WO2009096326A1 - Ceramic multilayer substrate manufacturing method, and ceramic multilayer substrate - Google Patents

Abstract

Provided is a highly reliable ceramic multilayer substrate manufacturing method, by which chip-type ceramic electronic parts are neither damaged or cracked nor degraded in characteristics. The method manufactures a ceramic multilayer substrate (10) having chip-type ceramic electronic parts (13) packaged therein, by burning simultaneously a ceramic green laminate (111) having a conductor pattern portion (112) and chip-type ceramic electronic parts (113) arranged in the ceramic green laminate (111) while being electrically connected with the conductor pattern portion (112). The method comprises a step of forming a contact-preventing agent layer (114) at a portion of a ceramic green layer (111A) to be contacted with the chip-type ceramic electronic parts (113), and a step of burning the ceramic green laminate (111) and the chip-type ceramic electronic parts (113) thereby to burn out the contact-preventing agent layer (114).

Description

Method for manufacturing ceramic multilayer substrate and ceramic multilayer substrate

The present invention relates to a method for manufacturing a ceramic multilayer substrate and a ceramic multilayer substrate, and more particularly to a method for manufacturing a ceramic multilayer substrate incorporating a chip-type ceramic electronic component and a ceramic multilayer substrate.

Conventional technologies of this type include a multilayer ceramic substrate with built-in electronic components described in Patent Document 1, a multilayer ceramic substrate described in Patent Document 2, and a method for manufacturing the same.

An electronic component built-in multilayer ceramic substrate described in Patent Document 1 includes a multilayer ceramic substrate, a chip-type ceramic electronic component housed in a space formed by a recess or a through hole in the multilayer ceramic substrate, and a multilayer ceramic substrate. It is provided with the conductor which has wired the above-mentioned chip type electronic component provided in the interlayer or space. Thus, since the chip-type electronic component is accommodated in the space in the multilayer ceramic substrate, a multilayer ceramic substrate having a desired shape can be obtained without deteriorating the flatness.

In the case of the multilayer ceramic substrate and the manufacturing method thereof described in Patent Document 2, functional elements such as a capacitor element, an inductor element, and a resistance element are produced using a sintered body plate obtained by firing the ceramic functional element in advance. In addition, these functional elements are built in the unsintered composite laminate. The unsintered composite laminate includes a base green layer, a constraining layer containing a hardly sinterable material, and a wiring conductor. When fired, the base green layer is formed by the action of the constraining layer. Shrinkage in the main surface direction is suppressed. Since it is fired by a non-shrinkage method using a constraining layer, the unsintered composite laminate can be fired without any problems in a state in which the functional element is incorporated, and the components are mutually exchanged between the functional element and the green layer for the substrate. Diffusion does not occur and the characteristics of the functional element are maintained after firing.

Japanese Patent Publication No. 06-32378 JP 2002-084067 A

However, in the case of the multilayer ceramic substrates described in Patent Document 1 and Patent Document 2, a multilayer ceramic substrate is obtained by firing a multilayer body of ceramic green sheets incorporating chip-type ceramic electronic components. Cracks were generated in the chip-type ceramic electronic component built in the multilayer ceramic substrate, and in some cases, the chip-type ceramic electronic component was even destroyed. This phenomenon was also observed in the non-shrinkage method using a constrained layer. In addition, since these multilayer ceramic substrates are fired in a state where the chip-type electronic component and the ceramic green sheet are in close contact, it is difficult to prevent mutual diffusion of material components between the chip-type electronic component and the ceramic layer. Even with the technique described in Patent Document 2, the characteristics of the chip-type electronic component may be deteriorated.

In addition, as described in Patent Document 1, in the case of a multilayer ceramic substrate in which a recess or a through hole for accommodating a chip-type electronic component is formed in the cavity, the problem is that the substrate strength is significantly reduced at the cavity portion. There was also.

The present invention has been made in order to solve the above-described problems, and is a highly reliable ceramic multilayer in which chip-type ceramic electronic components are not damaged such as cracks and the characteristics of chip-type ceramic electronic components are not deteriorated. It is an object of the present invention to provide a substrate manufacturing method and a ceramic multilayer substrate.

As a result of various studies on the cause of damage to chip-type ceramic electronic components built in the ceramic multilayer substrate, the present inventor has obtained the following knowledge.
That is, it has been found that when the thermal expansion coefficients of the ceramic layer of the ceramic multilayer substrate and the chip-type ceramic electronic component are greatly different, the chip-type ceramic electronic component is cracked or damaged. If shrinkage in the surface direction of the substrate is suppressed by adopting a non-shrinkage construction method, a chip-type ceramic electronic component that does not shrink can be incorporated. However, chip-type ceramic electronic components such as multilayer capacitors are often made of a high dielectric constant material, and the high dielectric constant material generally has a large thermal expansion coefficient. On the other hand, the material of the ceramic green layer serving as the ceramic layer is often composed of a low dielectric constant material, and the low dielectric constant material generally has a small thermal expansion coefficient.

For this reason, after firing the chip-type ceramic electronic component and the ceramic green layer in close contact with each other and cooling to room temperature, the chip-type ceramic electronic component shrinks more than the ceramic layer during cooling, and the chip-type ceramic electronic component from the ceramic layer Pulling force works against. The chip-type ceramic electronic component is formed of a ceramic material. However, since the ceramic material is weak against tensile stress, the tensile force from the ceramic layer causes cracking or breakage. For this reason, the constituent material of the chip-type ceramic electronic component incorporated in the ceramic multilayer substrate is limited. In other words, if the chip-type ceramic electronic component and the ceramic layer are not in close contact with each other, it is possible to eliminate the disadvantage that the chip-type ceramic electronic component is damaged or that the constituent material of the chip-type ceramic electronic component is limited. .

