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WO2009001850A1 - Resin composition and copper foil with resin obtained by using the resin composition - Google Patents

Resin composition and copper foil with resin obtained by using the resin composition Download PDF

Info

Publication number
WO2009001850A1
WO2009001850A1 PCT/JP2008/061529 JP2008061529W WO2009001850A1 WO 2009001850 A1 WO2009001850 A1 WO 2009001850A1 JP 2008061529 W JP2008061529 W JP 2008061529W WO 2009001850 A1 WO2009001850 A1 WO 2009001850A1
Authority
WO
WIPO (PCT)
Prior art keywords
component
resin
resin composition
copper foil
disclosed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/061529
Other languages
French (fr)
Japanese (ja)
Inventor
Tetsuro Sato
Toshifumi Matsushima
Tetsuhiro Matsunaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Kinzoku Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Priority to CN2008800220983A priority Critical patent/CN101687981B/en
Priority to JP2009520611A priority patent/JP5650908B2/en
Priority to KR1020097026807A priority patent/KR101249479B1/en
Publication of WO2009001850A1 publication Critical patent/WO2009001850A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)

Abstract

Disclosed is a resin composition which enables to form an insulating resin layer having adequate flame retardancy, while exhibiting good adhesion to a copper foil for printed wiring board production. Also disclosed is a copper foil with resin. Specifically disclosed is a resin composition for forming an insulating layer for printed wiring board, which is characterized by having a base composition containing a bisphenol epoxy resin having an epoxy equivalent of not more than 200 which is in a liquid state at 25˚C as a component A, a linear polymer having a crosslinkable functional group as a component B, a crosslinking agent as a component C, 4,4'-diaminodiphenylsulfone or 2,2-bis(4-(4-aminophenoxy)phenyl)propane as a component D, a flame-retardant epoxy resin as a component E, and a polyfunctional epoxy resin as a component F.
PCT/JP2008/061529 2007-06-25 2008-06-25 Resin composition and copper foil with resin obtained by using the resin composition Ceased WO2009001850A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2008800220983A CN101687981B (en) 2007-06-25 2008-06-25 Resin composition and copper foil with resin obtained by using the resin composition
JP2009520611A JP5650908B2 (en) 2007-06-25 2008-06-25 Resin composition and copper foil with resin obtained using the resin composition
KR1020097026807A KR101249479B1 (en) 2007-06-25 2008-06-25 Resin composition and copper foil with resin obtained by using the resin composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007166869 2007-06-25
JP2007-166869 2007-06-25

Publications (1)

Publication Number Publication Date
WO2009001850A1 true WO2009001850A1 (en) 2008-12-31

Family

ID=40185663

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/061529 Ceased WO2009001850A1 (en) 2007-06-25 2008-06-25 Resin composition and copper foil with resin obtained by using the resin composition

Country Status (6)

Country Link
JP (1) JP5650908B2 (en)
KR (1) KR101249479B1 (en)
CN (1) CN101687981B (en)
MY (1) MY150635A (en)
TW (1) TW200916525A (en)
WO (1) WO2009001850A1 (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012007091A (en) * 2010-06-25 2012-01-12 Panasonic Electric Works Co Ltd Epoxy resin composition for sealing semiconductor and semiconductor device using the same
WO2012017909A1 (en) * 2010-08-03 2012-02-09 三井金属鉱業株式会社 Method for producing printed wiring board, and printed wiring board
CN102585440A (en) * 2012-01-16 2012-07-18 广州宏仁电子工业有限公司 High-CTI (comparative tracking index) halogen-free flame retardant resin composition for copper-clad laminate
WO2015012376A1 (en) 2013-07-24 2015-01-29 Jx日鉱日石金属株式会社 Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed circuit board, copper-clad laminate, and method for manufacturing printed circuit board
WO2015012327A1 (en) 2013-07-23 2015-01-29 Jx日鉱日石金属株式会社 Treated surface copper foil, copper foil with carrier, substrate, resin substrate, printed circuit board, copper clad laminate, and printed circuit board manufacturing method
EP3046400A2 (en) 2015-01-16 2016-07-20 JX Nippon Mining & Metals Corporation Copper foil provided with carrier, laminate, printed wiring board, electronic device, and method for fabricating printed wiring board
EP3048864A2 (en) 2015-01-21 2016-07-27 JX Nippon Mining & Metals Corporation Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board
EP3054751A2 (en) 2015-02-06 2016-08-10 JX Nippon Mining & Metals Corporation Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board
JPWO2014106955A1 (en) * 2013-01-07 2017-01-19 株式会社ニコン Composition, laminate, method for producing laminate, transistor and method for producing transistor
WO2017161120A1 (en) * 2016-03-17 2017-09-21 Qed Labs Inc. Articles with improved flame retardancy and/or melt dripping properties
EP3232747A1 (en) 2016-04-15 2017-10-18 JX Nippon Mining & Metals Corp. Copper foil, copper foil for high-frequency circuit, carrier-attached copper foil, carrier-attached copper foil for high-frequency circuit, laminate, method of manufacturing printed wiring board, and method of manufacturing electronic device
CN118638145A (en) * 2024-08-13 2024-09-13 上海赭滢宏新材料科技有限公司 A coupling agent for flame-retardant polyethylene cable material and preparation method thereof

