[go: up one dir, main page]

WO2009063764A1 - Copper foil including resistive film layer - Google Patents

Copper foil including resistive film layer Download PDF

Info

Publication number
WO2009063764A1
WO2009063764A1 PCT/JP2008/070006 JP2008070006W WO2009063764A1 WO 2009063764 A1 WO2009063764 A1 WO 2009063764A1 JP 2008070006 W JP2008070006 W JP 2008070006W WO 2009063764 A1 WO2009063764 A1 WO 2009063764A1
Authority
WO
WIPO (PCT)
Prior art keywords
copper foil
film layer
resistive film
layer
copper
Prior art date
Application number
PCT/JP2008/070006
Other languages
French (fr)
Japanese (ja)
Inventor
Toshio Kurosawa
Masaru Sakamoto
Original Assignee
Nippon Mining & Metals Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining & Metals Co., Ltd. filed Critical Nippon Mining & Metals Co., Ltd.
Priority to JP2009503343A priority Critical patent/JP4460026B2/en
Priority to KR1020107001751A priority patent/KR101188146B1/en
Publication of WO2009063764A1 publication Critical patent/WO2009063764A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C23C28/321—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer with at least one metal alloy layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
    • C23C28/3455—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer with a refractory ceramic layer, e.g. refractory metal oxide, ZrO2, rare earth oxides or a thermal barrier system comprising at least one refractory oxide layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

Copper foil including an electric resistive film layer characterized in that a copper-zinc alloy layer containing 1000 μg/dm2 to 9000 μg/dm2 of zinc per unit area is provided on a roughened surface or a glossy surface of the copper foil, a stabilized layer with a thickness between 5 Å and 100 Å made of at least one component selected from among zinc oxide, chromium oxide, and nickel oxide is formed on the copper-zinc alloy layer, and a film layer made of an electric resistive material is provided on the stabilized layer. The additional formation of the electric resistive film layer in the copper foil enables a resistor to be embedded in a substrate, and the copper foil includes the resistive film layer with improved adhesiveness.
PCT/JP2008/070006 2007-11-14 2008-11-04 Copper foil including resistive film layer WO2009063764A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009503343A JP4460026B2 (en) 2007-11-14 2008-11-04 Copper foil with resistive film layer
KR1020107001751A KR101188146B1 (en) 2007-11-14 2008-11-04 Copper foil including resistive film layer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-295117 2007-11-14
JP2007295117 2007-11-14

Publications (1)

Publication Number Publication Date
WO2009063764A1 true WO2009063764A1 (en) 2009-05-22

Family

ID=40638616

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/070006 WO2009063764A1 (en) 2007-11-14 2008-11-04 Copper foil including resistive film layer

Country Status (4)

Country Link
JP (1) JP4460026B2 (en)
KR (2) KR20120084784A (en)
TW (1) TWI443226B (en)
WO (1) WO2009063764A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012132592A1 (en) * 2011-03-28 2012-10-04 Jx日鉱日石金属株式会社 Metal foil provided with electrically resistive film, and method for producing same
WO2012132593A1 (en) * 2011-03-31 2012-10-04 Jx日鉱日石金属株式会社 Metal foil provided with electrically resistive layer, and board for printed circuit using said metal foil
JP2013004236A (en) * 2011-06-14 2013-01-07 Dainippon Printing Co Ltd Conductive base material for forming wring pattern of current collection sheet for solar cell
JP2014146544A (en) * 2013-01-30 2014-08-14 Hitachi Metals Ltd Conductor for high speed transmission cable, method for producing the same, and high speed transmission cable
US9666746B2 (en) 2011-06-14 2017-05-30 Dai Nippon Printing Co., Ltd. Conductive base for forming wiring pattern of collector sheet for solar cells, and method for producing collector sheet for solar cells

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5400960B2 (en) 2010-11-22 2014-01-29 三井金属鉱業株式会社 Surface treated copper foil
WO2013176115A1 (en) * 2012-05-22 2013-11-28 三井金属鉱業株式会社 Copper foil, negative electrode current collector, and negative electrode material for non-aqueous secondary battery

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5925297A (en) * 1982-08-03 1984-02-09 日本電解株式会社 Copper foil for printed circuit
JPH07233497A (en) * 1994-02-24 1995-09-05 Nippon Denkai Kk Non-cyan copper-zinc electroplating bath, surface treatment of copper foil for printed circuit board using the bath, and the copper foil for printed circuit board
JP2002319407A (en) * 2001-04-23 2002-10-31 Sanyo Electric Co Ltd Lithium secondary battery electrode and lithium secondary battery
JP3452557B2 (en) * 2000-07-31 2003-09-29 グールド エレクトロニクス インコーポレイテッド Method of forming resistive material on copper layer used in printed circuit board and sheet material

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6489034B1 (en) * 2000-02-08 2002-12-03 Gould Electronics Inc. Method of forming chromium coated copper for printed circuit boards

