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WO2009078440A1 - Adhesive sheet for bonding wafer and wafer processing method - Google Patents

Adhesive sheet for bonding wafer and wafer processing method Download PDF

Info

Publication number
WO2009078440A1
WO2009078440A1 PCT/JP2008/072994 JP2008072994W WO2009078440A1 WO 2009078440 A1 WO2009078440 A1 WO 2009078440A1 JP 2008072994 W JP2008072994 W JP 2008072994W WO 2009078440 A1 WO2009078440 A1 WO 2009078440A1
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
adhesive sheet
bonding
processing method
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/072994
Other languages
French (fr)
Japanese (ja)
Inventor
Akira Yabuki
Syozo Yano
Satoshi Ota
Yuri Tamagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008306587A external-priority patent/JP5448430B2/en
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to CN2008801214941A priority Critical patent/CN101903983A/en
Publication of WO2009078440A1 publication Critical patent/WO2009078440A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • H10P54/00—
    • H10P72/74—
    • H10P72/7402—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2453/00—Presence of block copolymer
    • C09J2453/006—Presence of block copolymer in the substrate
    • H10P72/7416—
    • H10P72/742—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Dicing (AREA)

Abstract

Disclosed is an adhesive sheet for bonding a wafer. The adhesive sheet is composed of a base material film (1), and an adhesive layer (2), which is formed on the base material film and has a loss coefficient of 0.15 or more (at 23°C and a frequency of 1-100Hz) as a result of measuring the adhesive sheet by means of a dynamic viscoelastic measuring apparatus by using a test piece processed to have a width of 7mm. Also disclosed is a wafer processing method wherein a step of bonding a wafer to the adhesive sheet for bonding the wafer and a step of dicing the wafer are included, and a cut is not made up to the base material film of the adhesive sheet.
PCT/JP2008/072994 2007-12-18 2008-12-17 Adhesive sheet for bonding wafer and wafer processing method Ceased WO2009078440A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2008801214941A CN101903983A (en) 2007-12-18 2008-12-17 Adhesive sheet for wafer bonding and method for processing wafer

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-326555 2007-12-18
JP2007326555 2007-12-18
JP2008-306587 2008-12-01
JP2008306587A JP5448430B2 (en) 2007-12-18 2008-12-01 Wafer sticking sheet and wafer processing method

Publications (1)

Publication Number Publication Date
WO2009078440A1 true WO2009078440A1 (en) 2009-06-25

Family

ID=40795553

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/072994 Ceased WO2009078440A1 (en) 2007-12-18 2008-12-17 Adhesive sheet for bonding wafer and wafer processing method

Country Status (1)

Country Link
WO (1) WO2009078440A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011004825A1 (en) * 2009-07-08 2011-01-13 古河電気工業株式会社 Wafer-pasting adhesive sheet and wafer processing method using the same
US20130171449A1 (en) * 2010-09-13 2013-07-04 Sumitomo Bakelite Co., Ltd. Dicing film
JP2013194187A (en) * 2012-03-21 2013-09-30 Furukawa Electric Co Ltd:The Vibration-damping adhesive sheet
WO2016151911A1 (en) * 2015-03-23 2016-09-29 リンテック株式会社 Semiconductor processing sheet and method for manufacturing semiconductor device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09320996A (en) * 1996-03-29 1997-12-12 Denso Corp Method for manufacturing semiconductor device
JP2002155249A (en) * 2000-11-22 2002-05-28 Mitsui Chemicals Inc Adhesive tape for wafer processing, method for producing and using the same
JP2002294184A (en) * 2001-03-29 2002-10-09 Toyo Chem Co Ltd Sheet for fixing semiconductor wafer
JP2003007646A (en) * 2001-06-18 2003-01-10 Nitto Denko Corp Method for producing pressure-sensitive adhesive sheet for dicing and cut pieces
JP2003092273A (en) * 2001-09-19 2003-03-28 Mitsubishi Plastics Ind Ltd Dicing film for semiconductor wafer

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09320996A (en) * 1996-03-29 1997-12-12 Denso Corp Method for manufacturing semiconductor device
JP2002155249A (en) * 2000-11-22 2002-05-28 Mitsui Chemicals Inc Adhesive tape for wafer processing, method for producing and using the same
JP2002294184A (en) * 2001-03-29 2002-10-09 Toyo Chem Co Ltd Sheet for fixing semiconductor wafer
JP2003007646A (en) * 2001-06-18 2003-01-10 Nitto Denko Corp Method for producing pressure-sensitive adhesive sheet for dicing and cut pieces
JP2003092273A (en) * 2001-09-19 2003-03-28 Mitsubishi Plastics Ind Ltd Dicing film for semiconductor wafer

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011004825A1 (en) * 2009-07-08 2011-01-13 古河電気工業株式会社 Wafer-pasting adhesive sheet and wafer processing method using the same
CN102473617A (en) * 2009-07-08 2012-05-23 古河电气工业株式会社 Adhesive sheet for bonding wafers and method for processing wafers using the same
JPWO2011004825A1 (en) * 2009-07-08 2012-12-20 古河電気工業株式会社 Wafer sticking adhesive sheet and wafer processing method using the same
KR101336430B1 (en) * 2009-07-08 2013-12-04 후루카와 덴키 고교 가부시키가이샤 Wafer-pasting adhesive sheet and wafer processing method using the same
TWI447202B (en) * 2009-07-08 2014-08-01 古河電氣工業股份有限公司 Wafer bonding adhesive tape and the use of its wafer processing methods
CN102473617B (en) * 2009-07-08 2015-04-29 古河电气工业株式会社 Adhesive sheet for bonding wafers and method for processing wafers using the same
US20130171449A1 (en) * 2010-09-13 2013-07-04 Sumitomo Bakelite Co., Ltd. Dicing film
US9570335B2 (en) * 2010-09-13 2017-02-14 Sumitomo Bakelite Co., Ltd. Dicing film
JP2013194187A (en) * 2012-03-21 2013-09-30 Furukawa Electric Co Ltd:The Vibration-damping adhesive sheet
WO2016151911A1 (en) * 2015-03-23 2016-09-29 リンテック株式会社 Semiconductor processing sheet and method for manufacturing semiconductor device

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