The present invention has been made based on the above findings.
That is, the method for producing a ceramic multilayer substrate according to the present invention includes a ceramic green laminate having a plurality of ceramic green layers laminated and having a conductor pattern, a ceramic sintered body, a terminal electrode, and an interior of the ceramic green laminate. And a ceramic ceramic substrate containing the chip-type ceramic electronic component by simultaneously firing the chip-type ceramic electronic component disposed at the same time and having the terminal electrode electrically connected to the conductor pattern. A first step of forming an adhesion preventive agent layer at a portion of the ceramic green layer in contact with the chip-type ceramic electronic component; and firing the ceramic green laminate and the chip-type ceramic electronic component to form the adhesion preventive agent. And a second step of burning out the layer.

Further, the method for producing a ceramic multilayer substrate of the present invention preferably includes a step of disposing the adhesion preventive agent layer on both surfaces of the chip-type ceramic electronic component.

In the method for producing a ceramic multilayer substrate of the present invention, it is preferable that the adhesion preventing agent is a resin paste, and in the first step, the resin paste is applied onto the ceramic green layer.

In the method for producing a ceramic multilayer substrate of the present invention, the adhesion preventing agent does not burn out in a low oxygen atmosphere, but includes a burned material burned out in a high oxygen atmosphere. In the first step, the burnout material is composed of the burned material. In the second step, the ceramic green laminate and the chip-type ceramic electronic component are fired in a low oxygen atmosphere, and then both are fired again in a high oxygen atmosphere. It is preferable to burn off the burnout material.

In the method for producing a ceramic multilayer substrate of the present invention, the burnout material is preferably carbon.

Further, the method for producing a ceramic multilayer substrate of the present invention includes a step of forming a via hole at a position overlapping the terminal electrode of the chip-type ceramic electronic component of the adhesion preventive agent layer and filling the via hole with a conductive paste. Is preferred.

Further, in the method for producing a ceramic multilayer substrate according to the present invention, the ceramic ceramic laminate with the constraining layer made of an inorganic material that is not sintered at the firing temperature of the ceramic green laminate is disposed on at least one main surface of the ceramic green laminate. The green laminate and the chip-type ceramic electronic component are preferably fired.

In the method for producing a ceramic multilayer substrate according to the present invention, the thermal expansion coefficient of the sintered body of the ceramic green laminate is substantially equal to the thermal expansion coefficient of the ceramic sintered body constituting the chip-type ceramic electronic component. preferable.

In addition, the ceramic multilayer substrate of the present invention is provided at the interface between a ceramic laminate in which a plurality of ceramic layers are laminated and have a conductor pattern, and upper and lower ceramic layers, and is electrically connected to the ceramic sintered body and the conductor pattern. A ceramic multilayer substrate comprising a chip-type ceramic electronic component having a terminal electrode, wherein a gap exists at an interface between the ceramic layer and the chip-type ceramic electronic component, The terminal electrode and the conductor pattern are electrically connected by a protruding electrode formed in the gap.

In the ceramic multilayer substrate of the present invention, it is preferable that the protruding electrode is directly connected to a via-hole conductor formed in a ceramic layer in contact with the gap.

Further, in the ceramic multilayer substrate of the present invention, it is preferable that the terminal electrodes of the chip-type ceramic electronic component are arranged apart from each other in the stacking direction of the ceramic layers.

Further, in the ceramic multilayer substrate of the present invention, it is preferable that the protruding electrode is formed of a material having high ductility.

In the ceramic multilayer substrate of the present invention, it is preferable that the material having high ductility is silver.

According to the present invention, there is provided a highly reliable method for manufacturing a ceramic multilayer substrate and a ceramic multilayer substrate in which the chip-type ceramic electronic component is not damaged such as cracks and the characteristics of the chip-type ceramic electronic component are not deteriorated. can do.

(A), (b) is a figure which shows one Embodiment of the ceramic multilayer substrate of this invention, respectively, (a) is sectional drawing which shows the whole, (b) is the part enclosed with (circle) of (a). It is sectional drawing shown. (A)-(e) is process drawing which shows the principal part of the method of manufacturing the ceramic multilayer substrate shown in FIG. 1, respectively. It is sectional drawing equivalent to (b) of FIG. 1 which shows other embodiment of the ceramic multilayer substrate of this invention. It is sectional drawing equivalent to FIG.1, (b) which shows other embodiment of the ceramic multilayer substrate of this invention.

Explanation of symbols

10, 10A, 10B Ceramic multilayer substrate 11 Ceramic laminate 11A Ceramic layer 12 Conductive pattern 13, 113 Chip type ceramic electronic component 13A Ceramic sintered body 13B Terminal electrode 111 Ceramic green laminate 111A Ceramic green sheet (ceramic green layer)
114 Adhesion inhibitor layer 115 Constrained layer V Void

Hereinafter, the present invention will be described based on the embodiment shown in FIGS. 1A and 1B are diagrams showing an embodiment of the ceramic multilayer substrate of the present invention, FIG. 1A is a sectional view showing the whole of the ceramic multilayer substrate, and FIG. ) In FIG. 2 is an enlarged cross-sectional view, FIGS. 2A to 2E are process diagrams showing the main part of the method for manufacturing the ceramic multilayer substrate shown in FIG. 1, and FIG. sectional view corresponding to FIG. 1 (b) shows another embodiment of the ceramic multilayer substrate of the invention, corresponding to (b) of FIG. 1 FIG. 4 showing still another embodiment of the ceramic multilayer substrate of the present invention It is sectional drawing.

