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WO2009153129A3 - Verfahren zur herstellung einer elektronischen baugruppe - Google Patents

Verfahren zur herstellung einer elektronischen baugruppe Download PDF

Info

Publication number
WO2009153129A3
WO2009153129A3 PCT/EP2009/056286 EP2009056286W WO2009153129A3 WO 2009153129 A3 WO2009153129 A3 WO 2009153129A3 EP 2009056286 W EP2009056286 W EP 2009056286W WO 2009153129 A3 WO2009153129 A3 WO 2009153129A3
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
manufacture
fitted
electronic assembly
conductor track
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2009/056286
Other languages
English (en)
French (fr)
Other versions
WO2009153129A2 (de
Inventor
Ulrich Schaaf
Andreas Kugler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to CN200980132214.1A priority Critical patent/CN102124560B/zh
Priority to JP2011513971A priority patent/JP2011524645A/ja
Priority to US12/999,834 priority patent/US8505198B2/en
Priority to EP09765709A priority patent/EP2289100A2/de
Publication of WO2009153129A2 publication Critical patent/WO2009153129A2/de
Publication of WO2009153129A3 publication Critical patent/WO2009153129A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H10W70/041—
    • H10W70/093—
    • H10W70/611—
    • H10W70/614—
    • H10W70/688—
    • H10W72/0198—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H10P72/7438—
    • H10W70/60—
    • H10W72/90—
    • H10W72/9415—
    • H10W74/00—
    • H10W90/724—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

Die Erfindung betrifft ein Verfahren zur Herstellung einer elektronischen Baugruppe, umfassend mindestens ein elektronisches Bauelement (9) sowie eine Leiterbahnstruktur (7), mit der das mindestens eine elektronische Bauelement (9) kontaktiert wird. Bei dem Verfahren wird in einem ersten Schritt eine leitfähige Folie (1) zum Ausbilden der Leiterbahnstruktur (7) strukturiert. In einem zweiten Schritt wird die Leiterbahnstruktur (7) mit dem mindestens einen elektronischen Bauelement (9) bestückt. In einem abschließenden Schritt wird eine weitere Folie auf die mit dem mindestens ein elektronischen Bauelement (9) bestückte leitfähige Folie (1) auf der Seite, auf der die leitfähige Folie (1) mit dem mindestens ein elektronischen Bauelement (9) bestückt ist, auflaminiert.
PCT/EP2009/056286 2008-06-19 2009-05-25 Verfahren zur herstellung einer elektronischen baugruppe Ceased WO2009153129A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN200980132214.1A CN102124560B (zh) 2008-06-19 2009-05-25 用于制造电子组件的方法
JP2011513971A JP2011524645A (ja) 2008-06-19 2009-05-25 電子モジュールを製造するための方法
US12/999,834 US8505198B2 (en) 2008-06-19 2009-05-25 Method for manufacturing an electronic assembly
EP09765709A EP2289100A2 (de) 2008-06-19 2009-05-25 Verfahren zur herstellung einer elektronischen baugruppe

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008002532A DE102008002532A1 (de) 2008-06-19 2008-06-19 Verfahren zur Herstellung einer elektronischen Baugruppe
DE102008002532.1 2008-06-19

Publications (2)

Publication Number Publication Date
WO2009153129A2 WO2009153129A2 (de) 2009-12-23
WO2009153129A3 true WO2009153129A3 (de) 2010-03-04

Family

ID=40905909

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2009/056286 Ceased WO2009153129A2 (de) 2008-06-19 2009-05-25 Verfahren zur herstellung einer elektronischen baugruppe

Country Status (6)

