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WO2009024051A1 - Method of realizing the impedance matching of rf and rf impedance matching system - Google Patents

Method of realizing the impedance matching of rf and rf impedance matching system Download PDF

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Publication number
WO2009024051A1
WO2009024051A1 PCT/CN2008/071891 CN2008071891W WO2009024051A1 WO 2009024051 A1 WO2009024051 A1 WO 2009024051A1 CN 2008071891 W CN2008071891 W CN 2008071891W WO 2009024051 A1 WO2009024051 A1 WO 2009024051A1
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Prior art keywords
impedance
matching
admittance
matching network
input
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PCT/CN2008/071891
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French (fr)
Inventor
Huangang Wang
Wenli Xu
Hui Li
Ning Wang
Haonan Shen
Ye Wu
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Beijing NMC Co Ltd
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Beijing NMC Co Ltd
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    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/38Impedance-matching networks
    • H03H7/40Automatic matching of load impedance to source impedance

Definitions

  • the invention relates to an impedance matching technology, in particular to a method for realizing RF impedance matching and an RF impedance matching system. Background technique
  • an RF (radio frequency) generator with a constant output impedance typically 50 ⁇
  • a fixed frequency typically 13.56 MHz
  • the nonlinear load impedance of the plasma chamber is not equal to the constant output impedance of the RF generator, so there is a severe impedance mismatch between the RF generator and the plasma chamber, resulting in a large reflection on the transmission line.
  • the power is such that the power generated by the RF generator cannot be fully delivered to the plasma chamber.
  • the matching device is connected between the RF power source and the reaction chamber, and by adjusting the variable impedance component in the matching device, the impedance seen from the input end of the matching device to the output terminal is equal to the RF frequency.
  • the output impedance of the power supply allows the output power of the RF power source to be delivered to the reaction chamber for plasma excitation.
  • parameters such as voltage and current on the transmission line and phase difference between voltage and current are detected, and the input impedance of the matcher can be calculated based on these parameters. Then, based on the matched input impedance of the impedance detector, the amplitude error and the phase error are obtained, and the two error signals are used to control the tuning element, and the error signal is reduced to zero or small by continuously adjusting the tuning element. A match is reached.
  • the above prior art has at least the following disadvantages:
  • the tuning element affects both error signals simultaneously, ie affects both the amplitude error and the phase error. Due to the presence of this effect, the tuning time is long and the matching process is slow, resulting in an unreliable matching system. Summary of the invention
  • the impedance matching control between the radio frequency source and the load is implemented by matching the network, and the input admittance of the matching network is compared with the output admittance of the radio frequency source, and according to the comparison As a result, the input impedance of the matching network is adjusted to achieve impedance matching control.
  • the radio frequency impedance matching system of the present invention includes a radio frequency source and a load, wherein the radio frequency source is connected to the load through a matching network, and the matching network includes an impedance detector, a controller, and a variable impedance device.
  • the impedance detector detects an input impedance of the matching network and converts the input admittance of the matching network, and then transmits the input admittance to the controller; the controller is electrically connected to the variable impedance device, and
  • the input admittance of the matching network is compared with the output admittance of the radio frequency source, and the variable impedance device is adjusted according to the comparison result to achieve impedance matching between the radio frequency source and the load.
  • the input admittance of the matching network and the output admittance of the radio frequency source are performed. Comparing, and adjusting the input impedance of the matching network according to the result of the comparison to achieve impedance matching control. Therefore, the matching process is fast and the matching system is reliable.
  • FIG. 1 is a schematic diagram of a connection state of a matching device in the prior art
  • FIG. 2 is a circuit schematic diagram of a method for implementing RF impedance matching according to the present invention
  • FIG. 3 is a schematic diagram of a radio frequency impedance matching system of the present invention.
  • the invention implements a method for matching RF impedance, and achieves impedance matching control between a radio frequency source and a load through a matching network, compares an input admittance of the matching network with an output admittance of the radio frequency source, and according to the comparison result The input impedance of the matching network is adjusted to achieve impedance matching control.
