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WO2008120564A1 - Mounting structure of electronic component and method for mounting electronic component - Google Patents

Mounting structure of electronic component and method for mounting electronic component Download PDF

Info

Publication number
WO2008120564A1
WO2008120564A1 PCT/JP2008/054820 JP2008054820W WO2008120564A1 WO 2008120564 A1 WO2008120564 A1 WO 2008120564A1 JP 2008054820 W JP2008054820 W JP 2008054820W WO 2008120564 A1 WO2008120564 A1 WO 2008120564A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
support
mounting
connection
resin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/054820
Other languages
French (fr)
Japanese (ja)
Inventor
Tomohiro Nishiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP2009507452A priority Critical patent/JP5569676B2/en
Publication of WO2008120564A1 publication Critical patent/WO2008120564A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H10W72/30—
    • H10W74/012—
    • H10W74/15—
    • H10W90/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H10W72/01308—
    • H10W72/073—
    • H10W72/07311—
    • H10W72/07327—
    • H10W72/07331—
    • H10W72/252—
    • H10W72/387—
    • H10W72/856—
    • H10W72/90—
    • H10W72/923—
    • H10W72/9415—
    • H10W90/722—
    • H10W90/724—
    • H10W90/734—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

Disclosed is a technique for suppressing influence of stress during when an electronic component is mounted onto a support using an adhesive containing conductive particles. Specifically disclosed is a mounting structure of an electronic component, which comprises a frame-like insulating frame layer arranged on a support, a resin layer for connection which is arranged within the frame of the insulating frame layer, and an electronic component arranged on the support through the resin layer for connection. The resin layer for connection has a conductive portion for electrically connecting at least a part of the electronic component with at least a part of the support.
PCT/JP2008/054820 2007-03-28 2008-03-14 Mounting structure of electronic component and method for mounting electronic component Ceased WO2008120564A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009507452A JP5569676B2 (en) 2007-03-28 2008-03-14 Electronic component mounting method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007085960 2007-03-28
JP2007-085960 2007-03-28

Publications (1)

Publication Number Publication Date
WO2008120564A1 true WO2008120564A1 (en) 2008-10-09

Family

ID=39808146

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/054820 Ceased WO2008120564A1 (en) 2007-03-28 2008-03-14 Mounting structure of electronic component and method for mounting electronic component

Country Status (2)

Country Link
JP (1) JP5569676B2 (en)
WO (1) WO2008120564A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010134230A1 (en) * 2009-05-20 2010-11-25 パナソニック株式会社 Semiconductor device and method for manufacturing same
JP2011166094A (en) * 2010-02-15 2011-08-25 Sumitomo Bakelite Co Ltd Conductive connection sheet, method for connection between terminals, method for forming connection terminal, semiconductor device, and electronic apparatus
JP2011166093A (en) * 2010-02-15 2011-08-25 Sumitomo Bakelite Co Ltd Conductive connection sheet, method for connection between terminals, method for forming connection terminal, semiconductor device, and electronic apparatus
JP2011165981A (en) * 2010-02-10 2011-08-25 Sumitomo Bakelite Co Ltd Method for forming solder layer, method for connection between terminals, semiconductor device, and electronic apparatus
JP2013222833A (en) * 2012-04-17 2013-10-28 Toshiba Corp Electronic component and electronic apparatus

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3355666B1 (en) * 2017-01-26 2023-07-26 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Semifinished product and method of manufacturing a component carrier
EP4366582A1 (en) 2021-07-06 2024-05-15 Areco Finances Et Technologie - Arfitec Open vertical refrigerated display case comprising improved nebulizing means

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0270436U (en) * 1988-11-18 1990-05-29
JPH10199936A (en) * 1997-01-14 1998-07-31 Olympus Optical Co Ltd Flip chip mounting structure on flexible wiring board
JP2000151059A (en) * 1998-11-09 2000-05-30 Toshiba Corp Wiring board unit and method of manufacturing wiring board unit
JP2000260935A (en) * 1999-03-09 2000-09-22 Rohm Co Ltd Semiconductor integrated device
JP2000340614A (en) * 1999-05-28 2000-12-08 Sony Chem Corp Semiconductor element mounting method
JP2004006935A (en) * 2003-07-22 2004-01-08 Oki Electric Ind Co Ltd Method for manufacturing sealing member and method for manufacturing semiconductor device using the sealing member

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0270436U (en) * 1988-11-18 1990-05-29
JPH10199936A (en) * 1997-01-14 1998-07-31 Olympus Optical Co Ltd Flip chip mounting structure on flexible wiring board
JP2000151059A (en) * 1998-11-09 2000-05-30 Toshiba Corp Wiring board unit and method of manufacturing wiring board unit
JP2000260935A (en) * 1999-03-09 2000-09-22 Rohm Co Ltd Semiconductor integrated device
JP2000340614A (en) * 1999-05-28 2000-12-08 Sony Chem Corp Semiconductor element mounting method
JP2004006935A (en) * 2003-07-22 2004-01-08 Oki Electric Ind Co Ltd Method for manufacturing sealing member and method for manufacturing semiconductor device using the sealing member

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010134230A1 (en) * 2009-05-20 2010-11-25 パナソニック株式会社 Semiconductor device and method for manufacturing same
JP2011165981A (en) * 2010-02-10 2011-08-25 Sumitomo Bakelite Co Ltd Method for forming solder layer, method for connection between terminals, semiconductor device, and electronic apparatus
JP2011166094A (en) * 2010-02-15 2011-08-25 Sumitomo Bakelite Co Ltd Conductive connection sheet, method for connection between terminals, method for forming connection terminal, semiconductor device, and electronic apparatus
JP2011166093A (en) * 2010-02-15 2011-08-25 Sumitomo Bakelite Co Ltd Conductive connection sheet, method for connection between terminals, method for forming connection terminal, semiconductor device, and electronic apparatus
JP2013222833A (en) * 2012-04-17 2013-10-28 Toshiba Corp Electronic component and electronic apparatus

Also Published As

Publication number Publication date
JPWO2008120564A1 (en) 2010-07-15
JP5569676B2 (en) 2014-08-13

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