WO2008130958A1 - Thermally-conductive compositions - Google Patents
Thermally-conductive compositions Download PDFInfo
- Publication number
- WO2008130958A1 WO2008130958A1 PCT/US2008/060408 US2008060408W WO2008130958A1 WO 2008130958 A1 WO2008130958 A1 WO 2008130958A1 US 2008060408 W US2008060408 W US 2008060408W WO 2008130958 A1 WO2008130958 A1 WO 2008130958A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- thermally conductive
- packaged composition
- packaged
- package
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/08—Ingredients agglomerated by treatment with a binding agent
Definitions
- the present invention relates to the delivery of a thermally conductive composition in a package, hereinafter a "packaged thermally conductive composition” or a “thermally conductive package” or a “package "
- the package is particularly well suited for use in an electronic device to remove heat
- Thermal interface materials are used to improve the heat flux between hot devices/substrates/components and cold sinks/spreaders.
- the materials may be in various forms such as films, sheets, gels, pads, adhesives, greases and phase change materials
- These thermal interface materials consist primarily of thermosetting silicone elastomer and thermally-conductive filler material
- thermal management activity has been focused on increasing the filler loading and/or aligning filler particles to achieve a least resistance path for phonon transport
- increasing the particle loading sacrifices performance characteristics (e g adhesion, flexibility) and/or appiication/process requirements (e.g paste viscosity, handling characteristics of film materials).
- Boron nitride has been used as thermally conductive filler, however it is anisotropic and difficult to disperse in resin matrix, as the typical limit to loading boron nitride in resin system is about 40% by weight.
- aligning filler particles, such as carbon fibers provide a benefit to thermal performance, this method is not electrically insulating.
- thermally conductive fibers must be aligned greater than about 45° angle in order to be compressible in between substrates The use of aligned fillers for thermal management is relatively high in cost
- This invention is a packaged thermally conductive composition the package having discrete units of thermally conductive structures surrounded by adhesive unit The thermally conductive structure extends in a continuous manner from one end of the package face to the other face
- the packaged thermally conductive composition is adhesively attached to a heat source and a heat sink
- the thermally conductive structures are substantially perpendicular to the heat source and the heat sink
- thermally conductive structures of the package may be in various shapes
- the packaged thermally conductive composition may be in the form of a non-tacky film or a pressure sensitive film with liners
- thermally conductive structures comprise at least 65% fillers by volume of the composition and the adhesive units are substantially filler-free
- the thermally conductive structure comprises boron nitride particles
- the thermally conducive structure comprises metal alloys
- the thermally conductive structure further comprises UV transparent fillers
- the packaged thermally conductive composition has a thermal conductivity of at least 2.0 W/mK.
- Another embodiment is directed to a method of making or forming the packaged thermally conductive composition
- These methods comprise forming an adhesive unit, removing a portion of the adhesive to create a section, placing a thermally conductive structure into the section and heating to form a uniform layer of a package.
- Still another embodiment is directed to a process of sealing and/or making or forming electronic devices and electronic components. These processes comprise using the packaged thermally conductive composition of the invention on electronic devices
- Fig 1 is a schematic top view, one face of a packaged thermally conductive composition
- Fig 2 is a schematic three dimensional side view of a packaged thermally conductive composition
- Fig 3 is a schematic cross sectional view of a packaged thermally conductive composition piaced between a heat sink and a heat source
- the invention relates to a packaged thermally conductive composition, in particular the design of a thermally conductive composition package
- the invention is particularly useful for providing high thermal properties with good application characteristics
- thermally conductive composition ' and “thermally conducive composition package” are herein is defined as containing at least one thermally conductive structure surrounded by an adhesive unit
- thermally conductive structure is herein defined as a column-like structure that extends continuously from one end of the package face to the other face
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides the art with a packaged thermally conductive composition, the package having discrete units of thermally conductive structures surrounded by adhesive unit. The thermally conductive structure extends in a continuous manner from one end of the package face to the other face. The packaged thermally conductive composition provides high thermal properties with good application characteristics at low cost.
