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WO2009060755A1 - Procédé pour produire une structure intermédiaire et appareil d'inspection - Google Patents

Procédé pour produire une structure intermédiaire et appareil d'inspection Download PDF

Info

Publication number
WO2009060755A1
WO2009060755A1 PCT/JP2008/069516 JP2008069516W WO2009060755A1 WO 2009060755 A1 WO2009060755 A1 WO 2009060755A1 JP 2008069516 W JP2008069516 W JP 2008069516W WO 2009060755 A1 WO2009060755 A1 WO 2009060755A1
Authority
WO
WIPO (PCT)
Prior art keywords
glass substrate
pins
board
electroconductive
vessel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/069516
Other languages
English (en)
Japanese (ja)
Inventor
Shigekazu Komatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of WO2009060755A1 publication Critical patent/WO2009060755A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B23/00—Re-forming shaped glass
    • C03B23/26—Punching reheated glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/06—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/02—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing by fusing glass directly to metal
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)

Abstract

Selon l'invention, une pluralité de broches électroconductrices sont disposées à la verticale sur une carte pour des broches à l'état vertical. Une structure en verre est reçue dans un récipient dans un appareil de production. La carte sur laquelle les broches ont été placées est placée de telle sorte que les broches électroconductrices font face au substrat en verre à l'intérieur du récipient. Le substrat en verre à l'intérieur du récipient est chauffé et amené à fondre. La carte sur laquelle les broches ont été placées est déplacée vers le côté substrat en verre pour permettre aux broches électroconductrices sur la carte d'être introduites dans le substrat en verre fondu. Dans un état tel que les broches électroconductrices sont introduites à l'intérieur du substrat en verre, le substrat en verre est refroidi et amené à se solidifier. La carte pour les broches à l'état vertical est retirée des broches électroconductrices. Les surfaces recto et verso du substrat en verre sont polies.
PCT/JP2008/069516 2007-11-05 2008-10-28 Procédé pour produire une structure intermédiaire et appareil d'inspection Ceased WO2009060755A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007286929A JP2009115524A (ja) 2007-11-05 2007-11-05 中間構造体の製造方法及び検査装置
JP2007-286929 2007-11-05

Publications (1)

Publication Number Publication Date
WO2009060755A1 true WO2009060755A1 (fr) 2009-05-14

Family

ID=40625649

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/069516 Ceased WO2009060755A1 (fr) 2007-11-05 2008-10-28 Procédé pour produire une structure intermédiaire et appareil d'inspection

Country Status (2)

Country Link
JP (1) JP2009115524A (fr)
WO (1) WO2009060755A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020095656A1 (fr) * 2018-11-05 2020-05-14 Nok株式会社 Procédé de fabrication d'élément conducteur

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5550373B2 (ja) * 2010-02-05 2014-07-16 セイコーインスツル株式会社 パッケージの製造方法
JP5432077B2 (ja) * 2010-07-08 2014-03-05 セイコーインスツル株式会社 貫通電極付きガラス基板の製造方法及び電子部品の製造方法
JP5466102B2 (ja) * 2010-07-08 2014-04-09 セイコーインスツル株式会社 貫通電極付きガラス基板の製造方法及び電子部品の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151184A (ja) * 2000-11-08 2002-05-24 Jsr Corp 異方導電性シートおよび回路装置の電気的検査装置
JP2005317944A (ja) * 2004-03-31 2005-11-10 Jsr Corp プローブ装置およびこのプローブ装置を具えたウエハ検査装置並びにウエハ検査方法
JP2006194620A (ja) * 2005-01-11 2006-07-27 Tokyo Electron Ltd プローブカード及び検査用接触構造体
JP2007067387A (ja) * 2005-08-02 2007-03-15 Nec Schott Components Corp 絶縁基板およびその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151184A (ja) * 2000-11-08 2002-05-24 Jsr Corp 異方導電性シートおよび回路装置の電気的検査装置
JP2005317944A (ja) * 2004-03-31 2005-11-10 Jsr Corp プローブ装置およびこのプローブ装置を具えたウエハ検査装置並びにウエハ検査方法
JP2006194620A (ja) * 2005-01-11 2006-07-27 Tokyo Electron Ltd プローブカード及び検査用接触構造体
JP2007067387A (ja) * 2005-08-02 2007-03-15 Nec Schott Components Corp 絶縁基板およびその製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020095656A1 (fr) * 2018-11-05 2020-05-14 Nok株式会社 Procédé de fabrication d'élément conducteur
JP6756996B1 (ja) * 2018-11-05 2020-09-16 Nok株式会社 導電性部材の製造方法
TWI721629B (zh) * 2018-11-05 2021-03-11 日商Ｎｏｋ股份有限公司 導電性構件的製造方法
CN112585748A (zh) * 2018-11-05 2021-03-30 Nok株式会社 导电性部件的制造方法

Also Published As

Publication number Publication date
JP2009115524A (ja) 2009-05-28

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