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WO2008123053A1 - Positive photosensitive resin composition - Google Patents

Positive photosensitive resin composition Download PDF

Info

Publication number
WO2008123053A1
WO2008123053A1 PCT/JP2008/054932 JP2008054932W WO2008123053A1 WO 2008123053 A1 WO2008123053 A1 WO 2008123053A1 JP 2008054932 W JP2008054932 W JP 2008054932W WO 2008123053 A1 WO2008123053 A1 WO 2008123053A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
photosensitive resin
positive photosensitive
carbon atoms
octa
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/054932
Other languages
French (fr)
Japanese (ja)
Inventor
Kazuto Miyoshi
Daichi Miyazaki
Masao Tomikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP2008520660A priority Critical patent/JP5212103B2/en
Publication of WO2008123053A1 publication Critical patent/WO2008123053A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Electroluminescent Light Sources (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

Disclosed is a positive photosensitive resin composition which is excellent in chemical resistance after heat treatment and enables to form a pattern having a small taper angle. Specifically disclosed is a positive photosensitive resin composition containing (a) a polyamide acid and/or a polyamide acid ester having a structural unit represented by the general formula (1) below, (b) a quinonediazide compound and (c) a polyfunctional acrylate compound. (In the formula (1), R1 represents a tri- to octa-valent organic group having 2 or more carbon atoms; R2 represents a di- to octa-valent organic group having 2 or more carbon atoms; R3 and R4 may be the same or different and represent a hydrogen atom or a hydrocarbon group having 1-20 carbon atoms; p and q represent an integer of 0-4; r represents 1 or 2; and s represents an integer of 0-2. In this connection, p and q satisfy p + q > 0.)
PCT/JP2008/054932 2007-03-30 2008-03-18 Positive photosensitive resin composition Ceased WO2008123053A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008520660A JP5212103B2 (en) 2007-03-30 2008-03-18 Positive photosensitive resin composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-091097 2007-03-30
JP2007091097 2007-03-30

Publications (1)

Publication Number Publication Date
WO2008123053A1 true WO2008123053A1 (en) 2008-10-16

Family

ID=39830554

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/054932 Ceased WO2008123053A1 (en) 2007-03-30 2008-03-18 Positive photosensitive resin composition

Country Status (3)

Country Link
JP (1) JP5212103B2 (en)
TW (1) TWI416260B (en)
WO (1) WO2008123053A1 (en)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009062398A (en) * 2007-09-04 2009-03-26 Toray Ind Inc Diamine compound, heat-resistant resin precursor using it, and positive photosensitive resin composition
JP2009063980A (en) * 2006-11-15 2009-03-26 Asahi Kasei Corp Photosensitive resin composition and flexible printed wiring board using the same
JP2010053323A (en) * 2008-08-29 2010-03-11 Chisso Corp Thermosetting composition, method for producing the same, and use of the same
JP2010085673A (en) * 2008-09-30 2010-04-15 Nissan Chem Ind Ltd Positive photosensitive resin composition including terminal functional group-containing polyimide
JP2010134422A (en) * 2008-10-28 2010-06-17 Jsr Corp Radiation-sensitive resin composition, interlayer insulation film and microlens, and method for producing them
JP2011090153A (en) * 2009-10-22 2011-05-06 Sony Corp Display device and method of manufacturing the same
JP2011180520A (en) * 2010-03-03 2011-09-15 Tokyo Ohka Kogyo Co Ltd Positive photosensitive resin composition and cured product thereof
JP2012133153A (en) * 2010-12-22 2012-07-12 Toray Ind Inc Photosensitive resin composition, cured film using the same, method for manufacturing semiconductor device, and semiconductor device
JP2013152476A (en) * 2008-05-29 2013-08-08 Asahi Kasei E-Materials Corp Photosensitive resin composition
WO2014097992A1 (en) * 2012-12-20 2014-06-26 東レ株式会社 Photosensitive resin composition, method for producing heat-resistant resin film and display device
WO2015118836A1 (en) * 2014-02-10 2015-08-13 日立化成デュポンマイクロシステムズ株式会社 Resin composition containing polyimide precursor, method for manufacturing cured film, and electronic component
JP2015179153A (en) * 2014-03-19 2015-10-08 東レ株式会社 photosensitive resin composition
WO2020183617A1 (en) * 2019-03-12 2020-09-17 日立化成株式会社 Photosensitive resin composition, patterned cured film and production method therefor, semiconductor element, and electronic device
CN114316263A (en) * 2022-01-17 2022-04-12 深圳职业技术学院 Cross-linked polyamic acid ester, method for producing same, polyimide composition containing same, and method for producing polyimide resin film
KR20230018355A (en) * 2021-07-27 2023-02-07 지린 올레드 옵티컬 앤드 일렉트로닉 머티리얼즈 컴퍼니 리미티드 Resin composition, resin film and display device
US12109651B2 (en) 2018-04-03 2024-10-08 Ilika Technologies Limited Laser processing method for thin film structures

