[go: up one dir, main page]

WO2008114091A2 - Procédé et dispositif pour créer une incrustation de fréquence radio - Google Patents

Procédé et dispositif pour créer une incrustation de fréquence radio Download PDF

Info

Publication number
WO2008114091A2
WO2008114091A2 PCT/IB2007/004589 IB2007004589W WO2008114091A2 WO 2008114091 A2 WO2008114091 A2 WO 2008114091A2 IB 2007004589 W IB2007004589 W IB 2007004589W WO 2008114091 A2 WO2008114091 A2 WO 2008114091A2
Authority
WO
WIPO (PCT)
Prior art keywords
wire
substrate
loop
chip
antenna
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB2007/004589
Other languages
English (en)
Other versions
WO2008114091A3 (fr
Inventor
Ulrich Lang
Lionel Carre
Viroel-Marian Hasegan
David Finn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HID Global GmbH
Original Assignee
HID Global GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/733,756 external-priority patent/US7546671B2/en
Application filed by HID Global GmbH filed Critical HID Global GmbH
Priority to KR1020097008529A priority Critical patent/KR101346050B1/ko
Priority to AU2007349611A priority patent/AU2007349611C1/en
Priority to CA002664872A priority patent/CA2664872A1/fr
Priority to JP2009529801A priority patent/JP5408720B2/ja
Priority to CN2007800413375A priority patent/CN101627400B/zh
Priority to EP07872847A priority patent/EP2070013A2/fr
Publication of WO2008114091A2 publication Critical patent/WO2008114091A2/fr
Publication of WO2008114091A3 publication Critical patent/WO2008114091A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45565—Single coating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/4813—Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H01L2224/78303—Shape of the pressing surface, e.g. tip or head
    • H01L2224/78304—Shape of the pressing surface, e.g. tip or head comprising protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges
    • H01L2924/20755—Diameter ranges larger or equal to 50 microns less than 60 microns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges
    • H01L2924/20756—Diameter ranges larger or equal to 60 microns less than 70 microns

