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WO2009063911A1 - 熱電変換モジュール片、熱電変換モジュールおよびこれらの製造方法 - Google Patents

熱電変換モジュール片、熱電変換モジュールおよびこれらの製造方法 Download PDF

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Publication number
WO2009063911A1
WO2009063911A1 PCT/JP2008/070598 JP2008070598W WO2009063911A1 WO 2009063911 A1 WO2009063911 A1 WO 2009063911A1 JP 2008070598 W JP2008070598 W JP 2008070598W WO 2009063911 A1 WO2009063911 A1 WO 2009063911A1
Authority
WO
WIPO (PCT)
Prior art keywords
conversion module
thermoelectric conversion
faces
thermoelectric
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/070598
Other languages
English (en)
French (fr)
Inventor
Masahiro Sasaki
Takanori Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2009541158A priority Critical patent/JP5104875B2/ja
Publication of WO2009063911A1 publication Critical patent/WO2009063911A1/ja
Priority to US12/776,736 priority patent/US20100212713A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1056—Perforating lamina
    • Y10T156/1057—Subsequent to assembly of laminae

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Powder Metallurgy (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

　熱電変換モジュール片（１０１）は、絶縁層の表面にｐ型熱電材料層とｎ型熱電材料層とが交互に接続されて配置されることによってｐｎ接合対が蛇行状に繰り返して延在する単位回路を構成した熱電構成体を複数積層して構成された積層体を含み、複数個集めて相互に面同士を当接させて結合することによって全体を環状にしてなおかつ、相互に電気的に接続することが可能なように、前記積層体から電極を取り出すための面を接合面として斜めに有する。熱電変換モジュール（２０１）は、このような熱電変換モジュール片を複数つないで環状としたものを備える。
PCT/JP2008/070598 2007-11-14 2008-11-12 熱電変換モジュール片、熱電変換モジュールおよびこれらの製造方法 Ceased WO2009063911A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009541158A JP5104875B2 (ja) 2007-11-14 2008-11-12 熱電変換モジュール片、熱電変換モジュールおよびこれらの製造方法
US12/776,736 US20100212713A1 (en) 2007-11-14 2010-05-10 Thermoelectric Conversion Module Component, Thermoelectric Conversion Module, and Method for Producing the Aforementioned

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007295754 2007-11-14
JP2007-295754 2007-11-14

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/776,736 Continuation US20100212713A1 (en) 2007-11-14 2010-05-10 Thermoelectric Conversion Module Component, Thermoelectric Conversion Module, and Method for Producing the Aforementioned

Publications (1)

Publication Number Publication Date
WO2009063911A1 true WO2009063911A1 (ja) 2009-05-22

Family

ID=40638760

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/070598 Ceased WO2009063911A1 (ja) 2007-11-14 2008-11-12 熱電変換モジュール片、熱電変換モジュールおよびこれらの製造方法

Country Status (3)

Country Link
US (1) US20100212713A1 (ja)
JP (1) JP5104875B2 (ja)
WO (1) WO2009063911A1 (ja)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011129838A (ja) * 2009-12-21 2011-06-30 Fujitsu Ltd 熱電変換モジュール及びその製造方法
US20130081665A1 (en) * 2010-06-04 2013-04-04 O-Flexx Technologies Gmbh Thermoelectric element
WO2014034258A1 (ja) * 2012-08-30 2014-03-06 独立行政法人産業技術総合研究所 熱電材料および熱電モジュール
CN108831947A (zh) * 2018-06-14 2018-11-16 东华大学 一种柔性光伏热电一体化复合发电器件
JP2019179845A (ja) * 2018-03-30 2019-10-17 株式会社Ｎｂｃメッシュテック 熱電変換素子及び熱電変換素子の製造方法
JPWO2021025059A1 (ja) * 2019-08-08 2021-02-11
JP2022056393A (ja) * 2020-09-29 2022-04-08 コミッサリア ア レネルジー アトミーク エ オ ゼネルジ ザルタナテイヴ 互いに接触して設置される櫛体を付加製造する熱電素子の製造方法
JPWO2023276956A1 (ja) * 2021-06-30 2023-01-05
JP2023084646A (ja) * 2021-12-07 2023-06-19 サムソン エレクトロ－メカニックス カンパニーリミテッド． 熱電モジュール及びその製造方法

