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WO2008132933A1 - 導電性微粒子、異方性導電材料、及び、導電接続構造体 - Google Patents

導電性微粒子、異方性導電材料、及び、導電接続構造体 Download PDF

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Publication number
WO2008132933A1
WO2008132933A1 PCT/JP2008/056401 JP2008056401W WO2008132933A1 WO 2008132933 A1 WO2008132933 A1 WO 2008132933A1 JP 2008056401 W JP2008056401 W JP 2008056401W WO 2008132933 A1 WO2008132933 A1 WO 2008132933A1
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WO
WIPO (PCT)
Prior art keywords
electroconductive
fine particles
soldering layer
connection structure
anisotropic
Prior art date
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Ceased
Application number
PCT/JP2008/056401
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English (en)
French (fr)
Inventor
Ren-De Sun
Kiyoto Matsushita
Taku Sasaki
Shinya Uenoyama
Masaki Okuda
Nobuyuki Okinaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
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Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to EP08739514.1A priority Critical patent/EP2139009B1/en
Priority to US12/450,704 priority patent/US8609246B2/en
Publication of WO2008132933A1 publication Critical patent/WO2008132933A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/18—Non-metallic particles coated with metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/619—Amorphous layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/08—Metallic powder characterised by particles having an amorphous microstructure
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1689—After-treatment
    • C23C18/1692—Heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating
    • H10W72/01212—
    • H10W72/072—
    • H10W72/07236—
    • H10W72/07251—
    • H10W72/074—
    • H10W72/20—
    • H10W72/251—
    • H10W72/325—
    • H10W72/352—
    • H10W72/354—
    • H10W72/355—
    • H10W74/00—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)

Abstract

本発明は、微細な電極間の導電接続に用いられ、落下等による衝撃が加わってもハンダ層の亀裂や、電極と該導電性微粒子との接続界面の破壊による断線が生じにくく、加熱と冷却とを繰返し受けても疲労しにくい導電性微粒子、該導電性微粒子を用いてなる異方性導電材料、及び、導電接続構造体を提供することを目的とする。 本発明は、樹脂微粒子の表面に、錫を含有するハンダ層が形成された導電性微粒子であって、前記ハンダ層の表面にニッケルが付着しており、前記ハンダ層に含有される金属と前記ハンダ層の表面に付着しているニッケルとの合計に占めるニッケルの含有量が０．０００１～５．０重量％である導電性微粒子である。
PCT/JP2008/056401 2007-04-13 2008-03-31 導電性微粒子、異方性導電材料、及び、導電接続構造体 Ceased WO2008132933A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP08739514.1A EP2139009B1 (en) 2007-04-13 2008-03-31 Electroconductive fine particles, anisotropic electroconductive material, and electroconductive connection structure
US12/450,704 US8609246B2 (en) 2007-04-13 2008-03-31 Electroconductive fine particles, anisotropic electroconductive material, and electroconductive connection structure

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2007106320 2007-04-13
JP2007-106319 2007-04-13
JP2007106319 2007-04-13
JP2007-106320 2007-04-13
JP2007-270510 2007-10-17
JP2007270511 2007-10-17
JP2007-270511 2007-10-17
JP2007270510 2007-10-17

Publications (1)

Publication Number Publication Date
WO2008132933A1 true WO2008132933A1 (ja) 2008-11-06

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PCT/JP2008/056401 Ceased WO2008132933A1 (ja) 2007-04-13 2008-03-31 導電性微粒子、異方性導電材料、及び、導電接続構造体

Country Status (2)

Country Link
EP (1) EP2139009B1 (ja)
WO (1) WO2008132933A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010098452A1 (ja) * 2009-02-27 2010-09-02 日本ゼオン株式会社 リチウムイオン二次電池用負極活物質およびリチウムイオン二次電池
WO2011132658A1 (ja) * 2010-04-22 2011-10-27 積水化学工業株式会社 異方性導電材料及び接続構造体
WO2018174066A1 (ja) * 2017-03-23 2018-09-27 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
CN114599818A (zh) * 2019-09-12 2022-06-07 利夫考工业公司 用于电路板组装的表面金属化并整粒的复合焊料球