Definitions

  • the present invention relates to a method and apparatus for making radio frequency (RF) inlays and the resulting inlay, and more particularly to a method and apparatus for making high frequency RF devices that include an integrated circuit and an antenna affixed to a substrate material.
  • RF radio frequency
  • An RF inlay is generally understood to be an integrated circuit and antenna joined together on some type of substrate. Typically, the inlay is subjected to further processing to make a final product. Further processing may include adding additional outer layers of material such as plastic to make a card-shaped device. Other finishing techniques may form the inlay into a variety of final forms depending upon the final application of the product.
  • the integrated circuit is inductively coupled to one or more interrogating devices or readers through the antenna by means of radio frequency communication.
  • the integrated circuit or chip contains information that is useful for performing various tasks.
  • One type of information is identification information pertaining to the holder or user of the RF device.
  • the RF device may also be referred to as a radio frequency identification (RFID) device. Not all RF devices necessarily contain information about the identity of the user and some RF devices contain information in addition to the identity of the user.
  • RFID radio frequency identification
  • RF inlays in their finished form are used in a variety of applications.
  • RFID inlays are used for making security access devices (RFID devices) or may be used for other applications that may or may not involve identification of the user, including but not limited to access to computer or computer networks and databases, public transportation passes, toll way access passes, vending machine payment devices, and bank debit and/or credit cards and passports.
  • RFID inlays or RFID prelams (transponders that have been subjected to a lamination process) to store identification data and to allow efficient and rapid transfer of the identification data for processing by appropriate governmental agencies.
  • the identification data may include biometric data, such as fingerprints, and/or photos of the passport holder, as well as information identifying the holder.
  • a substrate of one or more layers is processed in various steps including hot and/or cold lamination.
  • a chip and antenna subassembly is incorporated in one or more of the layers and the layers are joined together by adhesives or by softening the plastic layer and, by means of pressure, joining the layers together.
  • wire is affixed to or embedded within a substrate in the form of an antenna and the opposing ends of the antenna coil are attached to the terminals of an integrated circuit (IC or chip) or to the terminal areas of a chip module.
  • a chip module as that term is used herein comprises an integrated circuit attached to a lead frame having enlarged terminal areas.
  • the terminal areas of the chip are connected to the enlarged terminal areas of the lead frame by either extremely small and delicate wires, on the order of 20 to 28 microns in diameter, or through a conductive adhesive such as in the case of a flip chip.
  • the chip and the electrical connections to the terminal areas of the lead frame are encased in an epoxy layer for protection.
  • the combination or subassembly of the chip/chip module and the coil of wire that forms an antenna is sometimes referred to as a transponder.
  • the wire forming the antenna may be embedded fully or partially within the substrate by use of an ultrasonic wire embedding technique, as understood by those skilled in the art.
  • the chip/chip module may be secured to the substrate by either placing it on the surface of the substrate or by placing it in a recess formed in the substrate. Adhesive may or may not be used to adhere the chip/chip module to the substrate.
  • the ends of the coil of wire may be bonded or connected to the terminal areas of the chip or chip module at about the same time as the wire is embedded in the substrate, or the bonding may be done in a separate or subsequent manufacturing step.
  • the wire used in the manufacture of RF inlays where the wire is ultrasonically embedded in a substrate, is 110 to 120 microns in diameter, which includes an outer insulating layer.
  • the wire is insulated to prevent short-circuiting of the antenna, as the windings of wire forming the antenna are closely positioned and may touch.
  • the insulation layer is typically made from polyurethanes, polyvinylbutyrals, polyamides, polyesterimids and similar compounds. Thicker or larger diameter wires, compared to thinner or smaller diameter wires, are more easily handled and typically provide a farther read range when inductively coupled to a reader. Larger diameter wires are also more robust and are susceptible to removal from an RF device without damage to their integrity or the operation and functionality of the transponder.
  • transponder subassembly chip/chip module and antenna
  • U.S. Patent Nos. 6,698,089 and 6,233,818 disclose methods of making an RF device wherein at least one chip and one antenna are affixed to a chip mounting board or substrate.
  • the wire forming the antenna is embedded in the substrate by use of an ultrasonic generator.
  • the insulated antenna wire is first fixed to the substrate.
  • the insulated wire is then guided directly over and away from a terminal area of the RFID chip and embedded to the substrate on the opposite side of the chip from the first embedding location to linearly align the wire between the two fixed locations and directly across the terminal area.
  • the antenna is formed by embedding the insulated wire into the substrate at a location spaced from the chip and terminal areas, the antenna being formed with a specific number of turns of the wire.
  • the antenna wire is then guided over another terminal area of the RFID chip and finally embedded on the opposite side to anchor the second end of the wire directly across the other terminal area of the chip.
  • the wire is then cut and the embedding head (or embedding tool) moves to a second transponder site on the substrate to repeat the same process.
  • the wire portions passing directly over the terminal areas of the RFID chip are interconnected to the terminal areas by means of thermal compression bonding.
  • the wire may be embedded as described and the chip subsequently positioned in a pre-designated recess where the terminals of the chip will contact the previously secured wire. The ends of the wire then will be bonded to the terminal areas of the chip by means of thermal compression bonding.
  • U.S. Patent 6,088,230 describes an alternative process where a first end of the wire is positioned in contact with a first terminal area of a chip or chip module and is bonded to the first terminal area, then the embedding tool embeds the wire in the substrate to form an antenna, and then the wire is positioned over a second terminal area of the chip or chip module where it is bonded to the terminal area.
  • the present invention may utilize small diameter wire, for example 60-micron wire diameter or less.
  • thinner wire the ability to successfully remove a chip and antenna assembly from an existing product, such as a passport, is substantially reduced as the antenna and/or its connection to the chip or chip module will likely be destroyed upon any attempted removal.
  • thinner wire also places a greater significance on the bond between the wire and chip terminals. When using thinner wire, flaws or defects in the bonding process can lead to weak and/or faulty bonds.
  • the wire that is used to form the antenna often includes an outer insulation or coating.
  • the antenna wire is bonded to the terminal area or bond pad by a high-energy thermal compression bonding technique.
  • the technique involves the application of a high voltage arc through a thermal bonding head that causes removal of the insulation, and simultaneously creates a localized weld that electrically connects the wire to the designated terminal.
  • a higher voltage is required to be used with thermal bonding process in order to accomplish both removal of the insulation and bonding of the wire to the terminal area than if the wire was insulated.
  • the thermal bonding heads must be more frequently replaced, thereby increasing manufacturing costs, including a slowdown of production capacity while the heads are replaced.
