimide resin layer (ii).
  • providing other polyimide resin layers has disadvantages such as an increased number of synthesis steps.
  • the ratio of the thickness of the polyimide resin layer (i), the polyimide resin layer (ii), and other polyimide resin layers (the total in the case of multiple layers) to the polyimide resin layer (A) is in the following range. .
  • the polyimide resin layer (i) is 50 to 95%, preferably 70 to 95%.
  • the polyimide resin layer (ii) is 5 to 50%, preferably 5 to 30%.
  • the other polyimide resin layer is 0 to 30%, preferably 0 to 10%.
  • the polyimide resin layer (A) having two or more resin layers is formed by directly applying a polyamic acid solution, which is a precursor of the polyimide resin layer, onto an appropriate support a plurality of times, and drying and curing. be able to.
  • a polyamic acid solution which is a precursor of the polyimide resin layer
  • metal foils such as copper foil mentioned above
  • a support body as a conductor layer of a wiring board
  • it can be set as the laminated body for flexible substrates.
  • a laminated body is formed using a glass plate, metal foil, etc. as a support body and a polyimide resin layer is removed from a support body by means, such as peeling, it can be set as a heat conductive polyimide film.
  • the polyimide resin layer has a plurality of layers, two or more kinds are used in the polyamic acid solution, and at least one kind contains a heat conductive filler.
  • the polyamic acid solution can be applied by a known method, for example, by appropriately selecting from a bar code method, a gravure coating method, a roll coating method, a die coating method and the like.
  • a laminate for a flexible substrate having metal layers on both sides of a polyimide resin layer As an example.
  • a metal foil such as a copper foil constituting the metal layer of the laminate for a flexible substrate is prepared, and a polyamic acid solution for forming a polyimide resin layer (ii) is applied on the metal foil and dried at a temperature of 140 ° C. or lower.
  • a polyamic acid solution for forming the polyimide resin layer (i) containing filler is applied and dried.
  • a polyamic acid solution for forming the polyimide resin layer (ii) is again applied thereon and dried to form a plurality of polyamic acid layers.
  • the polyamic acid is imidized by heat treatment at a higher temperature to obtain a laminate having a metal layer on one side of the polyimide resin layer.
  • the heat treatment conditions for imidization are preferably 150 to 360 ° C. and stepwise for about 15 to 20 minutes.
  • stacking metal foil, such as copper foil, on the polyimide resin layer side of the laminated body which has a metal layer on one side obtained in this way by thermocompression bonding is ,Obtainable.
  • the hot press temperature at the time of the said thermocompression bonding It is desirable that it is more than the glass transition temperature of the polyimide resin to be used.
  • the hot press pressure is preferably in the range of 1 to 500 kg / cm 2 depending on the type of press equipment used.
  • the metal foil used at this time can be the same as the metal foil described above.
  • the laminate for a flexible substrate of the present invention may be a laminate for a single-sided flexible substrate having a conductor layer only on one side, or a laminate for a double-sided flexible substrate having a metal foil on both sides.
  • the laminate for a single-sided flexible substrate is coated with a polyamic acid solution for forming a polyimide resin layer (ii) on a metal foil, dried at a temperature of 140 ° C. or less to remove a certain amount of solvent, and then filled with polyimide.
  • the polyamic acid solution for forming the resin layer (i) can be obtained by a method such as imidization by heat treatment at a high temperature after being applied and dried.
  • the polyamic acid solution containing the thermally conductive filler used in the present invention can be obtained by, for example, adding a certain amount of thermally conductive filler to a polyamic acid solution containing a solvent obtained by polymerization in advance and dispersing with a stirrer or the like.
  • examples thereof include a preparation method and a method in which a diamine and an acid anhydride are added and polymerized while dispersing a thermally conductive filler in a solvent.
  • the polyamic acid can be produced by a known method in which an aromatic diamine component and an aromatic tetracarboxylic dianhydride component are used in substantially equimolar amounts and polymerized in a solvent. That is, it can be obtained by dissolving the diamine in a solvent such as N, N-dimethylacetamide under a nitrogen stream, adding aromatic tetracarboxylic dianhydride, and reacting at room temperature for about 3 hours.
  • the preferred degree of polymerization of the polyamic acid suitable for forming the polyimide resin layer is, when expressed in the viscosity range, the solution viscosity is in the range of 5 to 2,000 P, more preferably in the range of 10 to 300 P.
  • the solution viscosity can be measured with a cone plate viscometer with a thermostatic water bath.
  • the solvent include N, N-dimethylacetamide, n-methylpyrrolidinone, 2-butanone, diglyme, xylene and the like, and these can be used alone or in combination of two or more.
  • m-TB 2,2′-dimethyl-4,4′-diaminobiphenyl 4,4′-DAPE: 4,4′-diaminodiphenyl ether
  • TPE-R 1,3-bis (4-aminophenoxy) benzene
  • BAPP 2,2-bis (4-aminophenoxyphenyl) propane
  • PMDA pyromellitic dianhydride
  • BPDA 3,3′4,4′-biphenyltetracarboxylic acid
  • ODPA 4,4′-oxydiphthalic acid dianhydride
  • DMAc N, N-dimethylacetamide
  • the polyimide resin film was cut into a size of 30 mm x 30 mm, and the thermal diffusivity in the thickness direction by the periodic heating method (FTC-1 apparatus made by ULVAC-RIKO), the specific heat by DSC, and the density by the underwater substitution method were measured. Based on this, the thermal conductivity (W / m ⁇ K) was calculated.
  • CTE Coefficient of thermal expansion
  • Glass transition temperature (Tg) When a polyimide resin film (10 mm ⁇ 22.6 mm) is heated from 20 ° C. to 500 ° C. at a rate of 5 ° C./min with a dynamic thermal analyzer, the glass transition temperature (tan ⁇ maximum) is measured. Value: ° C).
  • TPR Near Propagation Resistance
  • Laminate MIT A laminated body having a copper foil on one side is subjected to circuit processing so that a 12.5 ⁇ m-thick polyimide film faces a 25 ⁇ m epoxy adhesive layer on the surface on which the circuit is formed, and 18.3 kgf / cm 2 A test piece was obtained by thermocompression bonding using a high-temperature vacuum press under conditions of pressure and 170 ° C. for 30 minutes.
  • a metal laminate MIT test piece cut into a strip shape having a width of 10 mm and a length of 150 mm was prepared as a test piece, and the load was 500 g and the bending angle was 135.
