WO2008130537A3 - Micromechanical device with gold alloy contacts and method of manufacture - Google Patents
Micromechanical device with gold alloy contacts and method of manufacture Download PDFInfo
- Publication number
- WO2008130537A3 WO2008130537A3 PCT/US2008/004844 US2008004844W WO2008130537A3 WO 2008130537 A3 WO2008130537 A3 WO 2008130537A3 US 2008004844 W US2008004844 W US 2008004844W WO 2008130537 A3 WO2008130537 A3 WO 2008130537A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- gold alloy
- switch
- gold
- manufacture
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H01H1/023—Composite material having a noble metal as the basic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/04—Co-operating contacts of different material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
- H01H2001/0052—Special contact materials used for MEMS
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
- H01H2001/0078—Switches making use of microelectromechanical systems [MEMS] with parallel movement of the movable contact relative to the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H61/00—Electrothermal relays
- H01H2061/006—Micromechanical thermal relay
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H61/00—Electrothermal relays
- H01H2061/006—Micromechanical thermal relay
- H01H2061/008—Micromechanical actuator with a cold and a hot arm, coupled together at one end
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Micromachines (AREA)
- Manufacture Of Switches (AREA)
- Contacts (AREA)
Abstract
A MEMS switch device is made using a gold alloy as the switch contact material. The increased mechanical hardness of the alloy compared to the pure gold prevents the contacts of the switch from welding together. A scrubbing action which occurs when the switch closes may allow the contact surfaces to come to rest where their surfaces are complementary, thus resulting in higher contact area and low contact resistance, despite the higher sheet resistance of the gold alloy material relative to the pure gold material.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/785,119 | 2007-04-16 | ||
| US11/785,119 US20080250785A1 (en) | 2007-04-16 | 2007-04-16 | Micromechanical device with gold alloy contacts and method of manufacture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2008130537A2 WO2008130537A2 (en) | 2008-10-30 |
| WO2008130537A3 true WO2008130537A3 (en) | 2009-12-30 |
Family
ID=39852475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US2008/004844 Ceased WO2008130537A2 (en) | 2007-04-16 | 2008-04-15 | Micromechanical device with gold alloy contacts and method of manufacture |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20080250785A1 (en) |
| WO (1) | WO2008130537A2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120174572A1 (en) * | 2011-01-10 | 2012-07-12 | Donato Clausi | Method for mechanical and electrical integration of sma wires to microsystems |
| ES2555828B1 (en) * | 2014-07-04 | 2016-10-24 | Bsh Electrodomésticos España, S.A. | Disposition of gas burners, cooking point, and kitchen |
| US12055927B2 (en) | 2021-02-26 | 2024-08-06 | Honeywell International Inc. | Thermal metamaterial for low power MEMS thermal control |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020011758A1 (en) * | 1999-02-26 | 2002-01-31 | Vivek Agrawal | MEMS microactuators located in interior regions of frames having openings therein and methods of operating same |
| US20050236935A1 (en) * | 2004-04-22 | 2005-10-27 | Ngk Insulators, Ltd. | Microswitch and method for manufacturing the same |
| US7086918B2 (en) * | 2002-12-11 | 2006-08-08 | Applied Materials, Inc. | Low temperature process for passivation applications |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7235750B1 (en) * | 2005-01-31 | 2007-06-26 | United States Of America As Represented By The Secretary Of The Air Force | Radio frequency MEMS switch contact metal selection |
| US20080197964A1 (en) * | 2007-02-21 | 2008-08-21 | Simpler Networks Inc. | Mems actuators and switches |
-
2007
- 2007-04-16 US US11/785,119 patent/US20080250785A1/en not_active Abandoned
-
2008
- 2008-04-15 WO PCT/US2008/004844 patent/WO2008130537A2/en not_active Ceased
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020011758A1 (en) * | 1999-02-26 | 2002-01-31 | Vivek Agrawal | MEMS microactuators located in interior regions of frames having openings therein and methods of operating same |
| US7086918B2 (en) * | 2002-12-11 | 2006-08-08 | Applied Materials, Inc. | Low temperature process for passivation applications |
| US20050236935A1 (en) * | 2004-04-22 | 2005-10-27 | Ngk Insulators, Ltd. | Microswitch and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| US20080250785A1 (en) | 2008-10-16 |
| WO2008130537A2 (en) | 2008-10-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2009151826A3 (en) | User interface impact actuator | |
| WO2007010034A3 (en) | Ampholytic copolymer, production thereof, and use of the same | |
| WO2006138457A3 (en) | Isolating chip-to-chip contact | |
| EP1840924A3 (en) | Piezoelectric MEMS switch and method of fabricating the same | |
| WO2006073968A3 (en) | Derivatized 3,4-alkylenedioxythiophene monomers, methods of making them, and use thereof | |
| WO2007130237A3 (en) | Compositions comprising low-dp polymerized surfactants and methods of use thereof | |
| WO2008009268A3 (en) | Vehicle seat structure | |
| WO2007047468A3 (en) | Immunomodulation using placental stem cells | |
| EP1884974A3 (en) | Mems switch and manufacturing method thereof | |
| WO2010012899A3 (en) | Assembly of components connected by a device that maintains the integrity of the surface of one of the components | |
| WO2009084906A3 (en) | The proble pin composed in one body and the method of making it | |
| GB0816363D0 (en) | Detecting contacts during sporting activities etc. | |
| WO2004017351A3 (en) | Buckling beam bi-stable microelectromechanical switch using electro-thermal actuation | |
| WO2007047498A3 (en) | Formation and encapsulation of molecular bilayer and monolayer membranes | |
| WO2008130537A3 (en) | Micromechanical device with gold alloy contacts and method of manufacture | |
| WO2007073554A3 (en) | Block copolymer particles | |
| WO2008101485A3 (en) | Plug pin | |
| WO2007130236A3 (en) | Compositions comprising low-dp polymerized surfactants and methods of use thereof | |
| WO2008033213A3 (en) | Mechanical switch with a curved bilayer | |
| USD531819S1 (en) | Mirror | |
| EP1793403A3 (en) | Mems Switch | |
| GB0614368D0 (en) | Fluid-based switch, and method of making same | |
| WO2006036560A3 (en) | Mems switches with deforming membranes | |
| WO2006071746A3 (en) | Engineered dopamine neurons and uses thereof | |
| WO2005099811A3 (en) | Physical structural mechanical electrical and electromechanical features for use in association with electrically assisted delivery devices and systems |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 08742900 Country of ref document: EP Kind code of ref document: A2 |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 08742900 Country of ref document: EP Kind code of ref document: A2 |