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101400186B1 (en) 2010-12-31 2014-05-27 제일모직 주식회사 Positive photosensitive resin composition, photosensitive resin layer prepared by using the same, and semiconductor device including the photosensitive resin layer
JP6384678B2 (en) * 2013-10-21 2018-09-05 日産化学株式会社 Positive photosensitive resin composition
CN118240212B (en) * 2023-12-25 2025-10-31 比亚迪股份有限公司 Material for forming polyimide by electrophoresis, insulating material and electrophoresis coating method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002189290A (en) * 2000-09-29 2002-07-05 Nippon Zeon Co Ltd Radiation-sensitive resin composition for forming insulating film and insulating film for organic electroluminescence device
JP2002328472A (en) * 2001-02-26 2002-11-15 Toray Ind Inc Positive photosensitive resin precursor composition, electronic parts using the same and display
JP2004326094A (en) * 2003-04-07 2004-11-18 Toray Ind Inc Photosensitive resin composition
JP2005159368A (en) * 2003-11-27 2005-06-16 Samsung Sdi Co Ltd Flat panel display
WO2005068535A1 (en) * 2004-01-20 2005-07-28 Asahi Kasei Emd Corporation Resin and resin composition

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002012761A (en) * 2000-04-28 2002-01-15 Toray Ind Inc Heat-resistant resin composition
JP4292765B2 (en) * 2002-08-22 2009-07-08 東レ株式会社 Positive photosensitive resin precursor composition, electronic component for semiconductor using the same, and display device for organic electroluminescent element
JP4514542B2 (en) * 2004-07-30 2010-07-28 旭化成イーマテリアルズ株式会社 Positive photosensitive resin composition

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002189290A (en) * 2000-09-29 2002-07-05 Nippon Zeon Co Ltd Radiation-sensitive resin composition for forming insulating film and insulating film for organic electroluminescence device
JP2002328472A (en) * 2001-02-26 2002-11-15 Toray Ind Inc Positive photosensitive resin precursor composition, electronic parts using the same and display
JP2004326094A (en) * 2003-04-07 2004-11-18 Toray Ind Inc Photosensitive resin composition
JP2005159368A (en) * 2003-11-27 2005-06-16 Samsung Sdi Co Ltd Flat panel display
WO2005068535A1 (en) * 2004-01-20 2005-07-28 Asahi Kasei Emd Corporation Resin and resin composition