Description
THERMALLY-CONDUCTIVE COMPOSITIONS
The present application claims the benefit to U. S Provisional Application No. 60/912,236 filed April 17, 2007, which is incorporated by reference herein in its entirety.
FIELD OF INVENTION
The present invention relates to the delivery of a thermally conductive composition in a package, hereinafter a "packaged thermally conductive composition" or a "thermally conductive package" or a "package " The package is particularly well suited for use in an electronic device to remove heat
BACKGROUND OF INVENTION
Thermal management is important in electronic devices The development of highly sophisticated and small electronic device generates extreme temperatures. Heat generated in a sealed electronic device can potentially damage components inside the device, decrease the life expectancy of the device, or cause harm to the user.
One method to dissipate heat in an electronic device is through the use of thermal interface materials. Thermal interface materials are used to improve the heat flux between hot devices/substrates/components and cold sinks/spreaders. The materials may be in various forms such as films, sheets, gels, pads, adhesives, greases and phase change materials These thermal interface materials consist primarily of thermosetting silicone elastomer and thermally-conductive filler material
Much of the thermal management activity has been focused on increasing the filler loading and/or aligning filler particles to achieve a least resistance path for phonon transport However, increasing the particle loading sacrifices performance characteristics (e g adhesion, flexibility) and/or appiication/process requirements (e.g paste viscosity, handling characteristics of film materials). Boron nitride has been used as thermally conductive filler, however it is anisotropic and difficult to disperse in resin matrix, as the typical limit to loading boron nitride in resin system is about 40% by weight. While aligning filler particles, such as carbon fibers, provide a benefit to thermal performance, this method is not electrically insulating. In one proposed thermal management
method (US 5,695 847 and US 5 849 130) thermally conductive fibers must be aligned greater than about 45° angle in order to be compressible in between substrates The use of aligned fillers for thermal management is relatively high in cost
Other thermal management activity has been focused on arranging boron nitride particles in a columnar arrangement cured in silicone matrix (JP 2000108220) However such arrangements include free passage holes or pores in the matrix Such free passage holes or pores in the matrix can trap moisture and initiate cracks and failures and hence decrease thermal reliability during thermo-cycling conditions It is also cost prohibitive in some applications
There continues to be a need in the art for an improved design for packaging a thermally- conductive composition that provides high thermal properties with good application characteristics, and is low in cost The current invention addresses this need
SUMMARY OF INVENTION
This invention is a packaged thermally conductive composition the package having discrete units of thermally conductive structures surrounded by adhesive unit The thermally conductive structure extends in a continuous manner from one end of the package face to the other face
In another embodiment of the invention, the packaged thermally conductive composition is adhesively attached to a heat source and a heat sink The thermally conductive structures are substantially perpendicular to the heat source and the heat sink
In a further embodiment, the thermally conductive structures of the package may be in various shapes
Yet in another embodiment, the packaged thermally conductive composition may be in the form of a non-tacky film or a pressure sensitive film with liners
Further embodiment of the invention is directed a packaged thermally conductive composition wherein the thermally conductive structures comprise at least 65% fillers by volume of the composition and the adhesive units are substantially filler-free
In another embodiment of the invention the thermally conductive structure comprises boron nitride particles In a further embodiment of the invention, the thermally conducive structure comprises metal alloys Yet in another embodiment, the thermally conductive structure further comprises UV transparent fillers
In another embodiment of the invention, the packaged thermally conductive composition has a thermal conductivity of at least 2.0 W/mK.
Another embodiment is directed to a method of making or forming the packaged thermally conductive composition These methods comprise forming an adhesive unit, removing a portion of the adhesive to create a section, placing a thermally conductive structure into the section and heating to form a uniform layer of a package.
