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WO2009085631A3 - Adhesive tape and method for preparing the same - Google Patents

Adhesive tape and method for preparing the same Download PDF

Info

Publication number
WO2009085631A3
WO2009085631A3 PCT/US2008/086363 US2008086363W WO2009085631A3 WO 2009085631 A3 WO2009085631 A3 WO 2009085631A3 US 2008086363 W US2008086363 W US 2008086363W WO 2009085631 A3 WO2009085631 A3 WO 2009085631A3
Authority
WO
WIPO (PCT)
Prior art keywords
preparing
same
adhesive tape
conductive filler
adhesive tapes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2008/086363
Other languages
French (fr)
Other versions
WO2009085631A2 (en
Inventor
Hun Jeong
Jeongwan Choi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Priority to EP08867664A priority Critical patent/EP2235130A2/en
Priority to CN2008801220251A priority patent/CN101903484A/en
Priority to BRPI0821289-9A priority patent/BRPI0821289A2/en
Priority to JP2010539635A priority patent/JP2011508012A/en
Priority to CA2709934A priority patent/CA2709934A1/en
Publication of WO2009085631A2 publication Critical patent/WO2009085631A2/en
Publication of WO2009085631A3 publication Critical patent/WO2009085631A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

Disclosed are adhesive tapes which include a flake conductive filler material. According to the disclosed invention, the adhesive tapes comprising a flake conductive filler that can be changed depending on the light-shielding pattern of the mask, can be have a relatively small thickness of around about 100 µm and different electrical conductivity.
PCT/US2008/086363 2007-12-21 2008-12-11 Adhesive tape and method for preparing the same Ceased WO2009085631A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP08867664A EP2235130A2 (en) 2007-12-21 2008-12-11 Adhesive tape and method for preparing the same
CN2008801220251A CN101903484A (en) 2007-12-21 2008-12-11 Adhesive tape and preparation method thereof
BRPI0821289-9A BRPI0821289A2 (en) 2007-12-21 2008-12-11 Adhesive tape and method for preparing it
JP2010539635A JP2011508012A (en) 2007-12-21 2008-12-11 Adhesive tape and method for producing the same
CA2709934A CA2709934A1 (en) 2007-12-21 2008-12-11 Adhesive tape and method for preparing the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2007-0135804 2007-12-21
KR1020070135804A KR20090067964A (en) 2007-12-21 2007-12-21 Adhesive tape and manufacturing method thereof

Publications (2)

Publication Number Publication Date
WO2009085631A2 WO2009085631A2 (en) 2009-07-09
WO2009085631A3 true WO2009085631A3 (en) 2009-08-27

Family

ID=40824985

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/086363 Ceased WO2009085631A2 (en) 2007-12-21 2008-12-11 Adhesive tape and method for preparing the same

Country Status (9)

Country Link
EP (1) EP2235130A2 (en)
JP (1) JP2011508012A (en)
KR (1) KR20090067964A (en)
CN (1) CN101903484A (en)
BR (1) BRPI0821289A2 (en)
CA (1) CA2709934A1 (en)
RU (1) RU2010125988A (en)
TW (1) TW200948927A (en)
WO (1) WO2009085631A2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100608533B1 (en) 2005-05-13 2006-08-08 쓰리엠 이노베이티브 프로퍼티즈 캄파니 Polymer resin with excellent electrical conductivity and its manufacturing method
US9426878B2 (en) 2011-10-25 2016-08-23 3M Innovative Properties Company Nonwoven adhesive tapes and articles therefrom
CN110746901A (en) * 2019-11-12 2020-02-04 湖南省和祥润新材料有限公司 Combined type shading adhesive and manufacturing process thereof
US20230059388A1 (en) * 2020-01-22 2023-02-23 3M Innovative Properties Company Magnetic film
WO2021148916A1 (en) * 2020-01-22 2021-07-29 3M Innovative Properties Company Electrically conductive adhesive layer
RU2724650C1 (en) * 2020-01-22 2020-06-25 ООО "РТ-технологии" Electroconductive materials dispersed in non-conductive organic material
KR102271126B1 (en) * 2020-12-28 2021-07-02 주식회사 스파이더실크 High Thermal Conductivity Heat Dissipation Composite Material And Manufacturing Method Thereof
KR102795293B1 (en) * 2022-04-19 2025-04-16 주식회사 애스크와이 Adhesive film having different adhesive sections and method of manufacturing the same
CN115181505B (en) * 2022-07-12 2024-02-27 东莞市兆科电子材料科技有限公司 Heat conduction gasket and preparation method thereof
EP4431017A1 (en) * 2023-03-07 2024-09-18 Lohmann GmbH & Co. KG Dry electrode device
EP4428185A1 (en) * 2023-03-07 2024-09-11 Lohmann GmbH & Co. KG Pressure-sensitive adhesive, pressure-sensitive adhesive layer and pressure-sensitive tape
GB2628426A (en) * 2023-03-24 2024-09-25 Preeminent Smart Solutions Ltd A composition, an audio device, a connector and method of making a connector

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4731282A (en) * 1983-10-14 1988-03-15 Hitachi Chemical Co., Ltd. Anisotropic-electroconductive adhesive film
WO2004077621A1 (en) * 2003-02-28 2004-09-10 J.S.T. Mfg. Co. Ltd. Anisotropic conductive sheet
US7034403B2 (en) * 2003-04-10 2006-04-25 3M Innovative Properties Company Durable electronic assembly with conductive adhesive
US20070001292A1 (en) * 2005-06-30 2007-01-04 Polymatech Co., Ltd. Heat radiation member and production method for the same
US20070068622A1 (en) * 2004-02-26 2007-03-29 Sony Chemicals Corp. Method for establishing anisotropic conductive connection and anisotropic conductive adhesive film

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4731282A (en) * 1983-10-14 1988-03-15 Hitachi Chemical Co., Ltd. Anisotropic-electroconductive adhesive film
WO2004077621A1 (en) * 2003-02-28 2004-09-10 J.S.T. Mfg. Co. Ltd. Anisotropic conductive sheet
US7034403B2 (en) * 2003-04-10 2006-04-25 3M Innovative Properties Company Durable electronic assembly with conductive adhesive
US20070068622A1 (en) * 2004-02-26 2007-03-29 Sony Chemicals Corp. Method for establishing anisotropic conductive connection and anisotropic conductive adhesive film
US20070001292A1 (en) * 2005-06-30 2007-01-04 Polymatech Co., Ltd. Heat radiation member and production method for the same

Also Published As

Publication number Publication date
JP2011508012A (en) 2011-03-10
EP2235130A2 (en) 2010-10-06
TW200948927A (en) 2009-12-01
CN101903484A (en) 2010-12-01
RU2010125988A (en) 2012-01-27
BRPI0821289A2 (en) 2015-06-16
KR20090067964A (en) 2009-06-25
WO2009085631A2 (en) 2009-07-09
CA2709934A1 (en) 2009-07-09

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