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009063980A (en) * 2006-11-15 2009-03-26 Asahi Kasei Corp Photosensitive resin composition and flexible printed wiring board using the same
JP2009062398A (en) * 2007-09-04 2009-03-26 Toray Ind Inc Diamine compound, heat-resistant resin precursor using it, and positive photosensitive resin composition
JP2013152476A (en) * 2008-05-29 2013-08-08 Asahi Kasei E-Materials Corp Photosensitive resin composition
JP5260646B2 (en) * 2008-05-29 2013-08-14 旭化成イーマテリアルズ株式会社 Photosensitive resin composition
JP2010053323A (en) * 2008-08-29 2010-03-11 Chisso Corp Thermosetting composition, method for producing the same, and use of the same
JP2010085673A (en) * 2008-09-30 2010-04-15 Nissan Chem Ind Ltd Positive photosensitive resin composition including terminal functional group-containing polyimide
TWI451194B (en) * 2008-10-28 2014-09-01 Jsr Corp Radiosensitive resin composition, interlayer insulation film, microlens and methods for manufacturing them
JP2010134422A (en) * 2008-10-28 2010-06-17 Jsr Corp Radiation-sensitive resin composition, interlayer insulation film and microlens, and method for producing them
JP2011090153A (en) * 2009-10-22 2011-05-06 Sony Corp Display device and method of manufacturing the same
US8653532B2 (en) 2009-10-22 2014-02-18 Sony Corporation Display device and method for manufacturing display device
JP2011180520A (en) * 2010-03-03 2011-09-15 Tokyo Ohka Kogyo Co Ltd Positive photosensitive resin composition and cured product thereof
JP2012133153A (en) * 2010-12-22 2012-07-12 Toray Ind Inc Photosensitive resin composition, cured film using the same, method for manufacturing semiconductor device, and semiconductor device
CN104854508A (en) * 2012-12-20 2015-08-19 东丽株式会社 Photosensitive resin composition, method for producing heat-resistant resin film and display device
WO2014097992A1 (en) * 2012-12-20 2014-06-26 東レ株式会社 Photosensitive resin composition, method for producing heat-resistant resin film and display device
JPWO2014097992A1 (en) * 2012-12-20 2017-01-12 東レ株式会社 Photosensitive resin composition, heat-resistant resin film manufacturing method, and display device
US9897915B2 (en) 2012-12-20 2018-02-20 Toray Industries, Inc. Photosensitive resin composition, method for producing heat-resistant resin film and display device
CN104854508B (en) * 2012-12-20 2019-05-07 东丽株式会社 Photosensitive resin composition, method for producing heat-resistant resin film, and display device
CN110147031A (en) * 2012-12-20 2019-08-20 东丽株式会社 Photosensitive resin composition, method for producing heat-resistant resin film, and display device
JPWO2015118836A1 (en) * 2014-02-10 2017-03-23 日立化成デュポンマイクロシステムズ株式会社 Resin composition containing polyimide precursor, method for producing cured film, and electronic component
WO2015118836A1 (en) * 2014-02-10 2015-08-13 日立化成デュポンマイクロシステムズ株式会社 Resin composition containing polyimide precursor, method for manufacturing cured film, and electronic component
JP2015179153A (en) * 2014-03-19 2015-10-08 東レ株式会社 photosensitive resin composition
US12109651B2 (en) 2018-04-03 2024-10-08 Ilika Technologies Limited Laser processing method for thin film structures
WO2020183617A1 (en) * 2019-03-12 2020-09-17 日立化成株式会社 Photosensitive resin composition, patterned cured film and production method therefor, semiconductor element, and electronic device
JP7287453B2 (en) 2019-03-12 2023-06-06 株式会社レゾナック Photosensitive resin composition, pattern cured film and method for producing same, semiconductor element and electronic device
JPWO2020183617A1 (en) * 2019-03-12 2020-09-17
KR20230018355A (en) * 2021-07-27 2023-02-07 지린 올레드 옵티컬 앤드 일렉트로닉 머티리얼즈 컴퍼니 리미티드 Resin composition, resin film and display device
KR102735233B1 (en) 2021-07-27 2024-11-27 지린 올레드 옵티컬 앤드 일렉트로닉 머티리얼즈 컴퍼니 리미티드 Resin composition, resin film and display device
CN114316263A (en) * 2022-01-17 2022-04-12 深圳职业技术学院 Cross-linked polyamic acid ester, method for producing same, polyimide composition containing same, and method for producing polyimide resin film
CN114316263B (en) * 2022-01-17 2023-02-03 深圳职业技术学院 Cross-linked polyamic acid ester, method for producing same, polyimide composition containing same, and method for producing polyimide resin film

Also Published As

Publication number Publication date
TWI416260B (en) 2013-11-21
JP5212103B2 (en) 2013-06-19
JPWO2008123053A1 (en) 2010-07-15
TW200903163A (en) 2009-01-16

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