Another embodiment provides articles manufactured using the packaged thermally conductive composition of the invention Encompassed articles include computers and computer equipment, household appliances, sensors, personal electronic devices, LED devices, defense/aerospace devices and the like
Still another embodiment is directed to a process of sealing and/or making or forming electronic devices and electronic components. These processes comprise using the packaged thermally conductive composition of the invention on electronic devices
BRIEF DESCRIPTION OF THE DRAWING FIGURES
Fig 1 is a schematic top view, one face of a packaged thermally conductive composition Fig 2 is a schematic three dimensional side view of a packaged thermally conductive composition
Fig 3 is a schematic cross sectional view of a packaged thermally conductive composition piaced between a heat sink and a heat source
DETAILED DESCRIPTION OF INVENTION
The invention relates to a packaged thermally conductive composition, in particular the design of a thermally conductive composition package The invention is particularly useful for providing high thermal properties with good application characteristics
The terms "packaged thermally conductive composition ' and "thermally conducive composition package" are herein is defined as containing at least one thermally conductive structure surrounded by an adhesive unit
The term "thermally conductive structure" is herein defined as a column-like structure that extends continuously from one end of the package face to the other face
The term "thermally conductive composition" is herein defined as materials that make up the thermally conductive structure to provide high thermal properties
The term "adhesive unit" is herein defined an adhesive material that surrounds the thermally conductive structure and can be activated to bond onto substrates
The term 'substrates" is herein defined as heat generating surface or heat dissipating surface, such as a microprocessor chip, semiconductor devices/component or cold sink/spreader
The invention described herein provides the art with an alternative packaging design or packaged thermally conductive composition, which can be used to provide high thermal properties with good application characteristics at low cost
Reference will now be made in detail to the design of the thermally conductive composition package according to embodiments consistent with the present invention
Figure 1 illustrates one face of a packaged thermally conductive composition according to an embodiment consistent with the present invention
Referring to Figures 1 and 2, the packaged thermally conductive composition includes an adhesive unit 1 and thermally conductive structure 2 The thermally conductive structure has length x and width y The height of the thermally conductive structure, z, extends continuously from one end of the package face to the other end
Figure 3 is a cross sectional view illustrating the packaged thermally conductive composition attached onto substrates
Referring to Figure 3, the packaged thermally conductive composition 3 contains thermally conductive structures 2 extending from first substrate 4 to a second substrate 5 in a continuous manner that is substantially perpendicular to the substrates Substantially perpendicular denotes that the thermally conductive structure is normal to the substrates, and the angle between the thermally conductive structure to the substrate can range between from about 80° to about 100° The adhesive unit 1 surrounds the thermally conductive structures 2 The faces of the package are attached to the substrates 4 and 5
The package height z, from one end to the other, is from about 30 microns to about 300 microns The length x, width y or diameter (if the x and y are equivalent) of the thermally conductive
structure is from about 3 microns to about 3 millimeters The package length and width may be formed to any size, greater than 3 microns, to fit the substrate.
In one embodiment, the packaged composition is a non-tacky adhesive film. In another embodiment, the packaged composition is a pressure sensitive adhesive with liners. The package can later be activated by heat, radiation or pressure to be adhered onto a substrate,
The shape of the package may be a cylinder, cube, rectangular prism, and the like Various shapes are envisioned to best fit the substrates for which they are intended
In another embodiment, the thermally conductive structures may be in variety of shapes, such as cylinders, cubes, polyhedrons, or prisms, (e.g rectangular prism, pentagonal prism, hexagonal prism, octagonal prism) and the like, and are denominated "columns" herein The thermally conductive structures are three-dimensional structure that extend continuously from one face to the other, that is substantially normal (perpendicular) to the face of the package The two faces need not be congruent, so long as each of the thermally conductive structures extends in a continuous manner from one end of the package face to the other face The structures are continuous in the z-direction from one face of the package to the other face. Any polygon shape may be used as the shape of the face, including squares, circles, ovals, rectangles, diamonds, stars, and the like
The thermally conductive composition comprises at least 65% of thermally conductive particles, based on volume The thermally conductive composition may further comprise resin, air, solvent, antioxidants, plasticizers, stabilizers, dispersing agents, defoamers, rheology modifiers, coloring agents, tackifiers, corrosion inhibitor, hardeners and the like.