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101439496B1 (en) * 2009-12-22 2014-09-12 에스케이이노베이션 주식회사 Polyamic acid composition, method for preparing the same and polyimide metal clad laminate the same
CN102504197B (en) * 2011-10-10 2013-08-21 北京新福润达绝缘材料有限责任公司 Halogen-free epoxy resin composition with high proof tracking index and application thereof
CN102585663B (en) * 2012-02-06 2013-11-20 苏州太湖电工新材料股份有限公司 Halogen-free flame-retardant high-temperature-resistance insulation paint for motor
KR102135414B1 (en) * 2013-12-20 2020-07-17 엘지이노텍 주식회사 Liquid crystal polymer resin composite and printed circuit board comprising isolation using the same
KR102113190B1 (en) * 2013-12-20 2020-05-20 엘지이노텍 주식회사 Liquid crystal polymer resin composite and printed circuit board comprising isolation using the same
KR102172298B1 (en) * 2014-03-17 2020-10-30 엘지이노텍 주식회사 Epoxy resin composite and printed curcuit board comprising insulating layer using the same
KR102172297B1 (en) * 2014-04-17 2020-10-30 엘지이노텍 주식회사 Epoxy resin composite and printed curcuit board comprising insulating layer using the same
JP7312931B2 (en) * 2016-09-28 2023-07-24 東特塗料株式会社 electric insulated wire
CN106564240B (en) * 2016-11-07 2018-08-31 北京新福润达绝缘材料有限责任公司 A kind of preparation method of high anti creepage trace glass felt layers pressing plate
US10899871B2 (en) * 2019-04-23 2021-01-26 Chang Chun Plastics Co., Ltd. Phosphorous containing epoxy resins and process for synthesis

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08193188A (en) * 1995-01-18 1996-07-30 Mitsui Mining & Smelting Co Ltd Adhesive for copper foil and copper foil with the adhesive
JPH11186724A (en) * 1997-12-25 1999-07-09 Sumitomo Bakelite Co Ltd Manufacturing multilayered printed wiring board
JPH11186723A (en) * 1997-12-25 1999-07-09 Sumitomo Bakelite Co Ltd Manufacturing multilayered printed wiring board
JPH11279258A (en) * 1998-01-27 1999-10-12 Toto Kasei Co Ltd Phosphorus-containing epoxy resin composition
JP2001181593A (en) * 1999-12-28 2001-07-03 Kashima Oil Co Ltd Thermosetting adhesive and flexible printed wiring board material using the same
JP2002128867A (en) * 2000-10-20 2002-05-09 Nikko Materials Co Ltd Phenolic curing agent for epoxy resin and epoxy resin composition using the same
JP2005132925A (en) * 2003-10-29 2005-05-26 Matsushita Electric Works Ltd Epoxy resin composition and prepreg, metal-foil-clad laminate, and metal-foil-fitted resin sheet using the same
JP2005213352A (en) * 2004-01-29 2005-08-11 Arisawa Mfg Co Ltd Prepreg resin composition and prepreg using the same
JP2005314449A (en) * 2004-04-27 2005-11-10 Nikko Materials Co Ltd Additive for resin
JP2006328214A (en) * 2005-05-26 2006-12-07 Tamura Kaken Co Ltd Thermosetting resin composition, resin film and product with film
JP2007099956A (en) * 2005-10-06 2007-04-19 Tamura Kaken Co Ltd Thermosetting resin composition, resin film and structure