  • Step 1 detecting an input impedance of the matching network, and converting the input admittance of the matching network according to the detected value;
  • Step 2 Compare the input admittance of the matching network with the output admittance of the RF source, and adjust the variable impedance device according to the comparison result, and adjust the input impedance of the matching network to achieve impedance matching control.
  • the matching network includes a first variable impedance device in parallel with the load and a second variable impedance device in series with the load.
  • the input admittance of the matching network is separately compared with the real and imaginary parts of the output admittance of the radio frequency source, and the first variable impedance device and the second variable impedance device are compared according to the comparison result. Make adjustments. Specifically, the following two methods can be adopted:
  • One is to first adjust the second variable impedance device G according to the error between the input admittance of the matching network and the real part of the output admittance of the RF source; and then, according to the input admittance of the matching network and the RF source The error between the imaginary parts of the output admittance adjusts the first variable impedance device G to achieve matching control.
  • the other is to adjust the second variable impedance device G according to the error between the input admittance of the matching network and the real part of the output admittance of the radio frequency source; meanwhile, according to the input admittance of the matching network and the radio frequency source
  • the error between the imaginary parts of the output admittance adjusts the first variable impedance device G to achieve matching control.
  • the input impedance Z of the matching network is:
  • admittance real part b is the admittance imaginary part, specifically:
  • adjusting the capacitance G does not affect the real part of the matching network input admittance.
  • the method for implementing the matching control of the present invention fully utilizes this feature by decoupling the control algorithm, firstly adjusting the capacitance G to make the real part of the admittance meet the requirement, and then adjusting the capacitance G to make the admittance imaginary part meet the requirement, because the adjustment G is admittance The real part has no effect.
  • the admittance imaginary part is adjusted, the system enters the matching state.
  • the decoupling control algorithm first detects the input admittance of the matching network to obtain the admittance real part and the imaginary part b, and then calculates the admittance real part deviation £? and the imaginary part deviation £ ⁇ 4.
  • the measured RF source output impedance is
  • A K 2 e b (9)
  • proportional coefficient which is the adjustable parameter of the algorithm.
  • Method 1 After calculating the capacitance adjustment amount, adjust the capacitances G and G separately. First, use the capacitor G to adjust the real part of the admittance. After the real part is adjusted, use the capacitor G to adjust the yin part of the admittance. In theory, if the steps of matching the real input adjustment and the imaginary part adjustment of the network input admittance are completed in sequence, the impedance automatic matching is completed.
  • Method 2 After calculating the capacitance adjustment amount, adjust the capacitances G and C 2 simultaneously.
  • the capacitors C 2 and G are simultaneously adjusted according to the admittance real part deviation and the imaginary part deviation, but at this time, the adjustment of the capacitance G will be affected by the adjustment of the capacitance G, and the adjustment of the G is not affected by the G.
  • the impedance matching speed of the two capacitors is adjusted at the same time as the capacitor is adjusted separately.
  • the invention controls the tuning element adjustment by using a decoupling control algorithm, using the admittance real part and the imaginary part error, and tuning the series branch due to the special relationship between the real part and the imaginary part of the matching network input admittance and the tuning element.
  • the components are not affected by the parallel branch tuning components.
  • the system enters the matching state as soon as the parallel tuning components are adjusted to the corresponding positions.
  • the relationship between the two error signals and the two tuning elements is simple. It is very easy to overcome the nonlinear correspondence between the tuning elements and the corresponding errors by adjusting some parameters in the decoupling algorithm.
  • the system matching can be realized by the decoupling control algorithm. There is no point that the impedance matching cannot be completed, and the algorithm is simple, easy to implement, and the system is reliable.
  • the present invention also provides an RF impedance matching system.
  • Figure 3 illustrates a preferred embodiment of the RF impedance matching system.
  • the system includes a radio frequency source, such as a load of a reaction chamber, the RF source being coupled to the load through a matching network to achieve impedance matching between the RF source and the load through the matching network.
  • the matching network includes an impedance detector, a controller, and a variable impedance device.
  • the impedance detector detects an input impedance of the matching network, and converts an input admittance of the matching network, and then transmits the input admittance to the controller.
