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WO2009004894A1 - 表示モジュール、液晶表示装置、及び表示モジュールの製造方法 - Google Patents

表示モジュール、液晶表示装置、及び表示モジュールの製造方法 Download PDF

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Publication number
WO2009004894A1
WO2009004894A1 PCT/JP2008/060474 JP2008060474W WO2009004894A1 WO 2009004894 A1 WO2009004894 A1 WO 2009004894A1 JP 2008060474 W JP2008060474 W JP 2008060474W WO 2009004894 A1 WO2009004894 A1 WO 2009004894A1
Authority
WO
WIPO (PCT)
Prior art keywords
liquid crystal
display module
crystal display
circuit board
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/060474
Other languages
English (en)
French (fr)
Inventor
Kohji Minamino
Suguru Kusakai
Hisao Kawaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to CN200880018769A priority Critical patent/CN101682987A/zh
Priority to EP08765287A priority patent/EP2164310A4/en
Priority to US12/663,439 priority patent/US20100182293A1/en
Priority to JP2009521563A priority patent/JPWO2009004894A1/ja
Publication of WO2009004894A1 publication Critical patent/WO2009004894A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Combinations Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

　本発明の液晶表示装置（１０）は、液晶表示パネル（１１）と、外部回路基板（１３）と、該基板の端部に接続されたフィルム状のフレキシブルプリント基板（１４）とを備えた液晶表示モジュールを有している。この液晶表示モジュールにおいて、ソースドライバＩＣ（２１）は、ＣＯＦ実装方式によって、ＴＦＴ基板（１７）と外部回路基板（１３）との間に実装されている。フレキシブルプリント基板（１４）には、外部回路基板（１３）上の外部接続端子（２４）とフレキシブルプリント基板（１４）上の外部接続端子（２３）とを接続するためのコネクタ（２２）が備えられており、このコネクタ（２２）は、外部回路基板（１３）の端部を挟み込むようにして取り付けられている。これにより、回路基板とフレキシブル基板との接続を容易に行うことができ、組み立てラインの全自動化を実現できる。
PCT/JP2008/060474 2007-07-04 2008-06-06 表示モジュール、液晶表示装置、及び表示モジュールの製造方法 Ceased WO2009004894A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN200880018769A CN101682987A (zh) 2007-07-04 2008-06-06 显示模块、液晶显示装置和显示模块的制造方法
EP08765287A EP2164310A4 (en) 2007-07-04 2008-06-06 DISPLAY MODULE, LIQUID CRYSTAL DISPLAY DEVICE, AND METHOD OF MANUFACTURING THE DISPLAY MODULE
US12/663,439 US20100182293A1 (en) 2007-07-04 2008-06-06 Display module, liquid crystal display device and method for manufacturing display module
JP2009521563A JPWO2009004894A1 (ja) 2007-07-04 2008-06-06 表示モジュール、液晶表示装置、及び表示モジュールの製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-176701 2007-07-04
JP2007176701 2007-07-04

Publications (1)

Publication Number Publication Date
WO2009004894A1 true WO2009004894A1 (ja) 2009-01-08

Family

ID=40225949

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/060474 Ceased WO2009004894A1 (ja) 2007-07-04 2008-06-06 表示モジュール、液晶表示装置、及び表示モジュールの製造方法

Country Status (5)

Country Link
US (1) US20100182293A1 (ja)
EP (1) EP2164310A4 (ja)
JP (1) JPWO2009004894A1 (ja)
CN (1) CN101682987A (ja)
WO (1) WO2009004894A1 (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013236361A (ja) * 2012-05-10 2013-11-21 Lg Innotek Co Ltd 通信モジュール及びこれを含む照明装置
WO2014144305A1 (en) * 2013-03-15 2014-09-18 Molex Incorporated Led assembly
US9042107B2 (en) 2011-04-06 2015-05-26 Sony Corporation Display device and electronic apparatus
CN105702188A (zh) * 2016-02-05 2016-06-22 昆山龙腾光电有限公司 液晶显示装置及其测试方法
CN105792516A (zh) * 2016-02-25 2016-07-20 广东欧珀移动通信有限公司 软硬结合板及移动终端
JP2018066875A (ja) * 2016-10-20 2018-04-26 三菱電機株式会社 表示装置
US10598360B2 (en) 2015-09-15 2020-03-24 Molex, Llc Semiconductor assembly

