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WO2009008448A1 - Adhésif pour la connexion d'éléments de circuit - Google Patents

Adhésif pour la connexion d'éléments de circuit Download PDF

Info

Publication number
WO2009008448A1
WO2009008448A1 PCT/JP2008/062402 JP2008062402W WO2009008448A1 WO 2009008448 A1 WO2009008448 A1 WO 2009008448A1 JP 2008062402 W JP2008062402 W JP 2008062402W WO 2009008448 A1 WO2009008448 A1 WO 2009008448A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit member
member connection
adhesive
thermally crosslinkable
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/062402
Other languages
English (en)
Japanese (ja)
Inventor
Akira Nagai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2009522658A priority Critical patent/JP5557526B2/ja
Priority to CN200880023514A priority patent/CN101689518A/zh
Priority to KR1020127016495A priority patent/KR20120089347A/ko
Publication of WO2009008448A1 publication Critical patent/WO2009008448A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H10W72/30—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H10W72/01336—
    • H10W72/073—
    • H10W72/07338—
    • H10W72/322—
    • H10W72/354—
    • H10W74/00—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Adhesive Tapes (AREA)

Abstract

L'invention concerne un adhésif thermodurcissable pour la connexion d'éléments de circuit, qui est composé d'une composition résineuse contenant une résine thermiquement réticulable et un agent de durcissement qui réagit avec la résine thermiquement réticulable et les particules d'oxydes complexes dispersées dans la composition résineuse.
PCT/JP2008/062402 2007-07-11 2008-07-09 Adhésif pour la connexion d'éléments de circuit Ceased WO2009008448A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009522658A JP5557526B2 (ja) 2007-07-11 2008-07-09 回路部材接続用接着剤及び半導体装置
CN200880023514A CN101689518A (zh) 2007-07-11 2008-07-09 电路部件连接用粘接剂
KR1020127016495A KR20120089347A (ko) 2007-07-11 2008-07-09 회로 부재 접속용 접착제

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007182110 2007-07-11
JP2007-182110 2007-07-11

Publications (1)

Publication Number Publication Date
WO2009008448A1 true WO2009008448A1 (fr) 2009-01-15

Family

ID=40228619

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062402 Ceased WO2009008448A1 (fr) 2007-07-11 2008-07-09 Adhésif pour la connexion d'éléments de circuit

Country Status (5)

Country Link
JP (2) JP5557526B2 (fr)
KR (2) KR20120089347A (fr)
CN (2) CN102157407B (fr)
TW (1) TWI425598B (fr)
WO (1) WO2009008448A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010131575A1 (fr) * 2009-05-13 2010-11-18 日立化成工業株式会社 Composition d'adhésif, feuille adhésive pour élément de connexion d'un circuit et procédé pour la fabrication d'un dispositif à semi-conducteur
JP2010278324A (ja) * 2009-05-29 2010-12-09 Hitachi Chem Co Ltd 接着剤組成物、接着シート及び半導体装置
JP2012007007A (ja) * 2010-06-22 2012-01-12 Shin-Etsu Chemical Co Ltd ダイボンド剤組成物及び半導体装置。
JP2012520387A (ja) * 2009-03-16 2012-09-06 ロックタイト （アール アンド ディー） リミテッド 基体へのエラストマーの接合
CN103740309A (zh) * 2013-12-10 2014-04-23 江苏瑞德新能源科技有限公司 一种可修复导电胶及其制备方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011102404A (ja) * 2011-02-17 2011-05-26 Sony Chemical & Information Device Corp 異方性導電フィルム
CN102408679B (zh) * 2011-08-29 2012-12-26 天威新能源控股有限公司 一种环氧树脂复合材料
JP6017134B2 (ja) 2011-12-13 2016-10-26 東京エレクトロン株式会社 生産効率化システム、生産効率化装置および生産効率化方法
US20150371916A1 (en) * 2014-06-23 2015-12-24 Rohm And Haas Electronic Materials Llc Pre-applied underfill
CN104952702B (zh) * 2015-05-15 2017-11-28 张家港康得新光电材料有限公司 半导体器件及其制作方法
JP2025024833A (ja) * 2023-08-08 2025-02-21 株式会社レゾナック 接着剤フィルム、金属層付き接着剤フィルム、配線形成用部材、配線層の形成方法、及び、配線形成部材

