WO2009000104A1 - The package structure of led - Google Patents

Abstract

A package structure of a LED (1) is provided. The package structure of a LED (1) comprises a carrier (12), a substrate (14), a first LED (16) and a second LED (18). The carrier (12) comprises a partition (122), a top surface (124) and a bottom surface (126). A first concave part (128) is formed in the top surface (124). A second concave part (130) is formed in the bottom surface (126). The first concave part (128) contacts the second concave part (130). The substrate (14) embeds into the second concave part (130). The first LED (16) and the second LED (18) are disposed on the substrate (14). The partition (122) separates the first LED (16) and the second LED (18).

Description

 LED package structure

 The present invention relates to an LED package structure, and more particularly to an LED package structure having a plurality of LED chips integrated therein.

technical background

 With the development of semiconductor light-emitting components, light-emitting diodes have become an emerging light source with many advantages such as power saving, shock resistance, fast response, suitable mass production, and the like. Therefore, it has become common to use light-emitting diodes as indicators, and lighting products using light-emitting diodes as light sources have also become a trend. In order to enable electronic products with light-emitting diodes to provide more diverse functions, such as simultaneously emitting light of different colors, the electronic products are often required by a plurality of light-emitting diodes each emitting light of different wavelengths. However, each of the light-emitting diodes must be separated by a certain distance to prevent the emitted light from interfering with each other, thereby enabling the electronic product to simultaneously emit light of different wavelengths. Inevitably, such an arrangement will result in an increase in the volume of the electronic product, a reduction in design flexibility and a range of use. Accordingly, it is desirable to provide a light emitting diode package structure having a plurality of light emitting diode dies integrated to solve the above problems. '

Summary of invention

 It is an object of the present invention to provide an LED package structure.

 Another object of the present invention is to provide a light emitting diode package structure having a plurality of light emitting diode dies integrated therein.

The LED package structure of the present invention comprises a stage, a substrate, a first LED die and a second LED die. The stage includes a blocking portion, a top surface and a bottom a surface, the stage forming a first recess on the top surface, the stage forming a second recess on the bottom surface, the first recess and the second recess connection. The substrate is embedded in the second recess. The first LED die and the second LED die are both disposed on the substrate and separated by the blocking portion.

 The stage can be a low temperature co-fired ceramic plate, a printed circuit board or a metal core circuit board. An adhesive may be filled between the substrate and the second recess to increase the adhesion between the substrate and the second recess. The diameter of the first recessed portion is smaller than the diameter of the second recessed portion, such that the second recessed portion has a top portion, and the substrate is coupled to the top portion. The substrate can also be electrically connected to the top. In an embodiment, a circuit contact is disposed on the substrate, and a circuit contact is also disposed on the top. When the substrate is connected to the top, a circuit contact on the substrate is the top The upper circuit contacts are electrically connected. Further, the substrate may be silicon, metal or a low temperature co-fired ceramic. The first LED die or the second LED die is a half-conductor LED or a semiconductor laser.

 According to the LED package structure of the present invention, the first LED die can emit a first wavelength of light, and the second LED die can emit a second wavelength of light, the first wavelength of light is different from The second wavelength of light. The LED package structure may further comprise a package material. The encapsulating material may include a phosphor and cover the first LED chip, the second LED die, and the blocking portion.

In one embodiment, the LED package structure includes a first phosphor region and a second phosphor region. The first phosphor region is located above the first LED chip, and the first phosphor region is configured to convert a third wavelength of light emitted by the first LED die into a first Four wavelength light. The second phosphor region is located above the second LED chip, and the second phosphor region is configured to convert a fifth wavelength light emitted by the second LED die into a first Six wavelengths of light. In addition, the LED package structure may further comprise an encapsulation material. The encapsulating material covers the first phosphor powder region and the second phosphor powder region at the same time, and the phosphor powder of the first phosphor powder region is different from the second phosphor powder region. Fluorescent powder. Thereby, the LED package structure can simultaneously emit light of different wavelengths. In addition, according to the LED package structure of the present invention, in order to increase the light collecting efficiency, a lens may be disposed on the packaging material, and a reflective layer may also be disposed on the first recess.

 Therefore, the LED package structure of the present invention is configured to integrate the plurality of LED dies in the same package region by disposing the blocking portion between the first LED die and the second LED die. Reduces package area and provides the ability to simultaneously emit light of different wavelengths. DRAWINGS

 The above and other objects, features and advantages of the present invention will become more apparent from

 1A is a plan view of a light emitting diode package structure according to a preferred embodiment of the present invention; and FIG. 1B is a cross-sectional view taken along line X-X of FIG.

