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WO2008121001A1 - Appareil à fil à scier - Google Patents

Appareil à fil à scier Download PDF

Info

Publication number
WO2008121001A1
WO2008121001A1 PCT/NO2008/000119 NO2008000119W WO2008121001A1 WO 2008121001 A1 WO2008121001 A1 WO 2008121001A1 NO 2008000119 W NO2008000119 W NO 2008000119W WO 2008121001 A1 WO2008121001 A1 WO 2008121001A1
Authority
WO
WIPO (PCT)
Prior art keywords
slurry
roller
abrasives
upstream
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/NO2008/000119
Other languages
English (en)
Inventor
Thorvald Abel Engh
Anne Kvithyld
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from NO20081600A external-priority patent/NO20081600L/no
Application filed by Individual filed Critical Individual
Publication of WO2008121001A1 publication Critical patent/WO2008121001A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/0007—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires
    • B23D57/0023—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires with a plurality of saw wires or saw wires having plural cutting zones
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Definitions

  • This invention relates to an apparatus that allows direct on-line transfer of slurry from downstream of a multi-wire wafer saw back to the wires upstream. More specific, the invention relates to an apparatus in the wafer sawing operation for on-line removing and transferring slurry and abrasive through the downstream guide roller back through a pipe to go through the upstream guide rollers to the wires.
  • runoff and drippings from the workpiece may be transferred on-line back through the upstream guide roller.
  • Multi-crystalline solar cell wafers are typically produced by melting and casting silicon of sufficient purity in a directional solidification furnace. This produces a rectangular ingot of multicrystalline solar grade silicon metal which is sliced into 16-25 blocks with a quadratic cross- section. As illustrated in Fig 1 each block is then sliced into wafers of thickness about 0.2 mm. After slicing, the wafers are surface treated, textured, doped, given electric leads etc. to form solar cells that may be mounted together to form solar panels.
  • Wire-sawing, free abrasive machining- allows the production of very thin wafers from the large diameter ingots.
  • a thin steel wire of about 160-180 micrometer diameter and several hundreds of km long is wrapped around three or four rollers with grooves to hold and guide the wires, thus producing a wire web.
  • the fine silicon particles may be covered by a layer of oxide due to the somewhat oxidizing conditions during cutting and in the collection tank. Also the silicon kerf particles may adhere to SiC grains. DESCRIPTION OF THE PRIOR ART
  • a problem in adding cutting solution to the wires is that of hitting and wetting a rapidly moving thin wire target. In practice only a small fraction of the slurry seems to reach the wires.
  • One patented method, WO 0191982 is to position two nozzles on opposite sides of the ingot holder so that slurry is dispensed onto the wire web forming a curtain or sheet of slurry.
  • the slurry curtain extends across a full width of the wire web so that slurry is to be delivered to every reach of wire and every slice of ingot.
  • the openings between the wires cause losses.
  • the velocity difference between the slurry curtains and the moving wires is also a difficulty.
  • Slurry that can be reused may contain as much as 30 % kerf by mass in photovoltaic slurry, and up to 10 % in electronic slurry.
  • a high content of kerf gives an unwanted increase in the "effective viscosity" of the slurry.
  • the SiC particles may be covered with a layer of Si and traces of Fe that reduces the efficiency of the cutting operation.
  • a method European Patent 1020271 , is to remove slurry from the wires in a separate chamber using a cleaning liquid and shutting off the cleaning nozzles when the wires return to the cutting chamber.
  • a solution employed in the industry in the cutting operation is to add only fresh PEG and new SiC. However, this approach consumes large amounts of SiC and PEG.
  • the invention concerns an apparatus, sketched in Fig2, for upstream of the work-piece adding to the cutting wires slurry with abrasives directly recycled from the wires downstream and some fresh or reconstituted slurry with abrasives. More specific, the invention relates to an apparatus in the wafer sawing operation for reliably and uniformly adding cutting liquid with abrasive particles through the roller to the cutting wires upstream of the workpiece and downstream from the workpiece directly recycling the abrasive slurry from the wire through the downstream roller back through a transfer pipe. [0020] Runoff and drippings from the workpiece can also be recycled directly through the upstream roller as indicated in Fig.3.
  • SiC and PEG are mentioned explicitly. However, the patent also applies to similar systems for production of other wafers than Si, the use of abrasives other than SiC and the use of slurry compositions not based on PEG.
  • An example of the use of other abrasives than SiC is the use of diamonds fixed to the wires.
  • Figure 1 shows the rollers upstream and downstream of the work-piece and indicates the origin of the workpiece.
  • Figure 2 schematically shows transfer of slurry and abrasives through the guide rollers upstream and downstream of the workpiece, and on-line recycling back through a pipe from the downstream to the upstream roller.
  • Figure 3 schematically shows on-line recycling of runoff and drippings from the workpiece back through the upstream roller.