  • a by-product or residue such as hydrocyanic acid or other compounds, may remain at the bond site. It is believed that one or more of these residues may oxidize over time thereby further degrading the quality of the bond site and potentially shortening the life of the transponder.
  • Making the antenna wire of a minimum size makes removal of the antenna more difficult since the wire is more prone to breakage or damage during an attempted removal.
  • a method and apparatus are provided for manufacturing RF inlays or similar devices.
  • it may be considered a method of making inlays.
  • it may be considered the apparatus or manufacturing equipment used for making the inlays.
  • it may be considered an apparatus for making the RF inlays, including various sub-combinations, that is, the various apparatus components to produce the RF inlay.
  • the present invention may be considered the resulting inlay device produced by the method or apparatus.
  • one or more wire embedding heads are used to embed antenna wire partially or fully into a substrate.
  • the embedding heads may form the wire into virtually any pattern including forming the windings of an antenna.
  • the substrate may accommodate one or a plurality of antennas.
  • a single antenna may correspond to a single inlay or two or more antennas may be positioned in close proximity to each other and correspond to a single inlay. In the latter case, the plurality of antennas may be connected to a common chip/chip module or to different chips/chip modules and function independently. If a plurality of embedding heads is utilized, the embedding heads may move in unison or independently.
  • the wire is cut and either the embedding head(s) move to the next site or the substrate moves relative to the embedding head(s) to position new transponder sites proximate the embedding heads.
  • the chip or chip module is placed on the substrate or in a recess formed in the substrate prior to any wire being embedded into the substrate.
  • the chip or chip module may be placed in position after or during the wire embedding process.
  • the present invention provides an alternative approach of embedding wire into a substrate as described in the previously identified prior art patents and other known prior art. Rather than embedding the wire on one side of the terminal area of the RFID chip or chip module, guiding the wire directly over the terminal area, then embedding the insulated wire into the substrate on the opposite side of the terminal area, forming the antenna and then positioning the insulated wire directly over a second terminal area of the RFID chip and embedding it again, it is proposed that the embedding and bonding process begin with the wire adjacent to and laterally offset from the terminal area of a chip or chip module and that the wire not be passed over the terminal area. Rather, the wire is embedded into the substrate to form an antenna with the two end portions of the wire forming the antenna, not embedded in the substrate.
  • the two end portions are positioned adjacent to and laterally offset from terminal areas of a chip or chip module. In one embodiment the full length of each of these end portions of wire are unsecured to the substrate.
  • the end portions of the wire are moved into a position over or in contact with the terminal areas of the chip or chip module. The wire ends are not brought into contact with the terminal areas until after the antenna is fully formed, and bonding does not occur until the antenna is fully formed.
  • a first length of the wire is embedded in the substrate with the beginning portion of the first length of wire extending out of the substrate.
  • This first length of wire is positioned adjacent to and laterally offset from a terminal area of a chip or chip module.
  • a next continuous length of wire is not embedded in the substrate but is placed over the substrate.
  • the next following length of wire is embedded into the substrate to form an antenna.
  • the next continuous length is positioned along the substrate but not embedded.
  • a length of wire is embedded in the substrate with the final portion of that length of wire extending out of the substrate. The last two lengths of wire are positioned adjacent to and laterally offset from the terminal areas of a chip or chip module.
  • the lengths of wire that are laterally offset from the terminal areas are then repositioned so that portions of those lengths of wire are positioned over or in contact with the terminal areas of the chip or chip module. These lengths of wire are not brought into contact with the terminal areas until after the antenna is fully formed.
  • a first end of the wire is affixed to or embedded in the substrate for a relatively short distance of approximately 0.5 to 1.0 centimeters, although this length may vary.
  • the ultrasonic transducer is then preferably turned off and the embedding head raised a distance away from the surface of the substrate. Because the prior length of wire is fixed to the substrate, a further or second length of wire is pulled from the wire supply as the embedding head is raised. The embedding head then moves parallel to the plane of the substrate causing more wire to be pulled from the wire supply. Then, the head is lowered to a position close to the substrate, the ultrasonic transducer is turned on, and a further length of wire is embedded in the substrate.
  • a portion of the wire is not fixed to or embedded in the substrate but rather forms a loop or bridge of wire extending above the plane of the substrate.
  • This loop of wire is formed at a position laterally offset from the terminal areas of the chip or the chip module, with the term laterally offset being defined by the plane of the substrate.
  • the loop of wire is formed perpendicular to the plane of the substrate, but this is not a requirement of the invention.
  • the process of fixing the wire to or embedding the wire in the substrate continues such that an antenna is formed on or in the substrate and then a second loop or bridge of wire is similarly formed at a second location on the substrate, typically but not necessarily on the opposite side of the chip or chip module from the first loop of wire.
  • the loops are formed at positions offset or spaced from the terminal areas and chip, and therefore no portion of the loops are positioned over or in contact with any portion of the chip or terminal areas.
  • a portion of the insulation material that encapsulates the antenna wire along a portion of the loops of wire is removed. More specifically, in a fourth embodiment, a laser is used to strip away the insulation from the wire along a discrete length of the loop portion of the wire.
  • the locations where the insulation has been stripped from the loops are the areas that will make electrical contact with and will be bonded to the terminal areas.
  • the loops are offset or spaced from the terminal areas such that the loops are not positioned directly over or in contact with the terminal areas of the chip or chip module. This positioning permits a laser to be focused on the loops of wire to remove a discrete portion of the insulation from the loops without striking or damaging the terminal areas or the chip itself.
  • the laser may damage the terminal areas and thereby impair the ability to bond the wire to the terminal area or cause an inferior bond to be formed, or it may directly damage the chip itself.
  • the apparatus includes a wire-displacing tool that is used to displace the loops in a position such that they may then be bonded to the designated terminal areas.
  • a pair of jaws or fork shaped elements are used to engage the loops of wire and to displace and reform the loops so that at least some portion of the wire loops are centered directly over and/or in contact with the terminal areas of a chip or chip module or an area or region where the terminal areas will ultimately be positioned.
  • other means may be provided to position the loops in contact with the terminal areas, such as by use of a brush or comb device.
  • the lengths of wire that are located adjacent to the terminal areas can simply be lengths of wire that lie on top of the substrate, e.g., are not fixed to or embedded in the substrate, and then are displaced over the terminal areas either by the forked shaped elements or other means, including but not limited to a brush, a comb or even manually.