  • Synthesis Examples 1 to 10 In order to synthesize polyamic acids A to J, a 500 ml separable flask equipped with a stirrer was immersed in a water bath of an ultrasonic device, and under a nitrogen stream, a highly heat-conductive spherical alumina filler (maximum particle size 15 ⁇ m, average particle size was 0.6 ⁇ m filler 20 wt% mixed filler, specific surface area 0.65 m 2 / g) and DMAc were added and stirred for about 2 hours while irradiating with ultrasonic waves. Next, the diamine shown in Table 1 was added and dissolved while stirring, and then the tetracarboxylic dianhydride shown in Table 1 was added while maintaining stirring.
  • a highly heat-conductive spherical alumina filler maximum particle size 15 ⁇ m, average particle size was 0.6 ⁇ m filler 20 wt% mixed filler, specific surface area 0.65 m 2 / g
  • Synthesis Example 11 As a spherical alumina filler, a filler having a maximum particle size of 4.0 ⁇ m and an average particle size of 0.3 ⁇ m was used, and the diamine and tetracarboxylic dianhydride shown in Table 2 were used in the same manner as in Synthesis Examples 1 to 9. Thus, a viscous solution of polyamic acid K serving as a polyimide precursor was obtained.
  • Synthesis Example 12 In order to synthesize polyamic acid L, a 500 ml separable flask equipped with a stirrer was added and dissolved with stirring with the diamine shown in Table 2 under a nitrogen stream. Tetracarboxylic dianhydride was added. Thereafter, the polymerization reaction was continued for 3.5 hours at room temperature to obtain a viscous solution of polyamic acid serving as a polyimide precursor. The polyamic acid was mixed with a filler having an average major axis of 4.5 ⁇ m as a plate-like boron nitride filler, and mixed with a centrifugal stirrer until uniform to obtain a polyamic acid solution L containing 30 wt% filler.
  • Synthesis Example 13 A polyamic acid solution M was obtained in the same manner as in Synthesis Example 12 except that the blending ratio of the plate-like boron nitride filler to be blended with the polyamic acid was 50 wt%.
  • Synthesis Example 14 A polymerization reaction was performed using the monomer raw materials shown in Table 2 to obtain a viscous polyamic acid solution.
  • This polyamic acid is mixed with a plate-like boron nitride filler having an average major axis of 4.5 ⁇ m and a spherical alumina filler having an average particle size of 3 ⁇ m, and mixed with a centrifugal stirrer until uniform, to obtain a polyamic acid solution N containing 50 wt% filler. It was.
  • the ratio between the plate-like boron nitride filler and the spherical alumina filler was 50 wt%.
  • Synthesis Example 15 A polymerization reaction was performed using the monomer raw materials shown in Table 2 to obtain a viscous polyamic acid solution.
  • This polyamic acid is mixed with a plate-like boron nitride filler having an average major axis of 4.5 ⁇ m and a spherical alumina filler having an average particle size of 3 ⁇ m, and mixed with a centrifugal stirrer until uniform, and a polyamic acid solution O containing 50 wt% filler is added. Obtained. At this time, the ratio between the plate-like boron nitride filler and the spherical alumina filler was 50 wt%.
  • the solutions of polyamic acids A to O obtained in Synthesis Examples 1 to 15 were each applied onto a copper foil using an applicator and applied so that the thickness after curing was about 25 ⁇ m.
  • the laminate was dried for 30 minutes and heated in a stepwise manner over a temperature range of 130 to 360 ° C. over 30 minutes to form a laminate.
  • the copper foil was etched away using the ferric chloride aqueous solution, and it was set as the polyimide film.
  • Tables 1 and 2 show the results of measuring the glass transition temperature (Tg) and the coefficient of linear expansion (CTE) of the polyimide film thus obtained.
  • the thickness of the polyimide layer on the copper foil is 2/23 ⁇ m in the order of J / B from the copper foil side.
  • the copper foil was etched away in the same manner as described above to produce a polyimide resin film M1, and CTE, thermal conductivity, tear propagation resistance (TPR), and MIT were determined. Each was evaluated. Further, the flexibility of the laminate for a flexible substrate and the peel strength between the polyimide resin layer and the copper foil were evaluated.
  • the polyimide resin film obtained from the laminate M1 is referred to as film M1, and the same shall apply hereinafter.
  • Example 2 A laminate M2 and a film M2 were obtained in the same manner as in Example 1 except that the polyamic acid resin G obtained in Synthesis Example 7 was used instead of the polyamic acid resin B.
  • Comparative Examples 1 and 2 In place of the polyamic acid resin B, laminates M3 and M4 and a film M3 were obtained in the same manner as in Example 1 except that the polyamic acid resins D and E having a spherical alumina filler content of 20 wt% and 80 wt%, respectively, were used. , M4 was obtained. In addition, since the film M4 was brittle and easily cracked under pressure, the thermal conductivity in the thickness direction could not be measured.
  • Example 3 On the same copper foil as used in Example 1, a solution of polyamic acid resin J was applied to a thickness of 2 ⁇ m after curing, and dried by heating at 120 ° C. to remove the solvent. Next, the solution of polyamic acid resin A obtained in Synthesis Example 1 was applied thereon so that the thickness after curing was 21 ⁇ m, and dried by heating at 120 ° C. to remove the solvent. Further, a solution of polyamic acid resin J was applied thereon so that the thickness after curing was 2 ⁇ m, and dried by heating at 120 ° C. to remove the solvent. Thereafter, heating was performed stepwise in a temperature range of 130 to 360 ° C. over 30 minutes to prepare a wiring board laminate M8 composed of three polyimide layers on a copper foil. The thickness of the polyimide layer on the copper foil is 2/19/2 ⁇ m in the order of J / A / J from the copper foil side. In the same manner as in Example 1, a film M8 was obtained from the laminate M8 and evaluated in the same manner.
  • Examples 4 to 10, Comparative Example 6 Laminates M9 to M16 and films M9 to M16 were obtained and evaluated in the same manner as in Example 3 except that the type of polyamic acid resin used was changed and the configuration of the polyimide resin layer was changed.
  • Table 3 shows the evaluation results and layer structure of the laminate, and Table 4 shows the evaluation results of the polyimide resin film.
  • the thickness indicates the thickness of each resin layer constituting the film layer.
  • a laminate for a flexible substrate and a thermally conductive polyimide film that are excellent in heat dissipation and are suitably used for a flexible circuit substrate.
  • These flexible substrate laminates and thermally conductive polyimide films exhibit good heat dissipation and excellent adhesion to metal layers, so small electronic devices such as mobile phones and notebook computers that require these characteristics. Can be suitably used.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

