WO2008134965A1 - Module and electric assembly - Google Patents

Abstract

A module (11) is provided. The module comprises: a substrate (1) and two pin structures (3). The pin structure comprises pins (4) and a pin carrier (0). Each of the pins is mounted on the pin carrier independently. The number of the pin structures is two or more. They are disposed on the two sides of the substrate respectively, and used to connect the substrate and the motherboard (12). At least two locating protrudings (6) are disposed on the pin carrier. The locating holes (7) on the substrate correspond to locating protrudings on the pin carrier, and they are located on the same straight line. The locating protrudings on the pin carrier are assembled with the substrate through the locating holes. An electric assembly is provided as well, the electric assembly comprises the module and the motherboard. The module and electric assembly can ensure the assembled pins and the motherboard coplanar.

Description

 Module and electronic component

 The invention relates to the field of electronic technology, and in particular to a module and an electronic component. Background technique

 High-density miniaturization is the trend of electronic products development, and it is also a challenge that the electronic assembly process has always faced. Increasing the layout density of single-board has become a necessary condition for electronic products to achieve high-density miniaturization, and some common circuits on the circuit board, especially in one piece. The circuit unit that is repeated many times on the motherboard is integrated into the module and then assembled to the motherboard as a conventional device. In this way, not only the three-dimensional space is fully utilized, the floor space is reduced, but the assembly efficiency and quality are improved while the layout density is increased, and the production cost is reduced.

 A module is neither a special semiconductor device nor a passive component. The module is an integrated circuit component that includes a variety of devices designed according to the principles of optimized circuit and system structure. Broadly speaking, modular technology can be understood as a single unit that integrates different component packages. The module itself requires one assembly and a secondary assembly that is mounted to the motherboard. According to the module's secondary assembly on the motherboard, the module can be divided into vertical module and horizontal module.

 Among them, the vertical module can effectively utilize the three-dimensional space of the single board, but the existing vertical modules are mostly based on a single-row pin structure, so that the number of I/O ports derived in a limited space is naturally small. Restrict the bottleneck of module circuit integration.

With the development of miniaturization of electronic products, the circuit integration on the module is getting higher and higher, and the number of pins required to derive the I/O port is increasing. The pin structure has become a high I/O port. The key factors for the effective implementation of the modular module. At present, there are mainly the following vertical modules. FIG. 1 is a schematic diagram of the outline and pin of a conventional vertical single-row in-line module. As shown in FIG. 1, a plurality of pins 111 (also referred to as pins) functioning as an I/O connection and supporting before assembly are They are injection molded together and then assembled as a unit to the module substrate 112. The secondary assembly generally adopts the process of wave soldering or through-hole reflow soldering to realize the connection between the vertical module 11 and the motherboard 12. The vertical module 11 is also provided with components 113 on the vertical module, and the mother board is also provided with a mother. On-board component 121. The pins are in a single row and are located on one side of the module. After the assembly is completed, one pin realizes an I/O port connection.

 Referring to FIG. 1, in the process of implementing the present invention, the inventors have found that at least the following problems exist in the prior art, that a single row of pins makes the number of pins available for deriving an I/O port small, which limits the high integration of the module circuit. development of. When the module is reassembled on the motherboard, the design of the pin-in pins reduces the surface mount rate of the entire board. The assembly of the plug-in module requires a hole in the motherboard and a large via hole, which is disadvantageous for the increase in the wiring density on the board.

 2 is a schematic view of the shape and pin of the conventional vertical single-row surface mount module. As shown in FIG. 2, a plurality of pairs of pins 111 are connected by connecting strips 22 at both ends before one assembly, and a pair of connections are shown in FIG. The pin 21 is integrated into the module substrate 112 as a whole. The secondary assembly generally uses a reflow soldering process to connect the module to the motherboard. Although the I/O connection and support pins have the left and right wings on the two sides of the module, the two wings of the pair of pins are connected together, and only one I/O port can be realized after the assembly is completed. Connection.

 Referring to FIG. 2, in the process of implementing the present invention, the inventors have found that at least the following problems exist in the prior art, the surface mount pins on the left and right sides of the module are actually integrated, and the number of pins that can be used to derive the I/O port is still small. If you want to increase the number of I/O ports of the circuit, you must increase the size of the module board, which increases the floor space and limits the development of high integration of the module circuit.

