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WO2009063742A1 - 金属積層体 - Google Patents

金属積層体 Download PDF

Info

Publication number
WO2009063742A1
WO2009063742A1 PCT/JP2008/069494 JP2008069494W WO2009063742A1 WO 2009063742 A1 WO2009063742 A1 WO 2009063742A1 JP 2008069494 W JP2008069494 W JP 2008069494W WO 2009063742 A1 WO2009063742 A1 WO 2009063742A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal laminate
layer
heat
flexible metal
resin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/069494
Other languages
English (en)
French (fr)
Inventor
Shoko Nagata
Katsuya Shimeno
Tomoharu Kurita
Tomohiro Aoyama
Akira Nishimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyobo Co Ltd
Original Assignee
Toyobo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyobo Co Ltd filed Critical Toyobo Co Ltd
Priority to JP2009541087A priority Critical patent/JP5240204B2/ja
Publication of WO2009063742A1 publication Critical patent/WO2009063742A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546—Flexural strength; Flexion stiffness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/726—Permeability to liquids, absorption
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

本発明は、屈曲性、耐折特性、耐熱信頼性、吸湿特性、寸法精度に優れるフレキシブル金属積層体及びフレキシブルプリント基板を安価に提供するものである。 ポリアミドイミド樹脂からなる２層構成の耐熱性樹脂フィルムの少なくとも片面に、金属箔が積層されたフレキシブル金属積層体であって、該耐熱性樹脂フィルムは、そのうちの１層が、ａ）ナフタレン基を有するモノマー成分を、特定モル％以上含み、かつ、ｂ）イミド結合とアミド結合のモル比が、９９／１～６０／４０モル比、ｃ）イミド結合のイミド化率が５０％以上であり、弾性率４８００ＭＰａ以下の樹脂層から形成され、さらに、残りのもう１層が湿度膨張係数が２０ｐｐｍ以下の低湿度膨張性樹脂層から形成されていることを特徴とするフレキシブル金属積層体。
PCT/JP2008/069494 2007-11-12 2008-10-28 金属積層体 Ceased WO2009063742A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009541087A JP5240204B2 (ja) 2007-11-12 2008-10-28 金属積層体

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007292993 2007-11-12
JP2007-292993 2007-11-12

Publications (1)

Publication Number Publication Date
WO2009063742A1 true WO2009063742A1 (ja) 2009-05-22

Family

ID=40638594

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/069494 Ceased WO2009063742A1 (ja) 2007-11-12 2008-10-28 金属積層体

Country Status (3)

Country Link
JP (1) JP5240204B2 (ja)
TW (1) TW200930563A (ja)
WO (1) WO2009063742A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011152178A1 (ja) * 2010-05-31 2011-12-08 東洋紡績株式会社 フレキシブル金属張積層体
CN103171190A (zh) * 2011-12-21 2013-06-26 新日铁住金化学株式会社 两面覆金属层叠板及其制造方法
WO2018135432A1 (ja) * 2017-01-20 2018-07-26 住友化学株式会社 フィルム、樹脂組成物及びポリアミドイミド樹脂の製造方法
TWI731211B (zh) * 2017-02-10 2021-06-21 日商昭和電工包裝股份有限公司 成形用包裝材及表面印刷所成的蓄電裝置之製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001234020A (ja) * 2000-02-21 2001-08-28 Hitachi Ltd 樹脂組成物、該樹脂組成物を用いた接着フィルム、金属箔付き接着フィルム、配線基板及び実装構造体
JP2002261186A (ja) * 2001-03-02 2002-09-13 Hitachi Chem Co Ltd 半導体搭載用基板とその製造方法とそれを用いた半導体パッケージ並びにその製造方法
WO2003072639A1 (fr) * 2002-02-26 2003-09-04 Toyo Boseki Kabushiki Kaisha Resine polyamide-imide, stratifie plaque souple et carte imprimee souple
JP2005068226A (ja) * 2003-08-21 2005-03-17 Toyobo Co Ltd ポリアミドイミド樹脂、それを用いたフレキシブル金属張積層体およびフレキシブルプリント基板
JP2005325329A (ja) * 2003-09-01 2005-11-24 Toyobo Co Ltd ポリアミドイミド樹脂、樹脂組成物及びそれを用いた金属張積層体
JP2006224644A (ja) * 2005-01-18 2006-08-31 Kaneka Corp 絶縁シートおよび金属層／絶縁シート積層体とそれを用いたプリント配線板
JP2007204714A (ja) * 2006-02-06 2007-08-16 Toyobo Co Ltd ポリアミドイミド樹脂、フィルム、それを用いたフレキシブル金属張積層体およびフレキシブルプリント基板