  • the invention relates to an apparatus in the wafer sawing operation for adding and removing cutting liquid with abrasive particles from the wires. This is to be carried out in an efficient, clean, known and controlled manner with a minimum of losses. Spent slurry containing silicon kerf and waste abrasive is to be removed.
  • the invention deals with an apparatus in the wafer sawing operation for reliably and uniformly adding cutting liquid with abrasive particles through the roller to the cutting wires upstream of the workpiece, and downstream directly removing slurry and abrasives from the wires, through the roller and then recycling the abrasive slurry back through a pipe to the upstream roller.
  • the cutting liquid, PEG, "wets" the SiC, the surface of the rollers and the wires.
  • the slurry and abrasives spread out as a film over the surface and along the grooves of the guide rollers mainly due to gravity and shear between the rotating rollers and surrounding air. Wetting, surface tension effects and texture of the surface prevent the thin slurry film from running or dripping off the rollers and wires. Dripping from the wires and rollers are prevented by controlling the system so that the film on the wires is only about 20 micrometers thick and on the roller the thickness is less than the diameter of the wires, 0.2 mm.
  • the feed system of slurry and abrasives on the roller upstream is designed to give a film on the roller surface that wets and nearly immerses the wire, thus allowing transport of slurry and SiC to the workpiece.
  • stable control is attained. For instance, if more slurry goes to the workpiece than enters the roller surface, the thickness of the film decreases and transfer by the wire to the workpiece is reduced. Similarly, if less slurry leaves the downstream roller than enters, the thickness of the film increases and transfer away from the roller to the wire and through the roller increases.
  • the rollers may also be composite, supported by a cylindrical cage.
  • the material in the rollers walls may be perforated, composed of fibers, woven in a number of layers or tubes may pass the slurry and abrasives from the inlet/outlet to the surface.
  • abrasive slurry can move from the roller surface through the roller to the axial pipe and via a lead-through to the transfer pipe.
  • For the upstream roller movement is in the opposite direction from the transfer pipe to the surface.
  • the rollers must allow slurry including the SiC particles to pass through, while still sustaining the required pressure gradients.
  • the pressure drop for transfer of slurry and abrasives inside the rollers depends on the cross- section of the openings, viscosity, on the diameter of the SiC particles and on the specified feed rate for the slurry.
  • Upstream the recycled PEG-water slurry is pressed from the inside to the surface, partly due to the centrifugal forces.
  • the pressure at the lead-through inlet to the upstream roller may be higher than, equal to, or less than the ambient (atmospheric) pressure.
  • New abrasive grains must be added to the slurry to compensate for degradation and loss of the optimal large size fraction abrasives, usually SiC.
  • the wire-guiding rollers 1, 2 are perforated with openings- holes, slits or tubes- leading from the inside inlet of the rollers to the surface.
  • tubes 3 lead from an inner axial pipe to the surface of both the upstream and downstream rollers.
  • the openings in the tubes connect to an axial pipe going out of the roller to a transfer pipe via a lead-through 4 sealed by means of seals.
  • the openings-holes, slits or tubes- through the roller walls have a smallest dimension in the range from 20 micrometers to 40 micrometers.
  • the axial pipe in the downstream roller 2 is part of a vacuum system 5 pumping out via an axial lead-through 4 in the roller sealed by means of seals.
  • the pressure at the lead-through may be down to 0.001 bar.
  • the aim is to pump a given fraction to the upstream roller 1 through a transfer pipe
  • the remaining part is removed 8 and treated off-line to recover the large SiC grains and ideally to recover silicon kerf and to bleed-off unwanted contaminants such as iron and copper.
  • Treatment may be by standard settling, filtration, froth flotation, centrifugation, hydro-cyclone, distillation, drying, electrostatic separation, crushing and screening methods.
  • the upstream roller 1 is perforated with openings- holes, slits or tubes 3- leading to the surface from the axial pipe, connected to the transfer pipe 6 via a lead-through 4 sealed by means of seals.
  • the openings-holes, slits or tubes- through the roller walls have a smallest dimension in the range from 20 micrometers to
  • New and/or reconstituted slurry and abrasives 9 is added to the pipe 6 to compensate for removal of slurry and abrasives.
  • Example 1 of preferred embodiment for low or negligible runoff or dripping see Fig 2
  • the design is the same for the downstream roller, except that slurry and abrasives now move from the surface of the roller to the inside axial pipe.
  • the axial pipe is connected to the transfer pipe via lead- throughs sealed by means of seals.
  • the grooves on the roller surface are semicircular with diameter equal to the wire diameter.
  • Wafer thickness 180 micrometer
  • Diameter of tubes 3 for feeding in or out of slurry with abrasives 360 micrometers
  • Example 2 of preferred embodiment for major runoff or dripping see Fig 3)
  • the axial pipe is connected to the transfer pipe via a lead-through sealed by means of seals
  • the grooves on the roller surface are semicircular with diameter equal to the wire diameter.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