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08193188A (en) * 1995-01-18 1996-07-30 Mitsui Mining & Smelting Co Ltd Adhesive for copper foil and copper foil with the adhesive
JPH11186724A (en) * 1997-12-25 1999-07-09 Sumitomo Bakelite Co Ltd Manufacturing multilayered printed wiring board
JPH11186723A (en) * 1997-12-25 1999-07-09 Sumitomo Bakelite Co Ltd Manufacturing multilayered printed wiring board
JPH11279258A (en) * 1998-01-27 1999-10-12 Toto Kasei Co Ltd Phosphorus-containing epoxy resin composition
JP2001181593A (en) * 1999-12-28 2001-07-03 Kashima Oil Co Ltd Thermosetting adhesive and flexible printed wiring board material using the same
JP2002128867A (en) * 2000-10-20 2002-05-09 Nikko Materials Co Ltd Phenolic curing agent for epoxy resin and epoxy resin composition using the same
JP2005132925A (en) * 2003-10-29 2005-05-26 Matsushita Electric Works Ltd Epoxy resin composition and prepreg, metal-foil-clad laminate, and metal-foil-fitted resin sheet using the same
JP2005213352A (en) * 2004-01-29 2005-08-11 Arisawa Mfg Co Ltd Prepreg resin composition and prepreg using the same
JP2005314449A (en) * 2004-04-27 2005-11-10 Nikko Materials Co Ltd Additive for resin
JP2006328214A (en) * 2005-05-26 2006-12-07 Tamura Kaken Co Ltd Thermosetting resin composition, resin film and product with film
JP2007099956A (en) * 2005-10-06 2007-04-19 Tamura Kaken Co Ltd Thermosetting resin composition, resin film and structure

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012007091A (en) * 2010-06-25 2012-01-12 Panasonic Electric Works Co Ltd Epoxy resin composition for sealing semiconductor and semiconductor device using the same
WO2012017909A1 (en) * 2010-08-03 2012-02-09 三井金属鉱業株式会社 Method for producing printed wiring board, and printed wiring board
JP2012038772A (en) * 2010-08-03 2012-02-23 Mitsui Mining & Smelting Co Ltd Printed wiring board manufacturing method and printed wiring board
US9144157B2 (en) 2010-08-03 2015-09-22 Mitsui Mining & Smelting Co., Ltd. Manufacturing method of printed wiring board and printed wiring board
CN102585440A (en) * 2012-01-16 2012-07-18 广州宏仁电子工业有限公司 High-CTI (comparative tracking index) halogen-free flame retardant resin composition for copper-clad laminate
CN102585440B (en) * 2012-01-16 2013-09-04 广州宏仁电子工业有限公司 High-CTI (comparative tracking index) halogen-free flame retardant resin composition for copper-clad laminate
JPWO2014106955A1 (en) * 2013-01-07 2017-01-19 株式会社ニコン Composition, laminate, method for producing laminate, transistor and method for producing transistor
US10510460B2 (en) 2013-01-07 2019-12-17 Nikon Corporation Composition, laminate, method of manufacturing laminate, transistor, and method of manufacturing transistor
WO2015012327A1 (en) 2013-07-23 2015-01-29 Jx日鉱日石金属株式会社 Treated surface copper foil, copper foil with carrier, substrate, resin substrate, printed circuit board, copper clad laminate, and printed circuit board manufacturing method
WO2015012376A1 (en) 2013-07-24 2015-01-29 Jx日鉱日石金属株式会社 Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed circuit board, copper-clad laminate, and method for manufacturing printed circuit board
EP3046400A2 (en) 2015-01-16 2016-07-20 JX Nippon Mining & Metals Corporation Copper foil provided with carrier, laminate, printed wiring board, electronic device, and method for fabricating printed wiring board
EP3048864A2 (en) 2015-01-21 2016-07-27 JX Nippon Mining & Metals Corporation Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board
EP3054751A2 (en) 2015-02-06 2016-08-10 JX Nippon Mining & Metals Corporation Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board
US9839124B2 (en) 2015-02-06 2017-12-05 Jx Nippon Mining & Metals Corporation Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board
WO2017161120A1 (en) * 2016-03-17 2017-09-21 Qed Labs Inc. Articles with improved flame retardancy and/or melt dripping properties
US11008458B2 (en) 2016-03-17 2021-05-18 Qed Labs Inc. Articles with improved flame retardancy and/or melt dripping properties
EP3232747A1 (en) 2016-04-15 2017-10-18 JX Nippon Mining & Metals Corp. Copper foil, copper foil for high-frequency circuit, carrier-attached copper foil, carrier-attached copper foil for high-frequency circuit, laminate, method of manufacturing printed wiring board, and method of manufacturing electronic device
CN118638145A (en) * 2024-08-13 2024-09-13 上海赭滢宏新材料科技有限公司 A coupling agent for flame-retardant polyethylene cable material and preparation method thereof

Also Published As

Publication number Publication date
CN101687981B (en) 2012-04-04
JPWO2009001850A1 (en) 2010-08-26
KR101249479B1 (en) 2013-03-29
JP5650908B2 (en) 2015-01-07
TWI374909B (en) 2012-10-21
TW200916525A (en) 2009-04-16
CN101687981A (en) 2010-03-31
KR20100024949A (en) 2010-03-08
MY150635A (en) 2014-02-14

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