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WO2009041510A1 - Process for producing resin molded product, resin molded product produced by the process, optical device, microlens, microlens array, and microfluid device - Google Patents

Process for producing resin molded product, resin molded product produced by the process, optical device, microlens, microlens array, and microfluid device Download PDF

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Publication number
WO2009041510A1
WO2009041510A1 PCT/JP2008/067310 JP2008067310W WO2009041510A1 WO 2009041510 A1 WO2009041510 A1 WO 2009041510A1 JP 2008067310 W JP2008067310 W JP 2008067310W WO 2009041510 A1 WO2009041510 A1 WO 2009041510A1
Authority
WO
WIPO (PCT)
Prior art keywords
molded product
resin molded
resin composition
photocurable resin
microlens
Prior art date
Application number
PCT/JP2008/067310
Other languages
French (fr)
Japanese (ja)
Inventor
Yutaka Kinugasa
Tadahiro Yamaji
Hiroyuki Yagyu
Shinji Hashimoto
Original Assignee
Panasonic Electric Works Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007247886A external-priority patent/JP2010274417A/en
Priority claimed from JP2008082040A external-priority patent/JP2010276623A/en
Application filed by Panasonic Electric Works Co., Ltd. filed Critical Panasonic Electric Works Co., Ltd.
Publication of WO2009041510A1 publication Critical patent/WO2009041510A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0888—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds
    • B29C35/0894—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds provided with masks or diaphragms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/026—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Toxicology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

This invention provides, for example, a process for producing a resin molded product, which can produce a high-quality resin molded product. The production process comprises a preparation step of mixing a solid epoxy compound, a liquid epoxy compound, and a photopolymerization initiator together to prepare a photocurable resin composition which, upon heating, can be melted or softened and, upon cooling, can be solidified, a step of placing the photocurable resin composition on a base material at its predetermined position, and a molding step of heating the photocurable resin composition placed at the predetermined position to melt or soften the photocurable resin composition, press-contacting a mold having a desired transfer shape against the photocurable resin composition, and, while maintaining the press-contacted state, cooling the assembly to solidify the photocurable resin composition, and releasing the molded product from the mold to form a primary molded product.
PCT/JP2008/067310 2007-09-25 2008-09-25 Process for producing resin molded product, resin molded product produced by the process, optical device, microlens, microlens array, and microfluid device WO2009041510A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-247886 2007-09-25
JP2007247886A JP2010274417A (en) 2007-09-25 2007-09-25 Manufacturing method of resin molded body, resin molded body obtained by the manufacturing method, optical device, microlens, microlens array, and microfluidic device
JP2008-082040 2008-03-26
JP2008082040A JP2010276623A (en) 2008-03-26 2008-03-26 Method for forming a transparent resin structure on a three-dimensional substrate

Publications (1)

Publication Number Publication Date
WO2009041510A1 true WO2009041510A1 (en) 2009-04-02

Family

ID=40511393

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/067310 WO2009041510A1 (en) 2007-09-25 2008-09-25 Process for producing resin molded product, resin molded product produced by the process, optical device, microlens, microlens array, and microfluid device

Country Status (1)