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6587099B2 (ja) * 2015-12-15 2019-10-09 三菱マテリアル株式会社 ハンダ粉末及びその製造方法並びにこの粉末を用いたハンダ用ペーストの調製方法

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JPH09198916A (ja) * 1995-11-16 1997-07-31 Sekisui Finechem Co Ltd 導電性微粒子
JP2001220691A (ja) 2000-02-03 2001-08-14 Okuno Chem Ind Co Ltd 導電性微粒子
WO2002013205A1 (en) * 2000-08-04 2002-02-14 Sekisui Chemical Co., Ltd. Conductive fine particles, method for plating fine particles, and substrate structural body
JP2003068145A (ja) * 2001-08-23 2003-03-07 Sekisui Chem Co Ltd 導電性微粒子及び導電接続構造体
JP2004273401A (ja) * 2003-03-12 2004-09-30 Matsushita Electric Ind Co Ltd 電極接続部材、それを用いた回路モジュールおよびその製造方法
JP2007123100A (ja) * 2005-10-28 2007-05-17 Sony Corp 負極材料およびそれを用いた電池、並びに電池の製造方法

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US3573008A (en) * 1968-05-02 1971-03-30 Hudson Wire Co Composite metal article of copper material with a coat of nickel and tin
EP0985486B1 (en) * 1998-03-26 2004-07-21 Nihon Superior Sha Co., Ltd Leadless solder
EP1329911A4 (en) * 2000-08-04 2006-11-08 Sekisui Chemical Co Ltd CONDUCTIVE FINE PARTICLES, METHOD FOR GALVANIZING FINE PARTICLES AND SUBSTRATE STRUCTURAL BODIES

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JPH09198916A (ja) * 1995-11-16 1997-07-31 Sekisui Finechem Co Ltd 導電性微粒子
JP2001220691A (ja) 2000-02-03 2001-08-14 Okuno Chem Ind Co Ltd 導電性微粒子
WO2002013205A1 (en) * 2000-08-04 2002-02-14 Sekisui Chemical Co., Ltd. Conductive fine particles, method for plating fine particles, and substrate structural body
JP2003068145A (ja) * 2001-08-23 2003-03-07 Sekisui Chem Co Ltd 導電性微粒子及び導電接続構造体
JP2004273401A (ja) * 2003-03-12 2004-09-30 Matsushita Electric Ind Co Ltd 電極接続部材、それを用いた回路モジュールおよびその製造方法
JP2007123100A (ja) * 2005-10-28 2007-05-17 Sony Corp 負極材料およびそれを用いた電池、並びに電池の製造方法

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* Cited by examiner, † Cited by third party
Title
See also references of EP2139009A4

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010098452A1 (ja) * 2009-02-27 2010-09-02 日本ゼオン株式会社 リチウムイオン二次電池用負極活物質およびリチウムイオン二次電池
CN102334218A (zh) * 2009-02-27 2012-01-25 日本瑞翁株式会社 锂离子二次电池用负极活性物质及锂离子二次电池
US9159992B2 (en) 2009-02-27 2015-10-13 Zeon Corporation Negative electrode active material for lithium ion secondary battery and lithium ion secondary battery
CN102334218B (zh) * 2009-02-27 2016-01-20 日本瑞翁株式会社 锂离子二次电池用负极活性物质及锂离子二次电池
WO2011132658A1 (ja) * 2010-04-22 2011-10-27 積水化学工業株式会社 異方性導電材料及び接続構造体
JP2012190804A (ja) * 2010-04-22 2012-10-04 Sekisui Chem Co Ltd 異方性導電材料及び接続構造体
JP2012195294A (ja) * 2010-04-22 2012-10-11 Sekisui Chem Co Ltd 異方性導電材料及び接続構造体
JPWO2011132658A1 (ja) * 2010-04-22 2013-07-18 積水化学工業株式会社 異方性導電材料及び接続構造体
WO2018174066A1 (ja) * 2017-03-23 2018-09-27 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
CN114599818A (zh) * 2019-09-12 2022-06-07 利夫考工业公司 用于电路板组装的表面金属化并整粒的复合焊料球

Also Published As

Publication number Publication date
EP2139009B1 (en) 2013-06-26
EP2139009A4 (en) 2012-01-04
EP2139009A1 (en) 2009-12-30

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