In addition to the above two vertical modules, there is also a vertical module in which different surface-mounting pin structures are used on both sides of the substrate. The two positioning holes are arranged side by side at the two ends of the module substrate, and the positioning posts on the pin plastic body are respectively inserted into the positioning holes at corresponding positions on the module substrate for positioning. In the process of implementing the present invention, the inventors have found that at least the following problems exist in the prior art, In the implementation scheme, since different pin structures are used on both sides of the module substrate, and two pairs of positioning holes parallel to each other on the substrate are positioned, there are disadvantages such as cumulative tolerance of the size chain and difficulty in ensuring the coplanarity of the pins. Summary of the invention

 In view of this, the embodiments of the present invention provide a module and an electronic component, which can improve the integration degree of the module circuit and improve the coplanarity of the pins.

 To this end, an embodiment of the present invention provides a module including a substrate and a pin structure;

 Wherein, the pin structure comprises a pin and a pin carrier; each pin is mounted on the pin carrier independently of each other; the pin carrier is provided with a positioning post for passing through the substrate Positioning holes enable assembly with the substrate;

 The pin structure is at least two, respectively disposed on two sides of the substrate for connecting the motherboard and the substrate;

 A positioning hole corresponding to the positioning post disposed on the lead structure is disposed on the substrate, and the pin structure is assembled through the positioning hole; the positioning holes on the substrate are located on the same straight line.

 Meanwhile, an embodiment of the present invention provides an electronic component including a module and a motherboard;

 The module includes a substrate and a pin structure;

 The pin structure includes a pin and a pin carrier; the pins are mounted on the pin carrier independently of each other; the pin structure is at least two, respectively disposed on both sides of the substrate for connecting the mother a plate and the substrate;

The pin carrier is provided with at least two positioning posts, and the positioning hole corresponding to the positioning post disposed on the lead structure is disposed on the substrate, and the positioning holes on the substrate are located on the same straight line; A positioning post on the pin carrier is assembled with the substrate through the positioning hole. It can be seen from the above technical solutions that the embodiments of the present invention improve the pin structure, so that the pins on the two sides of the substrate are independent of each other, and can connect different I/O ports, thereby increasing the layout density and thus reducing the mother. The layout space of the board improves the overall layout density; since the pin structure adopts the positioning method on the same line, the size accumulation error is eliminated, and the coplanarity of the surface mount pins is improved. DRAWINGS

 1 is a schematic view of a shape and a pin of a conventional vertical single-row in-line module;

 2 is a schematic view of a shape and a pin of a conventional vertical single-row surface mount module;

 3 is a schematic view showing an embodiment of a module and a pin of the present invention;

 4 is a schematic view of an embodiment of a module assembled to a motherboard of the present invention;

 Figure 5 is a front elevational view of a modular embodiment of the present invention after assembly;

 6a-6b are schematic views of the assembly of the positioning post at the A section of Fig. 5;

 6c-6d are schematic views of the assembly of the positioning post at the B section of Fig. 5;

 7a-7d are schematic views showing an example of a pin shape in a module embodiment of the present invention; and Fig. 8 is a schematic view showing an embodiment of a positioning post structure on a pin structure in a module embodiment of the present invention;

 9a-Fig. 9b are schematic views showing the assembly of the positioning post at the B section of Fig. 5 when the positioning post structure shown in Fig. 8 is used;

 Figure 11 is a schematic illustration of a double row pin lead vertical module. detailed description

 The present invention will be further described in detail below with reference to the accompanying drawings.

 A module 11 of the present invention mainly comprises a substrate 1, a pin structure 3.

The pin structure 3 includes a pin 4 and a pin carrier 0; each of the pins 4 is mounted on the pin carrier 0 independently of each other; the pin structure 3 is at least two, respectively disposed on both sides of the substrate 1. , for connecting the substrate 1 and the motherboard 12; The pin carrier 0 is provided with at least two positioning posts 6 . The substrate 1 is provided with a positioning hole 7 corresponding to the positioning post 6 disposed on the lead structure 3 , and the positioning hole 7 on the substrate 1 is located On the same line;

 The positioning post 6 on the lead carrier 0 is assembled with the substrate 1 through the positioning hole 7.