First Embodiment A ceramic multilayer substrate 10 of the present embodiment includes, for example, as shown in FIG. 1A, a ceramic laminate 11 in which a plurality of ceramic layers 11A are laminated and have a conductor pattern 12, and upper and lower ceramics. A chip-type ceramic electronic component 13 which is provided at the interface of the layer 11A and has a ceramic sintered body 13A as a base body and terminal electrodes 13B at both ends thereof. Further, surface electrodes 14 and 14 are formed on both main surfaces (upper and lower surfaces) of the ceramic laminate 11, respectively.

A plurality of surface mount components 20 are mounted on one main surface (upper surface in the present embodiment) of the ceramic laminate 11 via a surface electrode 14. As the surface mount component 20, active elements such as semiconductor elements and gallium arsenide semiconductor elements, passive elements such as capacitors, inductors, resistors, etc. are bonded via solder or conductive resin, or bonding wires such as Au, Al, and Cu. And electrically connected to the surface electrode 14 on the upper surface of the ceramic laminate 11. The chip-type ceramic electronic component 13 and the surface mount component 20 are electrically connected to each other via the surface electrode 14 and the internal conductor pattern 12. The ceramic multilayer substrate 10 can be mounted on a mounting substrate such as a mother board via the surface electrode 14 on the other main surface (lower surface in the present embodiment).

Thus, for example, as shown in FIG. 1B, a gap V exists at the interface between the upper and lower ceramic layers 11A and 11A and the chip-type ceramic electronic component 13, and the entire surface (6 Surface) is opposed to the inner surfaces of the upper and lower ceramic layers 11A and 11A through the gap V. A conductor pattern 12 is formed on the upper ceramic layer 11A. The conductor pattern 12 includes a surface electrode 12A formed in a predetermined pattern on the surface of the upper ceramic layer 11A, and a via-hole conductor 12B formed vertically through the upper ceramic layer 11A from the surface electrode 12A, And a protruding electrode 12C that protrudes from the via-hole conductor 12B into the gap V and is electrically connected to the terminal electrode 13B of the chip-type ceramic electronic component 13.

The protruding electrode 12C is formed integrally with the via hole conductor 12B, for example, and electrically connects the via hole conductor 12B and the terminal electrode 13B of the chip-type ceramic electronic component 13 to each other. Accordingly, the chip-type ceramic electronic component 13 is suspended by the protruding electrode 12C in the space formed between the upper and lower ceramic layers 11A and 11A.

Thus, the material of the ceramic layer 11A constituting the ceramic laminate 11 is not particularly limited as long as it is a ceramic material. For example, a low temperature co-fired ceramic (LTCC) material is preferable. The low-temperature sintered ceramic material is a ceramic material that can be sintered at a temperature of 1050 ° C. or less and can be simultaneously fired with Ag, Cu, or the like having a small specific resistance. Specific examples of the low-temperature sintered ceramic include a glass composite LTCC material obtained by mixing borosilicate glass with ceramic powder such as alumina and forsterite, and ZnO—MgO—Al ₂ O ₃ —SiO ₂ crystal. Non-glass using crystallized glass-based LTCC material using a crystallized glass, BaO—Al ₂ O ₃ —SiO ₂ ceramic powder, Al ₂ O ₃ —CaO—SiO ₂ —MgO—B ₂ O ₃ ceramic powder, etc. System LTCC materials and the like.

By using a low-temperature sintered ceramic material as the material of the ceramic laminate 11, a low melting point metal having a low resistance and a low melting point such as Ag or Cu can be used as the conductor pattern 12. As a result, the ceramic laminate 11 and the conductor pattern 12 can be simultaneously fired at a low temperature of 1050 ° C. or lower. In particular, the protruding electrode 12C connected to the via-hole conductor 12B suspends the chip-type ceramic electronic component 13 in the ceramic laminate 11, and therefore absorbs the thermal expansion difference between the ceramic layer 11A and the chip-type ceramic electronic component 13. It is preferable that it is formed of Ag having high ductility so as to obtain.

Also, a high temperature sintered ceramic (HTCC) material can be used as the ceramic material. Examples of the high-temperature sintered ceramic material include alumina, aluminum nitride, mullite, and other materials added with a sintering aid such as glass and sintered at 1100 ° C. or higher. At this time, as the conductor pattern 12, a metal selected from molybdenum, platinum, palladium, tungsten, nickel, and alloys thereof is used.

The chip-type ceramic electronic component 13 is not particularly limited. For example, a ceramic sintered body 13A, such as barium titanate or ferrite, which is fired at 1050 ° C. or higher, and further 1200 ° C. or higher, is used, for example, FIG. In addition to the multilayer ceramic capacitor shown in FIG. 1, chip-type ceramic electronic components such as an inductor, a filter, a balun, and a coupler can be used. One or a plurality of these chip-type ceramic electronic components 13 can be appropriately selected according to the purpose and arranged in the ceramic laminate 11. Further, even if the terminal electrode 13B of the chip-type ceramic electronic component 13 used for the ceramic multilayer substrate 10 is a conductive paste applied and baked, the conductive paste is applied and dried before baking. It may be a thing.