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0741544A (ja) * 1993-08-02 1995-02-10 Tokuyama Corp エポキシ樹脂組成物及び光半導体装置
WO2006132165A1 (fr) * 2005-06-06 2006-12-14 Toray Industries, Inc. Composition adhésive pour semi-conducteur, dispositif semi-conducteur utilisant ladite composition et processus de fabrication de dispositif semi-conducteur

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6645632B2 (en) * 2000-03-15 2003-11-11 Shin-Etsu Chemical Co., Ltd. Film-type adhesive for electronic components, and electronic components bonded therewith
JP4240460B2 (ja) * 2003-03-06 2009-03-18 ソニーケミカル＆インフォメーションデバイス株式会社 接着剤、接着剤の製造方法及び電気装置
JP4171898B2 (ja) * 2003-04-25 2008-10-29 信越化学工業株式会社 ダイシング・ダイボンド用接着テープ
JP4235808B2 (ja) * 2003-09-19 2009-03-11 信越化学工業株式会社 接着剤組成物及び接着フィルム
JP4810911B2 (ja) * 2005-07-26 2011-11-09 パナソニック電工株式会社 エポキシ樹脂組成物、エポキシ樹脂フィルム、光導波路、光・電気混載配線基板並びに電子デバイス
KR101018273B1 (ko) * 2005-09-22 2011-03-04 독립행정법인 산업기술종합연구소 점토 박막 기판, 전극부착 점토 박막 기판 및 이들을이용한 표시소자

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0741544A (ja) * 1993-08-02 1995-02-10 Tokuyama Corp エポキシ樹脂組成物及び光半導体装置
WO2006132165A1 (fr) * 2005-06-06 2006-12-14 Toray Industries, Inc. Composition adhésive pour semi-conducteur, dispositif semi-conducteur utilisant ladite composition et processus de fabrication de dispositif semi-conducteur

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012520387A (ja) * 2009-03-16 2012-09-06 ロックタイト （アール アンド ディー） リミテッド 基体へのエラストマーの接合
WO2010131575A1 (fr) * 2009-05-13 2010-11-18 日立化成工業株式会社 Composition d'adhésif, feuille adhésive pour élément de connexion d'un circuit et procédé pour la fabrication d'un dispositif à semi-conducteur
JP2010285602A (ja) * 2009-05-13 2010-12-24 Hitachi Chem Co Ltd 接着剤組成物、回路部材接続用接着剤シート及び半導体装置の製造方法
JP2011157552A (ja) * 2009-05-13 2011-08-18 Hitachi Chem Co Ltd 接着剤組成物、回路部材接続用接着剤シート及び半導体装置の製造方法
JP2010278324A (ja) * 2009-05-29 2010-12-09 Hitachi Chem Co Ltd 接着剤組成物、接着シート及び半導体装置
JP2012007007A (ja) * 2010-06-22 2012-01-12 Shin-Etsu Chemical Co Ltd ダイボンド剤組成物及び半導体装置。
CN103740309A (zh) * 2013-12-10 2014-04-23 江苏瑞德新能源科技有限公司 一种可修复导电胶及其制备方法
CN103740309B (zh) * 2013-12-10 2015-01-21 江苏瑞德新能源科技有限公司 一种可修复导电胶及其制备方法

Also Published As

Publication number Publication date
JPWO2009008448A1 (ja) 2010-09-09
CN102157407A (zh) 2011-08-17
TW200919657A (en) 2009-05-01
KR20100033527A (ko) 2010-03-30
CN101689518A (zh) 2010-03-31
KR20120089347A (ko) 2012-08-09
CN102157407B (zh) 2014-01-08
JP5557526B2 (ja) 2014-07-23
JP2012044202A (ja) 2012-03-01
TWI425598B (zh) 2014-02-01

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