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WO2009001280A3 - A method for the production of a microelectronic sensor device - Google Patents

A method for the production of a microelectronic sensor device Download PDF

Info

Publication number
WO2009001280A3
WO2009001280A3 PCT/IB2008/052472 IB2008052472W WO2009001280A3 WO 2009001280 A3 WO2009001280 A3 WO 2009001280A3 IB 2008052472 W IB2008052472 W IB 2008052472W WO 2009001280 A3 WO2009001280 A3 WO 2009001280A3
Authority
WO
WIPO (PCT)
Prior art keywords
chip
production
sensor device
microelectronic sensor
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB2008/052472
Other languages
French (fr)
Other versions
WO2009001280A2 (en
Inventor
Johannes W Weekamp
Albert H J Immink
Jeroen H Nieuwenhuis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of WO2009001280A2 publication Critical patent/WO2009001280A2/en
Publication of WO2009001280A3 publication Critical patent/WO2009001280A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H10P72/74—
    • H10W74/019—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate

Landscapes

  • Pressure Sensors (AREA)
  • Micromachines (AREA)

Abstract

The invention relates to a microelectronic sensor device and to a method for the production of such a device comprising the following steps: placing an IC chip (10) in an insertion hole (21) of an interconnect carrier (20), wherein a sensitive side (12) of the chip contacts a removable layer (30) that is attached to the bottom side (22) of the carrier (20); filling the insertion hole (21) with an underfill material (40) and removing the removable layer (30); electrically connecting (via wire bonding or any other method) bond-pads (11) on the chip (10); placing a structured element (50) with fluidic channels (51) on ridges (52) that are disposed on the bottom side of the interconnect carrier (20) and/or the chip (10); encapsulating the bondwires (14) in an insulating material (60).
PCT/IB2008/052472 2007-06-27 2008-06-23 A method for the production of a microelectronic sensor device Ceased WO2009001280A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP07111121 2007-06-27
EP07111121.5 2007-06-27

Publications (2)

Publication Number Publication Date
WO2009001280A2 WO2009001280A2 (en) 2008-12-31
WO2009001280A3 true WO2009001280A3 (en) 2009-04-09

Family

ID=39874903

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2008/052472 Ceased WO2009001280A2 (en) 2007-06-27 2008-06-23 A method for the production of a microelectronic sensor device

Country Status (1)

Country Link
WO (1) WO2009001280A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11327073B2 (en) 2019-04-12 2022-05-10 Western Digital Technologies, Inc. Thermal sensor array for molecule detection and related detection schemes
EP3941625A1 (en) * 2019-04-12 2022-01-26 Western Digital Technologies Inc. Nucleic acid sequencing by synthesis using magnetic sensor arrays

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3570115A (en) * 1968-05-06 1971-03-16 Honeywell Inc Method for mounting electronic chips
US4850105A (en) * 1987-07-04 1989-07-25 Horiba, Ltd. Method of taking out lead of semiconductor tip part
EP1003035A2 (en) * 1998-11-17 2000-05-24 Micronas Intermetall GmbH Measuring device
US6663837B1 (en) * 1998-10-20 2003-12-16 Mesatronic Housing box for electronic chip with biological probes
US20060033219A1 (en) * 2004-08-10 2006-02-16 Navinchandra Kalidas Low profile, chip-scale package and method of fabrication
WO2006077210A1 (en) * 2005-01-20 2006-07-27 Siemens Aktiengesellschaft Semiconductor sensor component comprising protected feeders, and method for the production thereof
WO2007004133A2 (en) * 2005-07-05 2007-01-11 Koninklijke Philips Electronics N. V. Microchip assembly produced by transfer molding
US20070126122A1 (en) * 2004-05-06 2007-06-07 Michael Bauer Semiconductor device with a wiring substrate and method for producing the same

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3570115A (en) * 1968-05-06 1971-03-16 Honeywell Inc Method for mounting electronic chips
US4850105A (en) * 1987-07-04 1989-07-25 Horiba, Ltd. Method of taking out lead of semiconductor tip part
US6663837B1 (en) * 1998-10-20 2003-12-16 Mesatronic Housing box for electronic chip with biological probes
EP1003035A2 (en) * 1998-11-17 2000-05-24 Micronas Intermetall GmbH Measuring device
US20070126122A1 (en) * 2004-05-06 2007-06-07 Michael Bauer Semiconductor device with a wiring substrate and method for producing the same
US20060033219A1 (en) * 2004-08-10 2006-02-16 Navinchandra Kalidas Low profile, chip-scale package and method of fabrication
WO2006077210A1 (en) * 2005-01-20 2006-07-27 Siemens Aktiengesellschaft Semiconductor sensor component comprising protected feeders, and method for the production thereof
WO2007004133A2 (en) * 2005-07-05 2007-01-11 Koninklijke Philips Electronics N. V. Microchip assembly produced by transfer molding

Also Published As

Publication number Publication date
WO2009001280A2 (en) 2008-12-31

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