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WO2009063734A1 - 電子部品搭載機器 - Google Patents

電子部品搭載機器 Download PDF

Info

Publication number
WO2009063734A1
WO2009063734A1 PCT/JP2008/069322 JP2008069322W WO2009063734A1 WO 2009063734 A1 WO2009063734 A1 WO 2009063734A1 JP 2008069322 W JP2008069322 W JP 2008069322W WO 2009063734 A1 WO2009063734 A1 WO 2009063734A1
Authority
WO
WIPO (PCT)
Prior art keywords
case
circuit board
printed circuit
electronic component
conductor section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/069322
Other languages
English (en)
French (fr)
Inventor
Masaharu Imazato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP2009541085A priority Critical patent/JPWO2009063734A1/ja
Publication of WO2009063734A1 publication Critical patent/WO2009063734A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0009—Casings with provisions to reduce EMI leakage through the joining parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

【課題】ノイズ電流経路面積を最小にし、面積に比例するノイズ放射の電界強度を低減させることができ、かつ開閉が容易となる電子部品搭載機器を提供する。 【解決手段】導体部を有すると共に上部が開口した箱状の第１筐体１１と、導体部を有すると共に下部が開口しかつこの下部開口を前記第１筐体１１の上部開口と対向させて第１筐体１１を塞ぐ第２筐体１２と、第１筐体１１に装備されると共に電子部品１３を搭載したプリント回路基板１４と、第１筐体１１および第２筐体１２の導体部同士を電気的に接続する接続部材１６とを備え、プリント回路基板１４の外周と第１筐体１１および第２筐体１２の内周部とを近接させて配置すると共に、プリント回路基板１４を固定する基板取り付け部材１１Ａをプリント回路基板１４の外周端寄りの位置に設け、接続部材１６の一端部をプリント回路基板１４に固定して電子部品搭載機器１０を構成する。
PCT/JP2008/069322 2007-11-13 2008-10-24 電子部品搭載機器 Ceased WO2009063734A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009541085A JPWO2009063734A1 (ja) 2007-11-13 2008-10-24 電子部品搭載機器

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-294003 2007-11-13
JP2007294003 2007-11-13

Publications (1)

Publication Number Publication Date
WO2009063734A1 true WO2009063734A1 (ja) 2009-05-22

Family

ID=40638587

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/069322 Ceased WO2009063734A1 (ja) 2007-11-13 2008-10-24 電子部品搭載機器

Country Status (2)

Country Link
JP (1) JPWO2009063734A1 (ja)
WO (1) WO2009063734A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010283069A (ja) * 2009-06-03 2010-12-16 Hitachi Ltd 電子装置、および、雑音電流測定方法
US9521642B2 (en) 2012-08-20 2016-12-13 Qualcomm Incorporated Configuration of a new enrollee device for use in a communication network
US10154025B2 (en) 2013-03-15 2018-12-11 Qualcomm Incorporated Seamless device configuration in a communication network

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5834797U (ja) * 1981-09-01 1983-03-07 株式会社東芝 シ−ルド用金具の取付け装置
JPS6217198U (ja) * 1985-07-16 1987-02-02
JPH05343880A (ja) * 1992-06-09 1993-12-24 Sanyo Electric Co Ltd 電子機器の筐体構造
JPH0714687U (ja) * 1993-07-30 1995-03-10 株式会社電子技研 電子部品収納ケース
JP2000012113A (ja) * 1998-06-22 2000-01-14 Matsushita Electric Ind Co Ltd アースバネ装置
JP2000208981A (ja) * 1999-01-14 2000-07-28 Nec Shizuoka Ltd 環境配慮型ｆｇ構造
JP2000324423A (ja) * 1999-05-10 2000-11-24 Mitsubishi Electric Corp 映像表示装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5834797U (ja) * 1981-09-01 1983-03-07 株式会社東芝 シ−ルド用金具の取付け装置
JPS6217198U (ja) * 1985-07-16 1987-02-02
JPH05343880A (ja) * 1992-06-09 1993-12-24 Sanyo Electric Co Ltd 電子機器の筐体構造
JPH0714687U (ja) * 1993-07-30 1995-03-10 株式会社電子技研 電子部品収納ケース
JP2000012113A (ja) * 1998-06-22 2000-01-14 Matsushita Electric Ind Co Ltd アースバネ装置
JP2000208981A (ja) * 1999-01-14 2000-07-28 Nec Shizuoka Ltd 環境配慮型ｆｇ構造
JP2000324423A (ja) * 1999-05-10 2000-11-24 Mitsubishi Electric Corp 映像表示装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010283069A (ja) * 2009-06-03 2010-12-16 Hitachi Ltd 電子装置、および、雑音電流測定方法
US9521642B2 (en) 2012-08-20 2016-12-13 Qualcomm Incorporated Configuration of a new enrollee device for use in a communication network
US10154025B2 (en) 2013-03-15 2018-12-11 Qualcomm Incorporated Seamless device configuration in a communication network

Also Published As

Publication number Publication date
JPWO2009063734A1 (ja) 2011-03-31

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