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WO2008111391A1 - 高周波パッケージ - Google Patents

高周波パッケージ Download PDF

Info

Publication number
WO2008111391A1
WO2008111391A1 PCT/JP2008/053292 JP2008053292W WO2008111391A1 WO 2008111391 A1 WO2008111391 A1 WO 2008111391A1 JP 2008053292 W JP2008053292 W JP 2008053292W WO 2008111391 A1 WO2008111391 A1 WO 2008111391A1
Authority
WO
WIPO (PCT)
Prior art keywords
high frequency
dielectric substrate
multilayer dielectric
frequency device
frequency package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/053292
Other languages
English (en)
French (fr)
Inventor
Kousuke Yasooka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to US12/519,861 priority Critical patent/US8130513B2/en
Priority to EP08720878.1A priority patent/EP2124253B1/en
Priority to CN2008800017522A priority patent/CN101578697B/zh
Priority to JP2009503955A priority patent/JP4990353B2/ja
Publication of WO2008111391A1 publication Critical patent/WO2008111391A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H10W76/13—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H10W42/20—
    • H10W44/20—
    • H10W44/206—
    • H10W44/216—
    • H10W70/63—
    • H10W70/682—
    • H10W70/685—
    • H10W72/07552—
    • H10W72/50—
    • H10W72/521—
    • H10W72/5522—
    • H10W72/59—
    • H10W90/754—

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

　高周波デバイス２と、表層上に高周波デバイス２が搭載される多層誘電体基板２０と、この多層誘電体基板の表層の一部および高周波デバイス２を覆う電磁シールド部材としてのシールリング３およびカバー４を備える高周波パッケージにおいて、内部導体パッド５に、不要波の波長の略１／４の長さを有する先端開放線路５０を設ける。キャビティ空間に伝搬している不要放射は、ワイヤに結合して多層誘電体基板内層のバイアスラインを介して外部へ放射するので、ワイヤへの結合量を減らし、外部への不要放射量を低減することができる。
PCT/JP2008/053292 2007-03-14 2008-02-26 高周波パッケージ Ceased WO2008111391A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US12/519,861 US8130513B2 (en) 2007-03-14 2008-02-26 Radio-frequency package
EP08720878.1A EP2124253B1 (en) 2007-03-14 2008-02-26 High frequency package
CN2008800017522A CN101578697B (zh) 2007-03-14 2008-02-26 高频封装件
JP2009503955A JP4990353B2 (ja) 2007-03-14 2008-02-26 高周波パッケージ

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-065475 2007-03-14
JP2007065475 2007-03-14

Publications (1)

Publication Number Publication Date
WO2008111391A1 true WO2008111391A1 (ja) 2008-09-18

Family

ID=39759333

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/053292 Ceased WO2008111391A1 (ja) 2007-03-14 2008-02-26 高周波パッケージ

Country Status (5)

Country Link
US (1) US8130513B2 (ja)
EP (1) EP2124253B1 (ja)
JP (1) JP4990353B2 (ja)
CN (1) CN101578697B (ja)
WO (1) WO2008111391A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010171254A (ja) * 2009-01-23 2010-08-05 Hitachi Automotive Systems Ltd 電子デバイスパッケージ構造及びそれが用いられた電子回路モジュール
JP2010177618A (ja) * 2009-02-02 2010-08-12 Mitsubishi Electric Corp 高周波モジュール
JP2015154172A (ja) * 2014-02-13 2015-08-24 日本電信電話株式会社 Ｍｍｉｃ集積回路モジュール

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8110915B2 (en) * 2009-10-16 2012-02-07 Infineon Technologies Ag Open cavity leadless surface mountable package for high power RF applications
JP5512566B2 (ja) 2011-01-31 2014-06-04 株式会社東芝 半導体装置
CN107134442B (zh) * 2011-05-24 2020-04-28 三菱电机株式会社 高频封装
CN103151340B (zh) * 2013-02-08 2016-04-20 日月光半导体制造股份有限公司 天线封装模块及其制造方法
US9583811B2 (en) * 2014-08-07 2017-02-28 Infineon Technologies Ag Transition between a plastic waveguide and a semiconductor chip, where the semiconductor chip is embedded and encapsulated within a mold compound
CN106952886B (zh) * 2017-03-25 2019-08-09 华进半导体封装先导技术研发中心有限公司 一种射频芯片封装结构
US11152707B1 (en) * 2020-07-02 2021-10-19 International Business Machines Corporation Fast radio frequency package
KR102722385B1 (ko) * 2021-11-04 2024-10-25 주식회사 웨이브피아 알에프 칩 패키지