Non-limiting examples of the thermally conductive particles include boron oxide, aluminum, silver, copper, magnesium, brass, alumina, zinc oxide, carbon graphite, metal alloys and mixtures. Thermally conductive particles also include metal alloys Examples of metal alloys include alloys of aluminum, bismuth, cobalt, copper, gallium, gold, indium, iron, lead, magnesium, mercury, nickel, potassium, silver, titanium, tin, zinc and zirconium The thermally conductive particles have a mean particle si2e from about 1 micron to about 40 microns
The thermally conductive composition may further comprise UV transparent fillers Non- hmiting examples of UV transparent fillers include nano-quartz, non-aluminum trihydroxide, nano- mdium tin oxide and the like. UV transparent fillers may be added up to 60% of based on volume
The adhesive units surround the thermally conductive structures. The adhesive units hold the structure in place and also adhere the package onto the substrates The adhesive units are substantially filler-free, preferably less than 5 weight percent of filler.
The adhesive unit comprises an adhesive resin Non-limiting examples of the resin include pheπoxy-based, epoxy-based, vinyl-based, polyester-based, phenolic-based, acrylic-based, polyimide-based, poiyurethane-based, maleimide-based, urea-based, polycarbonate-based, polyallylsulfoπe-based, ammo-based, cellulosic-based, phenoxy-based, melamine-based, polyacrylate-based, cyanate ester-based resins or mixtures thereof Particularly preferred resins are thermoplastic resin, for instance, phenoxy, polyethyiene, polypropylene, and polystyrene
The adhesive unit may further comprise additives such as solvent, catalyst and/or curing agents Non-limiting examples of solvents include esters, ethers, ketones or alcohols Suitable catalyst and/or curing agents may be utilized to best balance the curing condition and work-life of the adhesive. It should be understood that a wide range of curing agents and cure conditions are possible, and these can be determined by the practitioner for the chosen resin without undue experimentation
The adhesive unit may further comprise other optional components as long as they do not impair the adhesive and flexibility properties of the unit. Such components may include antioxidants, UV transparent fillers, plasticizers, stabilizers, dispersing agents, defoamers, rheology modifiers, coloring agents, tackifiers, corrosion inhibitor, hardeners and the like
Hereinafter, a method of manufacturing a packaged thermally conductive package consistent with the present invention will be described in detail.
The adhesive unit is first formed with a height z, from about 30 microns to about 300 microns. Pre-forms are macie in the adhesive unit and removed. Into the pre-forms, thermally conductive structures, same height as the adhesive unit, are placed. The entire adhesive unit and thermally conductive structures are then heated to fuse them together to produce a thermally conductive composition package The package may also be coated onto a release liner as a pressure sensitive adhesive The package may then be shipped and/or stored
To fit the package onto the substrates, the package is first cut to fit the substrates The package is applied onto a first and/or second substrate The first substrate is then brought together with the second substrate such that the package is located between the first and the second
substrates The package is activated by means of heat, radiation, pressure or combinations thereof. Activating the package triggers the adhesive unit to cure and/or bond the package onto a substrate No additional mechanical fasteners or clamps are necessary to hold the packaged thermally conductive composition in place Hence, a faster throughput is envisioned for attaching the package onto the substrates