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101894903B (zh) * 2010-06-25 2012-03-28 清华大学 光电转换装置
DE102010043281A1 (de) * 2010-11-03 2012-05-03 Robert Bosch Gmbh Thermoelektrischer Generator mit thermoelektrischem Modul mit mäanderförmiger p-n-Anordnung
CA2854543A1 (en) 2011-11-02 2013-05-10 Cardinal Solar Technologies Company Thermoelectric device technology
DE102012105367A1 (de) * 2012-02-24 2013-08-29 O-Flexx Technologies Gmbh Thermoelektrisches Modul und Herstellungsverfahren
US10910962B2 (en) 2012-10-19 2021-02-02 University Of Southern California Pervasive power generation system
JP6091377B2 (ja) * 2013-08-21 2017-03-08 東京エレクトロン株式会社 断熱壁体の製造方法
KR101692502B1 (ko) * 2014-10-21 2017-01-03 국민대학교 산학협력단 유연열전소자 모듈 장치
US20170213951A1 (en) * 2016-01-27 2017-07-27 Korea Research Institute Of Standards And Science Flexible thin multi-layered thermoelectric energy generating module, voltage boosting module using super capacitor, and portable thermoelectric charging apparatus using the same
JP6399251B2 (ja) * 2016-03-31 2018-10-03 株式会社村田製作所 熱電変換素子および熱電変換素子の製造方法
US11063198B2 (en) * 2016-04-05 2021-07-13 United States Of America As Represented By The Administrator Of Nasa Metallic junction thermoelectric generator
WO2019064949A1 (ja) * 2017-09-29 2019-04-04 株式会社村田製作所 熱電変換素子および熱電変換素子の製造方法
KR102764279B1 (ko) * 2020-05-29 2025-02-07 현대자동차주식회사 열전 모듈

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01175779A (ja) * 1987-12-29 1989-07-12 Murata Mfg Co Ltd 熱起電力素子
WO1999007024A1 (fr) * 1997-08-01 1999-02-11 Citizen Watch Co., Ltd. Element thermoelectrique et son procede de fabrication
JPH11177154A (ja) * 1997-12-09 1999-07-02 Murata Mfg Co Ltd 熱電変換基板及び当該熱電変換基板を用いた電気回路装置
JPH11233837A (ja) * 1998-02-18 1999-08-27 Matsushita Electric Works Ltd 熱電変換モジュール
JP2003179275A (ja) * 2001-12-12 2003-06-27 Yaskawa Electric Corp 熱電変換モジュールおよびこれを用いた熱電変換装置

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* Cited by examiner, † Cited by third party
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FR2822295B1 (fr) * 2001-03-16 2004-06-25 Edouard Serras Generateur thermoelectrique a semi-conducteurs et ses procedes de fabrication
JP2004208476A (ja) * 2002-12-26 2004-07-22 Toyota Motor Corp 排熱発電装置
US20050000559A1 (en) * 2003-03-24 2005-01-06 Yuma Horio Thermoelectric generator
JP4165405B2 (ja) * 2003-10-06 2008-10-15 トヨタ自動車株式会社 排気ガス浄化装置
KR100632468B1 (ko) * 2005-08-31 2006-10-09 삼성전자주식회사 리테이너 링, 연마 헤드 및 화학적 기계적 연마 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01175779A (ja) * 1987-12-29 1989-07-12 Murata Mfg Co Ltd 熱起電力素子
WO1999007024A1 (fr) * 1997-08-01 1999-02-11 Citizen Watch Co., Ltd. Element thermoelectrique et son procede de fabrication
JPH11177154A (ja) * 1997-12-09 1999-07-02 Murata Mfg Co Ltd 熱電変換基板及び当該熱電変換基板を用いた電気回路装置
JPH11233837A (ja) * 1998-02-18 1999-08-27 Matsushita Electric Works Ltd 熱電変換モジュール
JP2003179275A (ja) * 2001-12-12 2003-06-27 Yaskawa Electric Corp 熱電変換モジュールおよびこれを用いた熱電変換装置

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011129838A (ja) * 2009-12-21 2011-06-30 Fujitsu Ltd 熱電変換モジュール及びその製造方法
US20130081665A1 (en) * 2010-06-04 2013-04-04 O-Flexx Technologies Gmbh Thermoelectric element
US10418538B2 (en) 2012-08-30 2019-09-17 National Institute Of Advanced Industrial Science And Technology Thermoelectric material and thermoelectric module
WO2014034258A1 (ja) * 2012-08-30 2014-03-06 独立行政法人産業技術総合研究所 熱電材料および熱電モジュール
JPWO2014034258A1 (ja) * 2012-08-30 2016-08-08 国立研究開発法人産業技術総合研究所 熱電材料の製造方法および熱電モジュールの製造方法
JP2019179845A (ja) * 2018-03-30 2019-10-17 株式会社Ｎｂｃメッシュテック 熱電変換素子及び熱電変換素子の製造方法
CN108831947A (zh) * 2018-06-14 2018-11-16 东华大学 一种柔性光伏热电一体化复合发电器件
JPWO2021025059A1 (ja) * 2019-08-08 2021-02-11
JP7662521B2 (ja) 2019-08-08 2025-04-15 デンカ株式会社 熱電変換素子
JP2022056393A (ja) * 2020-09-29 2022-04-08 コミッサリア ア レネルジー アトミーク エ オ ゼネルジ ザルタナテイヴ 互いに接触して設置される櫛体を付加製造する熱電素子の製造方法
JPWO2023276956A1 (ja) * 2021-06-30 2023-01-05
JP7679881B2 (ja) 2021-06-30 2025-05-20 株式会社村田製作所 熱電変換デバイス
JP2023084646A (ja) * 2021-12-07 2023-06-19 サムソン エレクトロ－メカニックス カンパニーリミテッド． 熱電モジュール及びその製造方法

Also Published As

Publication number Publication date
JP5104875B2 (ja) 2012-12-19
JPWO2009063911A1 (ja) 2011-03-31
US20100212713A1 (en) 2010-08-26

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