As described above, since the gap V is interposed at the interface between the chip-type ceramic electronic component 13 and the ceramic laminate 11, even if a stress such as a thermal stress acts on the ceramic laminate 11 in the plane direction, the stress is reduced to the chip-type. It is not directly transmitted to the ceramic electronic component 13, but is absorbed by the protruding electrodes 12C, and the chip-type ceramic electronic component 13 is not cracked or damaged. Further, by making the thermal expansion coefficient of the ceramic laminate 11 and the thermal expansion coefficient of the ceramic sintered body 13A of the chip-type ceramic electronic component 13 substantially the same, the thermal stress applied to the protruding electrode 12C can be reduced, Even if the projecting electrode 12C has poor ductility, it is possible to prevent a large load from being applied to the projecting electrode 12C.

In FIG. 1B, the description has been made by paying attention to the chip-type ceramic electronic component 13 in one place shown in FIG. 1A. However, the chip-type ceramic electronic component 13 has upper and lower ceramic layers 11A, A plurality of them may be arranged side by side at any location on the interface of 11A, or may be arranged in a plurality of stages on a plurality of different upper and lower interfaces. Therefore, the plurality of chip-type ceramic electronic components 13 are electrically connected to each other in series and / or in parallel via the conductor pattern 12 according to the purpose, so that the ceramic multilayer substrate 10 has multiple functions and high performance. be able to.

Next, a method for manufacturing the ceramic multilayer substrate 10 shown in FIGS. 1A and 1B will be described with reference to FIGS.
In this embodiment, the case where the ceramic multilayer substrate 10 is produced using a non-shrinkage method will be described. The non-shrinkage construction method refers to a construction method in which the shrinkage in the planar direction of the ceramic laminate is suppressed or prevented before and after the firing of the ceramic laminate, and the dimensions in the planar direction are not substantially changed.

In the present embodiment, a required number of ceramic green sheets 111A are produced using a slurry containing a low-temperature sintered ceramic material as shown in FIG. Here, the case where the ceramic multilayer substrate 10 having the upper and lower two-stage ceramic layers 11A shown in FIG. The two ceramic green sheets 111A are defined as a first ceramic green sheet 111A and a second ceramic green sheet 111A ', respectively. Since the ceramic green sheet becomes a ceramic green layer in the ceramic green laminate, the ceramic green layer composed of the first and second ceramic green sheets 111A and 111A ′ is also denoted by the same reference numerals as the ceramic green sheet. To do.

Next, using, for example, a screen printing method, an adhesion preventing agent made of a paste containing a burned-out material as a main component as shown in FIG. 2A is applied to the upper surfaces of the first and second ceramic green sheets 111A and 111A ′. The adhesion preventing agent layer 114 is formed by printing. The adhesion preventive agent prevents mutual diffusion of material components between the chip-type ceramic electronic component 13 and the first and second ceramic green sheets 111A and 111A ′ during firing, and is burned out after firing and the upper and lower ceramics. A material that forms the void V at the interface between the layers 11A and 11A and the chip-type ceramic electronic component 13 is used. The adhesion inhibitor is not particularly limited as long as it has the above function. As such an adhesion preventing agent, for example, a burned-out material such as resin or carbon can be used.

After the adhesion preventive agent layer 114 is formed on each of the first and second ceramic green sheets 111A and 111A ′, the first ceramic green sheet 111A and the adhesion are formed as shown in FIG. After forming the via hole penetrating the inhibitor layer 114, the conductive paste containing Ag as a main component is screen-printed on the first ceramic green sheet 111A from the surface opposite to the adhesion preventive agent layer 114. The via hole of one ceramic green sheet 111A is filled with a conductive paste to form the via hole conductor portion 112B and the surface electrode portion 112A. At this time, the protruding electrode portion 112C is integrally formed with the via-hole conductor portion 112B in the through hole of the adhesion preventing agent layer 114. These via-hole conductor portions 112B and protruding electrode portions 112C are formed corresponding to the pair of terminal electrodes 13B of the chip-type ceramic electronic component 13 (see FIG. 2C).

Thereafter, as shown in FIG. 2C, the second ceramic green sheet 111A ′ is disposed with the adhesion preventing agent layer 114 facing upward, and the adhesion preventing agent layer 114 of the second ceramic green sheet 111A ′ is disposed. After the chip-type ceramic electronic component 113 is disposed thereon, the first ceramic green sheet 111A is disposed above them with the adhesion preventing agent layer 114 facing downward. At this time, it is preferable that the chip-type ceramic electronic component 113 is fixed to a predetermined portion of the adhesion preventing agent layer 114 of the second ceramic green sheet 111A ′ with an adhesive. In this way, the chip-type ceramic electronic component 113 and the first ceramic green sheet 111A are stacked on the second ceramic green sheet 111A ′ and bonded to each other, and then the ceramic green laminate including the chip-type ceramic electronic component 113. 111 is formed. The chip-type ceramic electronic component before being built in the ceramic multilayer substrate 10 will be described with reference numeral “113”.

When the first and second ceramic green sheets 111A and 111A ′ are pressure-bonded, the first and second ceramic green sheets 111A and 111A ′ are laminated as ceramic green layers 111A and 111A ′ as shown in FIG. Thus, the ceramic green multilayer body 111 is formed, and the chip-type ceramic electronic component 113 is encased in the adhesion preventing agent layer 114 in the ceramic green multilayer body 111. Next, the constraining layers 115 are disposed on both upper and lower surfaces of the ceramic clean laminate 111, and the ceramic green laminate 111 is sandwiched between the upper and lower constraining layers 115, followed by thermocompression bonding at a predetermined temperature and pressure. A pressure-bonded body 110 shown in d) is obtained. As the constraining layer 115, as shown in the figure from a hardly sinterable powder that does not sinter at the sintering temperature of the ceramic green laminate 111, for example, a slurry containing Al ₂ O ₃ as a main component and an organic binder as a sub component. The one formed in a sheet shape is used.