The packaged thermally conductive composition may be utilized in various electronic devices to remove heat from the hot devices/substrates/components and transfer them to cold sinks/spreaders Non-limiting examples of the electronic devices include computers and computer equipment, such as LEDs, printers, fax machines, scanners, keyboards and the like; household appliances, medical sensors; automotive sensors and the like, personal electronic devices, such as telephones, mobile phones, calculators, remote controls, cameras, CD-players, DVD-players, GPS navigators and the like, and defense/aerospace devices, such as missiles, satellites, planes, and the like
In a further embodiment, the packaged thermally conductive composition has a thermal conductivity of at least 2 W/mK
The following examples are for purpose of illustration and not intended to limit the scope of the invention in any manner
EXAMPLES
Preparation of a thermally conductive package
Phenoxy resin (PKHS-40, InChem Corp., Rocky Hill, South Carolina) was dissolved in MEK
(methyl ethyl ketone, Aldrich) This was then cast onto a release MYLAR film (DuPont) and dried at
8O0C for 20 minutes to a thickness of 15 mil. Pre-forms were created by die punching circular sections from the film at room temperature
Thermally conductive structures from Denka's FSB300, Japan, were die punched Into the circular pre-forms of the phenoxy resin, the cut-out of highiy filled thermally conductive structures were placed to form a package The package was then heated at 15O0C to fuse together the thermally conductive structures and adhesive unit to form a single film The package was flexible and could be bent by hand without breaking
Evaluation of the package
The prepared film was inserted in between two Vz" aluminum disks with 80 psi spring clamps This was then placed in an oven at 15O0C for five minutes Evaluation with Laser Flash Mscroflash (Netzche) showed that the bond thickness was 0 154 mm (6 mils}, total resistance was 0 55Kcm2/W, and the thermal conductivity was 2 78VWmK The aluminum disks could not be separated by finger force, indicating good adhesion Prophetic Example - Preparation of a prophetic thermally conductive package
Laminate SolderQuik (solder embedded in carrier film) preforms with an adhesive film, such as phenoxy resin film Remove the carrier film of SolderQuik with a solvent such as MEK leaving the solder on the adhesive film Depending upon the desired thickness of the adhesive film, additional lamination steps may be performed This may now be cut to fit substrates to be activated at a later time
Many modifications and variations of this invention can be made without departing from its spirit and scope, as will be apparent to those skilled in the art The specific embodiments described herein are offered by way of example only, and the invention is to be limited oniy by the terms of the appended claims, along with the full scope of equivalents to which such claims are entitled
Claims
1 , A packaged thermally conductive composition, said packaged composition comprising thermally conductive structures surrounded by adhesive units
2 The packaged composition of claim 1 wherein said thermally conductive structures extend from one face to the other face in a continuous manner
3 The packaged composition of claim 1 wherein said thermally conductive structure comprises thermally conductive filler and binder
4 The packaged composition of claim 3 wherein said thermally conductive structure comprise at least 65% fillers by total volume of the structure
5 The packaged composition of claim 4 wherein said thermally conductive filler is selected from the group consisting of metal alloys, boron nitride, aluminum, silver, copper, magnesium, brass, alumina, zinc oxide, carbon graphite and mixtures thereof
6 The packaged composition of claim 5 wherein said thermally conductive filler is boron nitride.
7 The packaged composition of ciaim 4 wherein said metal alloys are selected from the group consisting of alloys of aluminum, bismuth, cobalt, copper, gallium, gold, indium, iron, lead, magnesium, mercury, nickel, potassium, silver, titanium, tin, zinc and zirconium.
8 The packaged composition of claim 3 wherein the thermally conductive structure further comprises UV-transparent fillers.