  • One end of each length of wire could be unattached to the substrate thereby allowing each length of wire to be simply moved to a position in contact with the corresponding terminal area where the wires are to be attached.
  • a bonding element is provided that electrically connects the lengths of wire or loops of wire positioned over or in contact with the terminal areas to the designated terminal areas. Bonding does not occur until the antenna is fully formed.
  • these processing steps may all occur at a single location or may occur at multiple locations.
  • a single head element may include the ultrasonic embedding tools, the tool to reposition the lengths of wire over or in contact with the terminal areas, a laser and the bonding tool.
  • these tools may be positioned on two or more separate heads or each positioned on a separate tool head.
  • the substrate may be moved to different positions for some or all of these process steps while the tools remain stationary.
  • Fig. 1 is a fragmentary perspective view of a processing machine used to manufacture RF and/or RFID inlays
  • Fig. 2 is an enlarged plan view of a portion of an RF or RFID inlay specifically illustrating a chip module positioned on a substrate, and placement of opposing ends of the antenna coil adjacent the chip module;
  • Fig. 3 is another enlarged plan view illustrating the opposing ends of the antenna coil secured to the terminal areas of the chip module;
  • Fig. 4 is an enlarged fragmentary perspective view of the inlay of Fig. 2 illustrating the chip module and antenna coil including portions of the opposing ends of the antenna coil configured in loop shapes prior to attachment of the ends to the terminal areas;
  • Fig. 5 is an enlarged fragmentary perspective view of Fig. 3 illustrating the inlay wherein portions of the opposing ends of the antenna coil are secured to the terminal areas of the chip module;
  • Fig. 6 is a schematic view illustrating working components of the processing machine for manufacture of the RF and/or RFID inlay, and specifically illustrating (i) an embedding tool for securing the antenna coil to a substrate (ii) a laser for removing insulation from an insulated wire and (iii) a wire displacing tool for displacing the antenna wire loops prior to bonding to the terminal areas;
  • Fig. 7 and 8 are schematic views of the embedding tool illustrating the sequence by which the opposing ends of the antenna coils are located adjacent to the chip module;
  • Fig. 9 is another schematic view illustrating another processing step for manufacture of the RF and/or RFID inlay wherein a laser is used to remove insulation material from the insulated wire forming the antenna coil;
  • Fig. 10 is a greatly enlarged elevation view illustrating the laser that has stripped the insulation material away from a designated location on the insulated wire
  • Fig. 11 is a plan view illustrating the location of the laser beam that strips the insulation material and the spaced orientation of the laser to prevent damage to the chip module;
  • Fig. 12 is a fragmentary perspective view of the wire-displacing tool prior to engaging the wire loops
  • Fig. 13 is an enlarged end view taken along line 13-13 of Fig. 12 illustrating one of the jaw assemblies and its orientation with respect to one of the wire loops to be engaged
  • Fig. 14 is an elevation view of the wire-displacing tool wherein the tool has been lowered and the lower surfaces of the jaw assemblies are placed in contact with the upper surface of the substrate
  • Fig. 15 is an enlarged end view similar to Fig. 13 but showing the jaw assembly in the lowered position of Fig. 14 and showing the back or opposite side of the jaw assembly
  • Fig. 16 is a perspective view showing the wire-displacing tool after the wire loops have been engaged and displaced by movement of the jaw assemblies;
  • Fig. 17 is an elevation view of the wire-displacing tool in the position of the tool shown in Fig. 16;
  • Fig. 18 is a perspective view showing the jaw assemblies disengaged from the wire loops after the loops have been displaced.
  • Fig. 19 is a schematic view of a thermal bonding head that creates the thermal compression bond between the antenna wire and the terminal area of a chip or chip module and the resulting electrical connection between the exposed conductors on the wire portions and the respective terminal areas;
  • Fig. 20 is a schematic view of an embedding tool such as a sonotrode having a length of residual wire extending from the end of the capillary tube having been previously cut following completion of wire placement in an RF device;
  • Fig. 21 is a schematic view of the embedding tool in a raised position wherein an additional length of wire is dispensed from the tool compared to that of Fig. 20;
  • Fig. 22 is an enlarged plan view of a portion of another RF or RFID inlay wherein the opposing ends of the antenna coil placed adjacent the chip module are not formed as loops, but rather are angular extensions, but still being offset or spaced from the terminal areas;
  • Fig. 23 illustrates the displacement of the angular extensions by brushing or combing them over the terminal areas so that the extensions may then be thermally bonded to the terminal areas.
  • a chip module is shown in the foregoing described figures, a chip may be substituted for a chip module (or vice versa) without departing from the scope of the present invention.
  • the wire shown in Figs. 1-23 is insulated unless otherwise indicated. However, it should be appreciated that uninsulated wire could be used with the present invention, provided care was taken to avoid creating a short circuit. In this case, the insulation removal step would be omitted.
  • Fig. 1 illustrates one embodiment of a processing apparatus or machine 10 for manufacturing RF and/or RFID inlays.
  • the machine 10 may be generally described as including a power drive group 12, a flexible communications bus 14 that transfers operational instructions from a computer processor (not shown) and power to the worldng components of the machine.
  • the bus 14 may facilitate the transfer of electronic signals between the processor and the working elements 16 of the machine that creates the inlays.
  • the working elements 16 may include a group or combination of one or more embedding tools, lasers, wire cutters and thermal bonding heads.
  • the working elements 16 traverse laterally across a support table 24 that secures a substrate 26 forming the bodies of the inlays.
  • a support table 24 that secures a substrate 26 forming the bodies of the inlays.
  • a lateral slide rail 18 allows the worldng elements 16 to traverse in the lateral direction across the substrate 26.
  • a longitudinal frame 20 secured to the lateral side rail 18 allows the machine to traverse or index in the longitudinal direction along longitudinal side rails 22.
  • the dashed or phantom lines 28 designate or outline the prospective individual inlay devices to be formed from the common substrate 26.
  • Reference number 30 is a chip or chip module previously placed on the substrate, or designates a recess where a chip or chip module may be placed in the future.
  • each inlay device has at least one transponder comprising an integrated circuit chip or chip module and a wire antenna that is connected to the chip or chip module.
  • a CNC or similar controller controls the positioning and movement of the worldng elements 16 relative to the substrate 26.
  • the device includes the substrate 26, typically made of a thermoplastic material or other material receptive to wire embedding (or may comprise a layer of material receptive to wire bonding affixed to the surface of a substrate, such as an adhesive layer), a chip module 34, and an antenna element formed by a continuous length of wire 32.
  • the chip module 34 in a known construction includes an integrated circuit 36 and at least one pair of terminal pads or terminal areas 40. Bonding pads 38 formed on the integrated circuit 36 are electrically connected to the terminal areas 40 by means of one or more very small leads or conductors 42.
  • a protective layer of material such as epoxy 44 covers the integrated circuit 36, portions of the respective terminal areas 40 and the interconnecting conductors 42.
  • the chip module may be constructed and assembled in other ways known to those of skill in the art or the integrated circuit 36 may be used in place of a chip module 34, in which case the antenna wire 32 is directly bonded to the bonding pads 38.