2 is fired at a temperature at which the constraining layer 115 is not sintered but the ceramic green laminate 111 is sintered. At this time, the firing conditions are different between the case where the adhesion preventing agent layer 114 is formed of a resin paste and the case of being formed of a carbon paste.

When the adhesion preventing agent layer 114 is formed of a resin paste, the adhesion preventing agent layer 114 is completely burned by firing the pressure-bonded body 110 shown in FIG. Thereafter, the constraining layer 115 is removed to obtain the ceramic multilayer substrate 10 shown in FIG.

Further, when the adhesion preventing agent layer 114 is formed of a carbon paste, a low oxygen atmosphere having a lower oxygen partial pressure than the atmosphere in which the carbon is not burned down in the crimped body 110 shown in FIG. (For example, when the oxygen partial pressure is set to 10 ⁻³ to 10 ⁻⁶ atm) and calcined at 870 ° C., then adjusted to a high oxygen atmosphere (for example, air with a high oxygen partial pressure) to 900 ° C. Then, the adhesion preventive agent layer 114 made of carbon paste is completely burned off by firing again to obtain the ceramic multilayer substrate 10 shown in FIG. When firing in a low oxygen atmosphere, even if the ceramic green laminate 111 is fired and sintered as the ceramic laminate 11, the carbon of the adhesion prevention layer 114 remains without being burned out and maintains its occupied space, and a high oxygen atmosphere When refired, the carbon burns completely and burns out.

The firing temperature is preferably a temperature at which the low-temperature sintered ceramic material is sintered, for example, in the range of 800 to 1050 ° C. If the firing temperature is less than 800 ° C., the ceramic component of the ceramic green laminate 111 may not be sufficiently sintered, and if it exceeds 1050 ° C., the metal particles such as the surface electrode 12A may melt and diffuse into the ceramic green layer 11. There is.

Due to the firing of the ceramic green laminate 111, the adhesion preventive agent layer 114 enclosing the chip-type ceramic electronic component 113 is burned off when the ceramic green laminate 111 is fired, and as shown in FIG. A narrow gap V is formed at the interface between the ceramic laminate 11 and the projecting electrode 12C that electrically connects the via-hole conductor 12B and the terminal electrode 13B. At this time, even if the difference between the thermal expansion coefficient of the ceramic laminate 11 and the thermal expansion coefficient of the chip-type ceramic electronic component 13 is large, the gap V is interposed between the ceramic laminate 11 and the chip-type ceramic electronic component 13. Since the chip-type ceramic electronic component 13 is connected to the via-hole conductor 12B of the ceramic multilayer body 11 only by the protruding electrode 12C, it is caused by the difference in thermal expansion coefficient between the ceramic multilayer body 11 and the chip-type ceramic electronic component 13. The thermal stress is absorbed by the protruding electrode 12C formed of Ag having high ductility, and the thermal stress acting directly on the chip-type ceramic electronic component 13 is relieved, so that the chip-type ceramic electronic component 13 is cracked, or the chip The mold ceramic electronic component 13 is not damaged.

Further, since the void V is formed at the interface between the ceramic laminate 11 and the chip-type ceramic electronic component 13 when the ceramic green laminate 111 is sintered, the ceramic sintering of the ceramic laminate 11 and the chip-type ceramic electronic component 13 is performed. Interdiffusion of material components with the body 13A can be reliably prevented, and characteristic deterioration of the chip-type ceramic electronic component 13 after firing can be prevented. In addition, the protruding electrode portion 12C and the terminal electrode 13B of the chip-type ceramic electronic component 13 are integrated by the respective metal particles growing and sintering, and these 12C and 13B are firmly connected.

After firing, the ceramic multilayer substrate 10 can be obtained by removing the upper and lower constraining layers 115 by blasting or ultrasonic cleaning.

As described above, according to the present embodiment, the ceramic green laminated body 111 in which the plurality of ceramic green layers 111A are laminated and has the conductor pattern portion 112, the ceramic sintered body 113A, the terminal electrode 113B, and the ceramic green A ceramic containing the chip-type ceramic electronic component 13 by simultaneously firing the chip-type ceramic electronic component 113 which is disposed inside the multilayer body 111 and in which the terminal electrode 113B is electrically connected to the conductor pattern portion 112. When the multilayer substrate 10 is manufactured, a step of forming the adhesion preventing agent layer 114 at a position where the ceramic green layers 111A and 111A ′ are in contact with the chip-type ceramic electronic component 113, and the ceramic green laminate 111 and the chip-type ceramic electronic component 113 are formed. Firing the adhesion inhibitor layer To include a step of burning off the 14, and the adhesion preventing agent layer 114 at the time of firing is burned, it is void V in the interface of the ceramic laminate 11 and the chip-type ceramic electronic component 13. As a result, even if thermal stress acts on the chip-type ceramic electronic component 13 from the ceramic laminate 11 due to the difference in thermal expansion coefficient between the thermal expansion coefficient of the ceramic laminate 11 and the chip-type ceramic electronic component 13 during firing. Since this thermal stress is absorbed by the protruding electrode 12C and the thermal stress is relaxed and is not easily transmitted to the chip-type ceramic electronic component 13, the chip-type ceramic electronic component 13 is cracked or the chip-type ceramic electronic component 13 is damaged. There is nothing. Further, the void V formed at the interface between the ceramic layer 11A and the chip-type ceramic electronic component 13 during firing can reliably prevent mutual diffusion of material components between the ceramic laminate 11 and the ceramic sintered body 13A. In addition, it is possible to prevent deterioration of the characteristics of the chip-type ceramic electronic component 13 built in the ceramic multilayer substrate 10.

