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WO2009075064A1 - ペースト塗布装置 - Google Patents

ペースト塗布装置 Download PDF

Info

Publication number
WO2009075064A1
WO2009075064A1 PCT/JP2008/003352 JP2008003352W WO2009075064A1 WO 2009075064 A1 WO2009075064 A1 WO 2009075064A1 JP 2008003352 W JP2008003352 W JP 2008003352W WO 2009075064 A1 WO2009075064 A1 WO 2009075064A1
Authority
WO
WIPO (PCT)
Prior art keywords
syringe
paste application
paste
application device
discharge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/003352
Other languages
English (en)
French (fr)
Inventor
Yuzuru Inaba
Osamu Okuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Priority to US12/746,595 priority Critical patent/US8302821B2/en
Priority to DE112008003338T priority patent/DE112008003338T5/de
Priority to CN200880120067.1A priority patent/CN101896284B/zh
Publication of WO2009075064A1 publication Critical patent/WO2009075064A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H10P72/0448—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H10P72/0446—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1798—Surface bonding means and/or assemblymeans with work feeding or handling means with liquid adhesive or adhesive activator applying means

Landscapes

  • Engineering & Computer Science (AREA)
  • Coating Apparatus (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

　シリンジの配置に起因する専有スペースの増加や、チューブの劣化の課題を解決する。 シリンジ（１６）内に収容されたペースト（７）を塗布対象物に塗布するペースト塗布ユニット（１５）（ペースト塗布装置）において、回転部材（３２）の下部に設けられた吐出ネジ部（３２ｂ）を、ケーシング部（３１）に設けられた吐出空間（３１ｂ）内で、軸線ＡＺ廻りに回転させることによりペースト（７）を圧送するポンプ機構（１８）を形成し、ケーシング部（３１）の端部に吐出空間（３１ｂ）と連通する吐出口（１７ａ）を設け、回転部材（３２）と同軸にシリンジ（１６）を配置して着脱自在に接続する構成を採用する。 これにより、シリンジ（１６）をポンプ機構（１８）と並列に配置する場合に生じる専有スペースの増加や、チューブの劣化の課題を解決できる。
PCT/JP2008/003352 2007-12-10 2008-11-17 ペースト塗布装置 Ceased WO2009075064A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US12/746,595 US8302821B2 (en) 2007-12-10 2008-11-17 Paste application device
DE112008003338T DE112008003338T5 (de) 2007-12-10 2008-11-17 Vorrichtung zum Auftragen einer Paste
CN200880120067.1A CN101896284B (zh) 2007-12-10 2008-11-17 膏剂涂敷装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-318132 2007-12-10
JP2007318132A JP5082813B2 (ja) 2007-12-10 2007-12-10 ペースト塗布装置

Publications (1)

Publication Number Publication Date
WO2009075064A1 true WO2009075064A1 (ja) 2009-06-18

Family

ID=40755314

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/003352 Ceased WO2009075064A1 (ja) 2007-12-10 2008-11-17 ペースト塗布装置

Country Status (6)

Country Link
US (1) US8302821B2 (ja)
JP (1) JP5082813B2 (ja)
KR (1) KR20100088694A (ja)
CN (1) CN101896284B (ja)
DE (1) DE112008003338T5 (ja)
WO (1) WO2009075064A1 (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8668794B2 (en) * 2011-02-03 2014-03-11 Texas Instruments Incorporated Mixing bonding adhesive at die bonder before dispense
JP2013055096A (ja) * 2011-09-01 2013-03-21 Panasonic Corp ペースト塗布装置
CN102553772A (zh) * 2011-12-30 2012-07-11 众泰控股集团有限公司 变速箱壳体接合面涂胶装置
US20130331770A1 (en) * 2012-06-07 2013-12-12 Nordson Corporation Low profile handle pneumatic assist device for dispensing dual materials with or without a gas assist used for spraying materials
JP2014014790A (ja) * 2012-07-10 2014-01-30 Hitachi Ltd ペースト塗布装置
JP5895129B2 (ja) * 2012-07-10 2016-03-30 パナソニックＩｐマネジメント株式会社 ペーストの供給方法
US8662352B1 (en) * 2012-10-29 2014-03-04 Nordson Corporation Fluid dispenser and method for dispensing a fluid including a uniform distribution of composite materials
US20140263468A1 (en) * 2013-03-15 2014-09-18 Nordson Corporation Liquid Dispensing Syringe
KR101512766B1 (ko) * 2013-11-14 2015-04-16 한형수 솔더 페이스트 토출 장치
KR101939439B1 (ko) * 2016-07-28 2019-01-16 변도영 잉크젯 방식의 기판 결함 리페어 장치의 노즐 및 잉크젯 방식의 기판 결함 리페어 장치
KR102580650B1 (ko) * 2018-01-22 2023-09-20 삼성전자주식회사 디스펜서용 언더필 용액 공급 장치, 이를 갖는 디스펜서 및 이를 이용한 반도체 모듈의 제조 방법
CN111167666B (zh) * 2020-02-12 2025-05-27 苏州乔瑞斯电子有限公司 防沉淀的光转换粒材注料机构及涂布方法和系统
US11684945B2 (en) * 2020-06-20 2023-06-27 Nsw Automation Sdn. Bhd. Dispensing system
TWI784886B (zh) * 2022-02-23 2022-11-21 黃廖全 點膠筒快速補膠裝置及其方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10244196A (ja) * 1997-03-03 1998-09-14 Matsushita Electric Ind Co Ltd ボンドの塗布装置
JP2003117484A (ja) * 2001-10-09 2003-04-22 Matsushita Electric Ind Co Ltd 粘性材料の塗布方法
WO2007058258A1 (ja) * 2005-11-21 2007-05-24 Shibaura Mechatronics Corporation ペースト塗布装置及びこれを用いた表示パネルの製造装置、ペースト塗布方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5265773A (en) * 1991-05-24 1993-11-30 Kabushiki Kaisha Marukomu Paste feeding apparatus
JPH09201558A (ja) * 1996-01-29 1997-08-05 Techno Kapura:Kk 塗布装置
US6386396B1 (en) * 2001-01-31 2002-05-14 Hewlett-Packard Company Mixing rotary positive displacement pump for micro dispensing
JP2002239435A (ja) * 2001-02-16 2002-08-27 Matsushita Electric Ind Co Ltd 粘性材料塗布装置、及び粘性材料塗布方法
US6983867B1 (en) * 2002-04-29 2006-01-10 Dl Technology Llc Fluid dispense pump with drip prevention mechanism and method for controlling same
JP4562653B2 (ja) 2005-12-28 2010-10-13 三菱電機株式会社 スイッチギヤ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10244196A (ja) * 1997-03-03 1998-09-14 Matsushita Electric Ind Co Ltd ボンドの塗布装置
JP2003117484A (ja) * 2001-10-09 2003-04-22 Matsushita Electric Ind Co Ltd 粘性材料の塗布方法
WO2007058258A1 (ja) * 2005-11-21 2007-05-24 Shibaura Mechatronics Corporation ペースト塗布装置及びこれを用いた表示パネルの製造装置、ペースト塗布方法

Also Published As

Publication number Publication date
US8302821B2 (en) 2012-11-06
JP2009136826A (ja) 2009-06-25
KR20100088694A (ko) 2010-08-10
CN101896284A (zh) 2010-11-24
CN101896284B (zh) 2012-08-29
US20100258591A1 (en) 2010-10-14
DE112008003338T5 (de) 2010-10-28
JP5082813B2 (ja) 2012-11-28

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