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001234020A (ja) * 2000-02-21 2001-08-28 Hitachi Ltd 樹脂組成物、該樹脂組成物を用いた接着フィルム、金属箔付き接着フィルム、配線基板及び実装構造体
JP2002261186A (ja) * 2001-03-02 2002-09-13 Hitachi Chem Co Ltd 半導体搭載用基板とその製造方法とそれを用いた半導体パッケージ並びにその製造方法
WO2003072639A1 (fr) * 2002-02-26 2003-09-04 Toyo Boseki Kabushiki Kaisha Resine polyamide-imide, stratifie plaque souple et carte imprimee souple
JP2005068226A (ja) * 2003-08-21 2005-03-17 Toyobo Co Ltd ポリアミドイミド樹脂、それを用いたフレキシブル金属張積層体およびフレキシブルプリント基板
JP2005325329A (ja) * 2003-09-01 2005-11-24 Toyobo Co Ltd ポリアミドイミド樹脂、樹脂組成物及びそれを用いた金属張積層体
JP2006224644A (ja) * 2005-01-18 2006-08-31 Kaneka Corp 絶縁シートおよび金属層／絶縁シート積層体とそれを用いたプリント配線板
JP2007204714A (ja) * 2006-02-06 2007-08-16 Toyobo Co Ltd ポリアミドイミド樹脂、フィルム、それを用いたフレキシブル金属張積層体およびフレキシブルプリント基板

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011152178A1 (ja) * 2010-05-31 2011-12-08 東洋紡績株式会社 フレキシブル金属張積層体
JP2012011388A (ja) * 2010-05-31 2012-01-19 Toyobo Co Ltd フレキシブル金属張積層体
JP4883432B2 (ja) * 2010-05-31 2012-02-22 東洋紡績株式会社 フレキシブル金属張積層体
CN103171190A (zh) * 2011-12-21 2013-06-26 新日铁住金化学株式会社 两面覆金属层叠板及其制造方法
JP2013129116A (ja) * 2011-12-21 2013-07-04 Nippon Steel & Sumikin Chemical Co Ltd 両面金属張積層板およびその製造方法
WO2018135432A1 (ja) * 2017-01-20 2018-07-26 住友化学株式会社 フィルム、樹脂組成物及びポリアミドイミド樹脂の製造方法
JP2018119141A (ja) * 2017-01-20 2018-08-02 住友化学株式会社 フィルム、樹脂組成物およびポリアミドイミド樹脂の製造方法
JP2019104939A (ja) * 2017-01-20 2019-06-27 住友化学株式会社 フィルム、樹脂組成物およびポリアミドイミド樹脂の製造方法
JP7118651B2 (ja) 2017-01-20 2022-08-16 住友化学株式会社 フィルム、樹脂組成物およびポリアミドイミド樹脂の製造方法
TWI731211B (zh) * 2017-02-10 2021-06-21 日商昭和電工包裝股份有限公司 成形用包裝材及表面印刷所成的蓄電裝置之製造方法

Also Published As

Publication number Publication date
JP5240204B2 (ja) 2013-07-17
JPWO2009063742A1 (ja) 2011-03-31
TW200930563A (en) 2009-07-16

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