Further, according to the present embodiment, since the adhesion preventing agent layer 114 is formed on the ceramic green sheet 111A, the adhesion preventing agent layer 114 can be formed in the same printing process as the surface electrode portion 112A. The adhesion preventing agent layer 114 can be formed without introducing a special process or apparatus for 114. Further, since the adhesion preventive agent layers 114 are arranged on both surfaces of the chip-type ceramic electronic component 13, a void V is formed surrounding the entire surface of the chip-type ceramic electronic component 13, and the chip-type ceramic electronic component 13 is ceramic laminated only by the protruding electrode 12C. Since it is connected to the via-hole conductor 12B of the body 11, the ceramic multilayer substrate 10 having a structure resistant to thermal stress can be obtained. Moreover, since the adhesion preventing agent layer 114 is formed using a resin that burns out at a temperature lower than the firing temperature as the burned material, the voids V can be more reliably formed during firing. When carbon is used as the burned-out material, the carbon remains when firing in a low-oxygen atmosphere to suppress the shrinkage of the ceramic green sheets 111A and 111A ′, thereby reliably ensuring a space to be a void V, The desired voids V can be reliably formed by completely burning and burning carbon in an oxygen atmosphere.

In addition, according to the present embodiment, since the ceramic layer 11A is a low-temperature sintered ceramic layer, a low-resistance and inexpensive metal such as Ag can be used as the conductor pattern 12, which reduces manufacturing costs and has high frequency characteristics. It can contribute to improvement. Furthermore, since the ceramic multilayer substrate 10 is manufactured by a non-shrinkage method, there is almost no shrinkage in the plane direction. Therefore, the thermal stress acting on the chip-type ceramic electronic component 13 during firing can be remarkably reduced, and damage to the chip-type ceramic electronic component 13 can be more reliably prevented.

Second Embodiment A ceramic multilayer substrate 10A of the present embodiment is configured according to the first embodiment except that the type of chip-type ceramic electronic component 13 is different as shown in FIG. Therefore, the same or corresponding parts as those in the first embodiment are denoted by the same reference numerals and the characteristic parts of this embodiment will be described.

As shown in FIG. 3, the chip-type ceramic electronic component 13 in the present embodiment includes a ceramic sintered body 13A and a pair of terminal electrodes 13B formed on both upper and lower surfaces of the ceramic sintered body 13A. . The pair of terminal electrodes 13B are arranged apart from each other in the stacking direction (vertical direction) of the ceramic layer 11A, and the ceramic sintered body 13A is sandwiched from above and below by these terminal electrodes 13B. The upper and lower terminal electrodes 13B are electrically connected to via-hole conductors 12B formed through the upper and lower ceramic layers 11A via projecting electrodes 12C formed in the gaps V at the respective central portions. The upper and lower via-hole conductors 12B are electrically connected to the surface electrode 12A formed on the surface of each ceramic layer 11A. In FIG. 3, the upper and lower terminal electrodes 13B are each connected to one via-hole conductor 12B via a protruding electrode 12C. However, if necessary, a plurality of protruding electrodes may be connected to a plurality of via-hole conductors. You may connect to a terminal electrode.

The ceramic multilayer substrate 10A of the present embodiment is configured in accordance with the ceramic multilayer substrate 10 of the first embodiment except that the structure of the terminal electrode 13B of the chip-type ceramic electronic component 13 is different. It can be manufactured according to the ceramic multilayer substrate 10 of the embodiment, and the same effect as the ceramic multilayer substrate 10 can be expected.

Third Embodiment As shown in FIG. 4, the ceramic multilayer substrate 10 </ b> B of the present embodiment is configured according to the first embodiment except that the form of the conductor pattern 12 is different. Therefore, the same or corresponding parts as those in the first embodiment are denoted by the same reference numerals and the characteristic parts of this embodiment will be described.

As shown in FIG. 4, the chip-type ceramic electronic component 13 in the present embodiment is configured substantially the same as the chip-type ceramic electronic component 13 in the first embodiment. In the first embodiment, the conductor pattern 12 is formed only on the upper ceramic layer 11A of the chip-type ceramic electronic component 13. However, in this embodiment, the conductor pattern 12 is also formed on the lower ceramic layer 11A. . The conductor patterns 12 formed on the upper and lower ceramic layers 11A are formed vertically symmetrical. Therefore, only the conductor pattern 12 of the upper ceramic layer 11A will be described.

As shown in FIG. 4, the conductor pattern 12 is a surface formed on the upper ceramic layer 11A facing the terminal electrode 13B of the chip-type ceramic electronic component 13 and the via-hole conductor 12B that vertically penetrates the upper ceramic layer 11A. It has an inner conductor 12D and a protruding electrode 12C that electrically connects the in-plane conductor 12D and the terminal electrode 13B. The conductor pattern 12 is formed corresponding to the left and right terminal electrodes 13B. The left and right protruding electrodes 12 </ b> C are each formed in a gap V formed at the interface between the ceramic laminate 11 and the chip-type ceramic electronic component 13. The protruding electrode 12C can form a protruding electrode portion by providing a through hole in a previously formed adhesion preventing agent layer (not shown) and filling the through hole with a conductive paste by screen printing. The in-plane conductor 12D can be directly formed on a ceramic green sheet (not shown) by screen printing.