Cette invention se rapporte à un stratifié pour cartes souples qui présente d'excellentes performances de dissipation de la chaleur, une couche de résine polyimide qui contient une charge de remplissage thermoconductrice étant formée sur une couche conductrice. Cette invention se rapporte également à un film polyimide thermoconducteur composé d'une couche de résine polyimide qui contient une charge de remplissage thermoconductrice. Le stratifié pour cartes souples ou le film polyimide thermoconducteur présente une couche de résine polyimide qui se compose de deux couches de résine différentes ou plus. Au moins une des deux couches de résine différentes ou plus est une couche de résine polyimide (i), 30 % à 75 % en poids d'une charge de remplissage thermoconductrice étant mélangés à une résine polyimide qui contient entre 10 % et 95 % par mole d'une unité structurale représentée par la formule générale (1), alors qu'au moins une autre des couches de résine différentes est une couche de résine polyimide (ii) qui présente une température de transition vitreuse inférieure à celle de la couche de résine polyimide (i).
PCT/JP2009/053724 2008-03-06 2009-02-27 Stratifié pour carte souple et film polyimide thermoconducteur Ceased WO2009110387A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010501876A JP5235211B2 (ja) 2008-03-06 2009-02-27 フレキシブル基板用積層体及び熱伝導性ポリイミドフィルム
KR1020107020640A KR101370559B1 (ko) 2008-03-06 2009-02-27 플렉시블 기판용 적층체 및 열전도성 폴리이미드 필름
CN2009801078941A CN101960929B (zh) 2008-03-06 2009-02-27 挠性基板用层叠体以及热传导性聚酰亚胺膜

