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WO2009017001A1 - 回路部材の接続構造 - Google Patents

回路部材の接続構造 Download PDF

Info

Publication number
WO2009017001A1
WO2009017001A1 PCT/JP2008/063170 JP2008063170W WO2009017001A1 WO 2009017001 A1 WO2009017001 A1 WO 2009017001A1 JP 2008063170 W JP2008063170 W JP 2008063170W WO 2009017001 A1 WO2009017001 A1 WO 2009017001A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit
circuit member
connecting structure
electrode
circuit electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/063170
Other languages
English (en)
French (fr)
Inventor
Kazuyoshi Kojima
Kouji Kobayashi
Motohiro Arifuku
Nichiomi Mochizuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2009525351A priority Critical patent/JPWO2009017001A1/ja
Priority to CN200880022959.8A priority patent/CN101690425A/zh
Publication of WO2009017001A1 publication Critical patent/WO2009017001A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Combinations Of Printed Boards (AREA)
  • Conductive Materials (AREA)
  • Multi-Conductor Connections (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

　第１の回路電極３２を有する第１の回路部材３０と、第１の回路部材３０に対向し、第２の回路電極４２を有する第２の回路部材４０との間に、複数の導電粒子１２を含有する回路接続材料が介在して、第１の回路電極３２と第２の回路電極４２とが電気的に導通する回路部材の接続構造１において、第１の回路電極３２と第２の回路電極４２とが２個の導電粒子１２を介して導通する接続箇所を少なくとも１箇所備え、導電粒子１２の最外層２２の一部が外側に突出して複数の突起部１４が形成されており、最外層２２が、ビッカス硬度が３００Ｈｖ以上である金属からなる、ことを特徴とする回路部材の接続構造１。
PCT/JP2008/063170 2007-07-27 2008-07-23 回路部材の接続構造 Ceased WO2009017001A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009525351A JPWO2009017001A1 (ja) 2007-07-27 2008-07-23 回路部材の接続構造
CN200880022959.8A CN101690425A (zh) 2007-07-27 2008-07-23 电路部件的连接结构

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007195764 2007-07-27
JP2007-195764 2007-07-27
JP2008144852 2008-06-02
JP2008-144852 2008-06-02

Publications (1)

Publication Number Publication Date
WO2009017001A1 true WO2009017001A1 (ja) 2009-02-05

Family

ID=40304233

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/063170 Ceased WO2009017001A1 (ja) 2007-07-27 2008-07-23 回路部材の接続構造

Country Status (5)

Country Link
JP (1) JPWO2009017001A1 (ja)
KR (1) KR20100039419A (ja)
CN (1) CN101690425A (ja)
TW (1) TW200924569A (ja)
WO (1) WO2009017001A1 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011012180A (ja) * 2009-07-02 2011-01-20 Hitachi Chem Co Ltd 回路接続材料及び回路接続構造体
JP2011066015A (ja) * 2010-12-21 2011-03-31 Sony Chemical & Information Device Corp 導電性粒子、異方性導電材料及び接続構造体
JP2012155950A (ja) * 2011-01-25 2012-08-16 Sekisui Chem Co Ltd 導電性粒子、異方性導電材料及び接続構造体
EP2230687A3 (de) * 2009-03-18 2012-12-05 Smartrac IP B.V. Schaltungsanordnung, Verfahren zum elektrischen und/oder mechanischen Verbinden und Vorrichtung zum Aufbringen von Verbindungselementen
WO2018168627A1 (ja) * 2017-03-14 2018-09-20 パナソニックＩｐマネジメント株式会社 タッチセンサ
WO2025206141A1 (ja) * 2024-03-29 2025-10-02 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109564240A (zh) * 2016-08-08 2019-04-02 积水化学工业株式会社 导通检测装置用部件和导通检测装置
CN114371578A (zh) * 2021-12-23 2022-04-19 长沙惠科光电有限公司 显示面板及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000171823A (ja) * 1998-12-03 2000-06-23 Casio Comput Co Ltd 液晶表示素子
JP2000340926A (ja) * 1999-05-26 2000-12-08 Process Lab Micron:Kk 金属・プラスチックハイブリッド構造印刷版の製造方法
JP2005166438A (ja) * 2003-12-02 2005-06-23 Hitachi Chem Co Ltd 回路接続材料、及びこれを用いた回路部材の接続構造

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007242307A (ja) * 2006-03-06 2007-09-20 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000171823A (ja) * 1998-12-03 2000-06-23 Casio Comput Co Ltd 液晶表示素子
JP2000340926A (ja) * 1999-05-26 2000-12-08 Process Lab Micron:Kk 金属・プラスチックハイブリッド構造印刷版の製造方法
JP2005166438A (ja) * 2003-12-02 2005-06-23 Hitachi Chem Co Ltd 回路接続材料、及びこれを用いた回路部材の接続構造

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2230687A3 (de) * 2009-03-18 2012-12-05 Smartrac IP B.V. Schaltungsanordnung, Verfahren zum elektrischen und/oder mechanischen Verbinden und Vorrichtung zum Aufbringen von Verbindungselementen
JP2011012180A (ja) * 2009-07-02 2011-01-20 Hitachi Chem Co Ltd 回路接続材料及び回路接続構造体
JP2011066015A (ja) * 2010-12-21 2011-03-31 Sony Chemical & Information Device Corp 導電性粒子、異方性導電材料及び接続構造体
JP2012155950A (ja) * 2011-01-25 2012-08-16 Sekisui Chem Co Ltd 導電性粒子、異方性導電材料及び接続構造体
WO2018168627A1 (ja) * 2017-03-14 2018-09-20 パナソニックＩｐマネジメント株式会社 タッチセンサ
WO2025206141A1 (ja) * 2024-03-29 2025-10-02 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP7792048B1 (ja) * 2024-03-29 2025-12-24 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体

Also Published As

Publication number Publication date
CN101690425A (zh) 2010-03-31
KR20100039419A (ko) 2010-04-15
TW200924569A (en) 2009-06-01
JPWO2009017001A1 (ja) 2010-10-21

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