 1C is a cross-sectional view showing an LED package structure of an embodiment;

 1D is a cross-sectional view of an LED package structure of an embodiment;

 2 is a cross-sectional view showing a light emitting diode package structure of another preferred embodiment. Summary of the invention

 1A and 1B, FIG. 1A is a top plan view of a light emitting diode package structure 1 in accordance with a preferred embodiment of the present invention. Fig. 1B is a cross-sectional view taken along line X-X of Fig. 1A.

The LED package structure 1 of the present invention comprises a stage 12, a substrate 14, a first LED die 16 and a second LED die 18. The stage 12 includes a blocking portion 122, a top surface 124 and a bottom surface 126. The stage 12 defines a first recess 128 on the top surface 124. The stage 12 is at the bottom. A second recess 130 is formed on the surface 126. The first recessed portion 128 is connected to the second recessed portion 130. The substrate 14 is embedded in the second recess 130. The first LED die 16 and the second LED die 18 are disposed on the substrate 14 and are separated by the blocking portion 122. The stage 12 can be a low temperature co-fired ceramic plate, a printed circuit board, a metal core circuit board or other material that can interface with the substrate 14. The substrate 14 can be silicon, metal, low temperature co-fired ceramic or other material that can carry light emitting diode dies. An adhesive may be filled between the substrate 14 and the second recess 130 to increase the adhesion between the substrate 14 and the second recess 130. The first LED die 16 or the second LED die 18 is a semiconductor light emitting diode or a semiconductor laser.

 As shown in FIG. 1B, the diameter of the first recessed portion 128 connected to the second recessed portion 130 is smaller than the diameter of the second recessed portion 130 connected to the first recessed portion 128, so that the first recessed portion The second recess 130 has a top portion 1302. The substrate 14 is coupled to the top portion 1302. The top portion 1302 has the function of engaging the substrate 14 , and may also increase the adhesion area between the substrate 14 and the second recess portion 130 , that is, increase the attachment between the substrate 14 and the second recess 130 . Focus on.

 Referring to FIG. 1C, FIG. 1C is a cross-sectional view of an LED package structure 3 of an embodiment. In comparison with the preferred embodiment, the first LED pellets 16 and the second LED die 18 of the LED package structure 3 are directly wired to the substrate 14. The stage 12 has a circuit 132 (shown in phantom) and a plurality of circuit contacts (not shown) are formed on the top 1302. The circuit contacts are electrically connected to the substrate 14 by embedding the substrate 14 in the second recess 130 and abutting the top portion 1302.

According to the preferred embodiment, the first LED die 16 can emit a first wavelength. The second LED die 18 can emit a second wavelength of light. The first wavelength of light is different from the second wavelength of light. Therefore, the LED package structure 1 can emit light of different colors. Referring to FIG. 1B , the LED package structure 1 further includes an encapsulation material 20 . The encapsulating material 20 may include a phosphor powder and cover the first LED die 16 , the second LED die 18 , and the blocking portion 122 . The encapsulating material 20 containing the phosphor may convert light emitted by the first LED die 16 and the second LED die 18.

 Referring to FIG. 1D, FIG. 1D is a cross-sectional view of an LED package structure 5 of an embodiment. The LED package structure 5 further includes a lens 22 as compared to the preferred embodiment. The lens 22 is disposed on the encapsulating material 20. Moreover, the LED package structure 5 further includes a reflective layer 24. The reflective layer 24 is located on the first recess 128. Therefore, the light emitting diode package structure 5 can increase the light collecting efficiency. In addition, it is necessary that the lens 22 is not attached to the encapsulating material 20.

Please refer to FIG. 2. FIG. 2 is a cross-sectional view of a light emitting diode package structure 7 according to another preferred embodiment. Compared with the LED package structure 1 of the preferred embodiment, the LED package structure 7 includes a first phosphor region and a second phosphor region (not shown). The first phosphor region is located above the first LED die 16. The second phosphor region is located above the second LED die 18. The first phosphor region is configured to convert a third wavelength of light emitted by the first LED die 16 into a fourth wavelength of light. The second phosphor region is configured to convert a fifth wavelength light emitted by the second LED die 18 into a sixth wavelength light. The LED package structure 7 can further include an encapsulation material 20'. The encapsulating material 20' covers both the first phosphor powder region and the second phosphor powder region. And the phosphor powder of the first phosphor region is different from the phosphor powder of the second phosphor region. Therefore, even if the third wavelength light emitted by the first LED die 16 is the same as the fifth wavelength light emitted by the second LED die 18, due to the first phosphor region The phosphor powder differs from the phosphor powder in the second phosphor powder region, and the light emitting diode package structure 7 can simultaneously emit light of different colors.

