[go: up one dir, main page]

WO2008123142A1 - プラズマ処理装置 - Google Patents

プラズマ処理装置 Download PDF

Info

Publication number
WO2008123142A1
WO2008123142A1 PCT/JP2008/055278 JP2008055278W WO2008123142A1 WO 2008123142 A1 WO2008123142 A1 WO 2008123142A1 JP 2008055278 W JP2008055278 W JP 2008055278W WO 2008123142 A1 WO2008123142 A1 WO 2008123142A1
Authority
WO
WIPO (PCT)
Prior art keywords
ground electrode
processing apparatus
dielectric member
plasma processing
guide hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/055278
Other languages
English (en)
French (fr)
Inventor
Hiroto Takeuchi
Yuichi Nakamori
Syunsuke Kunugi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to KR1020097019106A priority Critical patent/KR101087445B1/ko
Priority to JP2009509075A priority patent/JPWO2008123142A1/ja
Publication of WO2008123142A1 publication Critical patent/WO2008123142A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00Generating plasma; Handling plasma
    • H05H1/24Generating plasma
    • H05H1/2406Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
    • H10P50/242
    • H10P52/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Plasma Technology (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Cleaning In General (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

【課題】プラズマ処理装置の接地電極における噴出口の内面に異常放電が落ちるのを防止する。 【解決手段】プラズマ処理装置の接地電極40における電界印加電極30を向く放電面42上に誘電部材60を配置する。誘電部材60には電極間の放電空間1pに連なる噴出導孔62を形成し、接地電極40には噴出導孔62に連なる噴出口41を形成する。誘電部材60における噴出導孔62の内面を、接地電極40における噴出口41の内面より突出させる。誘電部材60には、接地電極40との当接面63から面一に延長された段差面64を設ける。
PCT/JP2008/055278 2007-03-27 2008-03-21 プラズマ処理装置 Ceased WO2008123142A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020097019106A KR101087445B1 (ko) 2007-03-27 2008-03-21 플라즈마 처리 장치
JP2009509075A JPWO2008123142A1 (ja) 2007-03-27 2008-03-21 プラズマ処理装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-082049 2007-03-27
JP2007082049 2007-03-27

Publications (1)

Publication Number Publication Date
WO2008123142A1 true WO2008123142A1 (ja) 2008-10-16

Family

ID=39830639

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055278 Ceased WO2008123142A1 (ja) 2007-03-27 2008-03-21 プラズマ処理装置

Country Status (5)

Country Link
JP (1) JPWO2008123142A1 (ja)
KR (1) KR101087445B1 (ja)
CN (1) CN101658076A (ja)
TW (1) TW200904262A (ja)
WO (1) WO2008123142A1 (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011154973A (ja) * 2010-01-28 2011-08-11 Mitsubishi Electric Corp プラズマ処理装置及びプラズマ処理方法
JP2012182026A (ja) * 2011-03-01 2012-09-20 Kazuo Shimizu プラズマ電極
WO2013040476A1 (en) 2011-09-15 2013-03-21 Cold Plasma Medical Technologies, Inc. Cold plasma treatment devices and associated methods
EP2306792A3 (de) * 2009-09-24 2013-04-17 Fachhochschule Hildesheim / Holzminden / Göttingen Verfahren und Vorrichtung zum Behandeln von Objekten mit einem physikalischen Plasma bei Atmosphärendruck
WO2018104988A1 (ja) * 2016-12-05 2018-06-14 東芝三菱電機産業システム株式会社 活性ガス生成装置
WO2019138456A1 (ja) * 2018-01-10 2019-07-18 東芝三菱電機産業システム株式会社 活性ガス生成装置
TWI675123B (zh) * 2018-01-10 2019-10-21 日商東芝三菱電機產業系統股份有限公司 活性氣體生成裝置及成膜處理裝置
JP2020161332A (ja) * 2019-03-27 2020-10-01 株式会社ニデック プラズマ処理装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5534359B2 (ja) * 2011-09-21 2014-06-25 日新イオン機器株式会社 スリット電極及びこれを備えた荷電粒子ビーム発生装置
WO2017044754A1 (en) * 2015-09-11 2017-03-16 Applied Materials, Inc. Plasma module with slotted ground plate