 The lead structure 3 can further be provided with a boss 5 for a patch for one assembly, and the positioning post 6 can be disposed on the boss 5.

 3 is a schematic diagram of an embodiment of a module and a pin of the present invention. The embodiment is a vertical double-row surface mount module, which mainly includes: a substrate 1, two pin structures 3; and a cap 9 may also be included.

 Each of the pin structures 3 includes: a pin 4, a pin carrier 0, in this embodiment, a pin 5 is disposed on the pin carrier 0, and the positioning post 6 is disposed on the boss 5;

 In this embodiment, the substrate 1 includes: a positioning hole 7 corresponding to the positioning posts of the two ends, and a positioning hole 8 corresponding to the intermediate positioning column; and the component 2 on the substrate may also be included.

 As shown in FIG. 3, the pin 4 is a surface mount metal pin, which is disposed on each of the pin structures 3, and the pins are independent of each other, and the pin structures on both sides of the substrate 1 are also independent of each other, and can be connected differently. I/O port.

 Each of the lead structures 3 has two positioning posts 6 each, wherein one of the two positioning posts 6 of each of the pin structures 3 is disposed on the boss 5 of one of the two ends of the pin structure 3, and If one of the lead structures 5 has a positioning post on one of the bosses 5, the post 5 of the corresponding end of the other pin structure 3 is not provided with a post;

 The other of the two positioning posts 6 of each of the above-described pin structures 3 is disposed on the boss 5 at the intermediate position of each of the pin structures 3. The positioning post on the boss 5 located at the intermediate position of the pin structure 3 is slightly offset from the midpoint position, which is offset from the position of the positioning post on the boss 5 at the intermediate position of the other pin structure 3, so as to position the two positions during mounting. The columns do not interfere with each other.

The size, shape and material of the positioning post 6 depend on the actual structural requirements, such as a cylindrical shape, and the length of the cylinder is not greater than the thickness of the substrate. It should be noted that the shape of the positioning post is merely an example, and is not used to define the shape of the positioning post, for example, the shape of the cubic column, the special shape, and the like; The material is not limited to the same material as the lead carrier, such as a metal harpoon lock.

 Positioning holes 6 on the corresponding pin structures 3 on the substrate 1 are respectively provided with at least three positioning holes on the same horizontal line, wherein the openings at the two ends of the substrate corresponding to the positions of the positioning posts are positioned at corresponding ends The positioning hole 7 of the column and the opening corresponding to the position of the positioning column in the middle are positioning holes 8 corresponding to the intermediate positioning column.

 The positioning hole 7 corresponding to the positioning posts of the two ends may be a circular hole or a waist hole, etc.; the positioning hole 8 corresponding to the intermediate positioning column is a waist hole, and cooperates with two positioning posts in the middle of the double-sided pin structure 3, The waist hole is in a horizontal direction parallel to the bottom end of the substrate 1. It should be noted that the shape of the positioning hole is merely an example, and is not used to define the shape of the positioning hole. For example, it may be a quadrilateral such as a rectangle, a square, a profiled shape, or the like.

 It should be noted that the positions of the positioning post and the positioning hole are not limited to the positions shown in FIG. 3, as long as the positioning holes are located on the same horizontal line, the substrate and the motherboard can be stably assembled, and how many positioning columns and positioning are set. It is another technical problem in the art to determine the position of the hole and the position to stabilize the substrate and the mother board, and is not related to the present invention, and therefore will not be described in detail herein.

 4 is a schematic view of an embodiment of assembly of a module of the present invention. Based on the vertical double-row surface mount module structure shown in FIG. 3, as shown in FIG. 4, the metal pin adopts a surface mount design, and a plurality of pins are Plastically sealed together, the injection mold is manufactured into a lead plastic body and assembled as a whole onto the module substrate. The lead plastic sealing material is an insulating, high temperature resistant, antistatic material. The bottoms of all pins 4 are on the same plane to ensure the quality of the electrical and mechanical connections when assembled to the motherboard substrate. If the surface-mount pins on both sides of the substrate are the same, it is only necessary to open the mold once. The boss 5 in the middle portion of the lead molding body can be used for the patch at the time of assembly, and the size of the suction surface 10 satisfies the pick-up requirement of the placement machine. A card cap 9 for secondary assembly of the patch is mounted on the top of the substrate.

