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WO2008137459A3 - Agitation of electrolytic solution in electrodeposition - Google Patents

Agitation of electrolytic solution in electrodeposition Download PDF

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Publication number
WO2008137459A3
WO2008137459A3 PCT/US2008/062027 US2008062027W WO2008137459A3 WO 2008137459 A3 WO2008137459 A3 WO 2008137459A3 US 2008062027 W US2008062027 W US 2008062027W WO 2008137459 A3 WO2008137459 A3 WO 2008137459A3
Authority
WO
WIPO (PCT)
Prior art keywords
electrolytic solution
agitation
electrodeposition
substrate
ultrasound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2008/062027
Other languages
French (fr)
Other versions
WO2008137459A2 (en
Inventor
Sergey Savastiouk
Valentin Kosenko
Alexander J Berger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Allvia Inc
Original Assignee
Allvia Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Allvia Inc filed Critical Allvia Inc
Publication of WO2008137459A2 publication Critical patent/WO2008137459A2/en
Publication of WO2008137459A3 publication Critical patent/WO2008137459A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/20—Electroplating using ultrasonics, vibrations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H10P14/47—
    • H10W20/023—
    • H10W20/0245—
    • H10W20/0261—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0292—Using vibration, e.g. during soldering or screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1492—Periodical treatments, e.g. pulse plating of through-holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H10W20/056—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

In a reverse pulse plating of a substrate (110), the electrolytic solution is agitated with a greater power on forward pulses (210) than on reverse pulses (220). An ultrasound agitation source (170) can be positioned at the bottom of the substrate (110) if the anode (134) is at the top. The ultrasound source may contact the substrate's bottom. Other features are also provided.
PCT/US2008/062027 2007-05-03 2008-04-30 Agitation of electrolytic solution in electrodeposition Ceased WO2008137459A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/744,046 US20080271995A1 (en) 2007-05-03 2007-05-03 Agitation of electrolytic solution in electrodeposition
US11/744,046 2007-05-03

Publications (2)

Publication Number Publication Date
WO2008137459A2 WO2008137459A2 (en) 2008-11-13
WO2008137459A3 true WO2008137459A3 (en) 2009-04-16

Family

ID=39864962

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/062027 Ceased WO2008137459A2 (en) 2007-05-03 2008-04-30 Agitation of electrolytic solution in electrodeposition

Country Status (2)

Country Link
US (1) US20080271995A1 (en)
WO (1) WO2008137459A2 (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
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CA2619509C (en) 2005-08-12 2015-01-06 Modumetal, Llc. Compositionally modulated composite materials and methods for making the same
BRPI1010877B1 (en) 2009-06-08 2020-09-15 Modumetal, Inc CORROSION RESISTANT MULTILAYER COATING AND ELECTRODEPOSITION METHOD
KR101783786B1 (en) 2011-06-24 2017-10-10 에이씨엠 리서치 (상하이) 인코포레이티드 Methods and apparatus for uniformly metallization on substrates
CN103000567B (en) * 2011-09-13 2015-07-22 中芯国际集成电路制造(北京)有限公司 Manufacturing method of semiconductor device
BR112015022078B1 (en) * 2013-03-15 2022-05-17 Modumetal, Inc Apparatus and method for electrodepositing a nanolaminate coating
WO2014145588A1 (en) 2013-03-15 2014-09-18 Modumetal, Inc. Nickel chromium nanolaminate coating having high hardness
US10472727B2 (en) 2013-03-15 2019-11-12 Modumetal, Inc. Method and apparatus for continuously applying nanolaminate metal coatings
CN110273167A (en) 2013-03-15 2019-09-24 莫杜美拓有限公司 Pass through the composition and nanometer layer pressing gold of the electro-deposition of the product of addition manufacturing process preparation
CN105283587B (en) 2013-03-15 2019-05-10 莫杜美拓有限公司 Nano Laminated Coating
JP6116450B2 (en) * 2013-09-05 2017-04-19 住友精密工業株式会社 Metal filling apparatus and metal filling method
EA201790644A1 (en) 2014-09-18 2017-08-31 Модьюметал, Инк. METHODS OF PRODUCTION OF PRODUCTS ELECTRICAL PLANTING AND PROCESSES OF LAYERED SYNTHESIS
BR112017005464A2 (en) 2014-09-18 2017-12-05 Modumetal Inc Method and Apparatus for Continuously Applying Nannaminated Metal Coatings
BR112019004508A2 (en) 2016-09-08 2019-06-04 Modumetal Inc methods for obtaining laminated coatings on workpieces and articles made therefrom
CN109922936A (en) 2016-09-09 2019-06-21 莫杜美拓有限公司 By on workpiece deposition materials layer manufacture mold, the mold and product that are obtained by the technique
WO2018053158A1 (en) 2016-09-14 2018-03-22 Modumetal, Inc. System for reliable, high throughput, complex electric field generation, and method for producing coatings therefrom
CN110114210B (en) 2016-11-02 2022-03-04 莫杜美拓有限公司 Topology-optimized high-interface-filled structures
CA3057836A1 (en) 2017-03-24 2018-09-27 Modumetal, Inc. Lift plungers with electrodeposited coatings, and systems and methods for producing the same
EP3612669A1 (en) 2017-04-21 2020-02-26 Modumetal, Inc. Tubular articles with electrodeposited coatings, and systems and methods for producing the same
EP3784823A1 (en) 2018-04-27 2021-03-03 Modumetal, Inc. Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation
CN115244226B (en) * 2021-12-06 2023-05-12 株式会社荏原制作所 Plating method and plating apparatus