9. The packaged composition of claim 3 wherein said binder further comprises antioxidants, plastfcizers, stabilizers, dispersing agents, coloring agents, tackifiers, corrosion inhibitors, hardener and combinations thereof
10. The packaged composition of claim 1 wherein the adhesive unit comprises an adhesive resin
1 1. The packaged composition of claim 9 wherein the resin is phenoxy polyethylene, polypropylene, polystyrene or a combination thereof
12. The packaged composition of claim 9 wherein the adhesive unit further comprises catalysts, curing agents and combinations thereof
13 The packaged composition of claim 9 wherein the adhesive unit further comprising antioxidants, plasticizers, stabilizers, dispersing agents, coloring agents, tackifiers, corrosion inhibitors, hardener, UV-transparent fillers and combinations thereof
14 The packaged composition of claim 1 wherein the thermally conductive structures have the shape of cylinders, cubes, polyhedrons, prisms and combinations thereof
15 A method of making the packaged composition of claim 1 comprising
(a) forming a homogenous adhesive unit;
(b) removing a portion of the adhesive unit to create voids;
(c) inserting a thermally conductive structure into the voids, and
(d) heating to fuse the adhesive unit and thermally conductive structure to form a uniform layer of a package.
16 A method of making the packaged composition of claim 15 further comprising applying a release liner to each face of the package.
17 A method of making the packaged composition of claim 1 comprising.
(a) applying a laminate film onto a solder embedded carrier film, and
(b) removing the carrier film, and wherein the thickness of the carrier film is equal to or greater than the thickness of the laminate film
A process for sealing and/or making an electronic device anci/or component, the process comprising
(a) applying the packaged composition of claim 1 onto a first and/or second substrate
(b) bringing said first substrate together with said second substrate such that said pacKage is located between said first substrate and said second substrate, and
(c) activating said packaged composition, whereby the first substrate becomes bonded to the second substrate
The process for sealing and/or making an electronic device and/or component of ctaim 18, wherein activating is selected from the group consisting of heat, radiation, pressure and combinations thereof
An apparatus comprising the packaged composition of claim 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US91223607P | 2007-04-17 | 2007-04-17 | |
| US60/912,236 | 2007-04-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2008130958A1 true WO2008130958A1 (en) | 2008-10-30 |
Family
ID=39875867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US2008/060408 Ceased WO2008130958A1 (en) | 2007-04-17 | 2008-04-16 | Thermally-conductive compositions |
Country Status (2)
| Country | Link |
|---|---|
| TW (1) | TW200845331A (en) |
| WO (1) | WO2008130958A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9234095B2 (en) | 2009-09-16 | 2016-01-12 | Kaneka Corporation | Thermally-conductive organic additive, resin composition, and cured product |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8921507B2 (en) * | 2010-04-19 | 2014-12-30 | Kaneka Corporation | Thermoplastic resin with high thermal conductivity |
| CN104766845B (en) * | 2014-01-07 | 2017-11-14 | 恩特日安 | Heat transfer structure and its manufacture method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5672297A (en) * | 1995-10-27 | 1997-09-30 | The Dow Chemical Company | Conductive composite articles based on expandable and contractible particulate matrices |
| US5853622A (en) * | 1990-02-09 | 1998-12-29 | Ormet Corporation | Transient liquid phase sintering conductive adhesives |
| US6884314B2 (en) * | 1997-02-07 | 2005-04-26 | Henkel Corporation | Conducive, silicone-based compositions with improved initial adhesion reduced microvoiding |
-
2008
- 2008-04-16 WO PCT/US2008/060408 patent/WO2008130958A1/en not_active Ceased
- 2008-04-17 TW TW97113924A patent/TW200845331A/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5853622A (en) * | 1990-02-09 | 1998-12-29 | Ormet Corporation | Transient liquid phase sintering conductive adhesives |
| US5672297A (en) * | 1995-10-27 | 1997-09-30 | The Dow Chemical Company | Conductive composite articles based on expandable and contractible particulate matrices |
| US6884314B2 (en) * | 1997-02-07 | 2005-04-26 | Henkel Corporation | Conducive, silicone-based compositions with improved initial adhesion reduced microvoiding |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9234095B2 (en) | 2009-09-16 | 2016-01-12 | Kaneka Corporation | Thermally-conductive organic additive, resin composition, and cured product |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200845331A (en) | 2008-11-16 |
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