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5925297A (en) * 1982-08-03 1984-02-09 日本電解株式会社 Copper foil for printed circuit
JPH07233497A (en) * 1994-02-24 1995-09-05 Nippon Denkai Kk Non-cyan copper-zinc electroplating bath, surface treatment of copper foil for printed circuit board using the bath, and the copper foil for printed circuit board
JP3452557B2 (en) * 2000-07-31 2003-09-29 グールド エレクトロニクス インコーポレイテッド Method of forming resistive material on copper layer used in printed circuit board and sheet material
JP2002319407A (en) * 2001-04-23 2002-10-31 Sanyo Electric Co Ltd Lithium secondary battery electrode and lithium secondary battery

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012132592A1 (en) * 2011-03-28 2012-10-04 Jx日鉱日石金属株式会社 Metal foil provided with electrically resistive film, and method for producing same
JP5346408B2 (en) * 2011-03-28 2013-11-20 Ｊｘ日鉱日石金属株式会社 Metal foil provided with electric resistance film and method for manufacturing the same
CN103429788A (en) * 2011-03-28 2013-12-04 吉坤日矿日石金属株式会社 Metal foil with resistive film and manufacturing method thereof
WO2012132593A1 (en) * 2011-03-31 2012-10-04 Jx日鉱日石金属株式会社 Metal foil provided with electrically resistive layer, and board for printed circuit using said metal foil
US20140041910A1 (en) * 2011-03-31 2014-02-13 Jx Nippon Mining & Metals Corporation Metal Foil Provided with Electrically Resistive Layer, and Board for Printed Circuit Using Said Metal Foil
US9578739B2 (en) 2011-03-31 2017-02-21 Jx Nippon Mining & Metals Corporation Metal foil provided with electrically resistive layer, and board for printed circuit using said metal foil
JP2013004236A (en) * 2011-06-14 2013-01-07 Dainippon Printing Co Ltd Conductive base material for forming wring pattern of current collection sheet for solar cell
US9666746B2 (en) 2011-06-14 2017-05-30 Dai Nippon Printing Co., Ltd. Conductive base for forming wiring pattern of collector sheet for solar cells, and method for producing collector sheet for solar cells
JP2014146544A (en) * 2013-01-30 2014-08-14 Hitachi Metals Ltd Conductor for high speed transmission cable, method for producing the same, and high speed transmission cable

Also Published As

Publication number Publication date
JP4460026B2 (en) 2010-05-12
TWI443226B (en) 2014-07-01
KR101188146B1 (en) 2012-10-05
JPWO2009063764A1 (en) 2011-03-31
TW200927993A (en) 2009-07-01
KR20100030654A (en) 2010-03-18
KR20120084784A (en) 2012-07-30

Similar Documents

Publication Publication Date Title
WO2009063764A1 (en) Copper foil including resistive film layer
WO2009057707A1 (en) Tin-plated material for electronic part
WO2008108255A1 (en) Transparent conductive film with adhesive layer and method for producing the same
TW200920589A (en) Mold release film
TWI654075B (en) Conductive sheet
MY158913A (en) Material for electric contact and method of producing the same
WO2009069086A3 (en) Composite materials including an intrinsically conducting polymer, and methods and devices
MY139858A (en) Fishing component
GB2442993A (en) Atomic layer deposited tantalum containing adhesion layer
MX2010000829A (en) Abrasive article with adhesion promoting layer.
WO2008123259A1 (en) Silver-coated material for movable contact component and method for manufacturing such silver-coated material
WO2008087972A1 (en) Insulating resin sheet multilayer body, multilayer printed wiring board obtained by laminating the insulating resin sheet multilayer bodies
MY152161A (en) Surface-treated copper foil, method for producing surface-treated copper foil, and surface-treated copper foil coated with extremely thin primer resin layer
WO2008081167A3 (en) A self-regulating electrical resistance heating element
EP2412520A4 (en) METAL SHEET COMPRISING AN ELECTRIC RESISTANCE FILM AND PROCESS FOR PRODUCTION THEREOF
JP2009182118A5 (en)
WO2006083997A3 (en) Water resistant switch mat having activation across its entire surface
EP1191550A3 (en) Resistor component with multiple layers of resistive material
WO2008117371A1 (en) Resistance storage element and non-volatile semiconductor storage device
WO2008099596A1 (en) Interlayer insulating film having carrier material, and multilayer printed circuit board using the interlayer insulating film
WO2009041135A1 (en) Fuel cell separator material and fuel cell stack
WO2010068256A3 (en) Counter sunk screen
WO2004039134A3 (en) Printed circuit heaters with ultrathin low resistivity materials
WO2008105355A1 (en) Conductive fine particle and anisotropic conductive material
WO2008114642A1 (en) Film and flexible metal-clad laminate

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 2009503343

Country of ref document: JP

Kind code of ref document: A

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08850954

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20107001751

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08850954

Country of ref document: EP

Kind code of ref document: A1