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WO2009075220A1 - Probe card - Google Patents

Probe card Download PDF

Info

Publication number
WO2009075220A1
WO2009075220A1 PCT/JP2008/072045 JP2008072045W WO2009075220A1 WO 2009075220 A1 WO2009075220 A1 WO 2009075220A1 JP 2008072045 W JP2008072045 W JP 2008072045W WO 2009075220 A1 WO2009075220 A1 WO 2009075220A1
Authority
WO
WIPO (PCT)
Prior art keywords
material layer
surface side
elastic material
inspection
side elastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/072045
Other languages
French (fr)
Japanese (ja)
Inventor
Takashi Amemiya
Syuichi Tsukada
Mutsuhiko Yoshioka
Isamu Mochizuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of WO2009075220A1 publication Critical patent/WO2009075220A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

A contact structure for inspection is attached on a lower surface side of a circuit board in a probe card. The contact structure for inspection is provided with a three-layer structure having an intermediate board, an upper surface side elastic material layer attached to the upper surface of the intermediate board, and a lower surface side elastic material layer attached to the lower surface of the intermediate board. The elastic material layer on the lower surface side has a plurality of elastic bodies which are brought into an electrically continuous state to a subject to be inspected when inspection is performed. The upper surface sideelastic material layer has a plurality of elastic bodies which are brought into an electrically continuous state to the circuit board. The elastic modulus of the upper surface side elastic material layer is set lower than that of the lower surface side elastic material layer by having the number of the elastic bodies in the upper surface side elastic material layer less than that in the lower surface side elastic material layer.
PCT/JP2008/072045 2007-12-10 2008-12-04 Probe card Ceased WO2009075220A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007317922A JP2009139298A (en) 2007-12-10 2007-12-10 Probe card
JP2007-317922 2007-12-10

Publications (1)

Publication Number Publication Date
WO2009075220A1 true WO2009075220A1 (en) 2009-06-18

Family

ID=40755464

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/072045 Ceased WO2009075220A1 (en) 2007-12-10 2008-12-04 Probe card

Country Status (3)

Country Link
JP (1) JP2009139298A (en)
TW (1) TW200931024A (en)
WO (1) WO2009075220A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021181933A (en) * 2020-05-19 2021-11-25 信越ポリマー株式会社 Vertical contact probes, probe cards and sockets
WO2024052463A1 (en) * 2022-09-08 2024-03-14 Silex Microsystems Ab Microstructure inspection device and system and use of the same
CN119757809A (en) * 2023-09-28 2025-04-04 芯卓科技(浙江)有限公司 Elastic intermediary layer and conductive device thereof

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5629545B2 (en) * 2009-12-18 2014-11-19 株式会社日本マイクロニクス Probe card and inspection device
JP5690321B2 (en) * 2012-11-29 2015-03-25 株式会社アドバンテスト Probe apparatus and test apparatus
KR20190035735A (en) 2016-08-08 2019-04-03 세키스이가가쿠 고교가부시키가이샤 Member for continuity test apparatus and continuity test apparatus
KR102339327B1 (en) * 2019-10-28 2021-12-15 주식회사 나노엑스 Manufacturing method of probe-head for led probe device
CN119104868A (en) * 2023-06-09 2024-12-10 颖崴科技股份有限公司 Test socket
TWI862047B (en) * 2023-06-09 2024-11-11 穎崴科技股份有限公司 Test socket

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000221209A (en) * 1999-01-29 2000-08-11 Nitto Denko Corp Inspection method for semiconductor element and anisotropic conductive film therefor
JP2001351702A (en) * 2000-06-09 2001-12-21 Jsr Corp Sheet connector, method of manufacturing the same, and electrical inspection device
JP2002124319A (en) * 2000-10-18 2002-04-26 Nitto Denko Corp Anisotropic conductive film and method for inspecting semiconductor element or electronic component using the same
JP2002139529A (en) * 2000-11-01 2002-05-17 Jsr Corp Connector for measuring electric resistance, apparatus and method for measuring electric resistance of circuit board
JP2005283571A (en) * 2004-03-02 2005-10-13 Jsr Corp Circuit board inspection apparatus and circuit board inspection method
WO2006026733A2 (en) * 2004-08-31 2006-03-09 Formactor, Inc. A method of designing a probe card apparatus with desired compliance characteristics
JP2006194620A (en) * 2005-01-11 2006-07-27 Tokyo Electron Ltd Probe card and inspection contact structure
JP2008039768A (en) * 2006-07-10 2008-02-21 Tokyo Electron Ltd Probe card

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000221209A (en) * 1999-01-29 2000-08-11 Nitto Denko Corp Inspection method for semiconductor element and anisotropic conductive film therefor
JP2001351702A (en) * 2000-06-09 2001-12-21 Jsr Corp Sheet connector, method of manufacturing the same, and electrical inspection device
JP2002124319A (en) * 2000-10-18 2002-04-26 Nitto Denko Corp Anisotropic conductive film and method for inspecting semiconductor element or electronic component using the same
JP2002139529A (en) * 2000-11-01 2002-05-17 Jsr Corp Connector for measuring electric resistance, apparatus and method for measuring electric resistance of circuit board
JP2005283571A (en) * 2004-03-02 2005-10-13 Jsr Corp Circuit board inspection apparatus and circuit board inspection method
WO2006026733A2 (en) * 2004-08-31 2006-03-09 Formactor, Inc. A method of designing a probe card apparatus with desired compliance characteristics
JP2006194620A (en) * 2005-01-11 2006-07-27 Tokyo Electron Ltd Probe card and inspection contact structure
JP2008039768A (en) * 2006-07-10 2008-02-21 Tokyo Electron Ltd Probe card

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021181933A (en) * 2020-05-19 2021-11-25 信越ポリマー株式会社 Vertical contact probes, probe cards and sockets
WO2021235483A1 (en) * 2020-05-19 2021-11-25 信越ポリマー株式会社 Vertical contact-type probe, probe card, and socket
JP7499609B2 (en) 2020-05-19 2024-06-14 信越ポリマー株式会社 Vertical contact probe, probe card and socket
WO2024052463A1 (en) * 2022-09-08 2024-03-14 Silex Microsystems Ab Microstructure inspection device and system and use of the same
CN119757809A (en) * 2023-09-28 2025-04-04 芯卓科技(浙江)有限公司 Elastic intermediary layer and conductive device thereof

Also Published As

Publication number Publication date
TW200931024A (en) 2009-07-16
JP2009139298A (en) 2009-06-25

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