  • the portions of the insulated wire 32 shown in Figs. 2 and 3 are the opposing ends of the wire that form the antenna, although this is more easily seen and understood with reference to Figs. 4 and 5. During manufacture, portions of the opposing ends of the wire are formed into a loop or bridge above the surface of the substrate, as shown in Fig. 4.
  • each loop is then bonded to the respective terminal areas 40 at bonding points 48.
  • the loops are displaced for purposes of bonding a portion of the loops to the terminal areas. Nonetheless, it should be understood that the loops may be displaced before the wire embedding process is completed.
  • both ends of a loop must be secured in some fashion, such as embedded in or affixed to the substrate at points 46, before the loop may be displaced. If only one end is fixed in place and the other end is not fixed to the substrate or otherwise secured in some manner, displacement of the loop will not work in a reliable or repeatable manner. As will be appreciated in connection with other embodiments, one end of the wire may be loose or not fixed to the substrate.
  • the device is shown wherein the antenna element is formed in a plurality of tracks or concentrically arranged coils 50.
  • the opposing ends of the wire 32 are formed as loops 47 that extend generally orthogonally above the upper surface of the substrate and adjacent to but not over any portion of the chip module 34. As smaller diameter wire is used, the loop may not extend orthogonally to the substrate but may take a different position.
  • the protruding loops 47 and their spaced arrangement from the chip module allows a selected amount of insulated material to be removed from the wire prior to electrical bonding of the wire to the terminal areas.
  • the insulated wire 32 has been displaced such that the wire loops are forced to a position directly above or into contact with the terminal areas 40. Portions of the wire loops are then thermally bonded to the terminal areas to make an electrical connection.
  • Fig. 6 illustrates further details of the working elements 16 of the machine 10.
  • the working elements 16 include at least one embedding tool 52 that is used to embed the insulated wire 32 fully or partially into the substrate 26.
  • the embedding tool 52 utilizes high frequency or ultrasonic oscillation in order to embed the insulated wire into the substrate.
  • the embedding tool travels in a preprogrammed pattern under the direction of a processor or controller to form the desired shape or pattern for the antenna.
  • the insulated wire 32 is dispensed from the tip 53 of the embedding tool.
  • the insulated wire that is dispensed but not yet attached to the substrate 26 is shown as insulated wire 54.
  • a tube 55 positioned adjacent the embedding tool can be used to deliver a flow of air to cool the embedding head.
  • the other working elements 16 include at least one laser 56 that is used to remove the insulation material from the insulated wire, at least one wire displacing tool 58 that displaces the wire loops to the positions shown in Figs. 3 and 5 such that wire may then be secured to the terminal areas, and a wire cutter (not shown) that cuts the wire and permits the machine to move relative to the substrate and form the next antenna.
  • the elements 16 may move together as a single group to make the inlays, or various combinations of the elements 16 may be positioned at different locations or individually positioned at different locations to most efficiently manufacture an array of inlays formed from the common or separate substrate 26.
  • the embedding tool 52 must travel in a pre-determined pattern to dispense the wire such that the loops and concentric windings are formed without breaking continuity in the wire.
  • a first step in the process is to form one of the loops 47 generally proximate to but laterally offset from the chip module 34 relative to the plane of the substrate 26.
  • the wire is affixed to the substrate in the form of an antenna pattern and then the embedding tool forms the second loop 47 generally proximate to but offset from an opposite side of the chip module. It should be appreciated that the location of the formed loops of wire is generally proximate the location of the respective terminal areas to which each loop of wire will be attached.
  • the insulated wire is cut, and the embedding tool 52 may then move to the next location on the substrate for formation of the next antenna, the substrate is moved relative to the embedding tool or some combination of relative movement occurs between the embedding tool and substrate.
  • FIG. 7 an operational sequence of the embedding tool 52 is illustrated for forming the second loop of the pair of loops 47, but it should be appreciated that the process is nearly identical for forming the first loop. From left to right in Fig. 7, the sequence is shown as dispensing the wire from the tool 52 and embedding the insulated wire 32 in the substrate 26, then upward movement of the embedding tool 52 to raise the insulated wire to a designated height H above the upper surface of the substrate 26 while sequentially or simultaneously turning off the ultrasonic source, and then horizontally traversing the embedding tool at the designated height for a desired distance forming a wire loop 47 of a generally known length. Referring to Fig.
  • the embedding tool 52 is then moved downward, the ultrasonic source is turned on and the end of the wire is embedded in the substrate 26 for a distance. At this point, the insulated wire can be cut and the embedding tool can move to the next station on the substrate to form the next antenna pattern.
  • the embedding tool forms the first loop 47 in the same general sequence as described with reference to Figs. 7 and 8. However, instead of cutting the wire after formation of the loop, the embedding tool continues embedding wire to form the antenna and the second loop.
  • the wire must be affixed to the substrate at 46, on both sides of the loops or otherwise secured in some fashion, in order for the loops to be displaced in subsequent handling.
  • Figs. 9-11 the insulation removal aspect of the invention is shown in operation.
  • the laser 56 generates a laser or ultraviolet light beam 57 that contacts a defined portion of the loops 47 in order to remove a selected amount of insulation.
  • the laser beam 57 is directed to remove the designated portion of the insulation material 72, thereby exposing the interior metal conductor 74.
  • a circular pattern 76 represents that portion of the substrate contacted by the laser beam 57.
  • the size and shape of the beam emitted by the laser may be altered to meet system requirements and space limitations. It is noted that the laser beam 57 does not strike any portion of the chip or chip module 34, thereby preventing any damage to the chip, chip module or their respective terminal areas. The gap or distance D between the insulated wire and the chip module ensures the insulation material can be safely removed without contaminating or damaging the bond site with controlled use of the laser.
  • the laser 56 is shifted or indexed from one loop to the next in order to sequentially treat each loop.
  • a protective jacket or shroud (not shown) may be utilized in combination with the laser 56 to restrict inadvertent reflection of the laser light towards the chip module or towards the operator of the equipment.
  • a temporary protective pad (not shown) directly underneath the wire loop being treated with the laser such that the laser does not burn a hole through or otherwise irreparably damage the substrate.
  • the protective pad could be incorporated in a controllable arm that is incorporated with the working elements 16 wherein the pad is placed during operation of the laser, and then retracted.
  • the wire-displacing tool 58 is shown in operation.
  • the construction of the tool 58 is characterized by (i) a frame 60, (ii) a pair of vertical supports 62, (iii) a pair of jaw assemblies 63 wherein each jaw assembly includes a pair of spaced jaws 64, and (iv) a pair of springs 68 that bias the rotational movement of the jaw assemblies 63 about respective pins 70.
  • Each of the jaws 64 includes a notch 66 that engages the loops 47 as discussed below.
  • the wire-displacing tool 58 is lowered from the position of Fig.