Country Link
US (1) US8505198B2 (de)
EP (1) EP2289100A2 (de)
JP (1) JP2011524645A (de)
CN (1) CN102124560B (de)
DE (1) DE102008002532A1 (de)
WO (1) WO2009153129A2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010014579A1 (de) * 2010-04-09 2011-10-13 Würth Elektronik Rot am See GmbH & Co. KG Verfahren zum Herstellen einer elektronischen Baugruppe
DE102010030528A1 (de) * 2010-06-25 2011-12-29 Robert Bosch Gmbh Eingekapseltes Steuerungsmodul für ein Kraftfahrzeug
WO2018063198A1 (en) * 2016-09-28 2018-04-05 Aleksandar Aleksov Flexible packaging for a wearable electronic device
DE102017203381A1 (de) * 2017-03-02 2018-04-05 Robert Bosch Gmbh Mikroelektronische Bauelementanordnung und entsprechendes Herstellungsverfahren
WO2021148137A1 (en) * 2020-01-24 2021-07-29 Huawei Technologies Co., Ltd. Functional housing structure for an electronic device
DE102021108701A1 (de) 2021-04-08 2022-10-13 Innome Gmbh Sensorbauteil und Verfahren zur Herstellung desselben

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030137045A1 (en) * 2002-01-23 2003-07-24 Matsushita Electric Industrial Co., Ltd. Circuit component built-in module and method of manufacturing the same
US20050006142A1 (en) * 2003-07-09 2005-01-13 Matsushita Electric Industrial Co., Ltd. Circuit board with in-built electronic component and method for manufacturing the same
US20050218491A1 (en) * 2004-03-31 2005-10-06 Alps Electric Co., Ltd. Circuit component module and method of manufacturing the same
US20070099449A1 (en) * 2005-10-31 2007-05-03 Daigo Suzuki Printed circuit board, electronic device, and manufacturing method for printed circuit board

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2816028B2 (ja) * 1991-02-18 1998-10-27 株式会社東芝 半導体装置の製造方法
TW350194B (en) * 1994-11-30 1999-01-11 Mitsubishi Gas Chemical Co Metal-foil-clad composite ceramic board and process for the production thereof the invention relates to the metal-foil-clad composite ceramic board and process for the production
EP1050078B1 (de) * 1998-01-22 2002-04-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mikrosystem und verfahren zum herstellen eines mikrosystems
DE19830540A1 (de) * 1998-07-08 2000-01-13 Siemens Ag Elektronischer Schaltungsträger
JP2000151057A (ja) 1998-11-09 2000-05-30 Hitachi Ltd 電子部品実装構造体およびその製造方法並びに無線ｉｃカードおよびその製造方法
US6512182B2 (en) 2001-03-12 2003-01-28 Ngk Spark Plug Co., Ltd. Wiring circuit board and method for producing same
JP2005045228A (ja) * 2003-07-09 2005-02-17 Matsushita Electric Ind Co Ltd 光学情報記録媒体とその製造方法
US6928726B2 (en) * 2003-07-24 2005-08-16 Motorola, Inc. Circuit board with embedded components and method of manufacture
TW200539246A (en) 2004-05-26 2005-12-01 Matsushita Electric Industrial Co Ltd Semiconductor device and method for manufacturing the same
DE102005003125A1 (de) 2005-01-21 2006-07-27 Robert Bosch Gmbh Elektrische Schaltung und Verfahren zur Herstellung einer elektrischen Schaltung
DE102006055576A1 (de) * 2006-11-21 2008-05-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Herstellen eines dehnbaren Schaltungsträgers und dehnbarer Schaltungsträger

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030137045A1 (en) * 2002-01-23 2003-07-24 Matsushita Electric Industrial Co., Ltd. Circuit component built-in module and method of manufacturing the same
US20050006142A1 (en) * 2003-07-09 2005-01-13 Matsushita Electric Industrial Co., Ltd. Circuit board with in-built electronic component and method for manufacturing the same
US20050218491A1 (en) * 2004-03-31 2005-10-06 Alps Electric Co., Ltd. Circuit component module and method of manufacturing the same
US20070099449A1 (en) * 2005-10-31 2007-05-03 Daigo Suzuki Printed circuit board, electronic device, and manufacturing method for printed circuit board

Also Published As

Publication number Publication date
DE102008002532A1 (de) 2009-12-24
CN102124560B (zh) 2014-05-07
JP2011524645A (ja) 2011-09-01
CN102124560A (zh) 2011-07-13
EP2289100A2 (de) 2011-03-02
US20110138620A1 (en) 2011-06-16
WO2009153129A2 (de) 2009-12-23
US8505198B2 (en) 2013-08-13

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