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WO2009001643A1 - 両頭平面研削盤 - Google Patents

両頭平面研削盤 Download PDF

Info

Publication number
WO2009001643A1
WO2009001643A1 PCT/JP2008/059802 JP2008059802W WO2009001643A1 WO 2009001643 A1 WO2009001643 A1 WO 2009001643A1 JP 2008059802 W JP2008059802 W JP 2008059802W WO 2009001643 A1 WO2009001643 A1 WO 2009001643A1
Authority
WO
WIPO (PCT)
Prior art keywords
work
holding hole
rotation axis
rocking
axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/059802
Other languages
English (en)
French (fr)
Inventor
Toshiharu Moridono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daisho Seiki Corp
Original Assignee
Daisho Seiki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daisho Seiki Corp filed Critical Daisho Seiki Corp
Priority to CN200880021784.9A priority Critical patent/CN103298586B/zh
Publication of WO2009001643A1 publication Critical patent/WO2009001643A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Abstract

両頭研削盤において、簡単な構造で、研削精度を向上させ、砥石車（２）の偏摩耗を防ぐ。同一の砥石回転軸芯（Ｏ１）上に対向配置された一対の砥石車と、前記砥石回転軸芯（Ｏ１）と平行な回転軸芯（Ｏ２）を有するキャリヤ円板回転軸（１２）に固定されると共にワーク（Ｗ）を保持するワーク保持孔（１８）を有するキャリヤ円板（１１）と、を備えており、ワーク保持孔（１８）の搬送軌道上の所定のローディング位置（Ａ１）で前記ワーク保持孔（１８）にワーク（Ｗ）を供給し、前記両砥石車（２）間にワーク（Ｗ）を挿入してワーク（Ｗ）の両面を研削した後、前記ワーク保持孔（１８）のワーク（Ｗ）を排出する両頭平面研削盤である。前記キャリヤ円板回転軸（１２）は、キャリヤ円板回転軸芯（Ｏ２）と平行な揺動軸芯（Ｏ３）回り揺動可能な揺動アーム（３０）に支持され、揺動駆動機構（３１）により、キャリヤ円板（１１）と共に前記揺動軸芯（Ｏ３）回りに揺動される。
PCT/JP2008/059802 2007-06-25 2008-05-28 両頭平面研削盤 Ceased WO2009001643A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN200880021784.9A CN103298586B (zh) 2007-06-25 2008-05-28 双头平面磨床

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-165963 2007-06-25
JP2007165963A JP4818995B2 (ja) 2007-06-25 2007-06-25 両頭平面研削盤

Publications (1)

Publication Number Publication Date
WO2009001643A1 true WO2009001643A1 (ja) 2008-12-31

Family

ID=40185465

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059802 Ceased WO2009001643A1 (ja) 2007-06-25 2008-05-28 両頭平面研削盤

Country Status (4)

Country Link
JP (1) JP4818995B2 (ja)
CN (1) CN103298586B (ja)
TW (1) TWI428203B (ja)
WO (1) WO2009001643A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102294652A (zh) * 2011-09-20 2011-12-28 天津市天机液压机械有限公司 大半径凹弧砂轮的修整装置和修整方法
US8838781B2 (en) 2010-07-15 2014-09-16 Cisco Technology, Inc. Continuous autonomous monitoring of systems along a path
US9787593B2 (en) 2010-07-07 2017-10-10 Cicsco Technology, Inc. Performing path-oriented systems management

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104128857A (zh) * 2014-07-30 2014-11-05 苏州鸿大金属制品有限公司 一种环状金属管打磨机
JP6285375B2 (ja) * 2015-02-17 2018-02-28 光洋機械工業株式会社 両頭平面研削装置
JP6858539B2 (ja) * 2016-12-08 2021-04-14 株式会社ディスコ 研削装置
KR102003399B1 (ko) * 2019-03-04 2019-10-01 (주)오성지엠 연속가공이 가능한 양두연삭장치
CN110253390A (zh) * 2019-06-19 2019-09-20 浙江三纵精密机械有限公司 叶片泵叶片宽度加工研磨设备
CN110977650B (zh) * 2020-01-08 2024-12-20 洛阳聚享新科智能科技有限公司 一种立式双端面研磨机摇臂装置及控制方法
CN112548719B (zh) * 2020-12-15 2022-09-30 长春斯迈尔科技有限公司 一种碳纤维材料加工用表面辅助处理设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5997831A (ja) * 1982-11-25 1984-06-05 Nisshin Kogyo Kk 両頭平面研削盤に於ける研削方法
JPH07186020A (ja) * 1993-12-24 1995-07-25 Koyo Mach Ind Co Ltd 立軸両頭研削盤
JP2000218532A (ja) * 1999-02-03 2000-08-08 Toshiba Mach Co Ltd 平面研磨装置
JP2002355750A (ja) * 2001-05-31 2002-12-10 Ibiden Co Ltd 面加工装置及び面加工方法
JP2002370161A (ja) * 2001-06-18 2002-12-24 Mitsubishi Materials Corp ウェーハの両面加工方法及びその装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63158754A (ja) * 1986-12-19 1988-07-01 Mitsubishi Electric Corp 内部改質形燃料電池
JPH0643020B2 (ja) * 1988-06-08 1994-06-08 光洋機械工業株式会社 両頭平面研削盤における研削方法
MY121670A (en) * 1996-09-09 2006-02-28 Koyo Machine Ind Co Ltd Double side grinding apparatus for flat disklike work
JP3310924B2 (ja) * 1998-02-26 2002-08-05 光洋機械工業株式会社 両頭平面研削装置
JP3527213B2 (ja) * 2001-04-11 2004-05-17 大昌精機株式会社 竪型両頭平面研削盤
CN100537134C (zh) * 2003-01-27 2009-09-09 英诺普雷股份有限公司 研磨半导体晶圆的设备及方法
CN2765718Y (zh) * 2005-02-06 2006-03-22 董广胜 双圆台转臂式平面磨床

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5997831A (ja) * 1982-11-25 1984-06-05 Nisshin Kogyo Kk 両頭平面研削盤に於ける研削方法
JPH07186020A (ja) * 1993-12-24 1995-07-25 Koyo Mach Ind Co Ltd 立軸両頭研削盤
JP2000218532A (ja) * 1999-02-03 2000-08-08 Toshiba Mach Co Ltd 平面研磨装置
JP2002355750A (ja) * 2001-05-31 2002-12-10 Ibiden Co Ltd 面加工装置及び面加工方法
JP2002370161A (ja) * 2001-06-18 2002-12-24 Mitsubishi Materials Corp ウェーハの両面加工方法及びその装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9787593B2 (en) 2010-07-07 2017-10-10 Cicsco Technology, Inc. Performing path-oriented systems management
US8838781B2 (en) 2010-07-15 2014-09-16 Cisco Technology, Inc. Continuous autonomous monitoring of systems along a path
US9565082B2 (en) 2010-07-15 2017-02-07 Cisco Technology, Inc. Continuous autonomous monitoring of systems along a path
US10110451B2 (en) 2010-07-15 2018-10-23 Cisco Technology, Inc. Continuous autonomous monitoring of systems along a path
CN102294652A (zh) * 2011-09-20 2011-12-28 天津市天机液压机械有限公司 大半径凹弧砂轮的修整装置和修整方法

Also Published As

Publication number Publication date
TWI428203B (zh) 2014-03-01
TW200911459A (en) 2009-03-16
JP4818995B2 (ja) 2011-11-16
CN103298586B (zh) 2015-07-15
CN103298586A (zh) 2013-09-11
JP2009000794A (ja) 2009-01-08

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