  • a central arch 65 of each of the jaw assemblies 63 allows the jaw assemblies to move toward the chip or chip module without the jaws or any other portion of the jaw assemblies striking the chip or chip module and, therefore movement of the jaws does not risk changing the position of the chip or chip module.
  • the jaws are moved toward one another so that each loop 47 is engaged with one of the pairs of jaws and the wire loops are secured in the notches 66.
  • the loops are displaced by respective movement of the jaws toward a terminal area of a chip or chip module. More specifically, the wire comprising the loops 47 bends or deforms in response to the inward movement of the jaws.
  • the shape of the deformed loop comprises three distinct linear segments due to the location fo the embedded or fixed areas 46 and the shape of the notches 66 of the jaw assemblies 63 which cause the loop to bend at location 49 as well as at location 46.
  • the loops therefore are displaced to a position directly above and perhaps in contact with at least a portion of the terminal areas 40.
  • the jaw assemblies have been disengaged and the wire loops have been displaced to a position where they can then be bonded to the respective or corresponding terminal areas.
  • the inward or pinching movement of the opposed jaws is limited by adjustable physical stops which prevent the jaws from too large of a movement which could dislodge portions of the wire fixed in the substrate at point 46 and thereby potentially misposition the loop wire relative to the terminal areas of the chip or chip module.
  • the length of wire forming each loop 47 and its height H together with the shape or profile of the jaws define the maximum distance the jaws 64 may move.
  • the distance D at which the wire 32 is offset from the chip module 34 may be adjusted by adjusting the height H and/or length of the loop of wire.
  • FIG. 19 another working element 16 is shown, namely, the thermal bonding head 80 that is used to electrically bond the loops 47 that have been displaced the position above the respective terminal areas 40.
  • the thermal bonding head 80 is shown as compressing one of the loops 47 in contact with one of the terminal areas 40.
  • the thermal bonding head generates a voltage sufficient to electrically bond the loops to the terminal areas.
  • the bonding head 80 is indexed or shifted from one bonding site to the next in order to sequentially bond each loop to its corresponding terminal area.
  • FIG 20 illustrates an example of an embedding device such as an ultrasonic sonotrode 90.
  • the sonotrode includes a manifold 92 which houses a capillary tube 94 and a compressed air channel 96 that communicates with the capillary tube 94.
  • the wire 32 is routed through the capillary tube so that it can be dispensed from the distal tip 98 of the sonotrode.
  • a wire clamping mechanism 102 controls the feed of wire.
  • the clamping mechanism jaws close together to prevent feed of the wire.
  • the compressed air can control the rate at which the wire is dispensed from the capillary tube when the jaws are open.
  • the wire 32 is cut leaving a residual amount of wire 100 extending from the distal tip of the embedding tool. This residual amount is equal in length to the distance between the embedding tool and the cutting tool (not shown). This residual amount of wire is used for the next RF site to be manufactured.
  • the embedding tool is shown in a raised position relative to the substrate.
  • a greater length of residual wire is shown compared to that shown in Fig. 20.
  • the additional length may be created by forcing air through channel 96 to push a length of wire out of the sonotrode.
  • the wire may be embedded or fixed to the substrate and an additional length of wire drawn from the wire supply by moving the sonotrode.
  • the ends of the coil wire 104 are arranged as angular extensions from the embedded coil and they do not contact any part of the chip module 34. Rather, the ends 104 simply lay on the substrate adjacent to the chip module. These angular extensions may be formed by simultaneously moving the ultrasonic head and forcing air through channel 96 to expel wire from the device. Once the length of wire has been arranged on the substrate, the coil 50 is formed. Then another length of the wire is positioned generally as shown to form the second angular extension. It is also alternatively contemplated that the wire ends 104 could have a very small length thereof that is embedded which helps to stabilize the position of the length of wire prior to repositioning and bonding to a terminal area.
  • the angular extensions are moved into position over the terminal areas as shown in Figure 23 for interconnection with the terminal areas. If any portion of the wire ends 104 are embedded, the force of the element displacing the wire ends overcomes the embedding force.
  • the angular extensions can be brushed or combed into position, such as by a rotating brush or comb 106.
  • the brush or comb 106 can be another element incorporated in the group of working elements 16.
  • the angular extensions may be gripped and rotated into position. The gripping may be accomplished by a machine or device, or manually by an operator. Once the angular extensions are placed over the terminal areas, the wire ends can be thermally bonded as discussed above.
  • One possible sequence for laying the antenna as shown in the embodiment of Figures 22 and 23, comprise the following: first, a length of wire is extended from the embedding head to form a first angular extension.
  • the wire end 104 of the first angular extension may simply lie on the substrate, or a very small length thereof may be embedded in the substrate.
  • the embedding tool then traverses across the substrate in an angular fashion to not lay the wire over any portion of the chip module, but to remain offset from the chip module.
  • the embedding tool travels to the periphery of the substrate and then begins laying the concentric coils to form the antenna. Upon formation of the last coil, the embedding tool travels in an angular orientation to form the second angular extension.
  • the embedding tool does not traverse over any portion of the chip module.
  • the insulated wire is cut at a position so that the angular extensions are approximately the same length, and have approximately the same angular orientation with respect to the opposite sides of the terminal areas.
  • the angular extension may have different lengths and/or orientations provided the relocation equipment can position the lengths of wire in contact with the terminal areas.
  • a device such as the brush or comb 106, is then used to displace the angular extensions over the designated portions of the chip module, such as the terminal areas, for electrically connecting the angular extensions to the chip module.
  • a manufacturing process is provided for manufacturing RF inlays or transponder devices wherein an improved electrical bond may be achieved between the antenna and terminal areas of the chip module by use of a laser that effectively removes all of the insulation from a designated portion of the wire loops.
  • the creation of the protruding loops spaced from the chip module allows the laser to operate without damaging the chip module or any other portions of the inlay or transponder device. This, in turn, allows use of smaller diameter insulated wire which makes the final RF device less susceptible to physical tampering.
  • the working elements of the processing machine may be integrated in a group such that a single processing machine may be used to fully fabricate the inlay, thereby eliminating the need for additional processing machines or non-cooperating manufacturing components. Alternatively, the processing tools may be separately located or separately co-located in different combinations.
  • the thermal compression bonding head can be operated at a lower voltage, thereby extending the life of the thermal compression bonding head. Additionally, the lower voltage is also compatible with and facilitates the use of smaller diameter wire. The lower voltage can be used to adequately bond the antenna wire to the terminal without completely destroying the wire conductor that could otherwise occur with a head that operates at much higher voltages.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing & Machinery (AREA)
  • Details Of Aerials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Near-Field Transmission Systems (AREA)

