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WO2009014126A1 - 多層配線基板 - Google Patents

多層配線基板 Download PDF

Info

Publication number
WO2009014126A1
WO2009014126A1 PCT/JP2008/063144 JP2008063144W WO2009014126A1 WO 2009014126 A1 WO2009014126 A1 WO 2009014126A1 JP 2008063144 W JP2008063144 W JP 2008063144W WO 2009014126 A1 WO2009014126 A1 WO 2009014126A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
wiring board
multilayer wiring
cavity
laminated body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/063144
Other languages
English (en)
French (fr)
Inventor
Tsuyoshi Suesada
Norio Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of WO2009014126A1 publication Critical patent/WO2009014126A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1003—Non-printed inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H10W90/724—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

　積層体の凹部から突出する高さを有する電子部品を搭載することができ、実装用基板に実装した状態で小型化及び低背化を実現することができる多層配線基板を提供する。 　本発明の多層配線基板１０は、多層配線基板１０は、複数の基材層１１Ａが積層されてなる積層体１１と、積層体１１の下面に形成されたキャビティ１１Ｂと、キャビティ１１Ｂ内に搭載された第１の電子部品（例えば、巻線型インダクタ）１３と、積層体１１の上面に搭載された第２の電子部品（例えば、半導体素子）１４と、を備え、第１の電子部品１３はキャビティ１１Ｂから突出する高さを有する電子部品（例えば、巻線型インダクタ）からなり、マザーボード２０は第１の電子部品１３のキャビティ１１Ｂからの突出部分を収容する凹陥部２０Ａを有する。
PCT/JP2008/063144 2007-07-23 2008-07-23 多層配線基板 Ceased WO2009014126A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-191472 2007-07-23
JP2007191472 2007-07-23

Publications (1)

Publication Number Publication Date
WO2009014126A1 true WO2009014126A1 (ja) 2009-01-29

Family

ID=40281377

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/063144 Ceased WO2009014126A1 (ja) 2007-07-23 2008-07-23 多層配線基板

Country Status (1)

Country Link
WO (1) WO2009014126A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013036394A (ja) * 2011-08-08 2013-02-21 Sanden Corp 電動圧縮機の電気回路耐振構造
WO2015033704A1 (ja) * 2013-09-05 2015-03-12 株式会社村田製作所 コンデンサ内蔵電子部品
CN105101636A (zh) * 2014-05-23 2015-11-25 三星电机株式会社 印刷电路板、其制造方法及具有印刷电路板的堆叠封装件
JP2018006408A (ja) * 2016-06-28 2018-01-11 株式会社ジェイデバイス 半導体パッケージ及びその製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0467372U (ja) * 1990-10-23 1992-06-15
WO2001048821A1 (fr) * 1999-12-27 2001-07-05 Mitsubishi Denki Kabushiki Kaisha Circuit integre
JP2004128413A (ja) * 2002-10-07 2004-04-22 Sanyo Electric Co Ltd 積層モジュール
JP2004128002A (ja) * 2002-09-30 2004-04-22 Taiyo Yuden Co Ltd 電子部品内蔵型多層基板
JP2004304159A (ja) * 2003-03-19 2004-10-28 Ngk Spark Plug Co Ltd 中継基板、半導体素子付き中継基板、中継基板付き基板、半導体素子と中継基板と基板とからなる構造体

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0467372U (ja) * 1990-10-23 1992-06-15
WO2001048821A1 (fr) * 1999-12-27 2001-07-05 Mitsubishi Denki Kabushiki Kaisha Circuit integre
JP2004128002A (ja) * 2002-09-30 2004-04-22 Taiyo Yuden Co Ltd 電子部品内蔵型多層基板
JP2004128413A (ja) * 2002-10-07 2004-04-22 Sanyo Electric Co Ltd 積層モジュール
JP2004304159A (ja) * 2003-03-19 2004-10-28 Ngk Spark Plug Co Ltd 中継基板、半導体素子付き中継基板、中継基板付き基板、半導体素子と中継基板と基板とからなる構造体

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013036394A (ja) * 2011-08-08 2013-02-21 Sanden Corp 電動圧縮機の電気回路耐振構造
WO2015033704A1 (ja) * 2013-09-05 2015-03-12 株式会社村田製作所 コンデンサ内蔵電子部品
JP5725268B1 (ja) * 2013-09-05 2015-05-27 株式会社村田製作所 コンデンサ内蔵電子部品
US9668353B2 (en) 2013-09-05 2017-05-30 Murata Manufacturing Co., Ltd. Electronic component with built-in capacitor
CN105101636A (zh) * 2014-05-23 2015-11-25 三星电机株式会社 印刷电路板、其制造方法及具有印刷电路板的堆叠封装件
JP2018006408A (ja) * 2016-06-28 2018-01-11 株式会社ジェイデバイス 半導体パッケージ及びその製造方法

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