Country Link
WO (1) WO2009041510A1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010126116A1 (en) * 2009-04-30 2010-11-04 日立化成工業株式会社 Resin composition for forming optical waveguide, resin film for forming optical waveguide, and optical waveguide
CN103852972A (en) * 2014-03-28 2014-06-11 西安交通大学 Micrometer impressing and laser induction forming method of double-focus microlens array
WO2016003983A1 (en) * 2014-07-01 2016-01-07 Isola Usa Corp. Prepregs including uv curable resins useful for manufacturing semi-flexible pcbs
US9764532B2 (en) 2014-07-01 2017-09-19 Isola Usa Corp. Prepregs including UV curable resins useful for manufacturing semi-flexible PCBs
TWI614107B (en) * 2015-07-15 2018-02-11 趙崇禮 Molding device for lens array and the using method thereof
JP2018067718A (en) * 2017-11-16 2018-04-26 大日本印刷株式会社 Imprint transfer board
CN111319175A (en) * 2019-01-15 2020-06-23 陈龙 Earphone shell and manufacturing method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06194502A (en) * 1992-12-24 1994-07-15 Ricoh Opt Ind Co Ltd Microlens and microlens array and their production
JP2004200577A (en) * 2002-12-20 2004-07-15 Fuji Photo Film Co Ltd Method for forming microstructure
WO2006009626A2 (en) * 2004-06-16 2006-01-26 Hewlett-Packard Development Company, L. P. Imprinting lithography using the liquid/solid transition of metals and their alloys
WO2006124552A2 (en) * 2005-05-13 2006-11-23 Microchem Corp. Method of forming a photoresist element
JP2007084771A (en) * 2004-12-13 2007-04-05 Hitachi Chem Co Ltd Resin composition for optical material, resin film for optical material, and optical waveguide using the same
JP2007522531A (en) * 2004-02-13 2007-08-09 マイクロケム コーポレイション Permanent resist composition, cured product thereof, and use thereof

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06194502A (en) * 1992-12-24 1994-07-15 Ricoh Opt Ind Co Ltd Microlens and microlens array and their production
JP2004200577A (en) * 2002-12-20 2004-07-15 Fuji Photo Film Co Ltd Method for forming microstructure
JP2007522531A (en) * 2004-02-13 2007-08-09 マイクロケム コーポレイション Permanent resist composition, cured product thereof, and use thereof
WO2006009626A2 (en) * 2004-06-16 2006-01-26 Hewlett-Packard Development Company, L. P. Imprinting lithography using the liquid/solid transition of metals and their alloys
JP2007084771A (en) * 2004-12-13 2007-04-05 Hitachi Chem Co Ltd Resin composition for optical material, resin film for optical material, and optical waveguide using the same
WO2006124552A2 (en) * 2005-05-13 2006-11-23 Microchem Corp. Method of forming a photoresist element

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010126116A1 (en) * 2009-04-30 2010-11-04 日立化成工業株式会社 Resin composition for forming optical waveguide, resin film for forming optical waveguide, and optical waveguide
CN102414591A (en) * 2009-04-30 2012-04-11 日立化成工业株式会社 Resin composition for forming optical waveguide, resin film for forming optical waveguide, and optical waveguide
US8787723B2 (en) 2009-04-30 2014-07-22 Hitachi Chemical Company, Ltd. Resin composition for forming optical waveguide, resin film for forming optical waveguide, and optical waveguide
CN103852972A (en) * 2014-03-28 2014-06-11 西安交通大学 Micrometer impressing and laser induction forming method of double-focus microlens array
CN103852972B (en) * 2014-03-28 2016-08-17 西安交通大学 Micron impressing and the induced with laser manufacturing process of a kind of bifocus microlens array
WO2016003983A1 (en) * 2014-07-01 2016-01-07 Isola Usa Corp. Prepregs including uv curable resins useful for manufacturing semi-flexible pcbs
US9764532B2 (en) 2014-07-01 2017-09-19 Isola Usa Corp. Prepregs including UV curable resins useful for manufacturing semi-flexible PCBs
US10307989B2 (en) 2014-07-01 2019-06-04 Isola Usa Corp. Prepregs including UV curable resins useful for manufacturing semi-flexible PCBs
TWI614107B (en) * 2015-07-15 2018-02-11 趙崇禮 Molding device for lens array and the using method thereof
JP2018067718A (en) * 2017-11-16 2018-04-26 大日本印刷株式会社 Imprint transfer board
CN111319175A (en) * 2019-01-15 2020-06-23 陈龙 Earphone shell and manufacturing method thereof
CN111319175B (en) * 2019-01-15 2022-06-07 陈龙 Earphone shell and manufacturing method thereof

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