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08227874A (ja) * 1995-02-21 1996-09-03 Mitsubishi Electric Corp 真空処理装置および真空処理方法
JPH0967685A (ja) * 1995-08-25 1997-03-11 Souzou Kagaku:Kk プラズマエッチング用平行平板電極
JP3050498U (ja) * 1998-01-12 1998-07-14 信越化学工業株式会社 プラズマ装置用電極板
WO1998046808A1 (en) * 1997-04-11 1998-10-22 Tokyo Electron Limited Processor
JPH1154296A (ja) * 1997-08-05 1999-02-26 Sony Corp プラズマ発生装置およびプラズマ装置
JP2001223204A (ja) * 2000-02-08 2001-08-17 Shin Etsu Chem Co Ltd プラズマエッチング装置用電極板
JP2003100646A (ja) * 2001-09-27 2003-04-04 Sekisui Chem Co Ltd 放電プラズマ処理装置
JP2005108482A (ja) * 2003-09-29 2005-04-21 E Square:Kk プラズマ表面処理装置
JP2005317958A (ja) * 2004-04-12 2005-11-10 Applied Materials Inc 大面積プラズマ増強化学気相堆積のためのガス拡散シャワーヘッド設計

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08227874A (ja) * 1995-02-21 1996-09-03 Mitsubishi Electric Corp 真空処理装置および真空処理方法
JPH0967685A (ja) * 1995-08-25 1997-03-11 Souzou Kagaku:Kk プラズマエッチング用平行平板電極
WO1998046808A1 (en) * 1997-04-11 1998-10-22 Tokyo Electron Limited Processor
JPH1154296A (ja) * 1997-08-05 1999-02-26 Sony Corp プラズマ発生装置およびプラズマ装置
JP3050498U (ja) * 1998-01-12 1998-07-14 信越化学工業株式会社 プラズマ装置用電極板
JP2001223204A (ja) * 2000-02-08 2001-08-17 Shin Etsu Chem Co Ltd プラズマエッチング装置用電極板
JP2003100646A (ja) * 2001-09-27 2003-04-04 Sekisui Chem Co Ltd 放電プラズマ処理装置
JP2005108482A (ja) * 2003-09-29 2005-04-21 E Square:Kk プラズマ表面処理装置
JP2005317958A (ja) * 2004-04-12 2005-11-10 Applied Materials Inc 大面積プラズマ増強化学気相堆積のためのガス拡散シャワーヘッド設計

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9558918B2 (en) 2007-04-23 2017-01-31 Plasmology4, Inc. Cold plasma treatment devices and associated methods
EP2306792A3 (de) * 2009-09-24 2013-04-17 Fachhochschule Hildesheim / Holzminden / Göttingen Verfahren und Vorrichtung zum Behandeln von Objekten mit einem physikalischen Plasma bei Atmosphärendruck
JP2011154973A (ja) * 2010-01-28 2011-08-11 Mitsubishi Electric Corp プラズマ処理装置及びプラズマ処理方法
JP2012182026A (ja) * 2011-03-01 2012-09-20 Kazuo Shimizu プラズマ電極
WO2013040476A1 (en) 2011-09-15 2013-03-21 Cold Plasma Medical Technologies, Inc. Cold plasma treatment devices and associated methods
EP2756516A4 (en) * 2011-09-15 2015-03-04 Cold Plasma Medical Technologies Inc COLD PLASMA PROCESSING DEVICES AND RELATED METHODS
US10840065B2 (en) * 2016-12-05 2020-11-17 Toshiba Mitsubishi-Electric Industrial Systems Corporation Active gas generation apparatus including a metal housing, first and second auxiliary members, and a housing contact
WO2018104988A1 (ja) * 2016-12-05 2018-06-14 東芝三菱電機産業システム株式会社 活性ガス生成装置
JPWO2018104988A1 (ja) * 2016-12-05 2019-03-28 東芝三菱電機産業システム株式会社 活性ガス生成装置
CN110024088A (zh) * 2016-12-05 2019-07-16 东芝三菱电机产业系统株式会社 活性气体生成装置
CN110024088B (zh) * 2016-12-05 2023-02-21 东芝三菱电机产业系统株式会社 活性气体生成装置
TWI639724B (zh) * 2016-12-05 2018-11-01 東芝三菱電機產業系統股份有限公司 活性氣體生成裝置
EP3740045A4 (en) * 2018-01-10 2021-09-29 Toshiba Mitsubishi-Electric Industrial Systems Corporation ACTIVE GAS GENERATING DEVICE
JPWO2019138456A1 (ja) * 2018-01-10 2020-10-01 東芝三菱電機産業システム株式会社 活性ガス生成装置
KR20200096607A (ko) * 2018-01-10 2020-08-12 도시바 미쓰비시덴키 산교시스템 가부시키가이샤 활성 가스 생성 장치
TWI675123B (zh) * 2018-01-10 2019-10-21 日商東芝三菱電機產業系統股份有限公司 活性氣體生成裝置及成膜處理裝置
KR102465845B1 (ko) 2018-01-10 2022-11-11 도시바 미쓰비시덴키 산교시스템 가부시키가이샤 활성 가스 생성 장치
WO2019138456A1 (ja) * 2018-01-10 2019-07-18 東芝三菱電機産業システム株式会社 活性ガス生成装置
JP2020161332A (ja) * 2019-03-27 2020-10-01 株式会社ニデック プラズマ処理装置
JP7328500B2 (ja) 2019-03-27 2023-08-17 株式会社ニデック 大気圧プラズマ処理装置

