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WO2009060585A1 - 露光装置及び露光方法、並びにデバイス製造方法 - Google Patents

露光装置及び露光方法、並びにデバイス製造方法 Download PDF

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Publication number
WO2009060585A1
WO2009060585A1 PCT/JP2008/003160 JP2008003160W WO2009060585A1 WO 2009060585 A1 WO2009060585 A1 WO 2009060585A1 JP 2008003160 W JP2008003160 W JP 2008003160W WO 2009060585 A1 WO2009060585 A1 WO 2009060585A1
Authority
WO
WIPO (PCT)
Prior art keywords
state
region
exposure
axis direction
wafer stages
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/003160
Other languages
English (en)
French (fr)
Inventor
Yuichi Shibazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Priority to HK10104656.5A priority Critical patent/HK1137077B/xx
Priority to CN200880011784.0A priority patent/CN101675500B/zh
Priority to JP2009539947A priority patent/JP4986185B2/ja
Publication of WO2009060585A1 publication Critical patent/WO2009060585A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • H10P76/2041—

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

　液浸領域（１４）が形成される投影光学系（ＰＬ）の下方の領域に、一方のウエハステージ（ＷＳＴ１）が位置する状態から他方のウエハステージ（ＷＳＴ２）が位置する状態に移行させる際に、両ウエハステージ（ＷＳＴ２，ＷＳＴ１）を、それぞれに設けられた庇部（２３ａ’）と段部（２３ｂ）とを係合させて、Ｘ軸方向に関してずれた状態で、Ｙ軸方向に近接又は接触させ、その状態を維持してＹ軸方向に同時に駆動する。これにより、液浸領域が、庇部を介して２つのウエハステージ間で受け渡し、液浸領域を形成する液体の漏れを抑制する。
PCT/JP2008/003160 2007-11-07 2008-11-04 露光装置及び露光方法、並びにデバイス製造方法 Ceased WO2009060585A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
HK10104656.5A HK1137077B (en) 2007-11-07 2008-11-04 Exposure apparatus, exposure method and device manufacturing method
CN200880011784.0A CN101675500B (zh) 2007-11-07 2008-11-04 曝光装置、曝光方法以及元件制造方法
JP2009539947A JP4986185B2 (ja) 2007-11-07 2008-11-04 露光装置及び露光方法、並びにデバイス製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-289203 2007-11-07
JP2007289203 2007-11-07

Publications (1)

Publication Number Publication Date
WO2009060585A1 true WO2009060585A1 (ja) 2009-05-14

Family

ID=40625493

Family Applications (1)

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PCT/JP2008/003160 Ceased WO2009060585A1 (ja) 2007-11-07 2008-11-04 露光装置及び露光方法、並びにデバイス製造方法

Country Status (6)

Country Link
US (1) US8797508B2 (ja)
JP (1) JP4986185B2 (ja)
KR (1) KR101470671B1 (ja)
CN (1) CN101675500B (ja)
TW (1) TWI435183B (ja)
WO (1) WO2009060585A1 (ja)

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US8902402B2 (en) * 2008-12-19 2014-12-02 Nikon Corporation Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method
US8599359B2 (en) 2008-12-19 2013-12-03 Nikon Corporation Exposure apparatus, exposure method, device manufacturing method, and carrier method
US8760629B2 (en) * 2008-12-19 2014-06-24 Nikon Corporation Exposure apparatus including positional measurement system of movable body, exposure method of exposing object including measuring positional information of movable body, and device manufacturing method that includes exposure method of exposing object, including measuring positional information of movable body
US8488109B2 (en) 2009-08-25 2013-07-16 Nikon Corporation Exposure method, exposure apparatus, and device manufacturing method
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US20110102761A1 (en) * 2009-09-28 2011-05-05 Nikon Corporation Stage apparatus, exposure apparatus, and device fabricating method
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US20110128523A1 (en) * 2009-11-19 2011-06-02 Nikon Corporation Stage apparatus, exposure apparatus, driving method, exposing method, and device fabricating method
US20110123913A1 (en) * 2009-11-19 2011-05-26 Nikon Corporation Exposure apparatus, exposing method, and device fabricating method
US8488106B2 (en) * 2009-12-28 2013-07-16 Nikon Corporation Movable body drive method, movable body apparatus, exposure method, exposure apparatus, and device manufacturing method
US9207549B2 (en) 2011-12-29 2015-12-08 Nikon Corporation Exposure apparatus and exposure method, and device manufacturing method with encoder of higher reliability for position measurement
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JP6362312B2 (ja) * 2013-09-09 2018-07-25 キヤノン株式会社 露光装置、それを用いたデバイスの製造方法
TWI768409B (zh) * 2015-02-23 2022-06-21 日商尼康股份有限公司 基板處理系統及基板處理方法、以及元件製造方法
JP6691693B2 (ja) 2015-02-23 2020-05-13 株式会社ニコン 計測装置、リソグラフィシステム及び露光装置、並びに重ね合わせ計測方法及びデバイス製造方法
CN112068406A (zh) 2015-02-23 2020-12-11 株式会社尼康 测量装置、光刻系统、以及组件制造方法
KR20240058311A (ko) * 2022-10-26 2024-05-03 삼성전자주식회사 기판 처리 장치

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US8599356B2 (en) 2009-09-11 2013-12-03 Asml Netherlands B.V. Shutter member, a lithographic apparatus and device manufacturing method

Also Published As

Publication number Publication date
KR101470671B1 (ko) 2014-12-08
JP4986185B2 (ja) 2012-07-25
CN101675500B (zh) 2011-05-18
US8797508B2 (en) 2014-08-05
CN101675500A (zh) 2010-03-17
US20090225288A1 (en) 2009-09-10
TW200935184A (en) 2009-08-16
JPWO2009060585A1 (ja) 2011-03-17
HK1137077A1 (en) 2010-07-16
TWI435183B (zh) 2014-04-21
KR20100085833A (ko) 2010-07-29

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