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008056321 2008-03-06
JP2008-056321 2008-03-06

Publications (1)

Publication Number Publication Date
WO2009110387A1 true WO2009110387A1 (fr) 2009-09-11

Family

ID=41055947

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2009/053724 Ceased WO2009110387A1 (fr) 2008-03-06 2009-02-27 Stratifié pour carte souple et film polyimide thermoconducteur

Country Status (5)

Country Link
JP (1) JP5235211B2 (fr)
KR (1) KR101370559B1 (fr)
CN (1) CN101960929B (fr)
TW (1) TWI454375B (fr)
WO (1) WO2009110387A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010201625A (ja) * 2009-02-27 2010-09-16 Nippon Steel Chem Co Ltd フレキシブル基板用積層体及び熱伝導性ポリイミドフィルム
WO2011111684A1 (fr) * 2010-03-10 2011-09-15 新日鐵化学株式会社 Film de polyimide thermoconducteur et stratifié thermoconducteur fabriqué à partir de celui-ci
JP2011225675A (ja) * 2010-04-16 2011-11-10 Mitsui Chemicals Inc 熱伝導性接着樹脂組成物、それを含む積層体および半導体装置
WO2013099173A1 (fr) * 2011-12-26 2013-07-04 三井化学株式会社 Corps moulé multicouche et son procédé de production, élément de protection électromagnétique et élément de dissipation de chaleur
JP2023149765A (ja) * 2022-03-31 2023-10-13 日鉄ケミカル＆マテリアル株式会社 ポリアミド酸、ポリイミド、金属張積層板及び回路基板