Citations (5)

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Publication number Priority date Publication date Assignee Title
JPH10204680A (en) * 1997-01-14 1998-08-04 Murata Mfg Co Ltd Plating method and plating apparatus
DE19925373A1 (en) * 1999-06-02 2000-12-07 Bosch Gmbh Robert Metal electroplating process, especially for producing metallic microstructures, uses a periodic succession of deposition pulses and pauses and electrolyte movement relative to the workpiece
US6368482B1 (en) * 2000-09-19 2002-04-09 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration, Washington, Dc (Us) Plating processes utilizing high intensity acoustic beams
WO2004112093A2 (en) * 2003-06-06 2004-12-23 P.C.T. Systems, Inc. Method and apparatus to process substrates with megasonic energy
US20060131175A1 (en) * 2002-12-18 2006-06-22 Reiner Anton Method for the deposition of an alloy on a substrate

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US4686014A (en) * 1984-11-23 1987-08-11 Pellegrino Peter P Turbulent cell electroplating method and apparatus
DE19547948C1 (en) * 1995-12-21 1996-11-21 Atotech Deutschland Gmbh Mfg. unipolar or bipolar pulsed current for plating esp. of circuit boards at high current
US5662788A (en) * 1996-06-03 1997-09-02 Micron Technology, Inc. Method for forming a metallization layer
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US6929723B2 (en) * 1996-11-22 2005-08-16 Hubert F. Metzger Electroplating apparatus using a non-dissolvable anode and ultrasonic energy
US6547936B1 (en) * 1996-11-22 2003-04-15 Chema Technology, Inc. Electroplating apparatus having a non-dissolvable anode
US6545138B1 (en) * 1998-05-25 2003-04-08 Nippon Shinyaku Co., Ltd. Process for producing composite preparation containing nucleic acid
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KR100390890B1 (en) * 1998-11-14 2003-10-08 주식회사 하이닉스반도체 A method for forming a conductive layer and an apparatus thereof
US6140241A (en) * 1999-03-18 2000-10-31 Taiwan Semiconductor Manufacturing Company Multi-step electrochemical copper deposition process with improved filling capability
DE60042976D1 (en) * 1999-08-06 2009-10-29 Ibiden Co Ltd SOLUTION FOR ELECTROCHEMICAL DEPOSITION, METHOD, MAKING A PCB WITH THE USE OF THIS SOLUTION, AND MULTILAYER CONDUCTOR PLATE
US6398937B1 (en) * 2000-09-01 2002-06-04 National Research Council Of Canada Ultrasonically assisted plating bath for vias metallization in printed circuit board manufacturing
US6610189B2 (en) * 2001-01-03 2003-08-26 Applied Materials, Inc. Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature
US6746590B2 (en) * 2001-09-05 2004-06-08 3M Innovative Properties Company Ultrasonically-enhanced electroplating apparatus and methods
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US20030196901A1 (en) * 2002-04-23 2003-10-23 Applied Materials, Inc. Method for plating metal onto wafers
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DE60336539D1 (en) * 2002-12-20 2011-05-12 Shipley Co Llc Method for electroplating with reversed pulse current

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Publication number Priority date Publication date Assignee Title
JPH10204680A (en) * 1997-01-14 1998-08-04 Murata Mfg Co Ltd Plating method and plating apparatus
DE19925373A1 (en) * 1999-06-02 2000-12-07 Bosch Gmbh Robert Metal electroplating process, especially for producing metallic microstructures, uses a periodic succession of deposition pulses and pauses and electrolyte movement relative to the workpiece
US6368482B1 (en) * 2000-09-19 2002-04-09 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration, Washington, Dc (Us) Plating processes utilizing high intensity acoustic beams
US20060131175A1 (en) * 2002-12-18 2006-06-22 Reiner Anton Method for the deposition of an alloy on a substrate
WO2004112093A2 (en) * 2003-06-06 2004-12-23 P.C.T. Systems, Inc. Method and apparatus to process substrates with megasonic energy

Non-Patent Citations (1)

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Also Published As

Publication number Publication date
WO2008137459A2 (en) 2008-11-13
US20080271995A1 (en) 2008-11-06

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