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WO2009041194A1 - 熱間加工性に優れた高強度高導電性銅合金 - Google Patents

熱間加工性に優れた高強度高導電性銅合金 Download PDF

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Publication number
WO2009041194A1
WO2009041194A1 PCT/JP2008/064931 JP2008064931W WO2009041194A1 WO 2009041194 A1 WO2009041194 A1 WO 2009041194A1 JP 2008064931 W JP2008064931 W JP 2008064931W WO 2009041194 A1 WO2009041194 A1 WO 2009041194A1
Authority
WO
WIPO (PCT)
Prior art keywords
copper alloy
hot workability
less
phase particles
excellent hot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/064931
Other languages
English (en)
French (fr)
Inventor
Masatoshi Eto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mining Holdings Inc
Original Assignee
Nippon Mining and Metals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining and Metals Co Ltd filed Critical Nippon Mining and Metals Co Ltd
Priority to JP2009534243A priority Critical patent/JP5232794B2/ja
Priority to CN2008801037913A priority patent/CN101784684B/zh
Priority to KR1020107001453A priority patent/KR101203437B1/ko
Publication of WO2009041194A1 publication Critical patent/WO2009041194A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)

Abstract

　熱間加工性が良好で曲げ加工性を損なうことなく高強度、高導電性及び高熱伝導性を発揮するＣｕ－Ｎｉ－Ｐ系合金からなる電子部品用銅合金を提供する。 　質量割合にて、Ｎｉ：０．５０％～１．００％、Ｐ：０．１０％～０．２５％を含有し、ＮｉとＰの含有量比率Ｎｉ／Ｐ：４．０～５．５で且つ、Ｃｒ：０．０３％～０．４５％、Ｏ：０．００５０％以下であり、Ｆｅ、Ｃｏ、Ｍｎ、Ｔｉ、Ｚｒのうち１種類以上の含有量が合計で０．０５％以下、好ましくは０．０３％以下で残部がＣｕ及び不可避的不純物から成る銅合金において、Ｎｉ－Ｐ系第２相粒子の大きさについて、長径：ａ、短径：ｂとした時、ａ：２０ｎｍ以上５０ｎｍ以下で且つアスペクト比ａ／ｂ：１以上５以下の第２相粒子が銅合金中に含まれる全第２相粒子の面積率で８０％以上を占める銅合金。
PCT/JP2008/064931 2007-09-27 2008-08-21 熱間加工性に優れた高強度高導電性銅合金 Ceased WO2009041194A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009534243A JP5232794B2 (ja) 2007-09-27 2008-08-21 熱間加工性に優れた高強度高導電性銅合金
CN2008801037913A CN101784684B (zh) 2007-09-27 2008-08-21 热加工性优异的高强度高导电性铜合金
KR1020107001453A KR101203437B1 (ko) 2007-09-27 2008-08-21 열간 가공성이 우수한 고강도 고도전성 구리 합금

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007251849 2007-09-27
JP2007-251849 2007-09-27

Publications (1)

Publication Number Publication Date
WO2009041194A1 true WO2009041194A1 (ja) 2009-04-02

Family

ID=40511088

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/064931 Ceased WO2009041194A1 (ja) 2007-09-27 2008-08-21 熱間加工性に優れた高強度高導電性銅合金

Country Status (5)