  • the variable impedance means comprises a reaction chamber in parallel with the first variable impedance device G series with the load and a second variable impedance device C 2.
  • the variable impedance device can be connected to a driving device for converting the impedance under the control of the controller.
  • the variable impedance device may be a variable resistor, a variable capacitor or a variable inductor, or a plurality of variable impedance devices may be connected in parallel or in series, and may be variable by a controller. The impedance device is controlled.
  • the controller is electrically connected to the variable impedance device, and compares an input admittance of the matching network with an output admittance of the radio frequency source, and adjusts a variable impedance device according to the comparison result to implement a radio frequency source and Impedance matching between loads. Specifically, the controller separately compares the input admittance of the matching network with the real and imaginary parts of the output admittance of the radio frequency source, and compares the first variable impedance device and the second variable impedance device according to the comparison result. Make adjustments.
  • the controller adjusts the first variable impedance device and the second variable impedance device in one of the following ways: First, according to the input admittance of the matching network and the output of the RF source The error between the real parts of the nanometer adjusts the second variable impedance device; then, the first variable impedance device is adjusted according to the error between the input admittance of the matching network and the imaginary part of the output admittance of the RF source , achieve impedance matching control.
  • the error between the imaginary parts adjusts the first variable impedance device to achieve impedance matching control.