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102113064B1 (ko) 2009-09-16 2020-05-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치 및 이의 제조 방법
JP5433628B2 (ja) * 2011-05-12 2014-03-05 東芝テック株式会社 回路基板およびインクジェットヘッドの製造方法
CN102262841B (zh) * 2011-07-22 2014-11-05 友达光电（苏州）有限公司 显示模组
CN102253513A (zh) 2011-08-17 2011-11-23 深圳市华星光电技术有限公司 液晶面板的软板上芯片构造的卷带基板及液晶面板
CN106054422B (zh) * 2016-08-16 2019-03-15 凌云光技术集团有限责任公司 用于lcd的fpc自动压接点亮测试设备
JP6930685B2 (ja) * 2016-12-27 2021-09-01 イー インク コーポレイション 表示装置用回路基板、表示装置および電子機器
KR20200002194A (ko) * 2018-06-29 2020-01-08 엘지디스플레이 주식회사 집적회로, 집적회로를 갖는 회로보드 및 이를 이용한 표시장치
TWI741827B (zh) * 2020-10-12 2021-10-01 友達光電股份有限公司 顯示裝置與其連接方法
CN114982386B (zh) 2020-12-25 2025-03-28 京东方科技集团股份有限公司 柔性电路板及显示装置
TWI803378B (zh) * 2021-07-01 2023-05-21 元太科技工業股份有限公司 驅動電路薄膜以及具有驅動電路薄膜的顯示裝置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01287476A (ja) * 1988-05-16 1989-11-20 Matsushita Electric Ind Co Ltd 回路基板の電気検査装置
JPH0357887U (ja) * 1989-10-11 1991-06-04
JP2000082514A (ja) * 1998-09-02 2000-03-21 Olympus Optical Co Ltd 電気配線板の接続構造
JP2002026491A (ja) * 2000-07-06 2002-01-25 Seiko Epson Corp プリント基板のメッキ方法、実装構造体、液晶装置および液晶装置の製造方法
JP2006049514A (ja) * 2004-08-03 2006-02-16 Sharp Corp 入力用配線フィルムおよびこれを備えた表示装置
JP2007108386A (ja) * 2005-10-13 2007-04-26 Sharp Corp 表示装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0357887A (ja) * 1989-07-26 1991-03-13 Mitsubishi Electric Corp 冷媒圧縮機
JP4485708B2 (ja) * 2001-05-21 2010-06-23 シャープ株式会社 液晶表示装置用周辺回路基板及びそれを備えた液晶表示装置
JP3995505B2 (ja) * 2002-03-25 2007-10-24 三洋電機株式会社 表示方法および表示装置
DE10253717B4 (de) * 2002-11-18 2011-05-19 Applied Materials Gmbh Vorrichtung zum Kontaktieren für den Test mindestens eines Testobjekts, Testsystem und Verfahren zum Testen von Testobjekten
KR100637429B1 (ko) * 2003-10-24 2006-10-20 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
JP2006157487A (ja) * 2004-11-30 2006-06-15 Sanyo Electric Co Ltd 表示装置および携帯電話

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01287476A (ja) * 1988-05-16 1989-11-20 Matsushita Electric Ind Co Ltd 回路基板の電気検査装置
JPH0357887U (ja) * 1989-10-11 1991-06-04
JP2000082514A (ja) * 1998-09-02 2000-03-21 Olympus Optical Co Ltd 電気配線板の接続構造
JP2002026491A (ja) * 2000-07-06 2002-01-25 Seiko Epson Corp プリント基板のメッキ方法、実装構造体、液晶装置および液晶装置の製造方法
JP2006049514A (ja) * 2004-08-03 2006-02-16 Sharp Corp 入力用配線フィルムおよびこれを備えた表示装置
JP2007108386A (ja) * 2005-10-13 2007-04-26 Sharp Corp 表示装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2164310A4 *

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9042107B2 (en) 2011-04-06 2015-05-26 Sony Corporation Display device and electronic apparatus
JP2013236361A (ja) * 2012-05-10 2013-11-21 Lg Innotek Co Ltd 通信モジュール及びこれを含む照明装置
US9324231B2 (en) 2012-05-10 2016-04-26 Lg Innotek Co., Ltd. Communication module and lighting apparatus having the same
US9881493B2 (en) 2012-05-10 2018-01-30 Lg Innotek Co., Ltd. Communication module and lighting apparatus having the same
WO2014144305A1 (en) * 2013-03-15 2014-09-18 Molex Incorporated Led assembly
TWI573956B (zh) * 2013-03-15 2017-03-11 Molex Inc LED components
US10598360B2 (en) 2015-09-15 2020-03-24 Molex, Llc Semiconductor assembly
CN105702188A (zh) * 2016-02-05 2016-06-22 昆山龙腾光电有限公司 液晶显示装置及其测试方法
CN105792516A (zh) * 2016-02-25 2016-07-20 广东欧珀移动通信有限公司 软硬结合板及移动终端
CN105792516B (zh) * 2016-02-25 2018-09-04 广东欧珀移动通信有限公司 软硬结合板及移动终端
JP2018066875A (ja) * 2016-10-20 2018-04-26 三菱電機株式会社 表示装置

Also Published As

Publication number Publication date
EP2164310A4 (en) 2011-01-05
EP2164310A1 (en) 2010-03-17
JPWO2009004894A1 (ja) 2010-08-26
US20100182293A1 (en) 2010-07-22
CN101682987A (zh) 2010-03-24

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