WO2009041388A1 - Ebauche de masque et masque de transfert - Google Patents
Ebauche de masque et masque de transfert Download PDFInfo
- Publication number
- WO2009041388A1 WO2009041388A1 PCT/JP2008/067098 JP2008067098W WO2009041388A1 WO 2009041388 A1 WO2009041388 A1 WO 2009041388A1 JP 2008067098 W JP2008067098 W JP 2008067098W WO 2009041388 A1 WO2009041388 A1 WO 2009041388A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- mask
- transferring
- less
- blank
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
La présente invention concerne un masque de transfert qui est utilisé lorsqu'un motif fin, ayant un demi pas (hp) DRAM de 45 nm ou plus selon une règle de conception de semi-conducteur, doit être formé grâce à l'utilisation d'une longueur d'onde de lumière d'exposition de 200 nm ou moins. Le masque de transfert comportant un motif de transfert sur un substrat présente une telle couche (ou une couche de réduction de flou) entre le substrat et le motif de transfert qui est faite d'un matériau ayant un intervalle de bande de 6,4 eV ou moins pour la longueur d'onde de lumière d'exposition de 200 nm ou moins.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-253250 | 2007-09-28 | ||
| JP2007253250A JP2009086094A (ja) | 2007-09-28 | 2007-09-28 | マスクブランク及び転写用マスク |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2009041388A1 true WO2009041388A1 (fr) | 2009-04-02 |
Family
ID=40511273
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2008/067098 Ceased WO2009041388A1 (fr) | 2007-09-28 | 2008-09-22 | Ebauche de masque et masque de transfert |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2009086094A (fr) |
| TW (1) | TW200921267A (fr) |
| WO (1) | WO2009041388A1 (fr) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010008604A (ja) * | 2008-06-25 | 2010-01-14 | Hoya Corp | マスクブランク及び転写用マスク |
| US8968970B2 (en) | 2009-10-09 | 2015-03-03 | Samsung Electronics Co., Ltd. | Phase shift masks and methods of forming phase shift masks |
| KR101663173B1 (ko) | 2009-10-09 | 2016-10-07 | 삼성전자주식회사 | 알카리 세정에 내성을 갖는 위상 반전 마스크 및 위상 반전 마스크의 제조 방법 |
| JP5602412B2 (ja) * | 2009-10-27 | 2014-10-08 | Hoya株式会社 | マスクブランク、転写用マスク、転写用マスクセットおよび半導体デバイスの製造方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10112429A (ja) * | 1996-10-07 | 1998-04-28 | Nippon Telegr & Teleph Corp <Ntt> | 光露光システム |
| JPH10125583A (ja) * | 1996-10-24 | 1998-05-15 | Nippon Telegr & Teleph Corp <Ntt> | X線マスク |
| JP2000284468A (ja) * | 1999-03-31 | 2000-10-13 | Canon Inc | マスク構造体、該マスク構造体を用いた露光方法および露光装置、該マスク構造体を用いて作製された半導体デバイス、ならびに半導体デバイス製造方法 |
| JP2003243292A (ja) * | 2002-02-18 | 2003-08-29 | Nikon Corp | 反射マスク、露光装置及びその清掃方法 |
| JP2007184361A (ja) * | 2006-01-05 | 2007-07-19 | Asahi Glass Co Ltd | 薄膜デバイス用ガラス基板およびその成膜方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2591244Y2 (ja) * | 1992-11-30 | 1999-03-03 | 京セラ株式会社 | フォトマスク |
| JPH0784357A (ja) * | 1993-09-14 | 1995-03-31 | Nikon Corp | 露光マスクおよび投影露光方法 |
| JP4201162B2 (ja) * | 2001-03-29 | 2008-12-24 | 大日本印刷株式会社 | パターン形成体の製造方法およびそれに用いるフォトマスク |
| JP2005175324A (ja) * | 2003-12-12 | 2005-06-30 | Nikon Corp | マスク汚染防止方法、マスク汚染防止装置及び露光装置 |
| JP2005186005A (ja) * | 2003-12-26 | 2005-07-14 | Dainippon Printing Co Ltd | 光触媒含有層基板およびパターン形成体の製造方法 |
| JP4635509B2 (ja) * | 2004-08-03 | 2011-02-23 | 凸版印刷株式会社 | フォトマスクの製造方法 |