Also, as described above, the conductor pattern 12 is formed on the lower ceramic layer 11A corresponding to the left and right terminal electrodes 13B of the chip-type ceramic electronic component 13 so as to be vertically symmetrical. Although the ceramic multilayer substrate 10B shown in FIG. 4 does not have a surface electrode, it goes without saying that a surface electrode may be provided if necessary.

The ceramic multilayer substrate 10B of this embodiment can also be manufactured according to the ceramic multilayer substrate 20 of the first and second embodiments, and the same effect as the ceramic multilayer substrate 10 can be expected.

Next, specific examples will be described below.

Example 1
In this example, a ceramic multilayer substrate was prepared according to the procedure shown in FIGS. That is, the adhesion preventing layer was formed by screen printing the resin paste on the two first and second ceramic green sheets. Further, a via hole that also penetrates the adhesion preventive agent layer is formed on the first ceramic green sheet using a puncher, and then a conductive paste mainly composed of Ag is filled in the via hole to form a via hole conductor portion. And the surface electrode part was formed in the surface on the opposite side to an adhesion inhibitor layer.

By arranging 100 multilayer capacitors as chip-type ceramic electronic components in the first and second ceramic green sheet adhesion preventing agent layers, and sandwiching and pressing them, 100 multilayer capacitors are built in the ceramic green multilayer body. It was. A constraining layer was thermocompression bonded to the upper and lower surfaces of the ceramic green laminate to obtain a pressed body. After firing this pressure-bonded body at 900 ° C., the constraining layer was removed to obtain a ceramic multilayer substrate. The multilayer capacitor used had a size of 0402 and a capacitance of 10 μF. The thermal expansion coefficient of the ceramic multilayer body was 6 ppm / ° C., and the thermal expansion coefficient of the multilayer capacitor was 11 ppm / ° C.

In addition, as a comparative example, a ceramic green laminate without an adhesion prevention layer was prepared, and this ceramic green laminate was sandwiched between constraining layers and thermocompression bonded, and then fired in the same manner as in the examples to produce a comparative ceramic multilayer substrate. Obtained.

As a result of examining the presence or absence of cracks in the ceramic multilayer substrate of this example obtained as described above, no cracks were observed in either the ceramic multilayer body or the multilayer capacitor. Moreover, as a result of measuring the capacity of the multilayer capacitor, it was 9.8 μF, which was almost the same as 10 μF before incorporation. On the other hand, as a result of examining the presence or absence of cracks in the ceramic multilayer substrate for comparison as well, cracks were found in the multilayer capacitor, and a desired capacity could not be obtained.

According to the above results, the adhesion preventing layer is burned out by firing, and a gap is formed at the interface between the ceramic multilayer body and the multilayer capacitor, and the ceramic multilayer body and the multilayer capacitor are connected only by protruding electrodes. Even if the difference in thermal expansion coefficient between the capacitor and the multilayer capacitor is as large as 5 ppm / ° C, the projecting electrode having high ductility can cause thermal stress due to the difference in thermal expansion coefficient between the thermal expansion coefficient of the ceramic multilayer body and that of the multilayer capacitor. The multilayer capacitor could be built in the ceramic multilayer body without any cracks in the multilayer capacitor.

Example 2
In this example, a chip coil (10 μH) is used instead of the multilayer capacitor used in Example 1, and the chip coil is built in the same manner as in Example 1, and there is a gap at the interface between the ceramic laminate and the chip coil. A ceramic multilayer substrate was produced. The thermal expansion coefficient of the ceramic multilayer body of this ceramic multilayer substrate was 10 ppm / ° C., and the thermal expansion coefficient of the chip coil was 10.2 ppm / ° C. For comparison, a ceramic multilayer substrate having a chip coil without voids was fabricated.

As a result of measuring the inductance value of the chip coil for the ceramic multilayer substrate of the present example obtained as described above, it was 9.8 μH, which was hardly lowered from 10 μH before incorporation. In contrast, the inductance value of the ceramic multilayer substrate for comparison was greatly reduced from 10 μH to 7.5 μH.

According to the above results, even when there is almost no difference in thermal expansion coefficient between the thermal expansion coefficient of the ceramic laminate and the thermal expansion coefficient of the chip coil, the comparative ceramic multilayer substrate without voids has a large size in the chip coil during firing. It is considered that the characteristics of the chip coil using the ferrite having a large characteristic fluctuation with respect to the compressive stress greatly deteriorated due to the compressive stress. Since shrinkage in the thickness direction cannot be suppressed even by the non-shrinkage method that suppresses shrinkage in the planar direction, it is not possible to prevent compressive stress from acting on the chip coil in the comparative ceramic multilayer substrate without voids. For this reason, conventionally, a chip coil that is weak against compressive stress cannot be incorporated in the ceramic laminate as it is.

In contrast, in the ceramic multilayer substrate of this example, since a void is formed at the interface between the ceramic laminate and the chip coil by firing, even if shrinkage stress in the thickness direction acts on the ceramic laminate during firing, the ceramic multilayer substrate Compressive stress does not directly act on the chip coil due to the gap between the laminated body and the chip coil, and fluctuations in the characteristics of the chip coil can be suppressed. Therefore, even a chip coil that has not been incorporated in the ceramic multilayer substrate can be incorporated in the ceramic multilayer substrate in the same manner as the multilayer capacitor.