Country Link
JP (1) JP5232794B2 (ja)
KR (1) KR101203437B1 (ja)
CN (1) CN101784684B (ja)
TW (1) TWI386493B (ja)
WO (1) WO2009041194A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6155405B2 (ja) * 2015-04-24 2017-06-28 古河電気工業株式会社 銅合金材料およびその製造方法
CN105603253B (zh) * 2016-01-15 2017-10-17 宁波博威合金材料股份有限公司 一种含镍磷、镍硼相的铜合金材料及其制造方法
CN107541613B (zh) * 2016-06-28 2019-03-08 沈阳慧坤新材料科技有限公司 一种铜合金及其制备方法和应用
CN110643850B (zh) * 2019-10-24 2020-12-01 宁波博威合金材料股份有限公司 一种折弯性能优异的铜合金及其制备方法和应用
CN115537595B (zh) * 2022-09-30 2023-08-01 宁波金田铜业(集团)股份有限公司 一种铜箔及其制备方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62133033A (ja) * 1985-12-04 1987-06-16 Mitsubishi Metal Corp 半導体装置用Ｃｕ合金リ−ド素材
JPH04231446A (ja) * 1990-12-27 1992-08-20 Nikko Kyodo Co Ltd 通電材料
JP2001335864A (ja) * 2000-05-25 2001-12-04 Kobe Steel Ltd 電気・電子部品用銅合金
JP2005298931A (ja) * 2004-04-14 2005-10-27 Mitsubishi Shindoh Co Ltd 銅合金及びその製造方法
JP2006016667A (ja) * 2004-07-01 2006-01-19 Dowa Mining Co Ltd 銅基合金およびその製造方法
JP2007270267A (ja) * 2006-03-31 2007-10-18 Nikko Kinzoku Kk 曲げ加工性及び寸法安定性に優れた高強度銅合金
JP2008248355A (ja) * 2007-03-30 2008-10-16 Nikko Kinzoku Kk 電子部品用チタン銅及びこれを用いた電子部品
JP2008248352A (ja) * 2007-03-30 2008-10-16 Nikko Kinzoku Kk 熱間加工性に優れた高強度高導電性銅合金
JP2008248351A (ja) * 2007-03-30 2008-10-16 Nikko Kinzoku Kk 熱間加工性に優れた高強度高導電性銅合金

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3968955B2 (ja) 2000-05-30 2007-08-29 Ｊｆｅスチール株式会社 耐食性に優れた有機被覆鋼板
JP3699701B2 (ja) * 2002-10-31 2005-09-28 日鉱金属加工株式会社 易加工高力高導電性銅合金
JP3871064B2 (ja) * 2005-06-08 2007-01-24 株式会社神戸製鋼所 電気接続部品用銅合金板
JP5079574B2 (ja) * 2008-03-31 2012-11-21 Ｊｘ日鉱日石金属株式会社 熱間加工性に優れた高強度高導電性銅合金

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62133033A (ja) * 1985-12-04 1987-06-16 Mitsubishi Metal Corp 半導体装置用Ｃｕ合金リ−ド素材
JPH04231446A (ja) * 1990-12-27 1992-08-20 Nikko Kyodo Co Ltd 通電材料
JP2001335864A (ja) * 2000-05-25 2001-12-04 Kobe Steel Ltd 電気・電子部品用銅合金
JP2005298931A (ja) * 2004-04-14 2005-10-27 Mitsubishi Shindoh Co Ltd 銅合金及びその製造方法
JP2006016667A (ja) * 2004-07-01 2006-01-19 Dowa Mining Co Ltd 銅基合金およびその製造方法
JP2007270267A (ja) * 2006-03-31 2007-10-18 Nikko Kinzoku Kk 曲げ加工性及び寸法安定性に優れた高強度銅合金
JP2008248355A (ja) * 2007-03-30 2008-10-16 Nikko Kinzoku Kk 電子部品用チタン銅及びこれを用いた電子部品
JP2008248352A (ja) * 2007-03-30 2008-10-16 Nikko Kinzoku Kk 熱間加工性に優れた高強度高導電性銅合金
JP2008248351A (ja) * 2007-03-30 2008-10-16 Nikko Kinzoku Kk 熱間加工性に優れた高強度高導電性銅合金

Also Published As

Publication number Publication date
CN101784684B (zh) 2012-05-23
TW200925298A (en) 2009-06-16
CN101784684A (zh) 2010-07-21
KR20100021666A (ko) 2010-02-25
JPWO2009041194A1 (ja) 2011-01-20
JP5232794B2 (ja) 2013-07-10
KR101203437B1 (ko) 2012-11-21
TWI386493B (zh) 2013-02-21

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