  • load in the foregoing embodiment is the reaction chamber of the plasma generating apparatus, other loads may be used in actual applications depending on actual needs.

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  • Plasma Technology (AREA)

Description

实现射频阻抗匹配的方法及射频阻抗匹配系统 技术领域
本发明涉及一种阻抗匹配技术, 尤其涉及一种实现射频阻抗匹配的方法 及射频阻抗匹配系统。 背景技术
在射频等离子体发生装置中, 恒定输出阻抗(通常为 50Ω ) 的 RF (射 频)发生器产生固定频率(通常为 13.56MHz )的 RF波, 向等离子体腔室提 供 RF功率, 以激发用于工艺的等离子体。 一般来讲, 等离子体腔室的非线 性负载阻抗与 RF发生器的恒定输出阻抗并不相等,故在 RF发生器和等离子 体腔室之间具有严重的阻抗失配, 使得传输线上存在较大的反射功率, 以致 RF发生器产生的功率无法全部输送给等离子体腔室。
如图 1所示, 现有技术中将匹配器连接于射频电源与反应室之间, 通过 调节匹配器中的可变阻抗元件, 能够使得从匹配器输入端向输出端看去的阻 抗等于射频电源的输出阻抗, 从而使得射频电源的输出功率能够最多地传送 到反应室中进行等离子体激发。
现有技术中, 检测传输线上的电压、 电流以及电压与电流的相位差等参 数, 根据这些参数可以计算出匹配器的输入阻抗。 然后, 根据阻抗检测器检 测的匹配器输入阻抗, 得出幅度误差和相位误差, 利用这两种误差信号来控 制调谐元件, 通过不断地调整调谐元件, 使误差信号降为零或很小, 系统达 到匹配状态。
上述现有技术至少存在以下缺点: 调谐元件同时影响两种误差信号, 即 同时影响幅度误差和相位误差。 由于这种影响的存在, 使调谐时间长, 匹配 过程緩慢, 导致匹配系统不可靠。 发明内容
本发明的目的是提供一种匹配过程迅速、 能够可靠地实现射频阻抗匹配 的方法及射频阻抗匹配系统。
本发明的目的是通过以下技术方案实现的:
本发明的实现射频阻抗匹配的方法, 通过匹配网络实现射频源与负载之 间的阻抗匹配控制, 将所述匹配网络的输入导纳与所述射频源的输出导纳进 行比较, 并根据比较的结果对所述匹配网络的输入阻抗进行调整, 实现阻抗 匹配控制。
本发明的射频阻抗匹配系统, 包括射频源、 负载, 其特征在于, 所述的 射频源通过匹配网络与所述负载连接, 所述匹配网络包括阻抗检测器、 控制 器、 可变阻抗器件, 所述阻抗检测器检测匹配网络的输入阻抗, 并换算出所 述匹配网络的输入导纳, 之后将所述输入导纳传输给控制器; 所述控制器与 所述可变阻抗器件电连接, 并将所述匹配网络的输入导纳与所述射频源的输 出导纳进行比较, 根据比较结果调整可变阻抗器件, 以实现射频源与负载之 间的阻抗匹配。
由上述本发明提供的技术方案可以看出, 在本发明所述的实现射频阻抗 匹配的方法及射频阻抗匹配系统中, 将所述匹配网络的输入导纳与所述射频 源的输出导纳进行比较, 并根据比较的结果对所述匹配网络的输入阻抗进行 调整而实现阻抗匹配控制。 因此, 匹配过程迅速、 匹配系统可靠。 附图说明
图 1为现有技术中的匹配器连接状态示意图;
图 2为本发明实现射频阻抗匹配的方法的电路原理图;
图 3为本发明射频阻抗匹配系统的示意图。 具体实施方式 本发明实现射频阻抗匹配的方法, 通过匹配网络实现射频源与负载之间 的阻抗匹配控制, 将所述匹配网络的输入导纳与所述射频源的输出导纳进行 比较, 并根据比较的结果对所述匹配网络的输入阻抗进行调整, 以实现阻抗 匹配控制。
具体包括:
步骤 1、 检测匹配网络的输入阻抗, 并根据检测值换算出所述匹配网络 的输入导纳;
步骤 2、 将匹配网络的输入导纳与射频源的输出导纳进行比较, 并根据 比较的结果调整可变阻抗器件, 对匹配网络的输入阻抗进行调整, 实现阻抗 匹配控制。
匹配网络包括与所述负载并联的第一可变阻抗器件和与所述负载串联 的第二可变阻抗器件。 所述的步骤 2中, 将匹配网络的输入导纳与射频源的 输出导纳的实部和虚部单独进行比较, 并根据比较的结果对第一可变阻抗器 件和第二可变阻抗器件进行调整。 具体地, 可以釆取如下两种方式:
一种是, 首先根据匹配网络的输入导纳与射频源的输出导纳的实部之间 的误差对第二可变阻抗器件 G进行调整; 然后, 根据匹配网络的输入导纳与 射频源的输出导纳的虚部之间的误差对第一可变阻抗器件 G进行调整, 实现 匹配控制。
另一种是, 根据匹配网络的输入导纳与射频源的输出导纳的实部之间的 误差对第二可变阻抗器件 G进行调整; 同时, 根据匹配网络的输入导纳与射 频源的输出导纳的虚部之间的误差对第一可变阻抗器件 G进行调整, 实现匹 配控制。
一个具体实施例, 如图 2所示。 其中, 表示等离子体装置的等效电阻, 表示等效电感, d、 C2为可变电容, 并且设等离子体装置的等效阻抗 为: ZL = R + j )L
匹配网络的输入阻抗 Z为:
Figure imgf000006_0001
则匹配网络的输入导纳 G为:
Figure imgf000006_0002
其中, 表示导纳实部, b表示导纳虚部, 具体为:
Figure imgf000006_0003
由上述表达式可以看出: 调整电容 G不会影响匹配网络输入导纳的实 部。 本发明实现匹配控制的方法通过解耦控制算法, 充分利用此特点, 首先 通过调整电容 G使导纳实部满足要求, 然后再调整电容 G使导纳虚部满足要 求, 因为调整 G对导纳实部无影响, 当导纳虚部调好后, 系统便进入匹配状 态。
所述解耦控制算法是, 首先检测匹配网络的输入导纳 得到导纳实部 和虚部 b, 然后计算导纳实部偏差£?„和虚部偏差 £¾。 艮定射频源输出阻抗为
50Ω, 则其输出导纳的实部为 0.02, 虚部为 0。)
ea=0m-a (6) eb = 0_b (7)
根据 e。和 £¾计算电容调整量△ 、 AC2, 其中
AQ =Kxea (8)
A =K2eb (9) 其中 、 为比例系数, 为算法的可调参数。
计算出电容调整量后, 釆用下述方法调整电容 G和
方法一: 计算出电容调整量后, 对电容 G和 G分开调整。 先利用电容 G调整导纳实部, 待实部调整好后再利用电容 G调整导纳虚部。 理论上, 若 依次完成匹配网络输入导纳实部调整和虚部调整的步骤, 则阻抗自动匹配完 成。
方法二: 计算出电容调整量后,对电容 G和 C2同时调整。 电容 C2和 G根 据导纳实部偏差和虚部偏差同时进行调整, 但此时电容 G的调整将受到电容 G的调整影响, 而 G的调整不受 G影响。 在匹配器大部分的状态下, 两个电 容同时调整的阻抗匹配速度要快于电容分开调整情况。
还可以修改 (8)、(9)两式中的参数 、 K2, 使其变为导纳实部和虚部的函 数, 完全校正系统的非线性。
本发明通过解耦控制算法, 釆用导纳实部和虚部误差来控制调谐元件的 调整, 由于匹配网络输入导纳的实部和虚部与调谐元件间的特殊关系, 串联 支路的调谐元件不受并联支路调谐元件的影响, 当串联调谐元件调整好后, 只要并联调谐元件调整到相应位置后, 系统则进入匹配状态。 两种误差信号 与两调谐元件之间关系简单, 通过调整解耦算法中的一些参数非常容易克服 调谐元件与对应误差之间的非线性对应关系。 在各种状态下, 只要存在阻抗 匹配点, 即可通过解耦控制算法实现系统匹配, 不存在不能完成阻抗匹配的 点, 并且算法简单, 容易实现, 系统可靠。
此外, 本发明还提供一种射频阻抗匹配系统。 图 3示出了该射频阻抗匹 配系统的一个较佳实施方式。 所述系统包括射频源、 诸如反应腔室的负载, 所述的射频源通过匹配网络与负载连接, 通过匹配网络实现射频源与负载之 间的阻抗匹配。 所述匹配网络包括阻抗检测器、 控制器、 可变阻抗器件。
其中, 所述阻抗检测器检测匹配网络的输入阻抗, 并换算出所述匹配网 络的输入导纳, 之后将所述输入导纳传输给控制器。 所述可变阻抗器件包括与反应腔室并联的第一可变阻抗器件 G和与所 述负载串联的第二可变阻抗器件 C2。 该可变阻抗器件可以连接有驱动装置, 用以在控制器的控制下变换阻抗。 在实际应用中, 所述的可变阻抗器件可以 是可变电阻、 可变电容或可变电感等, 也可以釆用多个可变阻抗器件并联或 串联的形式, 由控制器对可变阻抗器件进行控制。
所述控制器与所述可变阻抗器件电连接, 并将所述匹配网络的输入导纳 与所述射频源的输出导纳进行比较, 根据比较结果调整可变阻抗器件, 以实 现射频源与负载之间的阻抗匹配。 具体地, 所述控制器将匹配网络的输入导 纳与射频源的输出导纳的实部和虚部单独进行比较, 并根据比较的结果对第 一可变阻抗器件和第二可变阻抗器件进行调整。 更为具体地, 所述控制器釆 用下述方式之一对第一可变阻抗器件和第二可变阻抗器件进行调整: 其一, 首先根据匹配网络的输入导纳与射频源的输出导纳的实部之间的误差对第二 可变阻抗器件进行调整; 然后, 根据匹配网络的输入导纳与射频源的输出导 纳的虚部之间的误差对第一可变阻抗器件进行调整, 实现阻抗匹配控制。 其 二, 根据匹配网络的输入导纳与射频源的输出导纳的实部之间的误差对第二 可变阻抗器件进行调整; 同时, 根据匹配网络的输入导纳与射频源的输出导 纳的虚部之间的误差对第一可变阻抗器件进行调整, 实现阻抗匹配控制。
