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WO2009059857A3 - Micromechanical component comprising a membrane lattice - Google Patents

Micromechanical component comprising a membrane lattice Download PDF

Info

Publication number
WO2009059857A3
WO2009059857A3 PCT/EP2008/063306 EP2008063306W WO2009059857A3 WO 2009059857 A3 WO2009059857 A3 WO 2009059857A3 EP 2008063306 W EP2008063306 W EP 2008063306W WO 2009059857 A3 WO2009059857 A3 WO 2009059857A3
Authority
WO
WIPO (PCT)
Prior art keywords
openings
micromechanical component
cavity
stabilisation element
distances
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2008/063306
Other languages
German (de)
French (fr)
Other versions
WO2009059857A2 (en
Inventor
Torsten Kramer
Hubert Benzel
Matthias Illing
Simon Armbruster
Joerg Brasas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of WO2009059857A2 publication Critical patent/WO2009059857A2/en
Publication of WO2009059857A3 publication Critical patent/WO2009059857A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B81B3/007—For controlling stiffness, e.g. ribs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
    • B81C1/00468—Releasing structures
    • B81C1/00476—Releasing structures removing a sacrificial layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0315—Cavities

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Pressure Sensors (AREA)
  • Electron Beam Exposure (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)

Abstract

The invention relates to a micromechanical component comprising a substrate, a stabilisation element provided with openings, and a cavity located between the stabilisation element and the substrate. According to the invention, the minimum depth of the cavity can be deduced from the distribution of the openings in the stabilisation element. Essentially, the distance between the openings is to be taken into account for the determination of the required depth of the cavity. These distances are advantageously obtained by determining the distances between the centroids of the individual openings.
PCT/EP2008/063306 2007-11-08 2008-10-06 Micromechanical component comprising a membrane lattice Ceased WO2009059857A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007053280.8 2007-11-08
DE200710053280 DE102007053280A1 (en) 2007-11-08 2007-11-08 Micromechanical component with a membrane grid

Publications (2)

Publication Number Publication Date
WO2009059857A2 WO2009059857A2 (en) 2009-05-14
WO2009059857A3 true WO2009059857A3 (en) 2009-07-16

Family

ID=40530521

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/063306 Ceased WO2009059857A2 (en) 2007-11-08 2008-10-06 Micromechanical component comprising a membrane lattice

Country Status (2)

Country Link
DE (1) DE102007053280A1 (en)
WO (1) WO2009059857A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020215985A1 (en) 2020-12-16 2022-06-23 Robert Bosch Gesellschaft mit beschränkter Haftung Micromechanical component for a capacitive pressure sensor device, capacitive pressure sensor device and a manufacturing method for a capacitive pressure sensor device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020094435A1 (en) * 2000-06-21 2002-07-18 Hans Artmann Micromechanical component, in particular a sensor element, having a stabilized membrane and a method of producing such a component
US20040069626A1 (en) * 2000-11-23 2004-04-15 Hans Artmann Flow sensor
FR2863603A1 (en) * 2003-12-16 2005-06-17 Bosch Gmbh Robert Production process for a semiconductor element especially a micromechanical element such as a sensor forms a membrane over a cavity on a structured layer by epitaxy
US20060057816A1 (en) * 2004-09-08 2006-03-16 Hubert Benzel Sensor element with trenched cavity

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10032579B4 (en) 2000-07-05 2020-07-02 Robert Bosch Gmbh Method for producing a semiconductor component and a semiconductor component produced by the method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020094435A1 (en) * 2000-06-21 2002-07-18 Hans Artmann Micromechanical component, in particular a sensor element, having a stabilized membrane and a method of producing such a component
US20040069626A1 (en) * 2000-11-23 2004-04-15 Hans Artmann Flow sensor
FR2863603A1 (en) * 2003-12-16 2005-06-17 Bosch Gmbh Robert Production process for a semiconductor element especially a micromechanical element such as a sensor forms a membrane over a cavity on a structured layer by epitaxy
US20060057816A1 (en) * 2004-09-08 2006-03-16 Hubert Benzel Sensor element with trenched cavity

Also Published As

Publication number Publication date
WO2009059857A2 (en) 2009-05-14
DE102007053280A1 (en) 2009-05-14

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