Abstract

La présente invention concerne un procédé et un dispositif pour réaliser des incrustations de fréquences radio (RF). Les incrustations RF comprennent un circuit intégré et une antenne apposée à un matériau de substrat portant le circuit intégré. Pendant le traitement, des parties du câble formant l'antenne sont situées de manière adjacente à, mais pas directement sur le circuit intégré de sorte que le câble puisse être soumis à un autre traitement, tel que le retrait de l'isolation sans endommager le circuit intégré. Dans l'étape de traitement subséquente, les extrémités du câble sont amenées en contact avec les zones terminales de circuit intégré et fixées à celles-ci. Des procédés de la présente invention comprennent la formation de boucles avec les extrémités du câble, les boucles s'étendant au-dessus d'un plan du substrat, et dans une autre étape de traitement les boucles sont déplacées pour être connectées électriquement aux zones terminales. Des procédés comprennent également le repositionnement du câble et l'utilisation d'un dispositif à brosse ou à peigne.
PCT/IB2007/004589 2006-09-26 2007-09-26 Procédé et dispositif pour créer une incrustation de fréquence radio Ceased WO2008114091A2 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020097008529A KR101346050B1 (ko) 2006-09-26 2007-09-26 트랜스폰더 칩 및 관련 인레이 기판에의 안테나 연결 방법
AU2007349611A AU2007349611C1 (en) 2006-09-26 2007-09-26 Method of connecting an antenna to a transponder chip and corresponding inlay substrate
CA002664872A CA2664872A1 (fr) 2006-09-26 2007-09-26 Procede et dispositif pour creer une incrustation de frequence radio
JP2009529801A JP5408720B2 (ja) 2006-09-26 2007-09-26 アンテナをトランスポンダチップおよび対応するインレイ基板に接続する方法
CN2007800413375A CN101627400B (zh) 2006-09-26 2007-09-26 连接天线到应答器芯片和相应的嵌件基底的方法
EP07872847A EP2070013A2 (fr) 2006-09-26 2007-09-26 Procédé et dispositif pour créer une incrustation de fréquence radio

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US82692306P 2006-09-26 2006-09-26
US60/826,923 2006-09-26
US82986206P 2006-10-17 2006-10-17
US60/829,862 2006-10-17
US11/733,756 2007-04-10
US11/733,756 US7546671B2 (en) 2006-09-26 2007-04-10 Method of forming an inlay substrate having an antenna wire
US91375307P 2007-04-24 2007-04-24
US60/913,753 2007-04-24

Publications (2)

Publication Number Publication Date
WO2008114091A2 true WO2008114091A2 (fr) 2008-09-25
WO2008114091A3 WO2008114091A3 (fr) 2009-01-22

Family

ID=39766548

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2007/004589 Ceased WO2008114091A2 (fr) 2006-09-26 2007-09-26 Procédé et dispositif pour créer une incrustation de fréquence radio

Country Status (6)

Country Link
EP (1) EP2070013A2 (fr)
JP (1) JP5408720B2 (fr)
KR (1) KR101346050B1 (fr)
AU (1) AU2007349611C1 (fr)
CA (1) CA2664872A1 (fr)
WO (1) WO2008114091A2 (fr)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7707706B2 (en) 2007-06-29 2010-05-04 Ruhlamat Gmbh Method and arrangement for producing a smart card
WO2011023159A1 (fr) * 2009-08-26 2011-03-03 Melzer Maschinenbau Gmbh Procédé et dispositif pour fabriquer un ensemble transpondeur
WO2011154061A1 (fr) * 2010-06-07 2011-12-15 Feinics Amatech Teoranta Montage et connexion d'un conducteur d'antenne dans un transpondeur
JP2012114372A (ja) * 2010-11-26 2012-06-14 Toppan Printing Co Ltd ワイヤ導体の配設方法及びモジュール基板
EP2492847A1 (fr) * 2011-02-25 2012-08-29 NagraID S.A. Carte incorporant un transpondeur
ITMO20110331A1 (it) * 2011-12-22 2013-06-23 Fabele S R L Metodo e apparato per la realizzazione di un dispositivo di identificazione a radio frequenza dotato di antenna realizzata con un filo elettricamente conduttore
WO2014008937A1 (fr) 2012-07-12 2014-01-16 Assa Abloy Ab Procédé de fabrication d'une pièce rapportée fonctionnelle
US10078402B2 (en) 2012-05-31 2018-09-18 Zytronic Displays Limited Touch sensitive displays
US10262906B2 (en) 2014-12-15 2019-04-16 Assa Abloy Ab Method of producing a functional inlay and inlay produced by the method
DE102018005569A1 (de) * 2018-07-13 2020-01-16 Mühlbauer Gmbh & Co. Kg Vorrichtung und Verfahren zur Herstellung von RFID Transpondern
GB2576498A (en) * 2018-08-14 2020-02-26 The Francis Crick Institute Ltd Forming electrical connection between wire electrode and metallic contact surface
WO2021138061A1 (fr) * 2020-01-03 2021-07-08 Sensormatic Electronics Llc Étiquette rfid et son procédé de fabrication

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5886174B2 (ja) * 2012-11-16 2016-03-16 株式会社トッパンＴｄｋレーベル 非接触通信媒体の製造方法、非接触通信媒体、及びアンテナと回路装置の接続方法
KR101427339B1 (ko) * 2013-12-24 2014-08-06 주식회사포지스 알에프아이디 카드 및 그 제조방법
KR102001243B1 (ko) * 2017-11-28 2019-07-17 신혜중 다중 와이어를 선으로 하는 안테나 선 형성을 위한 와이어 임베딩 헤드
US20240244758A1 (en) * 2023-01-16 2024-07-18 Sciperio, Inc Wire Dispensing Device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010054230A1 (en) 1996-02-12 2001-12-27 David Finn Method and device for bonding a wire conductor
DE102004045896A1 (de) 2004-09-22 2006-03-30 Mühlbauer Ag Transponder mit Antenne und Flip-Chip-Modul und Verfahren zu dessen Herstellung