可以理解, 尽管前述实施方式中的负载为等离子体发生装置的反应腔 室, 但是在实际应用中也可以根据实际需要而为其它负载。
以上所述, 仅为本发明较佳的具体实施方式, 但本发明的保护范围并不 局限于此, 任何熟悉本技术领域的技术人员在本发明揭露的技术范围内, 可 轻易想到的变化或替换, 都应涵盖在本发明的保护范围之内。

Claims

1、 一种实现射频阻抗匹配的方法, 通过匹配网络实现射频源与负载之 间的阻抗匹配控制, 其特征在于, 将所述匹配网络的输入导纳与所述射频源 的输出导纳进行比较, 并根据比较的结果对所述匹配网络的输入阻抗进行调 整, 实现阻抗匹配控制。
2、 根据权利要求 1 所述的实现射频阻抗匹配的方法, 其特征在于, 所 述匹配网络包括与所述负载并联的第一可变阻抗器件和与所述负载串联的第 二可变阻抗器件。
3、 根据权利要求 2所述的实现射频阻抗匹配的方法, 其特征在于, 将 匹配网络的输入导纳与射频源的输出导纳的实部和虚部单独进行比较, 并根 据比较的结果对第一可变阻抗器件和第二可变阻抗器件进行调整。
4、 根据权利要求 3 所述的实现阻抗匹配的方法, 其特征在于, 首先根 据匹配网络的输入导纳与射频源的输出导纳的实部之间的误差对第二可变阻 抗器件进行调整; 然后, 根据匹配网络的输入导纳与射频源的输出导纳的虚 部之间的误差对第一可变阻抗器件进行调整, 实现阻抗匹配控制。
5、 根据权利要求 3 所述的实现阻抗匹配的方法, 其特征在于, 根据匹 配网络的输入导纳与射频源的输出导纳的实部之间的误差对第二可变阻抗器 件进行调整; 同时, 根据匹配网络的输入导纳与射频源的输出导纳的虚部之 间的误差对第一可变阻抗器件进行调整, 实现阻抗匹配控制。
6、 一种射频阻抗匹配系统, 包括射频源、 负载, 其特征在于, 所述的 射频源通过匹配网络与所述负载连接, 所述匹配网络包括阻抗检测器、 控制 器、 可变阻抗器件, 所述阻抗检测器检测匹配网络的输入阻抗, 并换算出所 述匹配网络的输入导纳, 之后将所述输入导纳传输给控制器; 所述控制器与 所述可变阻抗器件电连接, 并将所述匹配网络的输入导纳与所述射频源的输 出导纳进行比较, 根据比较结果调整可变阻抗器件, 以实现射频源与负载之 间的阻抗匹配。
7、 根据权利要求 6所述的射频阻抗匹配系统, 其特征在于, 所述的可 变阻抗器件包括与所述负载并联的第一可变阻抗器件和与所述负载串联的第 二可变阻抗器件。
8、 根据权利要求 7所述的射频阻抗匹配系统, 其特征在于, 所述控制 器将匹配网络的输入导纳与射频源的输出导纳的实部和虚部单独进行比较, 并根据比较的结果对第一可变阻抗器件和第二可变阻抗器件进行调整。
9、 根据权利要求 8所述的射频阻抗匹配系统, 其特征在于, 所述控制 器釆用下述方式之一对第一可变阻抗器件和第二可变阻抗器件进行调整: 首先根据匹配网络的输入导纳与射频源的输出导纳的实部之间的误差 对第二可变阻抗器件进行调整; 然后, 根据匹配网络的输入导纳与射频源的 输出导纳的虚部之间的误差对第一可变阻抗器件进行调整, 实现阻抗匹配控 制; 或者
根据匹配网络的输入导纳与射频源的输出导纳的实部之间的误差对第 二可变阻抗器件进行调整; 同时, 根据匹配网络的输入导纳与射频源的输出 导纳的虚部之间的误差对第一可变阻抗器件进行调整, 实现阻抗匹配控制。
10、 根据权利要求 6至 9中任意一项所述的射频阻抗匹配系统, 其特征 在于, 所述的负载为等离子体发生装置的反应腔室。
11、 根据权利要求 6至 9中任意一项所述的射频阻抗匹配系统, 其特征 在于,
PCT/CN2008/071891 2007-08-20 2008-08-06 Method of realizing the impedance matching of rf and rf impedance matching system Ceased WO2009024051A1 (en)

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