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012081615A1 (fr) 2010-12-17 2012-06-21 積水化学工業株式会社 Procédé de production de particules acide polyamide, procédé de production de particules polyimide, particules polyimide et matériau de collage pour composant électronique
WO2012133594A1 (fr) * 2011-03-30 2012-10-04 宇部興産株式会社 Film de polyimide et stratifié métallique utilisant ce dernier
CN102951873B (zh) * 2011-08-31 2015-07-15 深圳光启高等理工研究院 一种超材料介质基板材料及其制备方法
KR101567645B1 (ko) 2013-12-17 2015-11-23 현대자동차주식회사 연료 전지 시스템 및 그 운전 제어 방법
JP6613488B2 (ja) * 2014-10-10 2019-12-04 日産化学株式会社 樹脂薄膜形成用組成物及び樹脂薄膜
KR102894191B1 (ko) * 2015-10-15 2025-12-01 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 폴리이미드 적층체 및 그 제조방법
CN106928705B (zh) * 2015-12-30 2020-05-19 广东生益科技股份有限公司 一种含填料的聚酰亚胺复合材料、片材以及含有它的电路基板
US10485102B2 (en) 2017-08-08 2019-11-19 Sumitomo Electric Industries, Ltd. Substrate for high-frequency printed wiring board
KR102069709B1 (ko) * 2018-01-22 2020-01-23 에스케이씨코오롱피아이 주식회사 2 종 이상의 필러를 포함하는 고열전도성 폴리이미드 필름
KR102119752B1 (ko) * 2018-10-02 2020-06-05 주식회사 이엠따블유 연성회로기판 모듈 및 이의 제조방법
KR20230025652A (ko) * 2020-06-16 2023-02-22 도요보 가부시키가이샤 무색 다층 폴리이미드 필름, 적층체, 플렉시블 전자 디바이스의 제조 방법
KR20220044233A (ko) * 2020-09-30 2022-04-07 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 수지조성물, 수지필름, 적층체, 커버레이 필름, 수지 부착 동박, 금속박적층판 및 회로기판

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60243120A (ja) * 1984-05-18 1985-12-03 Hitachi Ltd フレキシブルプリント基板の製造方法
JPH01245586A (ja) * 1988-03-28 1989-09-29 Nippon Steel Chem Co Ltd フレキシブルプリント基板
JP2001185853A (ja) * 1999-12-27 2001-07-06 Matsushita Electric Ind Co Ltd 回路基板用基材とそれを用いたプリント回路基板
JP2002240193A (ja) * 2001-02-16 2002-08-28 Nippon Steel Chem Co Ltd 積層体及びその製造方法
JP2006190734A (ja) * 2005-01-05 2006-07-20 Toyobo Co Ltd プリント配線板
JP2006274040A (ja) * 2005-03-29 2006-10-12 Du Pont Toray Co Ltd ポリイミドフィルムおよびそれを用いたフレキシブル回路基板
JP2007045008A (ja) * 2005-08-10 2007-02-22 Ube Ind Ltd 片面或いは両面金属箔積層ポリイミドフィルム及びこれらの製造方法
JP2007055165A (ja) * 2005-08-26 2007-03-08 Shin Etsu Chem Co Ltd フレキシブル銅張積層板及びその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4937133A (en) * 1988-03-28 1990-06-26 Nippon Steel Chemical Co., Ltd. Flexible base materials for printed circuits
US20060124693A1 (en) * 2004-12-15 2006-06-15 Meloni Paul A Thermally conductive polyimide film composites having high mechanical elongation useful as a heat conducting portion of an electronic device
WO2007037192A1 (fr) * 2005-09-29 2007-04-05 Kaneka Corporation Film stratifié en résine polyimide