| JP4601459B2 (ja) * | 2005-03-01 | 2010-12-22 | 大日本印刷株式会社 | 露光用マスクおよびその製造方法 |
| JP2008197234A (ja) * | 2007-02-09 | 2008-08-28 | Nsk Ltd | 近接露光用フォトマスク、露光方法及び露光装置 |
| JP2008286838A (ja) * | 2007-05-15 | 2008-11-27 | Canon Inc | 露光用マスク、パターン形成装置及びパターン形成方法 |
-
2007
- 2007-09-28 JP JP2007253250A patent/JP2009086094A/ja active Pending
-
2008
- 2008-09-22 WO PCT/JP2008/067098 patent/WO2009041388A1/fr not_active Ceased
- 2008-09-26 TW TW097137086A patent/TW200921267A/zh unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10112429A (ja) * | 1996-10-07 | 1998-04-28 | Nippon Telegr & Teleph Corp <Ntt> | 光露光システム |
| JPH10125583A (ja) * | 1996-10-24 | 1998-05-15 | Nippon Telegr & Teleph Corp <Ntt> | X線マスク |
| JP2000284468A (ja) * | 1999-03-31 | 2000-10-13 | Canon Inc | マスク構造体、該マスク構造体を用いた露光方法および露光装置、該マスク構造体を用いて作製された半導体デバイス、ならびに半導体デバイス製造方法 |
| JP2003243292A (ja) * | 2002-02-18 | 2003-08-29 | Nikon Corp | 反射マスク、露光装置及びその清掃方法 |
| JP2007184361A (ja) * | 2006-01-05 | 2007-07-19 | Asahi Glass Co Ltd | 薄膜デバイス用ガラス基板およびその成膜方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009086094A (ja) | 2009-04-23 |
| TW200921267A (en) | 2009-05-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2008129908A1 (fr) | Pièce à masque réfléchissant pour lithographie euv | |
| EP1526405A3 (fr) | Masque à décalage de phase, précurseur et procédé pour transférer un motif | |
| WO2008129914A1 (fr) | Pièce à masque euv | |
| TW200833732A (en) | Hardmask composition having antireflective properties, process for forming patterned material layer by using the composition and semiconductor integrated circuit device produced using the process | |
| WO2008093534A1 (fr) | Ébauche de masque réfléchissant pour lithographie euv | |
| JP2016164683A5 (fr) | ||
| TW200834226A (en) | Mask blank and method for manufacturing transfer mask | |
| WO2009059128A3 (fr) | Structures de films minces photovoltaïques cristallins et leurs méthodes de production | |
| JP2010039352A5 (fr) | ||
| UA97809C2 (ru) | Способ изготовления многослойного тела и многослойное тело | |
| WO2009075793A3 (fr) | Contrôle de l'épaisseur d'une couche résiduelle | |
| EP2881790A3 (fr) | Ébauche de photomasque | |
| TW200625407A (en) | Method for foring a finely patterned resist | |
| TW200641543A (en) | Underlayer coating forming composition for lithography containing compound having protected carboxy group | |
| WO2006108611A3 (fr) | Feuille de transfert | |
| JP2011164598A5 (fr) | ||
| WO2008084680A1 (fr) | Ébauche de masque réfléchissant pour une lithographie aux ultraviolets extrêmes | |
| WO2008087763A1 (fr) | Dispositif à semi-conducteur et son procédé de fabrication | |
| WO2007053202A3 (fr) | Systemes et procedes pour le transfert de nanomateriaux | |
| WO2009041388A1 (fr) | Ebauche de masque et masque de transfert | |
| JP2017223890A5 (fr) | ||
| JP2011059502A5 (fr) | ||
| WO2008024643A3 (fr) | Création de motifs sur des surfaces non planaires | |
| WO2006081427A3 (fr) | Appareil presentant un cristal photonique | |
| JP2009086094A5 (fr) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 08833317 Country of ref document: EP Kind code of ref document: A1 |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 08833317 Country of ref document: EP Kind code of ref document: A1 |