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04186645A (ja) * 1990-11-16 1992-07-03 Sanyo Electric Co Ltd マイクロ波集積回路の製造方法
JPH04363901A (ja) * 1990-11-26 1992-12-16 Mitsubishi Materials Corp 高周波、マイクロ波用混成集積回路及びその製造方法
JPH10224119A (ja) * 1997-02-07 1998-08-21 Nec Corp 高周波回路およびその製造方法
JP2005101856A (ja) * 2003-09-24 2005-04-14 Mitsubishi Electric Corp 高周波伝送基板および高周波伝送基板接続構造

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US5045820A (en) * 1989-09-27 1991-09-03 Motorola, Inc. Three-dimensional microwave circuit carrier and integral waveguide coupler
JP2823461B2 (ja) 1992-12-11 1998-11-11 三菱電機株式会社 高周波帯ｉｃ用パッケージ
JP3209183B2 (ja) 1998-07-08 2001-09-17 日本電気株式会社 高周波信号用集積回路パッケージ及びその製造方法
JP2003086728A (ja) 2001-07-05 2003-03-20 Matsushita Electric Ind Co Ltd 高周波回路の製作方法及びそれを用いた装置
US6888235B2 (en) * 2001-09-26 2005-05-03 Molex Incorporated Power delivery system for integrated circuits utilizing discrete capacitors
JP3766791B2 (ja) * 2001-10-12 2006-04-19 シャープ株式会社 高周波フィルタ回路および高周波通信装置
CN1225082C (zh) * 2001-11-26 2005-10-26 松下电器产业株式会社 高频功率放大装置和使用它的功率放大器模块
JP3778075B2 (ja) * 2001-12-12 2006-05-24 ソニー株式会社 フィルタ回路
JP3649183B2 (ja) * 2001-12-27 2005-05-18 ソニー株式会社 フィルタ回路装置及びその製造方法
US7102458B2 (en) * 2002-05-23 2006-09-05 Kyocera Corporation High-frequency line-waveguide converter having the HF line terminated within an opening portion
JP3738755B2 (ja) * 2002-08-01 2006-01-25 日本電気株式会社 チップ部品を備える電子装置
DE10350346B4 (de) * 2002-10-29 2012-12-20 Kyocera Corp. Hochfrequenzleitungs-Wellenleiter-Konverter und Hochfrequenzpaket
JP4186645B2 (ja) 2003-02-24 2008-11-26 松下電器産業株式会社 超音波流量計測装置
JP4363901B2 (ja) 2003-06-02 2009-11-11 株式会社フジタ 電磁波吸収パネルの製作方法及び電磁波吸収パネル
JP2005198051A (ja) * 2004-01-08 2005-07-21 Hitachi Ltd 高周波モジュール
EP1729340B1 (en) 2004-03-26 2017-09-06 Mitsubishi Denki Kabushiki Kaisha High frequency package, transmitting and receiving module and wireless equipment
EP1775765B1 (en) * 2004-06-28 2018-05-02 Mitsubishi Electric Corporation Multilayer dielectric substrate and semiconductor package
JP4056500B2 (ja) * 2004-06-28 2008-03-05 三菱電機株式会社 伝送線路基板および半導体パッケージ
EP1793489A4 (en) * 2004-09-21 2008-01-16 Murata Manufacturing Co HIGH FREQUENCY OSCILLATION CIRCUIT AND TRANSMITTER / RECEIVER
CN101395759B (zh) * 2006-02-06 2011-06-22 三菱电机株式会社 高频模件
CA2650496C (en) * 2006-04-26 2016-06-28 Ems Technologies, Inc. Planar mixed-signal circuit board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04186645A (ja) * 1990-11-16 1992-07-03 Sanyo Electric Co Ltd マイクロ波集積回路の製造方法
JPH04363901A (ja) * 1990-11-26 1992-12-16 Mitsubishi Materials Corp 高周波、マイクロ波用混成集積回路及びその製造方法
JPH10224119A (ja) * 1997-02-07 1998-08-21 Nec Corp 高周波回路およびその製造方法
JP2005101856A (ja) * 2003-09-24 2005-04-14 Mitsubishi Electric Corp 高周波伝送基板および高周波伝送基板接続構造

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2124253A4 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010171254A (ja) * 2009-01-23 2010-08-05 Hitachi Automotive Systems Ltd 電子デバイスパッケージ構造及びそれが用いられた電子回路モジュール
JP2010177618A (ja) * 2009-02-02 2010-08-12 Mitsubishi Electric Corp 高周波モジュール
JP2015154172A (ja) * 2014-02-13 2015-08-24 日本電信電話株式会社 Ｍｍｉｃ集積回路モジュール

Also Published As

Publication number Publication date
EP2124253A1 (en) 2009-11-25
US8130513B2 (en) 2012-03-06
CN101578697A (zh) 2009-11-11
JP4990353B2 (ja) 2012-08-01
CN101578697B (zh) 2011-12-28
EP2124253B1 (en) 2019-05-22
EP2124253A4 (en) 2010-08-04
JPWO2008111391A1 (ja) 2010-06-24
US20100046184A1 (en) 2010-02-25

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