WO2008133209A1 - 導電性接触子および導電性接触子ユニット - Google Patents
導電性接触子および導電性接触子ユニット Download PDFInfo
- Publication number
- WO2008133209A1 WO2008133209A1 PCT/JP2008/057615 JP2008057615W WO2008133209A1 WO 2008133209 A1 WO2008133209 A1 WO 2008133209A1 JP 2008057615 W JP2008057615 W JP 2008057615W WO 2008133209 A1 WO2008133209 A1 WO 2008133209A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- plunger
- conductive contact
- end portion
- leading end
- longitudinal direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
Abstract
細径化に起因する許容電流の低下を抑制することが可能な導電性接触子および導電性接触子ユニットを提供する。この目的のため、略針状の導電性材料からなる第1プランジャと、略針状の導電性材料からなり、先端部が第1プランジャの先端部と相反する方向を指向する第2プランジャと、導電性材料からなり、一端が第1プランジャに取り付けられるとともに他端が第2プランジャに取り付けられ、長手方向に伸縮自在な弾性部材と、を備え、第1プランジャの先端部の長手方向の中心軸と第2プランジャの先端部の長手方向の中心軸は異なりかつ互いに平行であるとする。
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009511860A JP5361710B2 (ja) | 2007-04-19 | 2008-04-18 | 導電性接触子および導電性接触子ユニット |
| TW097114449A TWI383153B (zh) | 2007-04-19 | 2008-04-21 | 導電性觸頭及導電性觸頭單元 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-110942 | 2007-04-19 | ||
| JP2007110942 | 2007-04-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2008133209A1 true WO2008133209A1 (ja) | 2008-11-06 |
Family
ID=39925663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2008/057615 Ceased WO2008133209A1 (ja) | 2007-04-19 | 2008-04-18 | 導電性接触子および導電性接触子ユニット |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5361710B2 (ja) |
| TW (1) | TWI383153B (ja) |
| WO (1) | WO2008133209A1 (ja) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011048890A1 (ja) * | 2009-10-23 | 2011-04-28 | 株式会社ヨコオ | コンタクトプローブ及びソケット |
| WO2014017157A1 (ja) * | 2012-07-23 | 2014-01-30 | 山一電機株式会社 | コンタクトプローブ及びそれを備えた半導体素子用ソケット |
| KR20160096968A (ko) * | 2015-02-06 | 2016-08-17 | 리노공업주식회사 | 검사장치용 프로브 |
| JP2017146119A (ja) * | 2016-02-15 | 2017-08-24 | オムロン株式会社 | プローブピンおよびこれを用いた検査装置 |
| KR102162476B1 (ko) * | 2019-07-18 | 2020-10-06 | 박상량 | 단일 몸체의 하우징으로 구성되는 고성능 반도체 테스트 소켓 |
| WO2023181906A1 (ja) * | 2022-03-25 | 2023-09-28 | 株式会社ヨコオ | スプリングコネクタ |
| WO2023228844A1 (ja) * | 2022-05-26 | 2023-11-30 | 株式会社ヨコオ | プローブ |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180060565A (ko) * | 2016-11-29 | 2018-06-07 | 주식회사 파인디앤씨 | 계측용 프로브핀 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06201725A (ja) * | 1992-11-09 | 1994-07-22 | Nhk Spring Co Ltd | 導電性接触子及び導電性接触子ユニット |
| JPH0743419A (ja) * | 1993-06-29 | 1995-02-14 | Matsushita Electric Ind Co Ltd | プリント配線板検査治具 |
| JPH095356A (ja) * | 1995-06-23 | 1997-01-10 | Matsushita Electric Ind Co Ltd | 電子部品の検査装置 |
| JP2000028638A (ja) * | 1998-07-10 | 2000-01-28 | Nhk Spring Co Ltd | 導電性接触子 |
| JP2002350487A (ja) * | 2001-03-19 | 2002-12-04 | Inoue Shoji Kk | プリント配線板の検査治具 |
| JP2003021658A (ja) * | 2001-07-06 | 2003-01-24 | Murata Mfg Co Ltd | 電子部品の電気特性検査装置 |