 The assembly of the vertical double-row surface mount module includes one assembly and two assembly.

One assembly is equivalent to the assembly process of a general circuit component, that is, all components, surface mount pins, and card caps on the assembled module. FIG. 5 is a front view of a module embodiment of the present invention assembled once. The method of assembling once is: mounting the device on the one side of the module substrate while mounting the pin structure, and the positioning post on the lead plastic body is inserted into the positioning hole at the corresponding position on the module substrate, and the length of the positioning column is not greater than the thickness of the substrate, The solder printing process on the other side is ensured; likewise, when the device is mounted on the other side of the module substrate, the positioning post on the lead plastic body is inserted into the remaining two positioning holes of the substrate to complete the positioning, and then reflow soldering is performed to complete the assembly. .

 In the secondary assembly, the module is assembled to the motherboard through the surface mount pin structure on the module, and the secondary assembly can be performed by machine mounting and reflow soldering.

 6a-6b are schematic views of the assembly of the positioning post at the A section of Fig. 5, and Figs. 6a-6b clearly show the assembly between the positioning post located in the middle of the lead structure 3 and the positioning hole 8 of the corresponding intermediate positioning post. 6c-6d is a schematic view of the assembly of the positioning post at the B section of FIG. 5, and FIGS. 6c-6d clearly show the positioning post located at both ends of the lead structure 3 and the positioning holes 7 of the corresponding two positioning posts. The assembly between the two is indicated.

 The pin shape of the connection portion between the module and the motherboard may be a wing shape, an inverted F shape, a J shape, or the like, but is not limited to these three shapes. 7a-7d are schematic views of an example of a pin shape of the present invention, FIG. 7a is a perspective view of a wing pin, FIG. 7b is a schematic view of a wing pin, FIG. 7c is a schematic view of an inverted F pin, and FIG. 7d is a J pin. schematic diagram. 7a-7d are only examples. The shape and size of the individual pins of the module of the present invention are not limited to the above four shapes, and the size, the spacing, etc. are mainly related to the module substrate size, the component layout on the module substrate, and the number of I/O ports. related.

 The pins of the module of the present invention are independent of each other, and the pin structures on both sides of the substrate 1 are independent of each other and can be connected to different I/O ports.

 It should be noted that if the component layout on both sides of the module substrate and the number of I/O ports have special requirements or are affected by other factors, the pin structures on both sides of the module substrate may be different, and other designs of the module still adopt the present invention. structure.

For the pin structure of one side of the module substrate, the positioning post structure on the module is as shown in FIG. 3, that is, the length of the positioning post is not greater than the thickness of the substrate to ensure the tin printing process on the other side. For the pin structure mounted on the other side of the module substrate, FIG. 8 is a lead structure in a module embodiment of the present invention. A schematic diagram of an embodiment of the positioning post structure, on which the positioning post 91 (either or both) can be inserted through the module substrate and inserted into the positioning hole 92 of the opposite pin molding body to perform mutual positioning of the pin structures. The positioning holes at all positions on the module substrate are on the same horizontal line. 9a-9b are schematic views showing the assembly of the positioning post at the B section of Fig. 5 when the positioning post structure shown in Fig. 8 is used, and Figs. 9a-9b clearly show that the positioning post at both ends of the lead structure 3 passes through. The assembly of the module substrate is inserted into the positioning hole of the opposite pin plastic body.

 For the structure of the positioning hole, another form can be adopted. As shown in FIG. 10, FIG. 10 shows that the middle one of the waist holes shown in FIG. 3 is changed to two circular holes 108. The spacing between the two circular holes 108 is not particularly required, as long as the two circular holes are located on the same horizontal line. Further, the center line of the substrate may be symmetrical; or other shapes such as a waist shape may be used to position the holes. Correspondingly, the original circular holes at both ends are changed to waist-shaped holes, which are redundant for the insertion of the positioning posts, avoiding interference between the positioning holes and the positioning posts.

 Further, when more than two positioning posts are used for the pin structure, more than three positioning holes may be positioned on the substrate.

 In addition, the structure of all the modules of the present invention is equally applicable to the double-row pin vertical module shown in Fig. 11, and the pin 111 in the figure is a double-row pin.

