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WO2009075196A1 - Two-sided adhesive tape for semiconductor processing and tape for semiconductor processing - Google Patents

Two-sided adhesive tape for semiconductor processing and tape for semiconductor processing Download PDF

Info

Publication number
WO2009075196A1
WO2009075196A1 PCT/JP2008/071711 JP2008071711W WO2009075196A1 WO 2009075196 A1 WO2009075196 A1 WO 2009075196A1 JP 2008071711 W JP2008071711 W JP 2008071711W WO 2009075196 A1 WO2009075196 A1 WO 2009075196A1
Authority
WO
WIPO (PCT)
Prior art keywords
supporting plate
semiconductor processing
tape
sided adhesive
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/071711
Other languages
French (fr)
Japanese (ja)
Inventor
Yangsoo Lee
Daihei Sugita
Yuichi Sumii
Yasuhiko Oyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008088236A external-priority patent/JP2009001773A/en
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to KR1020107010414A priority Critical patent/KR101386367B1/en
Priority to JP2008555545A priority patent/JP5001955B2/en
Publication of WO2009075196A1 publication Critical patent/WO2009075196A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H10P52/00—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H10P72/0442—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

To provide a two-sided adhesive tape for semiconductor processing which is used for the purpose of strengthening a semiconductor wafer during an IC chip fabrication by providing an adhesion between the semiconductor wafer and a supporting plate, wherein separation between the two-sided adhesive tape and the supporting plate is ensured easily and securely by giving stimulation. A two-sided adhesive tape for semiconductor processing which is used for the purpose of strengthening a semiconductor wafer during IC chip fabrication by providing an adhesion between the semiconductor wafer and a supporting plate wherein the tape comprises a base material and adhesive layers formed on the both sides of the base material, one of the adhesive layers located on the side which adheres to the supporting plate contains a gas-forming agent which generates a gas by stimulation, at the same time, the base material on the side in contact with the adhesive layer located on the side of adhering to the supporting plate, is release-treated in dots, and where “x” is the diameter of the release-treated dots, and “y” is the number of the dots per 1cm2, the “x” and “y” fall within the range surrounded by broken lines A, B and C of Fig. 4.
PCT/JP2008/071711 2007-12-12 2008-11-28 Two-sided adhesive tape for semiconductor processing and tape for semiconductor processing Ceased WO2009075196A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020107010414A KR101386367B1 (en) 2007-12-12 2008-11-28 Two-sided adhesive tape for semiconductor processing and tape for semiconductor processing
JP2008555545A JP5001955B2 (en) 2007-12-12 2008-11-28 Double-sided adhesive tape for semiconductor processing

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-320587 2007-12-12
JP2007320587 2007-12-12
JP2008088236A JP2009001773A (en) 2007-05-21 2008-03-28 Semiconductor processing tape
JP2008-088236 2008-03-28

Publications (1)

Publication Number Publication Date
WO2009075196A1 true WO2009075196A1 (en) 2009-06-18

Family

ID=40755439

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/071711 Ceased WO2009075196A1 (en) 2007-12-12 2008-11-28 Two-sided adhesive tape for semiconductor processing and tape for semiconductor processing

Country Status (3)

Country Link
JP (2) JP5001955B2 (en)
KR (1) KR101386367B1 (en)
WO (1) WO2009075196A1 (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012062368A (en) * 2010-09-14 2012-03-29 Sekisui Chem Co Ltd Curable adhesive composition and method of processing member
JP2012151459A (en) * 2010-12-28 2012-08-09 Sekisui Chem Co Ltd Dicing tape and method of manufacturing semiconductor chip
JP2013231159A (en) * 2012-04-06 2013-11-14 Sekisui Chem Co Ltd Adhesive composition, adhesive tape, and method for processing wafer
JP2014107314A (en) * 2012-11-26 2014-06-09 Dainippon Screen Mfg Co Ltd Peeling assist method and peeling assist device
JP2015093972A (en) * 2013-11-14 2015-05-18 パナック株式会社 Protection film for process
WO2016140176A1 (en) * 2015-03-02 2016-09-09 古河電気工業株式会社 Adhesive tape for protecting semiconductor wafer surface, and semiconductor wafer processing method
JP2017082094A (en) * 2015-10-28 2017-05-18 積水化学工業株式会社 Double-sided adhesive tape for semiconductor processing
JP2017101139A (en) * 2015-12-01 2017-06-08 積水化学工業株式会社 Double-sided adhesive tape for semiconductor processing
WO2019221065A1 (en) * 2018-05-18 2019-11-21 積水化学工業株式会社 Adhesive tape and method for manufacturing electronic component
JP2020080411A (en) * 2020-01-31 2020-05-28 積水化学工業株式会社 Double-sided adhesive tape for semiconductor processing
WO2020129987A1 (en) * 2018-12-20 2020-06-25 積水化学工業株式会社 Adhesive tape and method for manufacturing electronic component
CN113272399A (en) * 2019-04-26 2021-08-17 积水化学工业株式会社 Adhesive tape
CN115083987A (en) * 2022-07-08 2022-09-20 京东方晶芯科技有限公司 Mass transfer method of micro light-emitting diode and display device
TWI817585B (en) * 2022-06-28 2023-10-01 山太士股份有限公司 Photo-curing protection tape and processing method

