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WO2009019903A1 - Fusible sur puce et son procédé de fabrication - Google Patents

Fusible sur puce et son procédé de fabrication Download PDF

Info

Publication number
WO2009019903A1
WO2009019903A1 PCT/JP2008/053547 JP2008053547W WO2009019903A1 WO 2009019903 A1 WO2009019903 A1 WO 2009019903A1 JP 2008053547 W JP2008053547 W JP 2008053547W WO 2009019903 A1 WO2009019903 A1 WO 2009019903A1
Authority
WO
WIPO (PCT)
Prior art keywords
fuse
heat storage
storage layer
electrode portions
element portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/053547
Other languages
English (en)
Japanese (ja)
Inventor
Katsuya Yamagishi
Hideki Seino
Hitoshi Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kamaya Electric Co Ltd
Original Assignee
Kamaya Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kamaya Electric Co Ltd filed Critical Kamaya Electric Co Ltd
Priority to CN2008800004039A priority Critical patent/CN101542670B/zh
Publication of WO2009019903A1 publication Critical patent/WO2009019903A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/0411—Miniature fuses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/0039—Means for influencing the rupture process of the fusible element
    • H01H85/0047—Heating means
    • H01H85/0056—Heat conducting or heat absorbing means associated with the fusible member, e.g. for providing time delay
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05—Component parts thereof
    • H01H85/055—Fusible members
    • H01H85/08—Fusible members characterised by the shape or form of the fusible member
    • H01H85/10—Fusible members characterised by the shape or form of the fusible member with constriction for localised fusing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/0411—Miniature fuses
    • H01H2085/0414—Surface mounted fuses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/046—Fuses formed as printed circuits

Landscapes

  • Fuses (AREA)

Abstract

L'invention porte sur un fusible sur puce qui a une augmentation de température supprimée en fonctionnement stable dans une région de courant nominal élevé, a des caractéristiques de fusion de type à retard et a un rendement élevé, et sur son procédé de fabrication. Dans le fusible sur puce, une couche de stockage de chaleur (12) est formée sur un substrat d'isolation (11), et un film de fusible (13) est formé sur la couche de stockage de chaleur (12) de façon à ne pas être en contact avec le substrat d'isolation (11). Le film de fusible (13) consiste en des parties d'électrode avant (12a) disposées sur les deux côtés et une partie d'élément fusible (13b) formée entre les parties d'électrode avant (13a). Une couche de protection (15) faite d'un matériau ayant une conductivité thermique supérieure à celle de la couche de stockage de chaleur (12) est formée entre les parties d'électrode avant (13a), recouvrant la partie d'élément fusible (13b). Par formation de la couche de stockage de chaleur (12) dans une dimension de façon à ne pas recouvrir la zone entière (11a) dans laquelle la partie d'élément fusible (13b) doit être formée, la couche de protection (15) est partiellement amenée en contact avec le substrat d'isolation.
PCT/JP2008/053547 2007-08-08 2008-02-28 Fusible sur puce et son procédé de fabrication Ceased WO2009019903A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2008800004039A CN101542670B (zh) 2007-08-08 2008-02-28 芯片熔丝及其制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007206314A JP4510858B2 (ja) 2007-08-08 2007-08-08 チップヒューズ及びその製造方法
JP2007-206314 2007-08-08

Publications (1)

Publication Number Publication Date
WO2009019903A1 true WO2009019903A1 (fr) 2009-02-12

Family

ID=40341142

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/053547 Ceased WO2009019903A1 (fr) 2007-08-08 2008-02-28 Fusible sur puce et son procédé de fabrication

Country Status (4)

Country Link
JP (1) JP4510858B2 (fr)
KR (1) KR101037300B1 (fr)
CN (1) CN101542670B (fr)
WO (1) WO2009019903A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2573790A1 (fr) * 2011-09-26 2013-03-27 Siemens Aktiengesellschaft Élément de fusible
EP2864996A2 (fr) * 2012-08-24 2015-04-29 Siemens Aktiengesellschaft Élément fusible

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5306139B2 (ja) * 2009-10-08 2013-10-02 北陸電気工業株式会社 チップヒューズ
KR101706875B1 (ko) * 2012-09-28 2017-02-14 가마야 덴끼 가부시끼가이샤 칩 퓨즈 및 그 제조 방법
JP6739922B2 (ja) * 2015-10-27 2020-08-12 デクセリアルズ株式会社 ヒューズ素子
CN105655213A (zh) * 2016-04-08 2016-06-08 长沙三瑞传感技术有限公司 一种过流保护用熔断器及其制作方法
JP7368144B2 (ja) * 2019-08-27 2023-10-24 Koa株式会社 チップ型電流ヒューズ
JP7729689B2 (ja) 2021-10-28 2025-08-26 エルジー エナジー ソリューション リミテッド パターンヒューズ及びその製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000260765A (ja) * 1999-03-05 2000-09-22 Matsushita Electronics Industry Corp 有機絶縁膜のパターン形成方法
JP2000331590A (ja) * 1999-03-18 2000-11-30 Koa Corp 回路保護素子及びその製造方法
JP2003165239A (ja) * 2001-11-29 2003-06-10 Kyocera Corp サーマルヘッドの製造方法
JP2004319168A (ja) * 2003-04-14 2004-11-11 Kamaya Denki Kk チップヒューズ及びその製造方法
JP2006344477A (ja) * 2005-06-08 2006-12-21 Mitsubishi Materials Corp チップ型ヒューズ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5552757A (en) * 1994-05-27 1996-09-03 Littelfuse, Inc. Surface-mounted fuse device
JPH0963454A (ja) * 1995-08-29 1997-03-07 Kyocera Corp チップヒューズ
US7570148B2 (en) * 2002-01-10 2009-08-04 Cooper Technologies Company Low resistance polymer matrix fuse apparatus and method
DE102004033251B3 (de) * 2004-07-08 2006-03-09 Vishay Bccomponents Beyschlag Gmbh Schmelzsicherung für einem Chip
CN100555500C (zh) * 2006-09-04 2009-10-28 广东风华高新科技股份有限公司 厚膜片式保险丝及其制造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000260765A (ja) * 1999-03-05 2000-09-22 Matsushita Electronics Industry Corp 有機絶縁膜のパターン形成方法
JP2000331590A (ja) * 1999-03-18 2000-11-30 Koa Corp 回路保護素子及びその製造方法
JP2003165239A (ja) * 2001-11-29 2003-06-10 Kyocera Corp サーマルヘッドの製造方法
JP2004319168A (ja) * 2003-04-14 2004-11-11 Kamaya Denki Kk チップヒューズ及びその製造方法
JP2006344477A (ja) * 2005-06-08 2006-12-21 Mitsubishi Materials Corp チップ型ヒューズ

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2573790A1 (fr) * 2011-09-26 2013-03-27 Siemens Aktiengesellschaft Élément de fusible
EP2864996A2 (fr) * 2012-08-24 2015-04-29 Siemens Aktiengesellschaft Élément fusible
US9893513B2 (en) 2012-08-24 2018-02-13 Siemens Aktiengesellschaft Fuse element

Also Published As

Publication number Publication date
CN101542670A (zh) 2009-09-23
JP4510858B2 (ja) 2010-07-28
KR20090040249A (ko) 2009-04-23
JP2009043513A (ja) 2009-02-26
KR101037300B1 (ko) 2011-05-26
CN101542670B (zh) 2012-06-20

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