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2146989T3 (es) * 1996-02-12 2000-08-16 David Finn Procedimiento y dispositivo para el contacto de un conductor de hilo.
DE102004011929A1 (de) * 2004-03-11 2005-09-29 Conti Temic Microelectronic Gmbh Verfahren zur Herstellung einer Bondverbindung zwischen elektrischen Kontaktflächen

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010054230A1 (en) 1996-02-12 2001-12-27 David Finn Method and device for bonding a wire conductor
DE102004045896A1 (de) 2004-09-22 2006-03-30 Mühlbauer Ag Transponder mit Antenne und Flip-Chip-Modul und Verfahren zu dessen Herstellung

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7707706B2 (en) 2007-06-29 2010-05-04 Ruhlamat Gmbh Method and arrangement for producing a smart card
WO2011023159A1 (fr) * 2009-08-26 2011-03-03 Melzer Maschinenbau Gmbh Procédé et dispositif pour fabriquer un ensemble transpondeur
KR101455770B1 (ko) 2010-06-07 2014-10-28 주)아마텍코리아 트랜스폰더에 있어서 안테나선의 설치 및 접속
WO2011154061A1 (fr) * 2010-06-07 2011-12-15 Feinics Amatech Teoranta Montage et connexion d'un conducteur d'antenne dans un transpondeur
US9104955B2 (en) 2010-06-07 2015-08-11 Feinics Amatech Teoranta Sonotrode with cutting mechanism
JP2012114372A (ja) * 2010-11-26 2012-06-14 Toppan Printing Co Ltd ワイヤ導体の配設方法及びモジュール基板
EP2492847A1 (fr) * 2011-02-25 2012-08-29 NagraID S.A. Carte incorporant un transpondeur
WO2013093826A1 (fr) * 2011-12-22 2013-06-27 Fabele - S.R.L. Procédé et appareil permettant de fabriquer un dispositif d'identification par radiofréquence pourvu d'une antenne composée d'un fil électroconducteur
ITMO20110331A1 (it) * 2011-12-22 2013-06-23 Fabele S R L Metodo e apparato per la realizzazione di un dispositivo di identificazione a radio frequenza dotato di antenna realizzata con un filo elettricamente conduttore
US10078402B2 (en) 2012-05-31 2018-09-18 Zytronic Displays Limited Touch sensitive displays
WO2014008937A1 (fr) 2012-07-12 2014-01-16 Assa Abloy Ab Procédé de fabrication d'une pièce rapportée fonctionnelle
US10262906B2 (en) 2014-12-15 2019-04-16 Assa Abloy Ab Method of producing a functional inlay and inlay produced by the method
DE102018005569A1 (de) * 2018-07-13 2020-01-16 Mühlbauer Gmbh & Co. Kg Vorrichtung und Verfahren zur Herstellung von RFID Transpondern
CN112384931A (zh) * 2018-07-13 2021-02-19 米尔鲍尔有限两合公司 用于制造rfid应答器的装置和方法
GB2576498A (en) * 2018-08-14 2020-02-26 The Francis Crick Institute Ltd Forming electrical connection between wire electrode and metallic contact surface
WO2021138061A1 (fr) * 2020-01-03 2021-07-08 Sensormatic Electronics Llc Étiquette rfid et son procédé de fabrication
US11694057B2 (en) 2020-01-03 2023-07-04 Sensormatic Electronics, LLC RFID tag and method of making same

Also Published As

Publication number Publication date
EP2070013A2 (fr) 2009-06-17
KR20090066309A (ko) 2009-06-23
JP2010541189A (ja) 2010-12-24
KR101346050B1 (ko) 2013-12-31
CA2664872A1 (fr) 2008-09-25
JP5408720B2 (ja) 2014-02-05
AU2007349611B2 (en) 2012-02-09
WO2008114091A3 (fr) 2009-01-22
AU2007349611C1 (en) 2015-08-06
AU2007349611A1 (en) 2008-09-25

Similar Documents

Publication Publication Date Title
AU2007349611C1 (en) Method of connecting an antenna to a transponder chip and corresponding inlay substrate
US8286332B2 (en) Method and apparatus for making a radio frequency inlay
US7971339B2 (en) Method and apparatus for making a radio frequency inlay
US7546671B2 (en) Method of forming an inlay substrate having an antenna wire
EP2577570B1 (fr) Montage et connexion d'un conducteur d'antenne dans un transpondeur
AU709049B2 (en) Process and device for contacting a wire conductor
US6698089B2 (en) Device for bonding a wire conductor
US7581308B2 (en) Methods of connecting an antenna to a transponder chip
CN104471593B (zh) 功能嵌体的制造方法
UA54374C2 (uk) Спосіб виготовлення модуля мікросхемної карти для безконтактних мікросхемних карт
US20100230151A1 (en) Circuit layout and method and device for producing a circuit pattern on a substrate
JP5167264B2 (ja) 無線周波数インレイを作製する方法および装置
SG174832A1 (en) Method and apparatus for making a radio frequency inlay
AU2007358536B2 (en) Method of connecting an antenna to a transponder chip and corresponding inlay substrate
WO2008037592A1 (fr) Procédé de connexion d'une antenne à une puce de transpondeur et incrustation de transpondeur correspondante
KR20150100047A (ko) 트랜스폰더 칩 및 이에 대응되는 인레이 기판에 안테나 연결시 생성되는 용접 탄화물의 제거방법
EP2070017A1 (fr) Procédé de connexion d'une antenne à une puce de transpondeur et incrustation de transpondeur correspondante

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200780041337.5

Country of ref document: CN

ENP Entry into the national phase

Ref document number: 2009529801

Country of ref document: JP

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 2007349611

Country of ref document: AU

ENP Entry into the national phase

Ref document number: 2664872

Country of ref document: CA

NENP Non-entry into the national phase

Ref country code: DE

REEP Request for entry into the european phase

Ref document number: 2007872847

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2007872847

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 2007349611

Country of ref document: AU

Date of ref document: 20070926

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 1020097008529

Country of ref document: KR

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07872847

Country of ref document: EP

Kind code of ref document: A2