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5639280B2 (en) * 2012-08-10 2014-12-10 積水化学工業株式会社 Wafer processing method
JP6014455B2 (en) * 2012-10-19 2016-10-25 富士フイルム株式会社 Manufacturing method of semiconductor device
JP6068279B2 (en) * 2012-12-27 2017-01-25 富士フイルム株式会社 Temporary bonding layer for manufacturing semiconductor device, laminated body, and method for manufacturing semiconductor device
JP6654825B2 (en) * 2015-08-11 2020-02-26 積水化学工業株式会社 Double-sided adhesive tape for semiconductor processing
JP6751312B2 (en) * 2016-06-02 2020-09-02 日東電工株式会社 Adhesive tape for vacuum process
KR20240161594A (en) 2023-05-04 2024-11-12 동우 화인켐 주식회사 Manufacturing method of the film for semiconductor packages

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10321886A (en) * 1997-05-21 1998-12-04 Shibata Ind Co Ltd Method of manufacturing solar cell module
JP2003231872A (en) * 2001-08-03 2003-08-19 Sekisui Chem Co Ltd Double-sided pressure-sensitive adhesive tape and method for manufacturing IC chip using the same
JP2004277534A (en) * 2003-03-14 2004-10-07 Lintec Corp Adhesive sheet and method for producing the same
JP2004277530A (en) * 2003-03-14 2004-10-07 Lintec Corp Adhesive sheet and method for producing adhesive sheet
JP2006070122A (en) * 2004-09-01 2006-03-16 Shindo Seni Kogyo Kk Emulsion silicone pressure-sensitive adhesive composition for porous sheet and re-releasable pressure-sensitive adhesive sheet

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4404526B2 (en) * 2002-07-11 2010-01-27 積水化学工業株式会社 Adhesive material, single-sided adhesive tape and double-sided adhesive tape
JP2004193237A (en) * 2002-12-10 2004-07-08 Disco Abrasive Syst Ltd Wafer holding member having pressure-sensitive adhesive sheet and method for peeling pressure-sensitive adhesive sheet

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10321886A (en) * 1997-05-21 1998-12-04 Shibata Ind Co Ltd Method of manufacturing solar cell module
JP2003231872A (en) * 2001-08-03 2003-08-19 Sekisui Chem Co Ltd Double-sided pressure-sensitive adhesive tape and method for manufacturing IC chip using the same
JP2004277534A (en) * 2003-03-14 2004-10-07 Lintec Corp Adhesive sheet and method for producing the same
JP2004277530A (en) * 2003-03-14 2004-10-07 Lintec Corp Adhesive sheet and method for producing adhesive sheet
JP2006070122A (en) * 2004-09-01 2006-03-16 Shindo Seni Kogyo Kk Emulsion silicone pressure-sensitive adhesive composition for porous sheet and re-releasable pressure-sensitive adhesive sheet

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012062368A (en) * 2010-09-14 2012-03-29 Sekisui Chem Co Ltd Curable adhesive composition and method of processing member
JP2012151459A (en) * 2010-12-28 2012-08-09 Sekisui Chem Co Ltd Dicing tape and method of manufacturing semiconductor chip
JP2013231159A (en) * 2012-04-06 2013-11-14 Sekisui Chem Co Ltd Adhesive composition, adhesive tape, and method for processing wafer
JP2014107314A (en) * 2012-11-26 2014-06-09 Dainippon Screen Mfg Co Ltd Peeling assist method and peeling assist device
JP2015093972A (en) * 2013-11-14 2015-05-18 パナック株式会社 Protection film for process
WO2016140176A1 (en) * 2015-03-02 2016-09-09 古河電気工業株式会社 Adhesive tape for protecting semiconductor wafer surface, and semiconductor wafer processing method
JP2017082094A (en) * 2015-10-28 2017-05-18 積水化学工業株式会社 Double-sided adhesive tape for semiconductor processing
JP2017101139A (en) * 2015-12-01 2017-06-08 積水化学工業株式会社 Double-sided adhesive tape for semiconductor processing
WO2019221065A1 (en) * 2018-05-18 2019-11-21 積水化学工業株式会社 Adhesive tape and method for manufacturing electronic component
WO2020129987A1 (en) * 2018-12-20 2020-06-25 積水化学工業株式会社 Adhesive tape and method for manufacturing electronic component
JPWO2020129987A1 (en) * 2018-12-20 2021-11-11 積水化学工業株式会社 Manufacturing method of adhesive tape and electronic parts
CN113272399A (en) * 2019-04-26 2021-08-17 积水化学工业株式会社 Adhesive tape
JP2020080411A (en) * 2020-01-31 2020-05-28 積水化学工業株式会社 Double-sided adhesive tape for semiconductor processing
TWI817585B (en) * 2022-06-28 2023-10-01 山太士股份有限公司 Photo-curing protection tape and processing method
CN115083987A (en) * 2022-07-08 2022-09-20 京东方晶芯科技有限公司 Mass transfer method of micro light-emitting diode and display device

Also Published As

Publication number Publication date
JP5001955B2 (en) 2012-08-15
JPWO2009075196A1 (en) 2011-04-28
KR20100098601A (en) 2010-09-08
JP2012109585A (en) 2012-06-07
KR101386367B1 (en) 2014-04-16
JP5039232B2 (en) 2012-10-03

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