Also Published As

Publication number Publication date
KR20090108738A (ko) 2009-10-16
TW200904262A (en) 2009-01-16
CN101658076A (zh) 2010-02-24
JPWO2008123142A1 (ja) 2010-07-15
KR101087445B1 (ko) 2011-11-25

Similar Documents

Publication Publication Date Title
WO2008123142A1 (ja) プラズマ処理装置
WO2010091205A3 (en) Ground return for plasma processes
WO2010039883A3 (en) Multi-electrode pecvd source
WO2009003613A8 (de) Vorrichtung zur behandlung von oberflächen mit einem mittels einer elektrode über ein feststoff-dielektrikum durch eine dielektrisch behinderte gasentladung erzeugten plasma
WO2007038054A3 (en) Apparatus for the removal of an edge polymer from a substrate and methods therefor
WO2010094304A8 (en) Electrode arrangement for generating a non-thermal plasma
WO2010151057A3 (en) Plasma deposition of a thin film
WO2009009157A3 (en) Electrocautery method and apparatus
WO2010071785A3 (en) Plasma confinement structures in plasma processing systems
WO2008043047A3 (en) Apparatus and method for substrate clamping in a plasma chamber
WO2008156562A3 (en) Showerhead electrode assemblies for plasma processing apparatuses
WO2006124624A3 (en) Electrosurgical ablation electrode with aspiration and method for using same
WO2008102154A3 (en) Electrosurgical systems
WO2008102738A1 (ja) 真空処理装置および真空処理装置を用いた製膜方法
TW200608541A (en) Method and apparatus for dechucking a substrate
WO2009134588A3 (en) Nonplanar faceplate for a plasma processing chamber
WO2011006018A3 (en) Apparatus and method for plasma processing
WO2007038256A3 (en) Apparatus for the removal of a metal oxide from a substrate and methods therefor
WO2007103489A3 (en) Branched radio frequency multipole
WO2008094727A3 (en) Rj style connector to eliminate cable electrostatic discharge events
WO2010036625A3 (en) Pulsed electrospray ion source with reduced analyte electrochemistry
WO2008000836A3 (en) Apparatus for accelerating an ion beam
WO2008149741A1 (ja) プラズマ処理装置のドライクリーニング方法
EP4248513A4 (en) ELECTRODE ARRANGEMENT
TW200705567A (en) Method and apparatus for dynamic plasma treatment of bipolar ESC system

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880009956.0

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08738701

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2009509075

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 1020097019106

Country of ref document: KR

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08738701

Country of ref document: EP

Kind code of ref document: A1