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60243120A (ja) * 1984-05-18 1985-12-03 Hitachi Ltd フレキシブルプリント基板の製造方法
JPH01245586A (ja) * 1988-03-28 1989-09-29 Nippon Steel Chem Co Ltd フレキシブルプリント基板
JP2001185853A (ja) * 1999-12-27 2001-07-06 Matsushita Electric Ind Co Ltd 回路基板用基材とそれを用いたプリント回路基板
JP2002240193A (ja) * 2001-02-16 2002-08-28 Nippon Steel Chem Co Ltd 積層体及びその製造方法
JP2006190734A (ja) * 2005-01-05 2006-07-20 Toyobo Co Ltd プリント配線板
JP2006274040A (ja) * 2005-03-29 2006-10-12 Du Pont Toray Co Ltd ポリイミドフィルムおよびそれを用いたフレキシブル回路基板
JP2007045008A (ja) * 2005-08-10 2007-02-22 Ube Ind Ltd 片面或いは両面金属箔積層ポリイミドフィルム及びこれらの製造方法
JP2007055165A (ja) * 2005-08-26 2007-03-08 Shin Etsu Chem Co Ltd フレキシブル銅張積層板及びその製造方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010201625A (ja) * 2009-02-27 2010-09-16 Nippon Steel Chem Co Ltd フレキシブル基板用積層体及び熱伝導性ポリイミドフィルム
WO2011111684A1 (fr) * 2010-03-10 2011-09-15 新日鐵化学株式会社 Film de polyimide thermoconducteur et stratifié thermoconducteur fabriqué à partir de celui-ci
JPWO2011111684A1 (ja) * 2010-03-10 2013-06-27 新日鉄住金化学株式会社 熱伝導性ポリイミドフィルム及びそれを用いた熱伝導性積層体
JP2011225675A (ja) * 2010-04-16 2011-11-10 Mitsui Chemicals Inc 熱伝導性接着樹脂組成物、それを含む積層体および半導体装置
WO2013099173A1 (fr) * 2011-12-26 2013-07-04 三井化学株式会社 Corps moulé multicouche et son procédé de production, élément de protection électromagnétique et élément de dissipation de chaleur
JP5330626B1 (ja) * 2011-12-26 2013-10-30 三井化学株式会社 電磁波シールド部材
KR101545430B1 (ko) 2011-12-26 2015-08-18 미쯔이가가꾸가부시끼가이샤 다층 성형체 및 그 제조 방법, 및 전자파 실드 부재 및 방열성 부재
JP2023149765A (ja) * 2022-03-31 2023-10-13 日鉄ケミカル＆マテリアル株式会社 ポリアミド酸、ポリイミド、金属張積層板及び回路基板

Also Published As

Publication number Publication date
CN101960929A (zh) 2011-01-26
KR20100125324A (ko) 2010-11-30
TW201000306A (en) 2010-01-01
JP5235211B2 (ja) 2013-07-10
TWI454375B (zh) 2014-10-01
KR101370559B1 (ko) 2014-03-06
JPWO2009110387A1 (ja) 2011-07-14
CN101960929B (zh) 2012-10-03

Similar Documents

Publication Publication Date Title
JP5235211B2 (ja) フレキシブル基板用積層体及び熱伝導性ポリイミドフィルム
JP7428646B2 (ja) 金属張積層板及び回路基板
JP6767759B2 (ja) ポリイミド、樹脂フィルム及び金属張積層板
JP6403460B2 (ja) 金属張積層体、回路基板及びポリイミド
JPWO2020022129A5 (fr)
JP2012176619A (ja) 熱伝導性フレキシブル基板用積層体及び熱伝導性ポリイミドフィルム
JP2012213899A (ja) 熱伝導性ポリイミド−金属基板
JP4757575B2 (ja) 配線基板用積層体
JP2010201625A (ja) フレキシブル基板用積層体及び熱伝導性ポリイミドフィルム
JP2012213900A (ja) 熱伝導性ポリイミド−金属基板
JP5665449B2 (ja) 金属張積層体及び熱伝導性ポリイミドフィルム
JP2015193117A (ja) 金属張積層体及び回路基板
JP2009028993A (ja) 配線基板用積層体
JP2008251900A (ja) フレキシブル基板用積層体及びその製造方法
KR101170201B1 (ko) 배선 기판용 적층체
KR101077405B1 (ko) 배선기판용 적층체
JP4642664B2 (ja) 配線基板用積層体
JP7621112B2 (ja) 金属張積層板及びその製造方法
JP7648377B2 (ja) ポリアミド酸組成物、ポリイミド組成物、金属張積層板及び回路基板
JP7804411B2 (ja) 樹脂フィルム、金属張積層板、回路基板及び積層構造体
WO2007086550A1 (fr) Stratifie pour carte de circuit imprime
JP2008159896A (ja) 配線基板用積層体
JP2024022280A (ja) 樹脂フィルム、金属張積層板及び回路基板
TW202405055A (zh) 聚醯胺酸、聚醯亞胺、覆金屬層疊板及電路基板
JP2007273767A (ja) 配線基板用積層体

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200980107894.1

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09717924

Country of ref document: EP

Kind code of ref document: A1

DPE1 Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101)
WWE Wipo information: entry into national phase

Ref document number: 2010501876

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20107020640

Country of ref document: KR

Kind code of ref document: A

122 Ep: pct application non-entry in european phase

Ref document number: 09717924

Country of ref document: EP

Kind code of ref document: A1