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WO2009048075A1 - Appareil de traitement au plasma - Google Patents

Appareil de traitement au plasma Download PDF

Info

Publication number
WO2009048075A1
WO2009048075A1 PCT/JP2008/068296 JP2008068296W WO2009048075A1 WO 2009048075 A1 WO2009048075 A1 WO 2009048075A1 JP 2008068296 W JP2008068296 W JP 2008068296W WO 2009048075 A1 WO2009048075 A1 WO 2009048075A1
Authority
WO
WIPO (PCT)
Prior art keywords
processing apparatus
electrode
plasma processing
magnets
distance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/068296
Other languages
English (en)
Japanese (ja)
Inventor
Eisaku Watanabe
Masayoshi Ikeda
Yohsuke Shibuya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Original Assignee
Canon Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Anelva Corp filed Critical Canon Anelva Corp
Publication of WO2009048075A1 publication Critical patent/WO2009048075A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3266—Magnetic control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3455—Movable magnets

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

Cette invention concerne un appareil de traitement au plasma, muni d'une chambre de traitement qui peut être évacuée par aspiration ; d'une première électrode disposée à l'intérieur de la chambre de traitement ; d'une pluralité d'aimants disposés sur la première électrode avec des polarités disposées inversement entre aimants adjacents ; et d'une seconde électrode disposée face à la première électrode. L'appareil de traitement au plasma est aussi muni d'un mécanisme de réglage de la distance destiné à régler une distance séparant les aimants et la première électrode.
PCT/JP2008/068296 2007-10-10 2008-10-08 Appareil de traitement au plasma Ceased WO2009048075A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007264510A JP2011026624A (ja) 2007-10-10 2007-10-10 プラズマ処理装置
JP2007-264510 2007-10-10

Publications (1)

Publication Number Publication Date
WO2009048075A1 true WO2009048075A1 (fr) 2009-04-16

Family

ID=40549219

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/068296 Ceased WO2009048075A1 (fr) 2007-10-10 2008-10-08 Appareil de traitement au plasma

Country Status (2)

Country Link
JP (1) JP2011026624A (fr)
WO (1) WO2009048075A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6604811B2 (ja) * 2015-10-15 2019-11-13 株式会社大阪真空機器製作所 干渉色装飾体の製造方法、干渉色装飾体、および、干渉色装飾体を製造するためのマグネトロンスパッタ装置
CN108690962B (zh) * 2017-04-06 2020-06-19 北京北方华创微电子装备有限公司 磁控溅射设备及磁控溅射沉积方法
US10513432B2 (en) * 2017-07-31 2019-12-24 Taiwan Semiconductor Manufacturing Co., Ltd. Anti-stiction process for MEMS device
JP7255078B2 (ja) * 2018-03-20 2023-04-11 日新電機株式会社 クランプ機構及び当該クランプ機構を備える基板保持装置
JP6533911B1 (ja) * 2018-05-18 2019-06-26 Tsk株式会社 電磁誘導加熱装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05202471A (ja) * 1992-01-28 1993-08-10 Fujitsu Ltd マグネトロンスパッタリング装置
JPH06887U (ja) * 1992-06-19 1994-01-11 八千代工機株式会社 電車線用碍子取付板の調整金具
JP2002363740A (ja) * 2001-06-01 2002-12-18 Anelva Corp スパッタ成膜応用のためのプラズマ処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05202471A (ja) * 1992-01-28 1993-08-10 Fujitsu Ltd マグネトロンスパッタリング装置
JPH06887U (ja) * 1992-06-19 1994-01-11 八千代工機株式会社 電車線用碍子取付板の調整金具
JP2002363740A (ja) * 2001-06-01 2002-12-18 Anelva Corp スパッタ成膜応用のためのプラズマ処理装置

Also Published As

Publication number Publication date
JP2011026624A (ja) 2011-02-10

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