L'invention concerne un appareil dans l'opération de sciage d'une tranche, pour l'addition en ligne propre et commandée, en amont du fil de coupe, d'un liquide de découpe avec des abrasifs et le retrait commandé en aval pour un recyclage en retour vers les fils en amont. La projection et la perte de coulis avec du SiC sont minimisées. Le coulis utilisé contenant des abrasifs d'entaille et de déchets est enlevé hors ligne (8) afin de récupérer le SiC et le silicium. De nouveaux coulis et abrasifs et/ou des coulis et abrasifs reconstitués (9) sont ajoutés pour compenser la dégradation et la perte des abrasifs à gros grains, habituellement SiC. Dans l'unité de sciage de tranche à multiples fils, les rouleaux de guidage de fil (1, 2) ont des perforations telles que des orifices, des trous, des fentes ou des tubes (3) de dimension la plus petite dans une plage de 20 micromètres à 40 micromètres, pour le transport du coulis avec des abrasifs vers et à partir des surfaces de rouleau par l'intermédiaire d'un tuyau de transfert d'aval en amont de la pièce. Les gradients de pression dans les rouleaux qui doivent déplacer le coulis et les abrasifs dépendent de la pression, de la viscosité, de la section transversale des orifices, du diamètre des particules de SiC et des vitesses d'alimentation spécifiées pour le coulis abrasif. En aval de la pièce, un système sous vide (5) pompe le coulis depuis la surface de rouleau dans des tubes (3) à travers le rouleau (2) par l'intermédiaire d'un tuyau axial et d'un passage traversant (4) scellé au moyen de joints d'étanchéité. La pression à l'intérieur du rouleau en aval peut être abaissée jusqu'à 0,001 bar. Comme représenté sur la Figure 3, des égouttures et un ruissellement depuis la pièce peuvent être recueillis en ligne (10). Le coulis abrasif à gros grains recyclé vers l'amont à partir de l'aval est dirigé jusqu'à la surface de rouleau à travers le tuyau d'entrée du rouleau de guidage de fil par l'intermédiaire d'un passage traversant axial (4) vers le rouleau scellé de façon étanche au moyen de joints d'étanchéité. La partie restante est traitée pour récupérer les grosses particules de SiC et pour récupérer idéalement le silicium à partir de l'entaille de silicium (8).
PCT/NO2008/000119 2007-04-02 2008-04-02 Appareil à fil à scier Ceased WO2008121001A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
NO20071722 2007-04-02
NO20071722 2007-04-02
NO20081600A NO20081600L (no) 2007-04-02 2008-03-31 A saw wire apparatus
NO20081600 2008-03-31

Publications (1)

Publication Number Publication Date
WO2008121001A1 true WO2008121001A1 (fr) 2008-10-09

Family

ID=39808496

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/NO2008/000119 Ceased WO2008121001A1 (fr) 2007-04-02 2008-04-02 Appareil à fil à scier

Country Status (1)

Country Link
WO (1) WO2008121001A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102093929A (zh) * 2009-12-11 2011-06-15 安集微电子（上海）有限公司 太阳能peg基回收切割液再利用方法及基于此方法得到的切割液
CN102672829A (zh) * 2011-03-17 2012-09-19 苏州赫瑞特电子专用设备科技有限公司 一种精密多线切割机控制系统
CN102962905A (zh) * 2011-09-01 2013-03-13 镇江仁德新能源科技有限公司 一种回收硅片多线切割过程中产生的废浆料的方法
FR3022478A1 (fr) * 2014-06-23 2015-12-25 Commissariat Energie Atomique Dispositif de decoupe par fil comportant un organe rotatif pourvu de moyens de lubrification du fil

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6161533A (en) * 1996-10-01 2000-12-19 Nippei Toyoma Corp. Slurry managing system and slurry managing method
EP0827798B1 (fr) * 1996-09-06 2002-04-03 Sharp Kabushiki Kaisha Une scie à fils multiples
US20040084042A1 (en) * 2002-11-06 2004-05-06 Seh America, Inc. Apparatus, system and method for cutting a crystal ingot

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0827798B1 (fr) * 1996-09-06 2002-04-03 Sharp Kabushiki Kaisha Une scie à fils multiples
US6161533A (en) * 1996-10-01 2000-12-19 Nippei Toyoma Corp. Slurry managing system and slurry managing method
US20040084042A1 (en) * 2002-11-06 2004-05-06 Seh America, Inc. Apparatus, system and method for cutting a crystal ingot

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102093929A (zh) * 2009-12-11 2011-06-15 安集微电子（上海）有限公司 太阳能peg基回收切割液再利用方法及基于此方法得到的切割液
CN102672829A (zh) * 2011-03-17 2012-09-19 苏州赫瑞特电子专用设备科技有限公司 一种精密多线切割机控制系统
CN102962905A (zh) * 2011-09-01 2013-03-13 镇江仁德新能源科技有限公司 一种回收硅片多线切割过程中产生的废浆料的方法
FR3022478A1 (fr) * 2014-06-23 2015-12-25 Commissariat Energie Atomique Dispositif de decoupe par fil comportant un organe rotatif pourvu de moyens de lubrification du fil
WO2015197523A1 (fr) * 2014-06-23 2015-12-30 Commissariat à l'énergie atomique et aux énergies alternatives Dispositif de découpe par fil comportant un organe rotatif pourvu de moyens de lubrification du fil

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