 The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modifications, equivalents, improvements, etc., which are made within the spirit and principles of the present invention, should be included. It is within the scope of the invention.

Claims

Rights request A module, disposed on a motherboard, wherein the module comprises a substrate and a pin structure; wherein the pin structure comprises a pin and a pin carrier; the pins are mounted independently of each other The pin carrier is at least two, which are respectively disposed on two sides of the substrate for connecting the mother board and the substrate;  The pin carrier is provided with at least two positioning posts, and the positioning hole corresponding to the positioning post disposed on the pin structure is disposed on the substrate, and the positioning holes on the substrate are located on the same straight line; A positioning post on the pin carrier is assembled with the substrate through the positioning hole.  2. The module according to claim 1, wherein the lead structure is further provided with a boss for a patch for one assembly, and the positioning post is disposed on the boss.  3. The module according to claim 2, wherein the pin structure is two; each of the positioning posts on the pin structure is two, and one of the positioning posts is disposed on the pin structure. On one of the two ends of the boss, the other positioning post is disposed on the boss in the middle of the pin structure;  The positioning post of the intermediate position is offset from the midpoint position of the pin structure.  The module according to claim 1 or 3, wherein the length of the positioning post of the pin structure is not greater than the thickness of the substrate.  The module according to claim 1 or 3, wherein the positioning holes on the substrate are three, wherein the two positioning holes are respectively disposed at positions of the positioning posts corresponding to the two ends of the substrate, and the third positioning The hole is placed in the middle corresponding to the position of the positioning post.  The module according to claim 5, wherein the positioning hole located in the middle is a waist hole, and the waist hole is in a horizontal direction parallel to the bottom end of the substrate.  7. The module of claim 1 wherein the pins are surface-mount metal pins. 8. The module of claim 1 wherein the pin is shaped as a wing Shape or inverted F or J shape.  The module according to claim 2, wherein the pin structure is two; wherein, the positioning posts on the first pin structure are two, and one positioning post is disposed on the pin structure On one of the bosses of the one end, the other positioning post is disposed on the boss in the middle of the pin structure and is at a midpoint of the side pin structure;  The second pin structure is identical to the first pin structure;  Or the length of the positioning post of the second pin structure is longer than the length of the positioning post of the first pin structure, and the positioning post of the second pin structure passes through the substrate, and then inserts into the corresponding positioning hole of the first pin structure. in.  The module according to claim 9, wherein the positioning holes on the substrate are three or more, wherein the two positioning holes are respectively disposed at positions corresponding to the positioning posts at both ends of the substrate, and the remaining The positioning hole is disposed at a position corresponding to the positioning post in the middle;  11. An electronic component, comprising: a module and a motherboard;  The module includes a substrate and a pin structure;  Wherein, the pin structure comprises a pin and a pin carrier; each pin is mounted on the pin carrier independently of each other; the pin structure is at least two, respectively disposed on both sides of the substrate, for connecting the substrate With the mother board;  The lead carrier is provided with at least two positioning posts, and the positioning hole corresponding to the positioning post disposed on the lead structure is disposed on the substrate, and the positioning holes on the substrate are located on the same straight line; The positioning post on the foot carrier is assembled with the substrate through the positioning hole.  The electronic component according to claim 11, wherein the positioning holes on the substrate are three, wherein the two positioning holes are respectively disposed at positions of the positioning posts corresponding to the two ends of the substrate, and the third positioning holes Set the position corresponding to the positioning post in the middle.  The electronic component according to claim 12, wherein the positioning holes at both ends of the substrate are circular or waist-shaped, and the hole width is the same as the diameter of the positioning post; The positioning hole located in the middle is a waist hole, and the waist hole is water parallel to the bottom end of the substrate Flat direction.  The electronic component according to claim 11, wherein the pin structure is two;  Wherein, the positioning pillars on the first pin structure are two, one of the positioning pillars is disposed on the boss of one end of the pin structure, and the other positioning pillar is disposed on the boss of the middle of the pin structure and The midpoint position of the side-biased pin structure;  The second pin structure is identical to the first pin structure; Or the length of the positioning post of the second pin structure is longer than the length of the positioning post of the first pin structure, and the positioning post of the second pin structure passes through the substrate, and then inserts into the corresponding positioning hole of the first pin structure. in. 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