 In addition, according to the LED package structure 7, the encapsulation material 20' can independently cover the first LED die 16 and the second LED die 18. Therefore, in an embodiment, the encapsulating material 20' on the first phosphor region may include a phosphor for converting the fourth wavelength light into a seventh wavelength light. Similarly, the encapsulating material 20' on the second phosphor region may include a phosphor for reconverting the sixth wavelength light into an eighth wavelength light. Thereby, even if the fourth wavelength light is the same as the sixth wavelength light, the LED package structure 7 can simultaneously emit different colors of light by adjusting the phosphor powder of the encapsulation material 20'.

In addition, the encapsulating material 20 ′ of the LED package structure 7 does not cover the blocking portion 122 , so the light emitted by the first LED die 16 and the second LED die 18 are emitted. The light does not interfere with each other. Thereby, the LED package structure 7 can simultaneously emit bright and different colors of light. In contrast, the encapsulation material 20 of the LED package structure 1 still covers the blocking portion 122, so the light emitted by the first LED die 16 and the light emitted by the second LED die 18 There is a partial blend, which in turn produces a softer effect. Thereby, the LED package structure 1 can emit light of a softer and different color. In addition, the light emitting diode package structure of the present invention can of course emit light of a single color, and the description will not be repeated. In summary, the LED package structure of the present invention is configured to integrate the plurality of LED dies in the same package region by disposing the blocking portion between the first LED die and the second LED die. Medium, thereby reducing the package area while providing the ability to simultaneously emit light of different wavelengths.

 The preferred embodiments of the present invention have been specifically described above, but the present invention is not limited to the embodiments, and various equivalent modifications or substitutions can be made by those skilled in the art without departing from the spirit of the invention. Such equivalent modifications or alternatives are intended to be included within the scope of the claims.

Claims

The present invention provides an LED package structure, comprising:  a stage comprising a blocking portion, a top surface and a bottom surface, wherein the loading platform forms a first recess on the top surface, and the stage forms a bottom surface on the bottom surface a second recessed portion, wherein the first recessed portion is connected to the second recessed portion;  a substrate, the substrate is embedded in the second recess;  a first LED die disposed on the substrate;  a second LED die disposed on the substrate;  The first LED die and the second LED die are separated by the blocking portion. The LED package structure according to claim 1, wherein: the stage is a low temperature co-fired ceramic plate, a printed circuit board or a metal core circuit board. The LED package structure according to claim 1, wherein: an adhesive is filled between the substrate and the second recess. The light emitting diode package structure according to claim 1, wherein: the diameter of the first recessed portion is smaller than the diameter of the second recessed portion, so that the second recessed portion has a top portion, the substrate and the substrate The top is connected. The LED package structure of claim 4, wherein the substrate is electrically connected to the top. The LED package structure of claim 1 , wherein: the first LED die emits a first wavelength of light, and the second LED die emits a second wavelength of light. The first wavelength of light is different from the second wavelength of light. The LED package structure of claim 1 further comprising: a first phosphor region located above said first LED die, said first phosphor region being used to A third wavelength light emitted by the first LED die is converted into a fourth wavelength light. The LED package structure according to claim 7, further comprising: a second phosphor region is disposed on the second LED chip, and the second phosphor region is configured to convert a fifth wavelength light emitted by the second LED die into a sixth wavelength Light.  The LED package structure of claim 8 further comprising: a package material, wherein the package material covers both the first phosphor region and the second phosphor region, and The phosphor of the first phosphor region is different from the phosphor of the second phosphor region. The LED package structure of claim 1 further comprising: an encapsulation material, the encapsulation material simultaneously covering the first LED die, the second LED die, and the Barrier. The LED package structure of claim 10, wherein: the encapsulating material comprises a phosphor. The LED package structure of claim 11, further comprising: a lens disposed on the encapsulation material. . The LED package structure according to claim 1, further comprising: a reflective layer, wherein the reflective layer is located on the first recess. The LED package structure according to claim 1, wherein the substrate is silicon, metal or low temperature co-fired ceramic. The LED package structure of claim 1, wherein: the first LED die is a semiconductor light emitting diode or a semiconductor laser.