Example 3
In the present embodiment, the ceramic multilayer substrate shown in FIG. 3 incorporating the chip-type ceramic electronic component having the terminal electrodes arranged vertically apart from each other in the thickness direction of the chip-type ceramic electronic component, that is, the stacking direction of the ceramic laminate. Produced.

In the ceramic multilayer substrate of this embodiment, thermal stress is generated between the upper and lower terminal electrodes, but since the dimension between the terminal electrodes is small, the difference in thermal expansion between the terminal electrodes is small, and the chip-type ceramic electronic component is cracked. And chip-type ceramic electronic components are not damaged.

Note that the present invention is not limited to the above-described embodiments, and is included in the present invention unless it is contrary to the gist of the present invention. For example, in each of the embodiments described above, the case where the ceramic multilayer substrate is manufactured by the non-shrinking method has been described. It is only necessary to include a step of forming voids at the interface, and the present invention is not limited to the non-shrinkage method, and manufacturing methods other than the non-shrinkage method are also included in the present invention. In this case, it is necessary to appropriately adjust the size of the adhesion preventing agent layer according to the shrinkage difference between the ceramic green layer and the adhesion preventing agent layer. For example, when the adhesion preventive agent layer is formed of a resin, a void having a desired size cannot be formed unless the size of the adhesion preventive agent layer made of the resin is sufficiently increased. In each of the above embodiments, the adhesion preventing agent layer is formed on the upper and lower ceramic green sheets. However, the adhesion preventing agent layer may be formed only on one side. Further, the terminal electrode of the chip-type ceramic electronic component may be directly connected to the surface electrode between the ceramic green layers or the via hole electrode formed in the ceramic green layer instead of the protruding electrode.

The present invention can be suitably used for a ceramic multilayer substrate used in an electronic device or the like and a manufacturing method thereof.

Claims (13)

A ceramic green laminate having a plurality of ceramic green layers and having a conductor pattern, a ceramic sintered body and a terminal electrode, disposed inside the ceramic green laminate, and the terminal electrode and the conductor pattern A method of manufacturing a ceramic multilayer substrate incorporating chip-type ceramic electronic components by simultaneously firing chip-type ceramic electronic components that are electrically connected,
A first step of forming an adhesion preventive agent layer at a portion of the ceramic green layer in contact with the chip-type ceramic electronic component;
And a second step of burning the ceramic green laminate and the chip-type ceramic electronic component to burn off the adhesion preventive agent layer. The method for producing a ceramic multilayer substrate according to claim 1, further comprising a step of disposing the adhesion preventing agent layer on both surfaces of the chip-type ceramic electronic component. 3. The ceramic multilayer substrate according to claim 1, wherein the adhesion preventing agent is a resin paste, and in the first step, the resin paste is applied on the ceramic green layer. Method. The adhesion preventing agent does not burn out in a low oxygen atmosphere, but includes a burned material that burns out in a high oxygen atmosphere,
In the first step, a paste made of the burned material is applied on the ceramic green layer,
In the second step, the ceramic green laminate and the chip-type ceramic electronic component are fired in a low oxygen atmosphere, and then both are fired again in a high oxygen atmosphere to burn down the burned material. The manufacturing method of the ceramic multilayer substrate of Claim 1 or Claim 2. The method for producing a ceramic multilayer substrate according to claim 4, wherein the burned-out material is carbon. 6. The method according to claim 1, further comprising a step of forming a via hole in a portion of the adhesion preventing agent layer overlapping with the terminal electrode of the chip-type ceramic electronic component, and filling the via hole with a conductive paste. A method for producing a ceramic multilayer substrate according to claim 1. The ceramic green laminate and the chip-type ceramic electronic component are fired in a state where a constraining layer made of an inorganic material that does not sinter at the firing temperature of the ceramic green laminate is disposed on at least one main surface of the ceramic green laminate. The method for producing a ceramic multilayer substrate according to any one of claims 1 to 6, wherein: 8. The thermal expansion coefficient of the sintered body of the ceramic green laminate is substantially equal to the thermal expansion coefficient of the ceramic sintered body constituting the chip-type ceramic electronic component. 2. A method for producing a ceramic multilayer substrate according to item 1. Chip-type ceramic electronic comprising a ceramic laminate having a plurality of ceramic layers laminated and having a conductor pattern, and a ceramic sintered body and a terminal electrode electrically connected to the conductor pattern provided at the interface between the upper and lower ceramic layers A ceramic multilayer board comprising components,
While there is a void at the interface between the ceramic layer and the chip-type ceramic electronic component,
A ceramic multilayer substrate, wherein a terminal electrode of the chip-type ceramic electronic component and the conductor pattern are electrically connected by a protruding electrode formed in the gap. 10. The ceramic multilayer substrate according to claim 9, wherein the protruding electrode is directly connected to a via-hole conductor formed in a ceramic layer in contact with the gap. 11. The ceramic multilayer substrate according to claim 9 or 10, wherein terminal electrodes of the chip-type ceramic electronic component are spaced apart from each other in the stacking direction of the ceramic layers. The ceramic multilayer substrate according to any one of claims 9 to 11, wherein the protruding electrode is formed of a material having high ductility. The ceramic multilayer substrate according to claim 12, wherein the material having high ductility is silver.

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