| JP2006170633A (ja) * | 2004-12-13 | 2006-06-29 | Inoue Shoji Kk | プリント配線板の検査治具 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6685492B2 (en) * | 2001-12-27 | 2004-02-03 | Rika Electronics International, Inc. | Sockets for testing electronic packages having contact probes with contact tips easily maintainable in optimum operational condition |
| JP4614434B2 (ja) * | 2004-09-30 | 2011-01-19 | 株式会社ヨコオ | プローブ |
| JP4757531B2 (ja) * | 2005-04-28 | 2011-08-24 | 日本発條株式会社 | 導電性接触子ホルダおよび導電性接触子ユニット |
-
2008
- 2008-04-18 WO PCT/JP2008/057615 patent/WO2008133209A1/ja not_active Ceased
- 2008-04-18 JP JP2009511860A patent/JP5361710B2/ja not_active Expired - Fee Related
- 2008-04-21 TW TW097114449A patent/TWI383153B/zh not_active IP Right Cessation
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06201725A (ja) * | 1992-11-09 | 1994-07-22 | Nhk Spring Co Ltd | 導電性接触子及び導電性接触子ユニット |
| JPH0743419A (ja) * | 1993-06-29 | 1995-02-14 | Matsushita Electric Ind Co Ltd | プリント配線板検査治具 |
| JPH095356A (ja) * | 1995-06-23 | 1997-01-10 | Matsushita Electric Ind Co Ltd | 電子部品の検査装置 |
| JP2000028638A (ja) * | 1998-07-10 | 2000-01-28 | Nhk Spring Co Ltd | 導電性接触子 |
| JP2002350487A (ja) * | 2001-03-19 | 2002-12-04 | Inoue Shoji Kk | プリント配線板の検査治具 |
| JP2003021658A (ja) * | 2001-07-06 | 2003-01-24 | Murata Mfg Co Ltd | 電子部品の電気特性検査装置 |
| JP2006170633A (ja) * | 2004-12-13 | 2006-06-29 | Inoue Shoji Kk | プリント配線板の検査治具 |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011048890A1 (ja) * | 2009-10-23 | 2011-04-28 | 株式会社ヨコオ | コンタクトプローブ及びソケット |
| JP2011089930A (ja) * | 2009-10-23 | 2011-05-06 | Yokowo Co Ltd | コンタクトプローブ及びソケット |
| WO2014017157A1 (ja) * | 2012-07-23 | 2014-01-30 | 山一電機株式会社 | コンタクトプローブ及びそれを備えた半導体素子用ソケット |
| JP2014021054A (ja) * | 2012-07-23 | 2014-02-03 | Yamaichi Electronics Co Ltd | コンタクトプローブ及びそれを備えた半導体素子用ソケット |
| US9684031B2 (en) | 2012-07-23 | 2017-06-20 | Yamaichi Electronics Co., Ltd. | Contact probe and semiconductor element socket provided with same |
| KR20160096968A (ko) * | 2015-02-06 | 2016-08-17 | 리노공업주식회사 | 검사장치용 프로브 |
| KR101704710B1 (ko) | 2015-02-06 | 2017-02-08 | 리노공업주식회사 | 검사장치용 프로브 |
| JP2017146119A (ja) * | 2016-02-15 | 2017-08-24 | オムロン株式会社 | プローブピンおよびこれを用いた検査装置 |
| WO2017141564A1 (ja) * | 2016-02-15 | 2017-08-24 | オムロン株式会社 | プローブピンおよびこれを用いた検査装置 |
| KR102162476B1 (ko) * | 2019-07-18 | 2020-10-06 | 박상량 | 단일 몸체의 하우징으로 구성되는 고성능 반도체 테스트 소켓 |
| WO2023181906A1 (ja) * | 2022-03-25 | 2023-09-28 | 株式会社ヨコオ | スプリングコネクタ |
| WO2023228844A1 (ja) * | 2022-05-26 | 2023-11-30 | 株式会社ヨコオ | プローブ |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200902983A (en) | 2009-01-16 |
| TWI383153B (zh) | 2013-01-21 |
| JPWO2008133209A1 (ja) | 2010-07-22 |
| JP5361710B2 (ja) | 2013-12-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
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| ENP | Entry into the national phase |
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| NENP | Non-entry into the national phase |
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| 122 | Ep: pct application non-entry in european phase |
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